Electronic equipment

Abstract

The embodiment of the utility model provides electronic equipment which comprises a cover plate, a frame body, a display screen and a bonding layer, a containing cavity with an opening is formed in the frame body, the display screen is arranged in the containing cavity, and the cover plate is connected to the frame body to block the opening of the containing cavity; wherein one side, close to the display screen, of the frame body is provided with a sunken part, the sunken part is sunken in the direction away from the display screen, the sunken part is at least partially filled with the bonding layer, and the cover plate, the frame body and the display screen are connected into a whole. According to the electronic equipment, the distance between the display screen and the frame body can be effectively reduced, so that the black edge size of the cover plate of the electronic equipment is reduced, and the attractiveness of the electronic equipment is improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of electronic equipment, and particularly relates to an electronic equipment. BACKGROUND

[0002] With the development of science and technology, the performance of electronic equipment in various aspects has been greatly improved. At the same time, users also hope that the electronic equipment has both performance upgrade and aesthetic appearance. The screen assembly of the electronic equipment usually includes a cover plate and a display screen, and a black border is arranged at the edge of the cover plate to prevent light leakage of the display screen.

[0003] In the related art, due to the influence of the dispensing width between the cover plate and the frame body and the avoidance of the display screen for antenna clearance, the size of the black border of the electronic equipment is large, which affects the appearance effect of the electronic equipment. CONTENT OF THE UTILITY MODEL

[0004] The application aims to provide an electronic equipment to solve the problem of large size of the black border of the cover plate of the existing electronic equipment.

[0005] In order to solve the above technical problem, the application is implemented as follows:

[0006] The application discloses an electronic equipment, which comprises a cover plate, a frame body, a display screen, and an adhesive layer. The frame body forms a containing cavity with an opening. The display screen is arranged in the containing cavity. The cover plate is connected to the frame body to block the opening of the containing cavity. Wherein,

[0007] The frame body is provided with a recessed part on the side close to the display screen. The recessed part is recessed towards the direction away from the display screen. The adhesive layer at least partially fills the recessed part and connects the cover plate, the frame body and the display screen into one body.

[0008] Optionally, the cover plate and the frame body are gap arranged along a first direction. The adhesive layer fills at least part of the gap.

[0009] Optionally, the width of the gap along the first direction is d1. Along the first direction, the cover plate has a third side arranged opposite to the frame body, and the frame body has a fourth side arranged opposite to the cover plate. The size of d1 is related to the size of the third side and the fourth side along a second direction and the adhesive strength of the adhesive layer. The second direction intersects the first direction.

[0010] Optionally, the adhesive layer located in the gap has a first thickness h1 along a second direction. The size of the first thickness h1 is related to the waterproof limit value of the electronic equipment. The second direction intersects the first direction.

[0011] Optionally, the display screen comprises a flexible circuit board, and the adhesive layer wraps an end of the flexible circuit board.

[0012] Optionally, the flexible circuit board comprises a first side close to the display screen and a second side away from the display screen along the second direction, and part of the adhesive layer is connected to the second side.

[0013] Optionally, the adhesive layer is a potting layer, and the potting layer on the second side of the flexible circuit board has a second thickness h2 along the second direction, and the second thickness h2 is related to a potting process limit of the potting layer.

[0014] Optionally, along the first direction, an edge of the flexible circuit board is at a distance d2 from the frame, and d2 is related to an antenna clearance requirement of the electronic device.

[0015] Optionally, the display screen is provided with a glue injection port, the glue injection port penetrates the display screen along the second direction for injecting injection glue, and the injection glue is solidified to form the adhesive layer.

[0016] Optionally, the number of the glue injection ports is multiple, and the multiple glue injection ports are arranged at intervals along the circumferential edge of the display screen.

