Grinding liquid supply device and grinding equipment

Abstract

The utility model relates to a grinding fluid supply device and grinding equipment, and the grinding fluid supply device comprises a grinding fluid supply arm which is movably arranged on a grinding platform; the liquid injection pipeline is used for providing cleaning liquid for the grinding platform, the free end of the grinding liquid supply arm is provided with a nozzle communicated with the liquid injection pipeline, and the nozzle is arranged towards the grinding platform; and the suction pipeline is installed on the side of the grinding fluid supply arm, the air inlet end of the suction pipeline is arranged close to the nozzle, and the suction pipeline is used for sucking air at the air inlet end. Therefore, cleaning liquid provided by the liquid injection pipeline can be sprayed to the grinding platform through the nozzle to wash used slurry, grinding residues and the like, at the moment, the suction pipeline carries out air suction work, and water vapor, slurry, grinding residues and the like which are backsplashed during washing are sucked to the suction pipeline and are prevented from polluting and scratching other surrounding parts by the water vapor, the slurry, the grinding residues and the like.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of semiconductor technology, and in particular, to a polishing liquid supply device and a polishing equipment. BACKGROUND

[0002] With the development of microelectronic integrated circuits towards miniaturization, multi-layer, thinness, and planarization process, chemical mechanical polishing technology has developed into a chemical mechanical polishing technology which takes a chemical mechanical polishing machine as the main body and integrates online detection, endpoint detection, cleaning, etc.

[0003] Polishing is an important process in the process of silicon wafer processing. When polishing and polishing the silicon wafer, the silicon wafer is adsorbed and fixed, and the silicon wafer is rotated and polished by the polishing pad under a certain pressure. At the same time, the polishing liquid is sprayed into the polishing pad, and the polishing pad polishes the silicon wafer under the action of the polishing liquid. In the polishing process, by-products will be generated on the polishing pad. In the related technology, the polishing liquid supply arm will provide high-pressure ultrapure water to clean the by-products in the polishing process. However, during the flushing process, water vapor and polishing residues and other dirt will be splashed to the surrounding parts by the water column, causing pollution to the surrounding parts, easily causing scratches on the silicon wafer, and causing a large amount of production loss. CONTENT OF THE INVENTION

[0004] The purpose of the present disclosure is to provide a polishing liquid supply device and a polishing equipment to at least partially solve the problems in the related art.

[0005] In order to achieve the above-mentioned purpose, the present disclosure provides a polishing liquid supply device, comprising:

[0006] A polishing liquid supply arm movably arranged on a polishing platform;

[0007] A liquid injection pipeline for providing cleaning liquid to the polishing platform, a free end of the polishing liquid supply arm is provided with a nozzle in communication with the liquid injection pipeline, and the nozzle is arranged towards the polishing platform; and

[0008] A suction pipeline installed on the side of the polishing liquid supply arm, and the air inlet end of the suction pipeline is arranged close to the nozzle, and the suction pipeline is used to suck air at the air inlet end.

[0009] Optionally, the polishing liquid supply device further comprises:

[0010] A sensor for monitoring whether the nozzle sprays liquid;

[0011] A controller electrically connected with the sensor, configured to send an air suction signal when the sensor monitors that the nozzle sprays liquid; and

[0012] A control valve is connected with the suction pipeline and the controller respectively, and is used to open to perform suction after receiving the suction signal.

[0013] Optionally, the end of the polishing liquid supply arm provided with the nozzle is further provided with a cover, which is arranged obliquely towards the polishing platform to cover the nozzle below the cover.

[0014] Optionally, a plurality of the suction pipelines are installed on the polishing liquid supply arm.

[0015] Optionally, the polishing liquid supply device comprises two suction pipelines, which are respectively installed on opposite sides of the polishing liquid supply arm.

[0016] Optionally, the injection pipeline is connected with a high-pressure pump.

[0017] Optionally, the suction pipeline is connected with a gas-liquid separator, which is used to perform gas-liquid separation on the medium sucked into the suction pipeline.

[0018] Optionally, the gas-liquid separator has a gas outlet and a liquid outlet, the gas outlet is connected to a gas discharge conduit, and the liquid outlet is connected to a waste liquid conduit.

[0019] Optionally, the polishing platform is provided with a polishing pad, which is used to polish a silicon wafer.

[0020] According to the second aspect of the present disclosure, a polishing device is further provided, which comprises a polishing platform and the above-mentioned polishing liquid supply device.

[0021] Through the above technical solution, the cleaning liquid provided by the injection pipeline can be sprayed to the polishing platform through the nozzle to flush the used slurry, polishing residues and the like, at this time, the suction pipeline performs suction work to suck the flushing back-splashed water vapor, slurry and polishing residues into the suction pipeline, so as to avoid pollution and scratching to other surrounding components.

[0022] Other features and advantages of the present disclosure will be described in detail in the following specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0023] The accompanying drawings are included to provide a further understanding of the present disclosure and constitute a part of the specification, which together with the following detailed description, serve to explain the present disclosure. In the drawings:

[0024] Figure 1 is a structural schematic diagram of a polishing device provided by an exemplary embodiment of the present disclosure;

[0025] Figure 2is another perspective view of the polishing apparatus according to an example embodiment of the present disclosure.

