Laser engraver

Abstract

The application relates to the technical field of laser engraving and aims to solve the problem of how to improve the working reliability of a laser engraving machine, and provides a laser engraving machine, which comprises a laser module, a heat dissipation circuit, a liquid cooling device, a first temperature monitoring module, a second temperature monitoring module and a control module. The first pipeline is arranged in the laser module, and the second pipeline is arranged outside the laser module. The first temperature monitoring module is arranged in the laser module. The second temperature monitoring module is arranged in the liquid cooling device. The flow monitoring module is arranged in the heat dissipation circuit. The control module is used for controlling the liquid cooling device to enter a working state and controlling the laser module to enter a working state when the laser engraving machine meets preset working conditions, the preset working conditions comprising that the temperature monitored by the first temperature monitoring module is within a first preset temperature range and the temperature monitored by the second temperature monitoring module is within a second preset temperature range. The application has the beneficial effect of improving the working reliability of the laser engraving machine.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser engraving, in particular, relates to a laser engraving machine. BACKGROUND

[0002] A laser engraving machine is provided in the related art, which uses a heat dissipation device to dissipate heat for a laser module. However, the working reliability of the laser engraving machine in the related art is low. CONTENT OF THE UTILITY MODEL

[0003] The present application provides a laser engraving machine to solve the problem of how to improve the working reliability of the laser engraving machine.

[0004] Embodiments of the present application provide a laser engraving machine, which comprises a laser module, a heat dissipation circuit, a liquid cooling device, a first temperature monitoring module, a second temperature monitoring module and a control module. The heat dissipation circuit is used for circulating flow of a cooling medium; the heat dissipation circuit comprises a first pipeline and a second pipeline in communication at the first and second ends, the first pipeline is arranged in the laser module, and the second pipeline is located outside the laser module. The liquid cooling device is used for dissipating heat for the cooling medium in the second pipeline. The first temperature monitoring module is arranged in the laser module. The second temperature monitoring module is arranged in the liquid cooling device. The control module is communicatively connected to the first temperature monitoring module and the second temperature monitoring module, respectively, and is used for controlling the liquid cooling device to enter a working state and controlling the laser module to enter a working state when the laser engraving machine meets a preset working condition. The preset working condition comprises that the temperature monitored by the first temperature monitoring module is within a first preset temperature range, and the temperature monitored by the second temperature monitoring module is within a second preset temperature range.

[0005] The above laser engraving machine monitors the state of the laser module through the first temperature monitoring module and monitors the state of the liquid cooling device through the second temperature monitoring module, so as to control the liquid cooling device to enter the working state and control the laser module to enter the working state after ensuring that the laser module and the liquid cooling device can normally operate, thereby improving the working reliability of the laser engraving machine.

[0006] In one of the embodiments, the laser engraving machine further comprises a flow monitoring module, the flow monitoring module is arranged in the liquid cooling device, and the flow monitoring module is communicatively connected to the control module. The preset working condition further comprises that the flow monitored by the flow monitoring module is within a preset flow range.

[0007] In one of the embodiments, the control module comprises a laser engraving machine sensing unit and a liquid cooling device sensing unit. The laser engraving machine sensing unit is in communication connection with the laser module, the first temperature monitoring module and the liquid cooling device sensing unit respectively. The liquid cooling device sensing unit is in communication connection with the liquid cooling device, the second temperature monitoring module and the flow monitoring module respectively. The laser engraving machine sensing unit is used to send a self-check signal to the liquid cooling device sensing unit when the temperature monitored by the first temperature monitoring module is within the first preset temperature range, so that the liquid cooling device sensing unit responds to the self-check signal, thereby controlling the liquid cooling device to enter a self-check state, and controlling the second temperature monitoring module and the flow monitoring module to start monitoring.

