Positioning and cutting device for wafer processing

Abstract

The utility model belongs to the technical field of wafer processing, and particularly relates to a wafer processing, positioning and cutting device which comprises a base and a conveying chain, the conveying chain is installed at the front end in the base, and the outer ends of the base and the conveying chain are connected with a cutting mechanism. According to the wafer processing, positioning and cutting device, when a wafer is cut, a second motor is started to drive a cutting blade to rotate, then the wafer to be cut is placed on the upper side of a mounting base, then a handle is rotated to drive a second threaded rod to rotate until a sliding plate at the outer end moves to the outer side of the wafer, and then the wafer is fixed to the upper side of the mounting base; then a conveying chain in the base is driven to rotate, then a mounting base provided with a wafer to be cut is continuously placed at the right end of the upper side of the conveying chain, a clamping rod is clamped into a clamping hole in the lower end of the mounting base, the wafer is driven by the conveying chain to be conveyed leftwards, and when the wafer on the mounting base passes through a rear supporting plate and a front supporting plate, the wafer is cut. And the rotating cutting blade cuts.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing technical field, concretely is a wafer processing positioning cutting device. BACKGROUND

[0002] Wafer cutting, also known as scribing, is to cut an individual on a wafer through a high-speed rotating diamond blade (also laser cutting technology) to form an independent single wafer for subsequent process preparation.

[0003] Cutting is divided into half-cut and full-cut, half-cut is cutting 4 / 5 wafer thickness, which will not cut through the wafer, and then it is automatically cracked and separated by mechanical means. In the current cutting process, if the wafer is not fixed and limited during the division and marking of the cutting position, the wafer may be shifted, resulting in deviation in the subsequent cutting process.

[0004] As disclosed in Chinese patent CN118163255A, a wafer positioning cutting device based on four-tube vertical furnace processing is provided, the vertical sections of the four locking plates cooperate with each other to limit and clamp the wafer in the circumferential direction, so that the axis of the wafer is collinear with the axis of the placement circular plate. By limiting and controlling the axis of the wafer, the wafer is positioned at the specified position, improving the accuracy of the subsequent cutting process. The distance between the horizontal section of the locking plate and the placement circular plate is the thickness of the wafer, so the horizontal section of the locking plate and the placement circular plate cooperate with each other to limit and clamp the wafer in the up-down direction, improving the stability during the subsequent positioning and cutting process.

[0005] However, after the cutting device performs a wafer cutting operation, the cut wafer needs to be disassembled, a new wafer is installed, and the next cutting operation is performed, so that the cutting device stops working during the wafer re-feeding process, and continuous wafer cutting cannot be performed, resulting in low wafer cutting efficiency. Therefore, we urgently need to provide a wafer processing positioning cutting device that can perform connected cutting. UTILITY MODEL CONTENT

[0006] The utility model aims at providing a wafer processing positioning cutting device to solve the problem of low wafer cutting efficiency caused by the cutting device stopping working during the wafer re-feeding process after performing a wafer cutting operation, and then installing a new wafer for the next cutting operation.

[0007] To achieve the above purpose, the utility model provides the following technical scheme:

[0008] A wafer processing positioning cutting device, comprising a base and a conveying chain, the conveying chain is installed in the base, a cutting mechanism is arranged above the conveying chain on the base;

[0009] The cutting mechanism comprises a rear support plate and a front support plate fixedly connected to the base;

[0010] A first threaded rod is hingedly arranged between the rear support plate and the front support plate near the top position, and a fixed limiting rod is arranged; the first threaded rod is driven to rotate by a first motor, and the first motor is fixedly arranged on the front support plate;

[0011] A limiting rod is arranged on the limiting rod and is slidably connected to the limiting rod; a threaded rod sleeve is fixedly arranged on the adjusting plate; the threaded rod sleeve is threadedly connected with the first threaded rod, and the movement of the adjusting plate in the horizontal direction is controlled by the first motor;

[0012] A cutting blade is rotatably arranged on the bottom of the adjusting plate, and the cutting blade is driven to rotate by a second motor arranged on the adjusting plate;

[0013] A mounting seat is detachably and fixedly arranged on the conveying chain, and a wafer mounting position is arranged on the top surface of the mounting seat.