[0017] In the embodiment of the application, the side of the frame close to the display screen is provided with a recess, wherein the recess is recessed towards the direction away from the display screen to serve as an antenna clearance of the electronic device, so as to avoid the display screen from expanding the distance from the display screen to the edge of the cover plate for the purpose of avoiding the antenna clearance. At the same time, since the recess is opposite to the display screen, the adhesive layer can at least partially fill in the recess while realizing the connection between the frame and the display screen. In the case that the adhesive layer connects the cover plate, the frame and the display screen as a whole, the width of the adhesive layer is reduced while ensuring the connection effect between the cover plate, the frame and the display screen, thereby reducing the distance from the display screen to the edge of the cover plate. In the electronic device in the embodiment of the application, by arranging the recess on the side of the frame close to the display screen and arranging the adhesive layer to at least partially fill in the recess, the distance between the display screen and the frame can be effectively reduced in the case that the adhesive layer connects the cover plate, the frame and the display screen as a whole, thereby reducing the black border size of the cover plate of the electronic device and also facilitating the reduction of the overall structure size of the electronic device and the improvement of the aesthetic appearance of the electronic device.

[0018] Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following and / or can be learned by practice of the application. BRIEF DESCRIPTION OF DRAWINGS

[0019] The above and / or additional aspects and advantages of the application will become apparent and be readily appreciated from the description of the embodiments, which follows, including the accompanying drawings.

[0020] Figure 1 is a partial sectional view of an electronic device in the prior art;

[0021] Figure 2 is a dispensing schematic of an electronic device frame in the prior art;

[0022] Figure 3 is a partial sectional view of an electronic device in the embodiments of the present application;

[0023] Figure 4 is a dispensing schematic of an electronic device in the embodiments of the present application.

[0024] Reference signs: 10 - cover plate, 11 - third side, 20 - display screen, 21 - flexible circuit board, 22 - dispensing opening, 30 - frame, 31 - recess, 32 - fourth side, 40 - adhesive layer, x - first direction, z - second direction. DETAILED DESCRIPTION

[0025] The embodiments of the present application will be described in detail below with reference to the drawings, in which the same or similar components have the same or similar reference numbers throughout the drawings and a repeated explanation is omitted. The embodiments described below are examples for explaining the present application and are not intended to limit the present application. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative work fall within the scope of the present application.

[0026] The terms "first", "second" in the specification and claims of the present application can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specified. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally means that the front and rear associated objects are in an "or" relationship.

[0027] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0028] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0029] With the development of science and technology, the performance of electronic devices in all aspects has been greatly improved, at the same time, users also hope that electronic devices have aesthetic appearance while upgrading performance. Generally, the screen assembly of electronic devices includes a cover plate and a display screen, wherein the cover plate edge is provided with a black border to prevent light leakage of the display screen. The cover plate is usually bonded with the frame by dispensing or back adhesive. Due to the increasing demand of users for the waterproof performance of electronic devices, combined with the influence of antenna clearance, the distance from the display screen to the edge of the cover plate is large, thereby affecting the size of the cover plate black border.

[0030] It should be noted that the electronic device described in the present application can include an electronic watch, a mobile phone, a tablet computer, etc. The specific type of electronic device is not limited in the present application. The following will take an electronic watch as an example for description, and other products can be referred to, which will not be repeated here.

[0031] For example, as shown in Figure 1 , for an electronic watch with a waterproof level of 5atm, in order to ensure the bonding strength between the cover plate and the frame, a relatively wide dispensing width is usually required. The commonly used dispensing width is more than 0.8mm, at the same time, the distance between the display screen flexible circuit board and the frame needs to ensure a safety space of 0.35mm or more for the antenna clearance. Under the influence of the above two factors, the distance from the maximum outline of the display screen of the electronic watch to the edge of the cover plate is at least 1.15mm, resulting in a wide black border, which not only affects the appearance of the device, but also limits the further reduction of the volume of the electronic watch.

[0032] Based on the above reasons, the present application provides an electronic device to solve the problem that the size of the black border at the edge of the cover plate in the existing electronic device is large, which affects the appearance of the product and leads to poor user experience.

[0033] As shown in Figure 3 , the electronic device disclosed in the present application can specifically include a cover plate 10, a frame 30, a display screen 20, and an adhesive layer 40, wherein the adhesive layer 40 is connected between the cover plate 10, the frame 30 and the display screen 20, and connects them into one, thereby enhancing the connection strength between the three, making the overall structure of the electronic device more stable, and improving the mechanical performance of the electronic device, i.e. service life.