[0008] In one of the embodiments, the laser engraving machine sensing unit is further used to control the liquid cooling device to enter an energy-saving state when the temperature monitored by the first temperature monitoring module is within a third preset temperature range; wherein the temperature of the third preset temperature range is lower than the temperature of the first preset temperature range; and / or

[0009] The laser engraving machine sensing unit is further used to control the liquid cooling device to enter an off state when the temperature monitored by the first temperature monitoring module is within a fourth preset temperature range; wherein the temperature of the fourth preset temperature range is lower than the temperature of the first preset temperature range.

[0010] In one of the embodiments, the liquid cooling device comprises a cooling medium radiator, the second pipeline is arranged through the cooling medium radiator, and the second temperature monitoring module is arranged in the cooling medium radiator. The cooling medium radiator is used to radiate the cooling medium flowing through the second pipeline.

[0011] In one of the embodiments, the liquid cooling device further comprises a refrigeration part, and the refrigeration part is provided with a refrigeration surface. The cooling medium radiator is mounted on the refrigeration surface.

[0012] In one of the embodiments, the refrigeration part is a semiconductor refrigeration sheet.

[0013] In one of the embodiments, the refrigeration part is further provided with a heat dissipation surface. The liquid cooling device further comprises a refrigeration part heat radiator mounted on the heat dissipation surface to radiate the refrigeration part.

[0014] In one of the embodiments, the liquid cooling device further comprises a heat dissipation fan arranged on the refrigeration part heat radiator.

[0015] In one of the embodiments, the laser module comprises a shell and a laser beam generator, and the laser beam generator and the first pipeline are arranged in the shell respectively. The control module is electrically connected with the laser beam generator to control the laser beam generator to enter a working state. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings in the embodiments will be briefly introduced as follows. It should be understood that the following drawings only show some of the embodiments of the present application, and therefore should not be considered as limiting the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0017] Figure 1 The structural block diagram of the laser engraving machine in an embodiment of the present application.

[0018] Main element symbol explanation:

[0019] Laser engraving machine 100

[0020] Laser module 10

[0021] Heat dissipation circuit 20

[0022] First pipe 21

[0023] Second pipe 22

[0024] Liquid cooling device 30

[0025] Cooling medium radiator 31

[0026] Refrigeration part 32

[0027] Refrigeration surface 321

[0028] Heat dissipation surface 322

[0029] Refrigeration part radiator 33

[0030] Heat dissipation fan 34

[0031] Driving device 35

[0032] Box 36

[0033] First temperature monitoring module 40

[0034] Second temperature monitoring module 50

[0035] Flow monitoring module 60

[0036] Control module 70

[0037] Laser engraving machine sensing unit 71

[0038] Liquid cooling device sensing unit 72

[0039] First power supply 80

[0040] Second power supply 90

[0041] The following specific embodiments will further illustrate the present application in combination with the above drawings. Detailed Implementation

[0042] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0043] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. When a component is said to be "set on" another component, it can be directly set on the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "or / and" as used herein includes any and all combinations of one or more of the associated listed items.

[0045] Some embodiments of this application are described in detail. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0046] Example

[0047] Figure 1 This is a structural block diagram of a laser engraving machine 100 according to an embodiment of this application.

[0048] See Figure 1The embodiment provides a laser engraving machine 100, which comprises a laser module 10, a heat dissipation loop 20, a liquid cooling device 30, a first temperature monitoring module 40, a second temperature monitoring module 50 and a control module 70. The heat dissipation loop 20 is used for circulating flow of a cooling medium, and comprises a first pipeline 21 and a second pipeline 22 which are in communication. The first pipeline 21 is arranged in the laser module 10, and the second pipeline 22 is arranged outside the laser module 10. The liquid cooling device 30 is used for dissipating heat of the cooling medium in the second pipeline 22. The first temperature monitoring module 40 is arranged in the laser module 10, and the second temperature monitoring module 50 is arranged in the liquid cooling device 30. The control module 70 is in communication connection with the first temperature monitoring module 40 and the second temperature monitoring module 50 respectively, and is used for controlling the liquid cooling device 30 to enter a working state and controlling the laser module 10 to enter a working state when the laser engraving machine 100 meets preset working conditions. The preset working conditions include that a temperature monitored by the first temperature monitoring module 40 is within a first preset temperature range, and a temperature monitored by the second temperature monitoring module 50 is within a second preset temperature range.

