Small chip testing and sorting mechanism

Abstract

The utility model relates to the technical field of chip preparation, and aims to solve the technical problem that the existing equipment is not suitable for small chips. In order to solve the technical problem, the utility model provides the small chip testing and sorting mechanism. The chip testing system comprises a chip feeding system, a chip carrying system, a chip testing system, a chip collecting system and a control system. The chip carrying system, the chip testing system and the chip collecting system are sequentially arranged in the rotating direction of the rotating platform. The chip carrying system comprises a grabbing assembly and a chip suction nozzle. A pick-up part of the chip collecting system is arranged above the rotating platform, and the pick-up part corresponds to the chip carrier rotating to the lower part of the pick-up part; the collecting boxes and the picking parts are arranged in a one-to-one correspondence manner, and the collecting boxes are connected with the picking parts; the control system is electrically connected with the feeding sensor, the grabbing assembly, the testing assembly and the chip collecting system. According to the utility model, full-automatic and efficient sorting of small chips is realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip preparation technical field especially is a small chip test sorting mechanism. BACKGROUND

[0002] The preparation process of the chip is as follows: a wafer is produced and then the wafer is divided into chips by a scribe machine. The resistance values of the chips at different positions in the wafer are different. Therefore, the next process needs to test multiple chips and sort them according to different resistance values. For example, if the resistance value is greater than 8kΩ, it is qualified, and then it is sorted into the first gear (9.5kΩ~10kΩ), the second gear (9kΩ~9.5kΩ), the third gear (8.58kΩ~9kΩ), the fourth gear (8kΩ~8.58kΩ), and the NG gear (<8kΩ) according to the test resistance value.

[0003] The chips produced by the company are small chips (with a diameter of less than 0.5mm), and the sorting of the chips requires more stringent requirements for test conditions, structure of the sorting mechanism, processing precision, etc. The existing sorting equipment (for chips larger than 0.5mm) cannot be applied to small chips. Therefore, a full-automatic sorting mechanism for testing the resistance performance of small chips needs to be designed. SUMMARY

[0004] Therefore, the utility model wants to solve the technical problem in prior art.

[0005] To solve the above technical problems, the utility model provides a small chip test sorting mechanism, which comprises:

[0006] The chip feeding system comprises a circular vibrator, a linear vibrator, and a feeding sensor. The linear vibrator is connected to the front end of the circular vibrator. The front end of the linear vibrator is provided with a feeding detection position, and the feeding sensor is arranged close to the feeding detection position.

[0007] The chip conveying system comprises a grabbing assembly and a chip suction nozzle connected to the grabbing assembly.

[0008] The chip testing system comprises a rotating platform and a testing assembly. The rotating platform is provided with a plurality of chip carriers for placing the chips to be tested at equal intervals in the circumferential direction. The testing assembly comprises a testing assembly body, a first testing probe, and a second testing probe. The first testing probe and the second testing probe are respectively connected to the testing assembly.

[0009] The chip collecting system comprises a plurality of pickup components and a plurality of collecting boxes. The pickup components are arranged above the rotating platform, and the pickup components correspond to the chip carriers below the rotating platform. The collecting boxes are arranged one by one corresponding to the pickup components, and the collecting boxes are connected to the pickup components.

[0010] A control system is electrically connected to the material arrival sensor, the grabbing assembly, the testing assembly, and the chip collecting system.

[0011] The chip handling system, the chip testing system, and the chip collecting system are sequentially arranged along a rotation direction of the rotating platform.

[0012] In an embodiment of the present application, the chip handling system further comprises a pressing assembly connected between the PPU manipulator and the chip suction nozzle; the pressing assembly comprises a linear guide rail, a sliding block matched with the linear guide rail, and an elastic member; the linear guide rail is vertically arranged and connected with the PPU manipulator; the sliding block is connected with the chip suction nozzle; the elastic member is vertically arranged, one end of the elastic member is connected with the PPU manipulator, and the other end of the elastic member is connected with the sliding block.