[0034] Specifically, the frame body 30 can include a plurality of side frames, which enclose a receiving cavity with an opening, the display screen 20 is arranged in the receiving cavity, and the cover plate 10 is connected to the frame body 30 to block the opening of the receiving cavity; wherein the frame body 30 is provided with a recess 31 on the side close to the display screen 20, the recess 31 is recessed towards the direction away from the display screen 20, the recess 31 can be formed by slotting the inner wall of the frame body 30 on the side close to the receiving cavity, the size of the recess 31 along the first direction x can be designed according to the requirements of antenna clearance and black border size, and the size of the recess 31 along the second direction z can be designed according to the size of the cover plate 10 and the display screen 20; the adhesive layer 40 at least partially fills the recess 31 and connects the cover plate 10, the frame body 30 and the display screen 20 into one body, and the adhesive layer 40 can be formed by curing injection molding glue, wherein the injection molding glue can be selected from epoxy resin glue, silicone glue, PUR hot melt glue, UV glue and the like, which is not limited in the present application.

[0035] Since the adhesive layer 40 connects the cover plate 10, the frame body 30 and the display screen 20 into one body, it changes the connection mode between the cover plate 10 and the frame body 30, which ensures the connection strength between the three, and the cover plate 10 and the frame body 30 do not need to reserve a wide glue dispensing width, thereby reducing the distance from the display screen 20 to the edge of the cover plate 10, which is beneficial to reducing the size of the black border of the cover plate 10.

[0036] Among them, compared with the frame body 30 of the prior art, the setting of the recess 31 increases the distance between the display screen 20 and the inner wall of the frame body 30, and the extra distance can be used as antenna clearance, so that the display screen 20 can no longer be offset to the inside of the electronic device to avoid the antenna clearance, thereby shortening the distance from the display screen 20 to the edge of the cover plate 10, which is of great significance to reducing the black border of the cover plate 10.

[0037] In addition, the combination of the recess 31 and the adhesive layer 40 forms a more compact sealing structure in the receiving cavity, thereby effectively preventing external impurities such as dust and water vapor from entering the inside of the electronic device, and protecting the display screen 20 and other elements from damage, thereby improving the durability and quality of the electronic device. Since the adhesive layer 40 directly connects the cover plate 10, the frame body 30 and the display screen 20 into one body, the assembly process is simplified, which is beneficial to improving the production efficiency.

[0038] In the embodiment of the present application, as shown in Figure 3 The cover plate 10 and the frame body 30 are arranged with a gap along the first direction x, and the adhesive layer 40 fills at least part of the gap to enhance the connection strength between the cover plate 10 and the frame body 30.

[0039] It should be noted that in the common electronic device, as Figure 2As shown, the arrow A is a point on the frame 30, wherein the frame 30 is close to the side of the cover plate 10, then the cover plate 10 is attached to the frame 30, and then the cover plate 10 and the frame 30 are pressed and kept still, and then the cover plate 10 and the frame 30 are disassembled after the glue solidifies to the target strength, and the assembly between the cover plate 10 and the frame 30 is completed.

[0040] In the above production process, since the glue is only applied to the side of the frame 30 close to the cover plate 10, the connection area between the assembled cover plate 10 and the frame 30 is small, and the connection strength is difficult to guarantee, which leads to the disconnection of the cover plate 10 and the frame 30 of the electronic device under external force during the user's later use. At the same time, there is inevitably a process gap between the cover plate 10 and the frame 30, and under the condition that the gap is not specially treated, dust, water vapor and the like are easily entered, which affects the internal structure of the electronic device and shortens the service life of the electronic device.

[0041] In this application, the gap between the cover plate 10 and the frame 30 is increased to provide more space for the adhesive layer 40 to fill, which ensures that the adhesive layer 40 can be fully and uniformly distributed between the cover plate 10 and the frame 30, thereby realizing a more stable and reliable connection structure to enhance the overall structural stability of the electronic device. It can also prevent impurities from entering the electronic device from the gap between the cover plate 10 and the frame 30, causing damage to the display screen 20 and other components.