[0049] The laser engraving machine 100 described above monitors the state of the laser module 10 through the first temperature monitoring module 40, and monitors the state of the liquid cooling device 30 through the second temperature monitoring module 50, so that the liquid cooling device 30 is controlled to enter the working state and the laser module 10 is controlled to enter the working state after it is ensured that the laser module 10 and the liquid cooling device 30 can normally operate, thereby improving the working reliability of the laser engraving machine 100 and avoiding damage caused by entering the working state when the laser module 10 or the liquid cooling device 30 is abnormal. Optionally, when any one of the temperature monitored by the first temperature monitoring module 40 and the temperature monitored by the second temperature monitoring module 50 is abnormal, the control module 70 controls the laser module 10 and the liquid cooling device 30 to pause, and reminds a user to detect the laser module 10 and the liquid cooling device 30 through a sound signal and a light signal, so as to avoid abnormal use and affect the use performance and service life of the laser engraving machine 100.

[0050] It should be noted that the related art provides a laser engraving machine, which is cooled through a forced air cooling assembly arranged in the laser module. When the power of the laser module increases and has higher heat dissipation requirements, the volume and weight of the laser module in the related art increase, so that the load of a movement mechanism for driving the laser module becomes larger, the running speed is affected, and the wear of structural parts is aggravated, thereby affecting the service life of the machine. In addition, the laser engraving machine in the related art generates smoke dust when engraving materials such as wood plates, and the forced air cooling assembly in the laser module is easy to suck in the smoke dust, block the air duct and affect the heat dissipation effect, thereby affecting the output optical power of the laser module.

[0051] The laser engraving machine 100 provided by the embodiment is provided with the heat dissipation loop 20, so that the heat in the laser module 10 is guided to the second pipeline 22 by the cooling medium, and the cooling medium in the second pipeline 22 is cooled by the liquid cooling device 30. Since the second pipeline 22 and the liquid cooling device 30 are located outside the laser module 10, the volume and weight of the laser module 10 are avoided to be increased, so that the load of the movement mechanism for driving the laser module 10 is reduced, thereby being beneficial to improve the operation speed and operation stability of the laser module 10 and reduce the abrasion of the structural parts. Moreover, since the liquid cooling device 30 is not affected by the smoke generated by the laser module 10 during operation, the heat dissipation reliability of the liquid cooling device 30 to the laser module 10 is improved, the service life of the laser engraving machine 100 is prolonged, and the user does not need to frequently disassemble the laser module 10 for cleaning, thereby improving the user experience.

[0052] In some embodiments, as shown in Figure 1 The laser engraving machine 100 further comprises a flow monitoring module 60, the flow monitoring module 60 is arranged in the liquid cooling device 30, and the flow monitoring module 60 is in communication connection with the control module 70. The preset working condition further comprises that the flow monitored by the flow monitoring module 60 is within a preset flow range. In this way, by arranging the flow monitoring module 60, the state of the liquid cooling device 30 is more comprehensively monitored, so as to further ensure that the liquid cooling device 30 can normally operate, thereby further improving the working reliability of the liquid cooling device 30.

[0053] Optionally, the first temperature monitoring module 40 and the second temperature monitoring module 50 can both adopt temperature sensors or thermistors, and the flow monitoring module 60 can adopt a flow sensor. The position of the flow monitoring module 60 on the heat dissipation loop 20 is not limited, for example, the flow monitoring module 60 can be arranged on the first pipeline 21 or the second pipeline 22, for monitoring whether the cooling medium normally flows and the flow speed of the cooling medium.