[0026] Reference Signs List

[0027] 1 - polishing platform; 11 - polishing pad; 2 - polishing liquid supply arm; 201 - base; 202 - arm body; 21 - nozzle; 22 - cover; 3 - suction line; 4 - gas-liquid separator; 51 - exhaust conduit; 52 - waste liquid conduit DETAILED DESCRIPTION

[0028] The specific embodiments of the present disclosure will be described below in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely intended to illustrate and explain the present disclosure, and are not intended to limit the present disclosure.

[0029] In the present disclosure, the orientation words "upper", "lower", "left", "right" used are defined based on the actual direction of use of the relevant components. "Inner" and "outer" are in relation to the contour of the respective components. In the present disclosure, the following description refers to the drawings, and unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0030] Reference Signs List Figure 1 , Figure 2 The present disclosure provides a polishing liquid supply device, which can include a polishing liquid supply arm 2, a liquid injection line, and a suction line 3, wherein the polishing liquid supply arm 2 is movably arranged on a polishing platform 1; the liquid injection line is used to provide cleaning liquid to the polishing platform 1, specifically, the cleaning liquid can be pure water, and the free end of the polishing liquid supply arm 2 is provided with a nozzle 21 in communication with the liquid injection line, the nozzle 21 is arranged towards the polishing platform 1, wherein the liquid injection line can be fixed on the polishing liquid supply arm 2, the liquid injection line is in communication with a cleaning liquid storage device at the liquid inlet end, and in communication with the nozzle 21 at the liquid outlet end, the number of nozzles 21 can be multiple, which can produce an atomization effect on the cleaning liquid; the suction line 3 is installed on the side of the polishing liquid supply arm 2, and the air inlet end of the suction line 3 is arranged close to the nozzle 21, and the suction line 3 is used to suck in the air at the air inlet end.

[0031] In the chemical mechanical grinding of the silicon wafer, the silicon wafer is adsorbed and fixed, the grinding platform 1 is rotated, and then the silicon wafer is ground by using the grinding head and the grinding pad. During the grinding process, the grinding liquid pipeline supplies the grinding liquid to the grinding platform 1. The base 201 of the grinding liquid supply arm 2 is fixed, and the arm body 202 of the grinding liquid supply arm 2 can be horizontally rotated and can be finely adjusted up and down, but when the height of the arm body 202 is adjusted, it must be ensured that it cannot interfere with other moving parts, and the final position is determined by the required position of the grinding liquid. The nozzle 21 is installed on the arm body 202, and by rotating the arm body 202, the nozzle 21 can maintain a suitable horizontal angle with the grinding platform 1, so that the poor angle between the nozzle 21 and the grinding platform 1 does not cause poor cleaning effect and water column splashing, thereby ensuring uniform and sufficient supply of cleaning liquid during the cleaning process, thereby ensuring the cleaning effect.

[0032] Through the above technical scheme, the cleaning liquid provided by the liquid injection pipeline can be sprayed to the grinding platform through the nozzle to flush the used slurry, grinding residues and the like. At this time, the suction pipeline performs the air suction work, and the rinsing back-splashed water vapor and the slurry, grinding residues and the like are sucked into the suction pipeline, so as to avoid pollution and scratching of the surrounding other components.

[0033] In some embodiments, the grinding liquid supply device can further include a sensor, a controller and a control valve, wherein the sensor is used to monitor whether the nozzle 21 sprays liquid; the controller is electrically connected with the sensor and is used to send an air suction signal when the sensor monitors that the nozzle 21 sprays liquid; and the control valve is connected with the suction pipeline 3 and the controller respectively and is used to open to perform air suction after receiving the air suction signal. Specifically, the control valve can be a pneumatic valve, which is corrosion-resistant and adjustable in opening degree, can prevent the valve body from being corroded by acid and alkali to affect its working performance, and ensures the reliability of the grinding liquid supply device. The pneumatic valve has fast execution speed, light switch, small size, receives the air suction signal through the pneumatic valve, and opens to perform air suction after receiving the air suction signal, so the program is simple and reliable and convenient to maintain. Specifically, when the sensor monitors that the nozzle 21 sprays liquid, the controller sends an air suction signal, and the control valve receives the air suction signal of the controller and performs air suction, which can carry away the grinding by-products generated during the grinding process to reduce the scratch defects of the silicon wafer caused by the grinding by-products during the grinding process, and greatly reduces the scratch and particle generation of the silicon wafer.

[0034] In some embodiments, with reference to Figure 1The end of the polishing liquid supply arm 2 provided with the nozzle 21 can also be provided with a cover 22, which is inclined towards the polishing platform 1 to cover the nozzle 21 below the cover 22. After the cleaning liquid is sprayed from the nozzle 21 to the polishing platform 1, the slurry, polishing residues and the like will splash upwards or obliquely upwards, which will be blocked by the cover 22 during the splashing process, and then guided to the air inlet end of the suction pipeline 3. This setting can avoid dirty splashing and affect the suction effect. Specifically, the cover 22 can be made of an acid and alkali resistant material, such as PTFE (Polytetrafluoroethylene), to prevent the cover 22 from being corroded and damaged by acid and alkali. In some embodiments, the cover 22 can be bent and inclined downward to guide the splashed slurry, polishing residues and the like to the air inlet end of the suction pipeline 3.