[0014] Further improvement lies in that a positioning unit is arranged on the mounting seat;

[0015] The positioning unit comprises a second bearing connected to the inside of the mounting seat, a second threaded rod fixedly connected to the inside of the second bearing, a handle fixedly connected to the other end of the second threaded rod, a sliding plate connected to the outer end of the second threaded rod, and a limiting plate fixedly connected to the upper side of the sliding plate.

[0016] Further improvement lies in that a clamping hole is arranged at the bottom end of the mounting seat, the outer side of the clamping rod is clamped with the inner side of the clamping hole, and the upper side of the conveying chain is abutted with the lower side of the mounting seat, so that the mounting seat is mounted to the upper side of the conveying chain after the mounting seat is placed on the upper side of the conveying chain and the clamping rod is clamped into the clamping hole at the bottom end of the mounting seat.

[0017] Further improvement lies in that a first threaded hole is arranged at the left side of the upper end of the adjusting plate, a limiting hole is arranged at the right side of the upper end of the adjusting plate, the outer side of the first threaded rod is threadedly connected with the inner side of the first threaded hole, the outer side of the limiting rod is slidably connected with the inner side of the limiting hole, and the rear end of the outer side of the first threaded rod is fixedly connected with the inner side of the first bearing, so that the adjusting plate at the outer end is translated along the outer sides of the first threaded rod and the limiting rod when the output shaft of the first motor is rotated to drive the first threaded rod to rotate.

[0018] Further improvement lies in that a sliding groove is arranged at the middle position of the periphery of the upper end of the mounting seat, a second bearing is arranged below the side close to the center of the mounting seat, a second threaded hole is arranged in the inner side of the sliding plate, the outer side of the second threaded rod is screwed with the inner side of the second threaded hole, and the outer side of the sliding plate is slidingly connected with the inner side of the sliding groove, so that when the second threaded rod is rotated by rotating the handle, the sliding plate at the outer end can be moved along the inner side of the sliding groove.

[0019] Further improvement lies in that the outer side of the sliding plate is abutted with the outer side of the wafer, the lower side of the limiting plate is slidingly connected with the lower side edge of the wafer, and the side of the sliding plate abutting with the wafer is pasted with a rubber pad, so that when the second threaded rod is rotated by rotating the handle, the sliding plate is moved to abut with the outer side of the wafer, and at the same time, the limiting plate at the upper end of the sliding plate is slidingly arranged at the upper side edge of the wafer, so that the wafer can be fixed to the upper side of the mounting seat.

[0020] Further improvement lies in that the inner side of the rear supporting plate is fixedly connected with a spraying water pipe at the lower end, the end of the spraying water pipe away from the rear supporting plate is connected with a water supply device, and the spraying direction of the spraying water pipe is towards the cutting blade, so that the cleaning water can be sprayed to the surface of the cutting blade by the spraying water pipe, and the powder debris generated by cutting can be washed away from the wafer.

[0021] In summary, the wafer processing and positioning cutting device is disclosed.

[0022] The wafer is installed on the mounting seat, the mounting seat is installed on the upper right end of the conveying chain, the conveying chain is driven to rotate, the mounting seat with the wafer is moved to the left, and the wafer is cut by the rotating cutting blade when passing between the rear supporting plate and the front supporting plate, so that the mounting seat with the wafer cut is continuously taken off from the left side of the conveying chain, the wafer cut is disassembled, the wafer to be cut is installed, and the mounting seat is reinstalled on the upper right end of the conveying chain, so that the wafer to be cut is continuously moved between the rear supporting plate and the front supporting plate for cutting, the cutting blade for cutting the wafer continuously cuts, and the cutting processing efficiency of the wafer is improved.