[0054] In some embodiments, as shown in Figure 1As shown, the control module 70 comprises a laser engraving machine sensing unit 71 and a liquid cooling device sensing unit 72. The laser engraving machine sensing unit 71 is communicatively connected with the laser module 10, the first temperature monitoring module 40 and the liquid cooling device sensing unit 72 respectively. The liquid cooling device sensing unit 72 is communicatively connected with the liquid cooling device 30, the second temperature monitoring module 50 and the flow monitoring module 60 respectively. The laser engraving machine sensing unit 71 is configured to send a self-check signal to the liquid cooling device sensing unit 72 when the temperature monitored by the first temperature monitoring module 40 is within the first preset temperature range, so that the liquid cooling device sensing unit 72 responds to the self-check signal to control the liquid cooling device 30 to enter a self-check state and control the second temperature monitoring module 50 and the flow monitoring module 60 to start monitoring. In this way, the liquid cooling device 30 is first caused to enter the self-check state, and then the liquid cooling device 30 is controlled to enter a working state when the temperature monitored by the second temperature monitoring module 50 is within the second preset temperature range and the flow monitored by the flow monitoring module 60 is within a preset flow range, so as to ensure that the liquid cooling device 30 can operate normally.

[0055] Optionally, the laser engraving machine sensing unit 71 and the liquid cooling device sensing unit 72 can be arranged on different circuit boards, for example, the circuit board on which the laser engraving machine sensing unit 71 is arranged can be arranged in the laser module 10, and the circuit board on which the liquid cooling device sensing unit 72 is arranged can be arranged in the liquid cooling device 30. In other embodiments, the laser engraving machine sensing unit 71 and the liquid cooling device sensing unit 72 can also be integrated on the same circuit board.

[0056] In some embodiments, the temperature monitored by the first temperature monitoring module 40 is directly transmitted back to the laser engraving machine sensing unit 71. In other embodiments, the first temperature monitoring module 40 is communicatively connected with the laser engraving machine sensing unit 71 through a single-chip microcomputer to indirectly transmit the monitored temperature back to the laser engraving machine sensing unit 71.

[0057] In some embodiments, when the liquid cooling device 30 enters the working state and the laser module 10 enters the working state, the first temperature monitoring module 40, the second temperature monitoring module 50 and the flow monitoring module 60 continue to detect. The laser engraving machine sensing unit 71 is configured to control the laser engraving machine 100 to pause working and alarm through a sound signal or a light signal when any one of the temperature monitored by the first temperature monitoring module 40, the temperature monitored by the second temperature monitoring module 50 and the flow monitored by the flow monitoring module 60 is abnormal, so as to remind the user to detect, thereby avoiding damage to the machine due to abnormal use.

[0058] In some embodiments, the laser engraving machine sensing unit 71 is further configured to control the liquid cooling device 30 to enter an energy-saving state when the temperature monitored by the first temperature monitoring module 40 is within a third preset temperature range, wherein the temperature of the third preset temperature range is lower than the temperature of the first preset temperature range. In this way, the liquid cooling device 30 is controlled to enter the energy-saving state when the heat generated by the laser module 10 is relatively small, so as to reduce the refrigeration intensity of the liquid cooling device 30, thereby reducing the power consumption and noise of the liquid cooling device 30. Optionally, in the energy-saving state, the working intensity of the liquid cooling device 30 is reduced, or the working time of the liquid cooling device 30 is reduced.

[0059] In some embodiments, the laser engraving machine sensing unit 71 is further configured to control the liquid cooling device 30 to enter an off state when the temperature monitored by the first temperature monitoring module 40 is within a fourth preset temperature range, wherein the temperature of the fourth preset temperature range is lower than the temperature of the first preset temperature range. In this way, when the laser module 10 is not operated after being powered on, or when the laser module 10 has completed engraving or cutting for a certain period of time, the liquid cooling device 30 is controlled to enter the off state when the temperature of the laser module 10 is relatively low, so as to further reduce the power consumption and noise of the liquid cooling device 30.

[0060] In some embodiments, the temperature of the fourth preset temperature range is lower than the temperature of the third preset temperature range, and the laser engraving machine sensing unit 71 is configured to control the liquid cooling device 30 to enter the off state when the laser module 10 is in the standby state and when the temperature monitored by the first temperature monitoring module 40 is within the fourth preset temperature range.