[0042] Further, as shown in Figure 3 The width of the gap along the first direction x is d1, and along the first direction x, the cover plate has a third side 11 opposite the frame, and the frame has a fourth side 32 opposite the cover plate, wherein the size of d1 is related to the size of the third side 11 and the fourth side 32 along the second direction z, and the adhesive strength of the adhesive layer 40, and the second direction z intersects the first direction x.

[0043] Wherein d1 is related to the size of the third side 11 and the fourth side 32 along the second direction z, because the adhesive layer is arranged between the third side 11 and the fourth side 32 of the cover plate, and the size of the adhesive layer along the second direction z is limited by the size of the third side 11 and the fourth side 32 along the second direction z; Specifically, when the size of the third side 11 and the fourth side 32 along the second direction z is small, the size of the adhesive layer along the second direction z is limited, at this time, in order to guarantee the connection strength between the cover plate and the frame, d1 needs to be set larger to increase the width of the adhesive layer along the first direction x, on the contrary, when the size of the third side 11 and the fourth side 32 along the second direction z is large, the size of the adhesive layer along the second direction z can be set larger, in this way, the size of d1 can be set smaller, and the connection strength between the cover plate and the frame can also be met.

[0044] In addition, the bonding strength of the bonding layer also affects the size of d1, for example, when the bonding strength of the bonding layer is high, d1 can be set smaller, and when the bonding strength of the bonding layer is low, d1 needs to be increased to increase the volume of the bonding layer to ensure the bonding effect.

[0045] It should be noted that the size of the gap directly affects the sealing performance of the electronic device and the connection strength between the frame 30 and the cover plate 10. The design of the gap must consider the feasibility of the manufacturing process, the characteristics of the bonding layer 40 material, and the user experience, etc. A gap that is too small can increase manufacturing difficulty and cost, and the performance parameters of different bonding layer 40 materials can affect the filling effect of the injection molding glue, and a gap that is too large can also affect the appearance of the device. Therefore, when designing the gap width between the cover plate 10 and the frame 30, the technician also needs to consider the actual needs of the third side 11, the fourth side 32 in the second direction z and the bonding strength of the bonding layer, etc.

[0046] For example, the width of the gap can be 0.15mm, 0.16mm, 0.17mm, 0.18mm, 0.19mm, 0.2mm, etc. to ensure that the injection molding glue used to form the bonding layer 40 can be smoothly filled into the gap, providing shear force and extending the waterproof path.

[0047] Optionally, as shown in Figure 3 The bonding layer 40 located in the gap has a first thickness h1 along the second direction z, and the size of the first thickness h1 is related to the waterproof limit value of the electronic device.

[0048] In practical applications, when the electronic device is in a harsh environment, dust and water in the external environment entering the internal part of the electronic device can easily affect the normal function of the electronic device. Especially when the electronic device is in a humid environment or submerged in water, water gradually penetrates from the outermost side of the bonding layer to the inside. Therefore, in order to meet the waterproof grade requirements of the electronic device, the corresponding bonding layer thickness needs to be set to meet the waterproof requirements of the electronic device within a certain period of time and ensure the waterproof performance.

[0049] For example, in the embodiments of the present application, the first thickness h1 can be set to 0.7mm, 0.75mm, 0.8mm, etc., thereby improving the waterproof and dustproof capability of the electronic device and the structural strength.

[0050] It can be understood that the thicker bonding layer 40 increases the connection strength between the cover plate 10 and the frame 30, so that the part of the bonding layer 40 forms a more stable connection between the cover plate 10 and the frame 30. In addition, by fully filling the gap and maintaining a certain thickness, the bonding layer 40 can more effectively prevent the invasion of external substances such as dust and water vapor, and protect the internal display screen 20 and other components from damage.

[0051] In a specific application, the height of the cover plate 10 and the frame 30 along the second direction z can be increased, so that the bonding layer 40 can meet the requirements. From the perspective of manufacturing process, increasing the height of the cover plate 10 and the frame 30 can reduce the assembly precision requirement between the cover plate 10 and the frame 30. Due to the influence of the glue injection process, the glue injection thickness cannot be guaranteed at a high precision. Designing a thicker bonding layer 40 thickness can avoid the influence of the bonding layer 40 thickness not meeting the requirements on the connection strength between the cover plate 10 and the frame 30 and the waterproof and dustproof performance of the electronic device under the condition that the glue injection process precision is not high.