[0013] In an embodiment of the present application, a vertical extending circular hole is arranged in the chip carrier, a conductive member with conductive performance is arranged in the circular hole, the conductive member is not conductive with the chip carrier; a part of the circular hole located at the top end of the conductive member forms a testing placement groove, and the chip to be tested is placed in the testing placement groove.

[0014] In an embodiment of the present application, the axes of the first testing probe and the second testing probe coincide; the first testing probe and the second testing probe are respectively connected with the testing assembly body through a moving part to slide up and down; the moving part is electrically connected with the control system.

[0015] In an embodiment of the present application, the chip testing system further comprises a reference assembly electrically connected with the control system, the reference assembly is arranged close to the testing assembly; the reference assembly comprises a reference assembly body, a first reference probe, a second reference probe, a reference carrier, and a reference chip; the first reference probe and the second reference probe are respectively connected with the reference assembly body; the reference carrier is arranged on the reference assembly body, and the reference chip placed on the reference carrier is conductive with the first reference probe and the second reference probe.

[0016] In an embodiment of the present application, the structure and size of the reference carrier are the same as those of the chip carrier.

[0017] In an embodiment of the present application, the grabbing assembly comprises a servo driving part and a PPU manipulator connected with the servo driving part; the servo driving part and the PPU manipulator are respectively electrically connected with the control system; the servo driving part is connected with the PPU manipulator, the servo driving part drives the PPU manipulator to move along the X direction and the Y direction; the PPU manipulator is connected with the chip suction nozzle.

[0018] In an embodiment of the present application, the straight vibration comprises a transportation track for conveying the chip to be tested, and the material arrival detection position is arranged at the front end of the transportation track; the front end of the material arrival detection position is provided with a material blocking plate.

[0019] In one embodiment of the present application, the upper cover of the transportation track is provided with a cover plate.

[0020] In one embodiment of the present application, the chip collecting system further comprises a vacuum adsorption driving part electrically connected with the control system, the vacuum adsorption driving part is communicated with the collecting box; the pickup part comprises a vertically arranged adsorption pipe, the bottom end of the adsorption pipe is aligned with the to-be-tested chip on the chip carrier; the collecting box is connected with the adsorption pipe through a pipeline.

[0021] Compared with the prior art, the above technical scheme of the present application has the following advantages:

[0022] The small chip testing and sorting mechanism provided with the chip feeding system, the chip carrying system, the chip testing system and the chip collecting system can test the resistance of the small chip and collect the small chip according to the test result, and the present application realizes full automation and efficient sorting of the small chip. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to make the content of the present application more easily understood, the present application will be further described in detail below according to the specific embodiments of the present application and in combination with the drawings, in which:

[0024] Figure 1 is a structure schematic view of a small chip testing and sorting mechanism in the preferred embodiment of the present application;

[0025] Figure 2 is Figure 1 a structure schematic view of the chip feeding system in the small chip testing and sorting mechanism of the present application;

[0026] Figure 3 is Figure 2 an enlarged view of A in the present application;

[0027] Figure 4 is Figure 1 a structure schematic view of the chip carrying system in the small chip testing and sorting mechanism of the present application;

[0028] Figure 5 is Figure 4 a front view of the present application;

[0029] Figure 6 is Figure 5 an enlarged view of C in the present application;

[0030] Figure 7 is Figure 1 a structure schematic view of the chip testing system and the reference assembly in the small chip testing and sorting mechanism of the present application;

[0031] Figure 8 is Figure 1A schematic view of a chip carrier in a small chip testing and sorting mechanism of the present application;

[0032] Figure 9 A schematic view of a chip carrier in a small chip testing and sorting mechanism of the present application; Figure 8 A schematic view of a chip carrier in a small chip testing and sorting mechanism of the present application;

[0033] Figure 10 A schematic view of a chip carrier in a small chip testing and sorting mechanism of the present application; Figure 1 A schematic view of a chip carrier in a small chip testing and sorting mechanism of the present application;