[0061] In some embodiments, as shown in FIG. 1, Figure 1 The liquid cooling device 30 includes a cooling medium radiator 31, the second pipeline 22 passes through the cooling medium radiator 31, and the second temperature monitoring module 50 is arranged in the cooling medium radiator 31. The cooling medium radiator 31 is configured to cool the cooling medium flowing through the second pipeline 22. Optionally, the second temperature monitoring module 50 is embedded in the cooling medium radiator 31 and is configured to monitor the cooling condition of the cooling medium in the cooling medium radiator 31.

[0062] In some embodiments, the liquid cooling device 30 further includes a refrigeration component 32, and the refrigeration component 32 is provided with a refrigeration surface 321, and the cooling medium radiator 31 is mounted on the refrigeration surface 321. In this way, by arranging the refrigeration component 32, the heat dissipation effect of the cooling medium in the cooling medium radiator 31 is improved.

[0063] In some embodiments, the refrigeration component 32 is a semiconductor refrigeration sheet.

[0064] In some embodiments, the refrigeration component 32 is further provided with a heat dissipation surface 322, and the liquid cooling device 30 further comprises a refrigeration component heat sink 33, which is installed on the heat dissipation surface 322 to dissipate heat from the refrigeration component 32, so as to ensure that the refrigeration component 32 can work normally and stably.

[0065] In some embodiments, the liquid cooling device 30 further comprises a heat dissipation fan 34, which is arranged on the refrigeration component heat sink 33 to assist the refrigeration component heat sink 33 in dissipating heat from the refrigeration component 32.

[0066] In some embodiments, the liquid cooling device 30 further comprises a driving device 35 (such as a water pump), which is used to drive the cooling medium to flow in the heat dissipation loop 20. Optionally, the control module 70 is communicatively connected to the driving device 35 to drive the driving device 35 to work. Optionally, the driving device 35 is arranged on the second pipeline 22.

[0067] In use, the cooling medium is driven by the driving device 35 to flow through the laser module 10 and carry the heat of the laser module 10 to the cooling medium heat sink 31, and the heat generated by the heat dissipation surface 322 of the refrigeration component 32 is dissipated through the refrigeration component heat sink 33 and the heat dissipation fan 34.

[0068] In some embodiments, the control module 70 drives the driving device 35, the refrigeration component 32 and the heat dissipation fan 34 to enter the working state or the self-checking state, respectively.

[0069] In some embodiments, the liquid cooling device 30 further comprises a tank 36, which is connected to the second pipeline 22 and is used to store the cooling medium (such as water cooling liquid). The driving device 35 can draw the cooling medium from the tank 36, flow through the laser module 10 and the cooling medium heat sink 31 through the second pipeline 22, and then flow back to the tank 36. In this way, by arranging the tank 36, it is convenient to add the cooling medium to the tank 36.

[0070] In some embodiments, the laser module 10 comprises a housing and a laser beam generator (such as a laser diode chip), and the laser beam generator and the first pipeline 21 are arranged in the housing, respectively. The control module 70 is electrically connected to the laser beam generator to control the laser beam generator to enter the working state. Optionally, in the working state, the laser engraving machine sensing unit 71 is used to control the laser beam generator to output laser.

[0071] In some embodiments, the control module 70 further comprises a laser module sensing unit, which is in communication connection with the laser engraving machine sensing unit 71 and is provided with direct current power supply and signals (PWM signals or analog signals) by the laser engraving machine sensing unit 71. The temperature monitored by the second temperature monitoring module 50 is directly collected by the laser engraving machine sensing unit 71 or indirectly collected by the laser engraving machine sensing unit 71 in communication with the laser module sensing unit, for judging whether the laser module 10 works normally or the heat dissipation is normal.

[0072] Optionally, the second temperature monitoring module 50 is embedded in a structural member of the laser beam generator. The first pipeline 21 is provided with an inlet and an outlet, one end of the second pipeline 22 is in communication with the inlet, and the other end of the second pipeline 22 is in communication with the outlet.