[0052] It should be noted that in the embodiments of the present application, the second direction z intersects the first direction x. Specifically, the first direction x can be the length direction or the width direction of the electronic device, and the second direction z is the thickness direction of the electronic device.

[0053] Optionally, the display screen 20 includes a flexible circuit board 21, and the bonding layer 40 wraps the end of the flexible circuit board 21 to provide effective protection for the end of the flexible circuit board 21.

[0054] The flexible circuit board 21 (FPC) serves as a bridge for connecting the display screen 20 and external circuits, and the fixation and protection of the end thereof are crucial. In the case that the bonding layer 40 wraps the end of the flexible circuit board 21, the flexible circuit board 21 not only obtains effective fixation, but also avoids loosening or damage caused by external factors such as vibration and impact, thereby ensuring stable transmission of internal signals of the electronic device and normal operation of the display screen 20.

[0055] In actual application, the flexible circuit board 21 (FPC) of the display screen 20 of the electronic device can include COF-FPC and TPC-FPC, and the bonding layer 40 can wrap the end of any one of the above flexible circuit boards 21, thereby providing more effective and safe protection for the flexible circuit board 21.

[0056] Optionally, as shown in Figure 3 The flexible circuit board 21 includes a first side close to the display screen 20 and a second side away from the display screen 20 along the second direction z, and part of the bonding layer 40 is connected to the second side, thereby enhancing the strength of the second side of the flexible circuit board 21.

[0057] It should be noted that the first side of the flexible circuit board 21 is arranged close to the display screen 20, wherein, in order to ensure the display effect of the electronic device, the display screen 20 is usually as close as possible to the cover plate 10, so as to minimize the distance between the cover plate 10 and the flexible circuit board 21 along the second direction z. In the case where the cover plate 10, the frame 30 and the display screen 20 are connected as a whole, the cover plate 10 can also serve as a support for the flexible circuit board 21, thereby enhancing the strength of the flexible circuit board 21. However, other components also need to be arranged inside the electronic device, and the second side of the flexible circuit board 21 is actually a free surface. Therefore, when part of the adhesive layer 40 is arranged on the second side of the flexible circuit board 21, the part of the adhesive layer 40 on the second side can serve as a support for the flexible circuit board 21, so as to form a more solid structural framework, thereby enhancing the stability of the flexible circuit board 21 inside the electronic device and reducing the risk of deformation or damage caused by external factors such as vibration and impact.

[0058] In an optional embodiment of the present application, as shown in Figure 3 the adhesive layer is a potting layer, and a vacuum potting process is used to fill glue inside the electronic device and wait for curing. The potting layer on the second side of the flexible circuit board 21 has a second thickness h2 along the second direction z, wherein the second thickness h2 is related to the limit of the potting process of the potting layer.

[0059] In practical applications, the vacuum potting process can reduce a large number of air bubbles generated after filling the glue, ensure the structural strength, and at the same time, enable the glue to better penetrate into the parts to be filled and eliminate the space hidden in the fine gaps inside the electronic device to a greater extent.

[0060] In an embodiment, h2 can be set to be greater than 0.4 mm. It can be understood that the thicker adhesive layer 40 provides stronger support and protection on the second side of the flexible circuit board 21. This enhanced support not only helps to resist external impact and vibration and reduce deformation or damage of the flexible circuit board 21 due to mechanical stress, but also ensures the stable connection of the display screen 20 and other parts of the electronic device, thereby ensuring the normal work of the display screen 20. The design of the second thickness can also take into account factors such as the internal space of the electronic device and the specific structural size of the flexible circuit board 21, and be adjusted according to actual needs.

[0061] Optionally, as shown in Figure 3 along the first direction x, the distance between the edge of the flexible circuit board 21 and the frame 30 is d2, wherein d2 is related to the antenna clearance requirement of the electronic device, that is, the size of d2 needs to ensure the emission of the antenna signal of the electronic device.