[0034] Figure 11 A schematic view of a chip carrier in a small chip testing and sorting mechanism of the present application; Figure 10 A schematic view of a chip carrier in a small chip testing and sorting mechanism of the present application;

[0035] Figure 12 A schematic view of a chip carrier in a small chip testing and sorting mechanism of the present application; Figure 11 A schematic view of a chip carrier in a small chip testing and sorting mechanism of the present application;

[0036] 100, chip feeding system; 110, circular vibration; 120, linear vibration; 121, transport track; 122, material blocking plate; 123, cover plate; 130, arrival sensor;

[0037] 200, chip handling system; 210, chip suction nozzle; 220, servo driving part; 230, PPU manipulator; 240, pressing assembly; 241, linear guide rail; 242, sliding block; 243, elastic member;

[0038] 300, chip testing system; 310, rotating platform; 311, chip carrier; 312, circular hole; 313, conductive member; 314, testing placement slot; 320, testing assembly; 321, testing assembly body; 322, first testing probe; 323, second testing probe;

[0039] 400, chip collecting system; 410, picking-up part; 411, suction tube; 420, collecting box; 421, box body; 422, vacuum suction driving part; 423, suction area; 424, partition plate; 425, through hole;

[0040] 500, chip to be tested;

[0041] 600, reference assembly; 610, reference assembly body; 620, first reference probe; 630, second reference probe; 640, reference carrier. DETAILED DESCRIPTION

[0042] The present application will be further described below in conjunction with the drawings and specific embodiments, so that those skilled in the art can better understand the present application and implement it, but the embodiments are not intended to limit the present application.

[0043] Referring to Figures 1-12The utility model embodiment provides a kind of small chip test sorting mechanism, comprising:

[0044] Chip supply system 100, including round vibration 110, straight vibration 120 and to material sensor 130.The front end of round vibration 110 is connected with straight vibration 120;The front end of straight vibration 120 is equipped with to material detection position, and to material sensor 130 is close to to material detection position and is arranged, for identifying whether the chip 500 to be measured reaches to material detection position.In some embodiments, to material sensor 130 is optical fiber sensor, and it can detect whether there is micro product.

[0045] Chip handling system 200, chip handling system 200 includes grabbing assembly and chip suction nozzle 210 connected on grabbing assembly;

[0046] Chip testing system 300, including rotating platform 310 and test assembly 320;Rotating platform 310 is equipped with multiple chip carriers 311 for placing chip 500 to be measured along the circumferential direction at equal intervals;Test assembly 320 includes test assembly body 321, first test probe 322 and second test probe 323;First test probe 322 and second test probe 323 are respectively connected with test assembly 320 slidingly;

[0047] Chip collection system 400, including multiple pickup components 410 and multiple collection boxes 420;Pickup component 410 is arranged above rotating platform 310, and pickup component 410 is arranged correspondingly with chip carrier 311 rotating below it;Collection box 420 is arranged one by one with pickup component 410, and collection box 420 is connected with pickup component 410, for carrying chip 500 to be measured corresponding with the pickup component 410 into corresponding collection box 420;

[0048] Control system, to material sensor 130, grabbing assembly, test assembly 320 and chip collection system 400 are electrically connected;

[0049] Among them, along the rotation direction of rotating platform 310, chip handling system 200, chip testing system 300 and chip collection system 400 are sequentially arranged.

[0050] The chip feeding system 100 transports the to-be-tested chip 500 to the feeding detection position. When the feeding sensor 130 identifies that the to-be-tested chip 500 is transported to the feeding detection position, the control system controls the grabbing assembly to work, so as to drive the chip suction nozzle 210 to move and adsorb the to-be-tested chip 500 and transport it to the chip carrier 311. The rotating platform 310 drives the to-be-tested chip 500 to rotate until the to-be-tested chip 500 is rotated to the side of the testing assembly 320. The control system controls the rotating platform 310 to stop rotating. At the same time, the control system controls the first testing probe 322 and the second testing probe 323 to move and conduct with the to-be-tested chip 500, so as to perform testing. After the testing is completed, the control system controls the rotating platform 310 to rotate, so that the next to-be-tested chip 500 is rotated to the side of the testing assembly 320. Then, the above steps are repeated to test the next to-be-tested chip 500. With the intermittent rotation of the rotating platform 310, the control system matches the chip to be tested with the pickup component 410 and the collection box 420 of the corresponding gear according to the resistance value of the chip. When the chip after the testing is rotated to the position below the pickup component 410 of the gear, the control system controls the collection box 420 to work, so as to collect the chip into the collection box 420 of the corresponding gear.