[0073] In some embodiments, the laser engraving machine 100 further comprises a first power supply 80 and a second power supply 90, the first power supply 80 is in electrical connection with the laser engraving machine sensing unit 71 to supply power for the laser engraving machine sensing unit 71, and the second power supply 90 is in electrical connection with the liquid cooling device sensing unit 72 to supply power for the liquid cooling device sensing unit 72.

[0074] The embodiments of the present application further provide a control method of the laser engraving machine 100, which comprises the following steps:

[0075] S110: The laser engraving machine sensing unit 71 acquires the temperature monitored by the first temperature monitoring module 40 and judges whether the temperature monitored by the first temperature monitoring module 40 is within the first preset temperature range.

[0076] S120: If the temperature monitored by the first temperature monitoring module 40 is within the first preset temperature range, the laser engraving machine sensing unit 71 sends a self-check signal to the liquid cooling device sensing unit 72 to make the liquid cooling device 30 respond to the self-check signal, so as to control the liquid cooling device 30 to enter a self-check state, and judge whether the temperature monitored by the second temperature monitoring module 50 is within the second preset temperature range and whether the flow monitored by the flow monitoring module 60 is within the preset flow range.

[0077] S130: If the temperature monitored by the second temperature monitoring module 50 is within the second preset temperature range and the flow monitored by the flow monitoring module 60 is within the preset flow range, the laser engraving machine sensing unit 71 controls the liquid cooling device 30 to enter a working state and controls the laser module 10 to enter a working state; the laser engraving machine sensing unit 71 judges whether the temperature monitored by the first temperature monitoring module 40 is within the first preset temperature range, whether the temperature monitored by the second temperature monitoring module 50 is within the second preset temperature range, and whether the flow monitored by the flow monitoring module 60 is within the preset flow range.

[0078] S140: If the temperature monitored by the first temperature monitoring module 40 is within the first preset temperature range, the temperature monitored by the second temperature monitoring module 50 is within the second preset temperature range, and the flow monitored by the flow monitoring module 60 is within the preset flow range, the laser engraving machine sensing unit 71 controls the laser beam generator to output laser.

[0079] In some embodiments, after S120, the control method of the laser engraving machine 100 further comprises:

[0080] S131: If any one of the temperature monitored by the first temperature monitoring module 40, the temperature monitored by the second temperature monitoring module 50, and the flow monitored by the flow monitoring module 60 is abnormal, the laser engraving machine sensing unit 71 controls the laser engraving machine 100 to pause work and alarms through a sound signal or a light signal.

[0081] In some embodiments, after S130, the control method of the laser engraving machine 100 further comprises:

[0082] S141: If any one of the temperature monitored by the first temperature monitoring module 40, the temperature monitored by the second temperature monitoring module 50, and the flow monitored by the flow monitoring module 60 is abnormal, the laser engraving machine sensing unit 71 controls the laser engraving machine 100 to pause work and alarms through a sound signal or a light signal.

[0083] In some embodiments, the control method of the laser engraving machine 100 further comprises:

[0084] S210: The liquid cooling device sensing unit 72 is connected in communication with the laser engraving machine sensing unit 71.

[0085] S210: When the liquid cooling device sensing unit 72 receives the self-check signal, it enters a self-check state, which includes: obtaining the temperature monitored by the second temperature monitoring module 50 and the flow monitored by the flow monitoring module 60, and determining whether the temperature monitored by the second temperature monitoring module 50 is within the second preset temperature range, and determining whether the flow monitored by the flow monitoring module 60 is within the preset flow range.

[0086] S220: If the temperature monitored by the second temperature monitoring module 50 is within the second preset temperature range, and the flow monitored by the flow monitoring module 60 is within the preset flow range, the liquid cooling device sensing unit 72 controls the liquid cooling device 30 to enter a working state when it receives a control signal, and determines whether the temperature monitored by the second temperature monitoring module 50 is within the second preset temperature range, and determines whether the flow monitored by the flow monitoring module 60 is within the preset flow range.