[0023] Further, the second threaded rod is rotated by rotating the handle, the sliding plate is moved to abut with the wafer on the upper side of the mounting seat, the limiting plate at the upper end of the sliding plate is slidingly arranged at the upper side edge of the wafer, the wafer is fixed to the upper side of the mounting seat, the positions of the sliding plates around the wafer can be adjusted, different diameters of wafers can be placed on the mounting seat, the positions of the sliding plates are adjusted to the periphery of the wafer, the wafers are fixed, the wafer cutting is performed after the wafer positioning, and the practicability of the cutting device is improved. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0025] Figure 2 This is a schematic diagram of the mounting base structure of this utility model;

[0026] Figure 3 This is a schematic diagram of the internal structure of the mounting base of this utility model;

[0027] Figure 4 This is a schematic diagram of the structure between the rear support plate and the front support plate of this utility model.

[0028] In the diagram: 1. Base; 2. Conveyor chain; 301. Rear support plate; 302. Front support plate; 303. First bearing; 304. First motor; 305. First threaded rod; 306. Limiting rod; 307. Adjusting plate; 308. Second motor; 309. Cutting blade; 310. Clamping rod; 311. Mounting base; 312. Wafer; 401. Second bearing; 402. Second threaded rod; 403. Handle; 404. Sliding plate; 405. Limiting plate; 5. Spray water pipe. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Please see Figures 1-4 This utility model provides a technical solution:

[0031] A wafer processing positioning and cutting device includes a base 1 and a conveyor chain 2. The conveyor chain 2 is installed at the inner front end of the base 1, and a cutting mechanism is connected to the outer ends of the base 1 and the conveyor chain 2.

[0032] The cutting mechanism comprises a rear support plate 301 fixedly connected to the rear end of the upper side of the base 1, a front support plate 302 fixedly connected to the front end of the upper side of the base 1, a first bearing 303 installed at the upper left corner of the front end of the rear support plate 301, a first motor 304 installed at the upper left corner of the front side of the front support plate 302, a first threaded rod 305 fixedly connected to the rear end of the output shaft of the first motor 304, a limiting rod 306 fixedly connected to the upper right corner of the side adjacent to the rear support plate 301 and the front support plate 302, an adjusting plate 307 connected to the outer end of the limiting rod 306, a second motor 308 installed at the lower end of the front side of the adjusting plate 307, a cutting blade 309 installed at the rear end of the output shaft of the second motor 308, a first threaded hole formed at the left side of the upper end of the adjusting plate 307, a limiting hole formed at the right side of the upper end of the adjusting plate 307, the outer side of the first threaded rod 305 in threaded connection with the inner side of the first threaded hole, the outer side of the limiting rod 306 in sliding connection with the inner side of the limiting hole, and the rear end of the first threaded rod 305 in fixed connection with the inner side of the first bearing 303, so that when the first motor 304 is started and the output shaft thereof is rotated to drive the first threaded rod 305 to rotate, the adjusting plate 307 at the outer end can be translated along the outer sides of the first threaded rod 305 and the limiting rod 306, so that the cutting blade 309 at the lower end can be moved to different positions for cutting work.

[0033] The outer side of the conveying chain 2 is fixedly connected with a clamping rod 310 at equal distances, the upper side of the conveying chain 2 is connected with a mounting seat 311, and the upper end of the mounting seat 311 is installed with a wafer 312.

[0034] The upper end of the mounting seat 311 is connected with a positioning unit, the positioning unit comprises a second bearing 401 connected to the inside of the mounting seat 311, a second threaded rod 402 fixedly connected to the inner side of the second bearing 401, a handle 403 fixedly connected to the other end of the second threaded rod 402, a sliding plate 404 connected to the outer end of the second threaded rod 402, and a limiting plate 405 fixedly connected to the upper side of the sliding plate 404.