[0035] The polishing liquid supply arm 2 can be provided with a plurality of suction pipelines 3. The plurality of suction pipelines 3 can be fixed to the polishing liquid supply arm 2 by clamping, screwing, welding or the like. In addition, the number of suction pipelines 3 is not limited in the present disclosure, and all belong to the protection scope of the present disclosure.

[0036] Further, referring to Figure 2 The polishing liquid supply device can include two suction pipelines 3, which are respectively installed on opposite sides of the polishing liquid supply arm 2. Specifically, the two suction pipelines 3 can be respectively installed on the left and right sides or the upper and lower sides of the polishing liquid supply arm 2.

[0037] In some embodiments, the liquid injection pipeline can be connected with a high-pressure pump to enable the nozzle 21 to spray a high-pressure water column to improve the cleaning effect.

[0038] As an exemplary embodiment of the present disclosure, referring to Figure 1 The suction pipeline 3 can be connected with a gas-liquid separator 4 for gas-liquid separation of the medium sucked into the suction pipeline 3. By separating the gas in the medium, it can avoid the existence of gas residues in the waste liquid conduit 52, which can cause blockage.

[0039] Further, referring to Figure 1 The gas-liquid separator 4 can have an exhaust port connected to an exhaust conduit 51 and a liquid outlet connected to a waste liquid conduit 52, so as to recycle the waste liquid.

[0040] The polishing platform 1 can be provided with a polishing pad 11 for polishing the silicon wafer. The nozzle 21 sprays cleaning liquid to the polishing pad 11 to flush the used slurry, polishing residues and the like on the polishing pad 11.

[0041] According to a second aspect of the present disclosure, as Figure 1As shown, a grinding device is also provided, which can include the grinding platform 1 and the above-mentioned grinding fluid supply device. The grinding device has the same advantages as the grinding fluid supply device described above relative to the prior art, and will not be described again here.

[0042] The preferred embodiments of the present disclosure are described in detail above in combination with the drawings, but the present disclosure is not limited to the specific details in the above-described embodiments. Within the technical concept scope of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.

[0043] In addition, it should be noted that each specific technical feature described in the above specific embodiments can be combined in any appropriate manner without contradiction. In order to avoid unnecessary repetition, various possible combinations are not described again in the present disclosure.

[0044] In addition, various different embodiments of the present disclosure can also be combined in any manner as long as they do not deviate from the idea of the present disclosure, and they should also be considered as disclosed by the present disclosure.

Claims

1. A grinding fluid supply device, characterized in that, include: The grinding fluid supply arm is movably mounted on the grinding platform; The liquid injection line is used to supply cleaning fluid to the grinding platform. The free end of the grinding fluid supply arm is provided with a nozzle that is connected to the liquid injection line and the nozzle is oriented toward the grinding platform. as well as A suction line is installed on the side of the grinding fluid supply arm, and the air inlet end of the suction line is located close to the nozzle. The suction line is used to draw in air from the air inlet end.

2. The grinding fluid supply device according to claim 1, characterized in that, The grinding fluid supply device further includes: A sensor is used to monitor whether the nozzle is spraying liquid; A controller, electrically connected to the sensor, is configured to issue a suction signal when the sensor detects liquid being ejected from the nozzle; and A control valve, connected to both the suction line and the controller, is used to open upon receiving the suction signal to perform suction.

3. The grinding fluid supply device according to claim 1, characterized in that, The end of the grinding fluid supply arm with the nozzle is also provided with a protective cover, which is inclined toward the grinding platform so as to cover the nozzle under the protective cover.

4. The grinding fluid supply device according to claim 1, characterized in that, The grinding fluid supply arm is equipped with multiple suction lines.

5. The grinding fluid supply device according to claim 4, characterized in that, The grinding fluid supply device includes two suction lines, which are respectively installed on opposite sides of the grinding fluid supply arm.

6. The grinding fluid supply device according to claim 1, characterized in that, The injection pipeline is connected to a high-pressure pump.

7. The grinding fluid supply device according to any one of claims 1-6, characterized in that, The suction line is connected to a gas-liquid separator for gas-liquid separation of the medium drawn into the suction line.

8. The grinding fluid supply device according to claim 7, characterized in that, The gas-liquid separator has an exhaust port and a liquid discharge port. The exhaust port is connected to an exhaust pipe, and the liquid discharge port is connected to a waste liquid pipe.

9. The grinding fluid supply device according to claim 1, characterized in that, The grinding platform is equipped with a grinding pad for grinding silicon wafers.

10. A grinding apparatus, characterized in that, It includes a grinding platform and a grinding fluid supply device as described in any one of claims 1 to 9.

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