[0087] S230: When at least one of the temperature monitored by the second temperature monitoring module 50 and the flow monitored by the flow monitoring module 60 is abnormal, the liquid cooling device sensing unit 72 controls the liquid cooling device 30 to suspend refrigeration and alarms through a sound signal or a light signal.

[0088] The above embodiments are only used to illustrate the technical solutions of the present application but not limit the present application, and although the present application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A laser engraver characterized by, The laser engraving machine comprises: a laser module; a heat dissipation loop for circulating cooling medium; the heat dissipation loop comprises a first pipe and a second pipe connected in series, the first pipe is arranged in the laser module, and the second pipe is arranged outside the laser module; a liquid cooling device for dissipating heat of the cooling medium in the second pipe; a first temperature monitoring module arranged in the laser module; a second temperature monitoring module arranged in the liquid cooling device; a control module, the control module is respectively connected with the first temperature monitoring module and the second temperature monitoring module, and the control module is used for controlling the liquid cooling device to enter a working state and controlling the laser module to enter a working state when the laser engraving machine meets a preset working condition. The preset working condition comprises that the temperature monitored by the first temperature monitoring module is within a first preset temperature range, and the temperature monitored by the second temperature monitoring module is within a second preset temperature range.

2. The laser engraver of claim 1, wherein, The laser engraving machine further comprises a flow monitoring module, the flow monitoring module is arranged in the liquid cooling device, and the flow monitoring module is connected with the control module in communication. The preset working condition further comprises that the flow monitored by the flow monitoring module is within a preset flow range.

3. The laser engraver of claim 2, wherein, The control module comprises a laser engraving machine sensing unit and a liquid cooling device sensing unit. The laser engraving machine sensing unit is connected with the laser module, the first temperature monitoring module and the liquid cooling device sensing unit in communication. The liquid cooling device sensing unit is connected with the liquid cooling device, the second temperature monitoring module and the flow monitoring module in communication. The laser engraving machine sensing unit is used for sending a self-check signal to the liquid cooling device sensing unit when the temperature monitored by the first temperature monitoring module is within the first preset temperature range, so that the liquid cooling device sensing unit responds to the self-check signal, thereby controlling the liquid cooling device to enter a self-check state and controlling the second temperature monitoring module and the flow monitoring module to start monitoring.

4. The laser engraver of claim 3, wherein, The laser engraving machine sensing unit is further used for controlling the liquid cooling device to enter an energy-saving state when the temperature monitored by the first temperature monitoring module is within a third preset temperature range; wherein the temperature of the third preset temperature range is lower than the temperature of the first preset temperature range; and / or The laser engraving machine sensing unit is further used for controlling the liquid cooling device to enter an off state when the temperature monitored by the first temperature monitoring module is within a fourth preset temperature range; wherein the temperature of the fourth preset temperature range is lower than the temperature of the first preset temperature range.

5. The laser engraver of claim 1, wherein, The liquid cooling device comprises a cooling medium radiator, the second pipe is arranged in the cooling medium radiator, and the second temperature monitoring module is arranged in the cooling medium radiator. The cooling medium radiator is used for dissipating heat of the cooling medium flowing through the second pipe.

6. The laser engraver of claim 5, wherein, The liquid cooling device further comprises a refrigeration piece, and the refrigeration piece is provided with a refrigeration surface. The cooling medium radiator is mounted on the refrigeration surface.

7. The laser engraver of claim 6, wherein, The refrigeration piece is a semiconductor refrigeration piece.

8. The laser engraver of claim 6, wherein, The refrigeration piece is further provided with a heat dissipation surface. The liquid cooling device further comprises a refrigeration component radiator installed on the heat dissipation surface to dissipate heat of the refrigeration component.

9. The laser engraver of claim 8, wherein, The liquid cooling device further comprises a heat dissipation fan arranged on the refrigeration component radiator.

10. The laser engraver of claim 1, wherein, The laser module comprises a shell and a laser beam generator, and the laser beam generator and the first pipeline are arranged in the shell respectively. The control module is electrically connected with the laser beam generator to control the laser beam generator to enter a working state.

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