[0051] Specifically, the chip feeding system 100, the chip transporting system 200, the chip testing system 300 and the chip collecting system 400 are arranged in the embodiment, so that the small chip can be tested in resistance and collected according to the test result. The application realizes full automation and efficient sorting of the small chip.

[0052] Further, the grabbing assembly includes a servo driving part 220 and a PPU manipulator 230 connected with the servo driving part 220. The servo driving part 220 and the PPU manipulator 230 are respectively electrically connected with the control system. The servo driving part 220 is connected with the PPU manipulator 230. The servo driving part 220 drives the PPU manipulator 230 to move along the X direction and the Y direction. The PPU manipulator 230 is connected with the chip suction nozzle 210. Specifically, the servo driving part 220 and the PPU manipulator 230 are connected to realize the movement of the chip suction nozzle 210. The structure is stable and reliable in operation.

[0053] Further, the chip handling system 200 further comprises a pressing assembly 240 connected between the PPU manipulator 230 and the chip suction nozzle 210; the pressing assembly 240 comprises a linear guide rail 241, a sliding block 242 matched with the linear guide rail 241, and an elastic member 243. The linear guide rail 241 is vertically arranged and connected with the PPU manipulator 230; the sliding block 242 is connected with the chip suction nozzle 210; the elastic member 243 is vertically arranged, one end of the elastic member 243 is connected with the PPU manipulator 230, and the other end of the elastic member 243 is connected with the sliding block 242. Specifically, the pressing assembly 240 is arranged in the embodiment, so that when the chip suction nozzle 210 contacts and adsorbs the to-be-tested chip 500, the consistency during suction can be ensured, and the chip will not be pressed. In some embodiments, the elastic member 243 is a spring. In some embodiments, two elastic members 243 are symmetrically arranged on both sides of the linear guide rail 241.

[0054] Further, the chip carrier 311 is provided with a vertically extending circular hole 312, and the circular hole 312 is provided with a conductive member 313 having a conductive property, and the conductive member 313 is not conductive with the chip carrier 311. A part of the circular hole 312 located at the top end of the conductive member 313 forms a test placement groove 314, and the to-be-tested chip 500 is placed in the test placement groove 314. During testing, the first test probe 322 is conductive with the top end of the to-be-tested chip 500 placed in the test placement groove 314, the bottom end of the to-be-tested chip 500 is conductive with the top end of the conductive member 313, and the second test probe 323 is conductive with the bottom of the conductive member 313. Specifically, the conductive member 313 is embedded in the chip carrier 311 in the embodiment, so as to facilitate the conduction of the to-be-tested chip 500 with the first test probe 322 and the second test probe 323.

[0055] Further, the axes of the first test probe 322 and the second test probe 323 coincide; the first test probe 322 and the second test probe 323 are respectively connected with the test assembly body 321 through a moving member and slide up and down. The moving member is electrically connected with the control system. Specifically, the axes of the first test probe 322 and the second test probe 323 are both vertical in the embodiment, so that when the rotating platform 310 drives the to-be-tested chip 500 to move to the test station, the control system controls the moving member to work to drive the first test probe 322 to move downward and the second test probe 323 to move upward, so as to realize the conduction of the to-be-tested chip 500, the first test probe 322 and the second test probe 323, and perform testing. After testing is completed, the control system controls the moving member to work to drive the first test probe 322 to move upward and the second test probe 323 to move downward, so that the first test probe 322 and the second test probe 323 are away from the chip carrier 311, thereby facilitating the rotation of the rotating platform 310 to perform testing on the next to-be-tested chip 500. The layout of the present application is reasonable, the occupied area is small, and the testing efficiency is high.