[0062] In one embodiment of this application, the distance between the display screen 20 and the frame 30 needs to be maintained at more than 0.35mm to ensure antenna clearance. Furthermore, since the cover plate is placed on top of the display screen, and the edge of the cover plate is provided with a black border to prevent light leakage from the display screen, d2 also needs to take into account the blocking effect of the black border of the cover plate on the display screen. For example, d2 can be set to be greater than 0.5mm. Specifically, when the distance between the edge of the flexible circuit board 21 and the frame 30 is greater than 0.5mm, after deducting the 0.35mm antenna clearance, the distance between the edge of the flexible circuit board 21 and the edge of the cover plate 10 can be 0.15mm, thereby reducing the size of the black border and improving the appearance of the electronic device. In addition, without changing the size of the display screen 20 of the electronic device, the distance between the frame 30 and the display screen 20 can be reduced, which is conducive to reducing the overall structural size of the electronic device and improving product competitiveness.

[0063] It should be noted that in actual products, the end of the flexible circuit board 21 may have a bent portion toward the cover plate 10. The distance between the edge of the flexible circuit board 21 and the frame 30 in the embodiments of this application refers to the distance between the maximum outer shape of the flexible circuit board 21 and the inner wall of the frame 30, that is, the position of the flexible circuit board 21 at the bend closest to the frame 30.

[0064] Optionally, the display screen 20 is provided with an injection port 22, which penetrates the display screen 20 along the second direction z for injecting injection molding compound. The injection molding compound cures to form an adhesive layer 40. This direct injection method ensures that the adhesive layer 40 can uniformly cover and tightly adhere to the periphery of the display screen 20, thereby enhancing the connection strength between the display screen 20 and the frame 30. At the same time, since the adhesive layer 40 is directly cured from injection molding compound, its material properties are more compatible with the display screen 20 and the frame 30, further improving the stability and reliability of the connection.

[0065] like Figure 4 As shown, there are multiple glue injection ports 22, which are spaced apart along the circumferential edge of the display screen 20. This ensures a more uniform connection strength between the cover plate 10, the frame 30, and the display screen 20 along the circumferential direction of the electronic device. For example, the electronic device in this embodiment has two glue injection ports on each of its two sides.

[0066] It should be noted that by using multiple injection ports 22 of the product, and by setting the multiple injection ports 22 at intervals, the problem of uneven thickness or local missing parts of the adhesive layer 40 that may be caused by a single injection port 22 can be effectively avoided; and, when injecting the injection molding compound, the multiple injection ports 22 can work simultaneously, shortening the assembly time of a single electronic device.

[0067] In actual applications, the injection port 22 can be designed according to the specific type and structural size characteristics of the electronic device, and the number and position of the injection port 22 can be flexibly selected, which is not limited in the present application.

[0068] Generally, when the electronic device cover plate 10 and the frame 30 are assembled, glue needs to be applied near the cover plate 10 side, then the cover plate 10 is attached to the frame 30, and then the cover plate 10 and the frame 30 are pressed and pressure-kept, and after the glue solidification connection strength reaches the target strength, the pressure-keeping fixture is removed, and the assembly between the cover plate 10 and the frame 30 is completed. The above process requires high automation, and the production cycle is long, which is not conducive to improving production efficiency and increasing production time cost.

[0069] The electronic device provided by the embodiment of the present application can simplify the assembly process by using the vacuum low-temperature injection molding process or the vacuum micro-gap impregnation technology to connect the cover plate 10, the display screen 20 and the frame 30. In the embodiment of the present application, the injection molding process is taken as an example for description: the cover plate 10, the display screen 20 and the frame 30 are placed in the mold at the same time, the glue is injected from the glue injection port 22 of the display screen 20, and the cover plate 10, the display screen 20 and the frame 30 are connected together by the injection glue, and at the same time, the glue fills the gap between the cover plate 10 and the frame 30.

[0070] The electronic device in the present application is formed by injecting the injection glue into the adhesive layer 40 through the glue injection port 22, which simplifies the assembly process and improves the production efficiency.