[0035] The bottom end of the mounting seat 311 is provided with a clamping hole, the outer side of the clamping rod 310 is clamped with the inner side of the clamping hole, and the upper side of the conveying chain 2 abuts against the lower side of the mounting seat 311, so that after the mounting seat 311 is placed on the upper side of the conveying chain 2 and the clamping rod 310 is clamped into the clamping hole at the bottom end of the mounting seat 311, the mounting seat 311 can be installed on the upper side of the conveying chain 2 and then moved together with the rotating conveying chain 2.

[0036] The sliding slot is arranged at the middle position of the upper end of the mounting base 311, and the second bearing 401 is arranged below the side close to the center of the mounting base 311. The second threaded hole is arranged in the inner side of the sliding plate 404, the outer side of the second threaded rod 402 is threadedly connected with the inner side of the second threaded hole, and the outer side of the sliding plate 404 is slidably connected with the inner side of the sliding slot, so that the sliding plate 404 at the outer end can be moved along the inner side of the sliding slot when the second threaded rod 402 is rotated by rotating the handle 403.

[0037] The outer side of the sliding plate 404 abuts against the outer side of the wafer 312, and the lower side of the limiting plate 405 is slidably connected with the lower edge of the wafer 312. The side of the sliding plate 404 in contact with the wafer 312 is pasted with a rubber pad. After the wafer 312 is placed at the middle position of the upper side of the mounting base 311, the second threaded rod 402 is rotated by rotating the handle 403, so that the sliding plate 404 moves to the outer side of the wafer 312, and the limiting plate 405 at the upper end of the sliding plate 404 slides to the upper edge of the wafer 312, so that the wafer 312 is fixed to the upper side of the mounting base 311. Since the positions of the sliding plates 404 around the wafer 312 can be adjusted, the wafer 312 with different diameters can be placed on the mounting base 311, and the positions of the sliding plates 404 around the wafer 312 can be adjusted to fix the wafer 312, so that the wafer 312 with different diameters can be positioned by the positioning structure, and the practicability of the cutting device is improved.

[0038] The spraying water pipe 5 is fixedly connected to the inner lower end of the rear supporting plate 301, one end of the spraying water pipe 5 away from the rear supporting plate 301 is connected with a water supply device, and the spraying direction of the spraying water pipe 5 is towards the cutting blade 309. During the cutting process of the wafer 312 by the cutting blade 309, the cleaning water is sprayed to the surface of the cutting blade 309 by the spraying water pipe 5, so that the powder debris generated during the cutting process can be washed away from the wafer 312, and the influence of the debris on the cutting precision of the wafer 312 is avoided.

[0039] Working principle: when the wafer 312 is cut, first start the first motor 304, the output shaft rotates the first threaded rod 305 to rotate, so that the adjusting plate 307 moves the lower end of the cutting blade 309 to the appropriate cutting position, and then start the second motor 308 to drive the cutting blade 309 to rotate, then place the wafer 312 to be cut on the upper side of the mounting seat 311, then rotate the handle 403 to drive the second threaded rod 402 to rotate, until the outer end of the sliding plate 404 moves to the outside of the wafer 312, then fix the wafer 312 to the upper side of the mounting seat 311, drive the transmission chain 2 inside the base 1 to rotate, then continuously place the mounting seat 311 with the cutting wafer 312 on the upper right end of the transmission chain 2, and the clamping rod 310 is clamped into the clamping hole at the lower end of the mounting seat 311, which is driven by the transmission chain 2 to the left, and the wafer 312 above the mounting seat 311 is cut by the rotating cutting blade 309 when passing through the rear support plate 301 and the front support plate 302, and the cleaning water sprayed by the spray pipe 5 is washed at the same time, then the wafer 312 after cutting continues to be conveyed to the left, together with the mounting seat 311 below, is taken off from the left side of the transmission chain 2, then the wafer 312 after cutting is removed from the mounting seat 311, and a new wafer 312 to be cut is placed on the upper right end of the transmission chain 2, through the working process, the wafer 312 is continuously cut.