[0056] Further, the chip testing system 300 further comprises a reference assembly 600 electrically connected with the control system. The reference assembly 600 is arranged close to the testing assembly 320; the reference assembly 600 comprises a reference assembly body 610, a first reference probe 620, a second reference probe 630, a reference carrier 640 and a reference chip. The first reference probe 620 and the second reference probe 630 are respectively connected with the reference assembly body 610; the reference carrier 640 is arranged on the reference assembly body 610, and the reference carrier 640 is provided with a reference placing groove for placing the reference chip; the reference chip placed on the reference carrier 640 is in conduction with the first reference probe 620 and the second reference probe 630. Since the humidity and temperature in the testing environment have a relatively large influence on the resistance measurement value of the small chip, in order to solve this problem, the embodiment is provided with the reference assembly 600, so that the reference chip needs to be measured synchronously when the chip to be tested 500 is tested, and then compared with the reference chip to eliminate the influence of environmental factors on the measurement value.

[0057] Further, the reference carrier 640 has the same structure and size as the chip carrier 311. Specifically, the consistency of the reference assembly 600 and the testing assembly 320 further reduces the error.

[0058] Further, the straight vibration 120 comprises a conveying track 121 for conveying the chip to be tested 500, and a material feeding detection position is arranged at the front end of the conveying track 121; a material blocking plate 122 is arranged at the front end of the material feeding detection position. Specifically, the arrangement of the material blocking plate 122 in the embodiment can avoid the chip to be tested 500 from being separated from the conveying track 121.

[0059] Further, a cover plate 123 is arranged above the conveying track 121. Since the chip is relatively small, the cover plate 123 is arranged to avoid the chip from moving due to the influence of the external environment during the conveying process.

[0060] Further, the chip collection system 400 further comprises a vacuum suction driving part 422 electrically connected with the control system, and the vacuum suction driving part 422 is communicated with the collection box 420. The pickup component 410 comprises a vertically arranged suction pipe 411, and the bottom end of the suction pipe 411 is aligned with the to-be-tested chip 500 on the chip carrier 311. The collection box 420 is connected with the suction pipe 411 through a pipeline; in some embodiments, the pipeline is a hose. The suction pipe 411 is a hard pipe. Specifically, after the test is completed, the test assembly 320 feeds back the test result to the control system, the control system matches the to-be-tested chip 500 with the collection box 420 corresponding to the corresponding gear according to the test result, and the control system calculates the time when the to-be-tested chip 500 moves to below the pickup component 410 corresponding to the collection box 420 according to the rotation node of the rotating platform 310, and then controls the vacuum suction driving part 422 corresponding to the collection box 420 to work when the to-be-tested chip 500 rotates to below the pickup component 410, so as to adsorb the to-be-tested chip 500 into the collection box 420 of the gear. The structure is simple, and automatic gear collection is realized.

[0061] Further, the collection box 420 comprises a box body 421, a suction area 423 arranged on one side of the box body 421, and a partition plate 424 for separating the box body 421 and the suction area 423; for example, the suction area 423 is arranged on the back side of the box body 421. The vacuum suction driving part 422 is arranged below the suction area 423, the bottom of the suction area 423 is provided with a through hole 425, the through hole 425 is communicated with the vacuum suction driving part 422; the box body 421 is communicated with the suction area 423. In some embodiments, the partition plate 424 is provided with a hole groove, so as to realize the communication between the suction area 423 and the box body 421. Specifically, the partition plate 424 of the embodiment separates the box body 421 and the suction area 423, so as to ensure the suction force, so that the chip after the test is adsorbed into the box body 421. At the same time, it can also avoid that the chip is adsorbed into the through hole 425 due to large suction force.

[0062] Obviously, the above embodiments are only examples for clearly illustrating, and are not limitation to the embodiments. Based on the above description, other different forms of changes or variations can be made by those skilled in the art. Here, all the embodiments are not required to be exhausted, and the obvious changes or variations derived therefrom are still within the protection scope of the present application.