[0071] In summary, the electronic device provided by the embodiment of the present application has at least the following advantages:

[0072] In the embodiment of the present application, the side of the frame close to the display screen is provided with a recessed part, wherein the recessed part is recessed towards the direction away from the display screen to serve as an antenna clearance of the electronic device, avoiding the expansion of the distance from the display screen to the edge of the cover plate due to the avoidance of the display screen for the antenna clearance; at the same time, since the recessed part is opposite to the display screen, the connection between the frame and the display screen can be realized while the adhesive layer is at least partially filled in the recessed part, and the width of the adhesive layer is reduced while ensuring the connection effect between the cover plate, the frame and the display screen, thereby reducing the distance from the display screen to the edge of the cover plate. In the electronic device in the embodiment of the present application, by providing the recessed part on the side of the frame close to the display screen and arranging the adhesive layer to be at least partially filled in the recessed part, the distance between the display screen and the frame can be effectively reduced when the cover plate, the frame and the display screen are connected as a whole by the adhesive layer, thereby reducing the black edge size of the cover plate of the electronic device, and further, the overall structural size of the electronic device is reduced, and the appearance of the electronic device is improved.

[0073] In the description of the application, reference has been made to descriptive terms such as "one embodiment", "some embodiments", "an embodiment", "example", "specific example" or "some examples" etc. Such terminology means that a particular feature, structure, material or characteristic being described is included in at least one embodiment or example of the application. The illustrative appearances of such terminology in various places in the specification does not necessarily refer to the same embodiment or example. Moreover, it is appreciated that the specific features, structures, materials or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0074] Although embodiments of this application have been shown and described, it is to be understood that various modifications, substitutions, combinations, and variations can be made therein without departing from the spirit and scope of the application, which is defined by the appended claims and their equivalents.

Claims

1. An electronic device, characterized in that, include: The system comprises a cover plate, a frame, a display screen, and an adhesive layer. The frame forms an open receiving cavity, the display screen is disposed within the receiving cavity, and the cover plate is connected to the frame to seal the opening of the receiving cavity. The frame has a recessed portion on the side near the display screen, the recessed portion is recessed in a direction away from the display screen, the adhesive layer at least partially fills the recessed portion, and connects the cover plate, the frame and the display screen into one unit.

2. The electronic device according to claim 1, characterized in that, The cover plate and the frame are spaced apart along a first direction, and the adhesive layer fills at least part of the gap.

3. The electronic device according to claim 2, characterized in that, The width of the gap along the first direction is d1. Along the first direction, the cover plate has a third side disposed opposite to the frame, and the frame has a fourth side disposed opposite to the cover plate. The dimension of d1 is related to the dimensions of the third side and the fourth side along the second direction and the adhesive strength of the adhesive layer. The second direction intersects the first direction.

4. The electronic device according to claim 2, characterized in that, The adhesive layer located within the gap has a first thickness h1 along a second direction, wherein the dimension of the first thickness h1 is related to the waterproof limit of the electronic device, and the second direction intersects the first direction.

5. The electronic device according to claim 1, characterized in that, The display screen includes a flexible circuit board, and the adhesive layer wraps around the end of the flexible circuit board.

6. The electronic device according to claim 5, characterized in that, The flexible circuit board includes a first side close to the display screen and a second side away from the display screen along a second direction, with a portion of the adhesive layer connected to the second side.

7. The electronic device according to claim 6, characterized in that, The adhesive layer is a potting layer, and the potting layer located on the second side of the flexible circuit board has a second thickness h2 along the second direction. The second thickness h2 is related to the potting process limit of the potting layer.

8. The electronic device according to claim 5, characterized in that, Along the first direction, the distance between the edge of the flexible circuit board and the frame is d2, where d2 is related to the clearance requirement of the electronic device antenna.

9. The electronic device according to claim 1, characterized in that, The display screen is provided with an injection port, which extends through the display screen in a second direction for injecting injection molding compound, which cures to form the adhesive layer.

10. The electronic device according to claim 9, characterized in that, The number of glue injection ports is multiple, and the multiple glue injection ports are spaced apart along the circumferential edge of the display screen.

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