[0040] It should be noted that in this document, the terms such as first and second are used only to distinguish one entity or operation from another, and do not necessarily require or imply these entities or operations have any such actual relationship or order. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or includes elements inherent in such process, method, article or equipment. Without more limitations, the element defined by the statement "including a" does not exclude the presence of other identical elements in the process, method, article or equipment including the element.

Claims

1. A wafer processing positioning and cutting device comprising a base (1) and a conveyor chain (2) mounted in the base (1), characterized in that: The base (1) is provided with a cutting mechanism above the conveying chain (2); The cutting mechanism comprises a rear support plate (301) and a front support plate (302) fixedly connected to the base (1); The rear support plate (301) and the front support plate (302) are provided with a hinged first threaded rod (305) and a fixedly connected limiting rod (306) near the top position; the first threaded rod (305) is driven to rotate by a first motor (304), and the first motor (304) is fixedly arranged on the front support plate (302); The limiting rod (306) is provided with an adjusting plate (307) slidably connected thereto; the adjusting plate (307) is provided with a fixedly connected threaded rod sleeve, the threaded rod sleeve is threadedly connected with the first threaded rod (305), and the movement of the adjusting plate (307) in the horizontal direction is driven and controlled by the first motor (304); The bottom of the adjusting plate (307) is provided with a rotatably arranged cutting blade (309), and the cutting blade (309) is driven to rotate by a second motor (308) on the adjusting plate (307); The conveying chain (2) is provided with a detachably fixed mounting seat (311), and the top surface of the mounting seat (311) is provided with a wafer mounting position.

2. A wafer processing positioning and cutting apparatus as claimed in claim 1, characterized in that: The mounting seat (311) is provided with a positioning unit; The positioning unit comprises a second bearing (401) connected to the inside of the mounting seat (311), the inner side of the second bearing (401) is fixedly connected with a second threaded rod (402), the other end of the second threaded rod (402) is fixedly connected with a handle (403), the outer end of the second threaded rod (402) is connected with a sliding plate (404), and the upper side of the sliding plate (404) is fixedly connected with a limiting plate (405).

3. The wafer processing and positioning cutting apparatus of claim 1, wherein: The bottom end of the mounting seat (311) is provided with a clamping hole, the outer side of the clamping rod (310) is clamped with the inner side of the clamping hole, and the upper side of the conveying chain (2) is abutted with the lower side of the mounting seat (311).

4. The wafer processing and positioning cutting apparatus of claim 1, wherein: The left side of the upper end of the adjusting plate (307) is provided with a first threaded hole, the right side of the upper end of the adjusting plate (307) is provided with a limiting hole, the outer side of the first threaded rod (305) is threadedly connected with the inner side of the first threaded hole, the outer side of the limiting rod (306) is slidably connected with the inner side of the limiting hole, and the rear end of the first threaded rod (305) is fixedly connected with the inner side of the first bearing (303).

5. The wafer processing and positioning cutting apparatus of claim 2, wherein: The mounting seat (311) is provided with a sliding groove at the middle position around the upper end, the second bearing (401) is installed below the side close to the center of the mounting seat (311), the inside of the sliding plate (404) is provided with a second threaded hole, the outer side of the second threaded rod (402) is threadedly connected with the inner side of the second threaded hole, and the outer side of the sliding plate (404) is slidably connected with the inner side of the sliding groove.

6. A wafer processing positioning and cutting apparatus as claimed in claim 2, wherein: The outer side of the sliding plate (404) is abutted with the outer side of the wafer (312), the lower side of the limiting plate (405) is slidably connected with the lower edge of the wafer (312), and a rubber pad is attached to the side of the sliding plate (404) contacting the wafer (312).

7. The wafer processing and positioning cutting apparatus of claim 1, wherein: The rear support plate (301) is internally fixedly connected with a water spraying pipe (5) at a lower end, one end of the water spraying pipe (5) away from the rear support plate (301) is connected with a water supply device, and the spraying direction of the water spraying pipe (5) is towards the cutting blade (309).

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