Claims

1. A small chip test handler, characterized by: The chip supply system comprises a circular vibrator, a linear vibrator connected to the front end of the circular vibrator, and a feeding sensor. The front end of the linear vibrator is provided with a feeding detection position, and the feeding sensor is arranged close to the feeding detection position. The chip handling system comprises a grabbing assembly and a chip suction nozzle connected to the grabbing assembly. The chip testing system comprises a rotating platform and a testing assembly. The rotating platform is provided with a plurality of chip carriers for placing test chips at equal intervals in the circumferential direction. The testing assembly comprises a testing assembly body, a first testing probe, and a second testing probe. The first testing probe and the second testing probe are respectively connected to the testing assembly. The chip collection system comprises a plurality of pickup components and a plurality of collection boxes. The pickup components are arranged above the rotating platform and correspond to the chip carriers rotating thereunder. The collection boxes are arranged one by one corresponding to the pickup components and are connected to the pickup components. A control system is electrically connected to the feeding sensor, the grabbing assembly, the testing assembly, and the chip collection system. The chip handling system, the chip testing system, and the chip collection system are sequentially arranged in the rotating direction of the rotating platform. The grabbing assembly comprises a servo drive part and a PPU manipulator connected to the servo drive part. The servo drive part and the PPU manipulator are respectively electrically connected to the control system. The servo drive part is connected to the PPU manipulator, and the servo drive part drives the PPU manipulator to move in the X direction and the Y direction. The PPU manipulator is connected to the chip suction nozzle.

2. The small chip test handler mechanism of claim 1, wherein: The chip handling system further comprises a pressing assembly connected between the PPU manipulator and the chip suction nozzle. The pressing assembly comprises a linear guide rail, a slider matched with the linear guide rail, and an elastic member. The linear guide rail is vertically arranged and connected to the PPU manipulator. The slider is connected to the chip suction nozzle. The elastic member is vertically arranged, one end of the elastic member is connected to the PPU manipulator, and the other end of the elastic member is connected to the slider.

3. The small chip test handler mechanism of claim 2, wherein: A vertically extending circular hole is arranged in the chip carrier. A conductive member with conductive performance is arranged in the circular hole. The conductive member is not conductive with the chip carrier. A test placement groove is formed in the part of the circular hole located at the top end of the conductive member, and the test chip is placed in the test placement groove.

4. The small chip test handler mechanism of claim 1, wherein: The axes of the first testing probe and the second testing probe coincide. The first testing probe and the second testing probe are respectively connected to the testing assembly body through a moving part. The moving part is electrically connected to the control system.

5. The small chip test handler mechanism of claim 1, wherein: The chip testing system further comprises a reference assembly electrically connected to the control system. The reference assembly is arranged close to the testing assembly. The reference assembly comprises a reference assembly body, a first reference probe, a second reference probe, a reference carrier, and a reference chip.

6. The small chip test handler mechanism of claim 1, wherein: The first reference probe and the second reference probe are respectively connected to the reference assembly body. ​ The reference carrier is arranged on the reference assembly body, and a reference chip placed on the reference carrier is in conduction with the first reference probe and the second reference probe.

7. The small chip test handler mechanism of claim 6, wherein: The reference carrier has the same structure and size as the chip carrier.

8. The small chip test handler mechanism of claim 1, wherein: The direct vibration includes a conveying track for conveying the to-be-tested chip, and the arrival detection position is arranged at the front end of the conveying track.

9. The small chip test handler mechanism of claim 8, wherein: A cover plate is arranged on the top of the conveying track.

10. The small chip test handler mechanism of claim 1, wherein: The chip collection system further comprises a vacuum suction driving part electrically connected with the control system, the vacuum suction driving part being in communication with the collection box; the pickup part comprises a vertically arranged suction pipe, the bottom end of the suction pipe being aligned with the to-be-tested chip on the chip carrier; and the collection box is connected with the suction pipe through a pipeline.

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