Wafer and clamping jig applied to wafer

Abstract

The utility model discloses a wafer and a clamping jig applied to the wafer, and relates to the technical field of wafers. The semiconductor device comprises a semiconductor substrate, a plurality of functional areas and a plurality of dielectric layers, the functional areas are arranged in the semiconductor substrate, the dielectric layers are arranged on the semiconductor substrate, circuit areas are arranged in the dielectric layers, a plurality of cutting grooves are formed in the semiconductor substrate, a cutting channel is formed between every two adjacent dielectric layers, the cutting channels are communicated with the cutting grooves, and the circuit areas are communicated with the cutting channels. The depth of the cutting groove is larger than that of the functional area, and an isolation medium is arranged in the cutting groove. During cutting, the cutting marking line is regarded as the cutting track for cutting, in the cutting process, the generation probability of cracks can be reduced to a certain extent through arrangement of the isolation medium, and due to the fact that the depth of the cutting groove is larger than that of the functional area, even if cracks are generated during cutting, the cutting efficiency is improved. And the damage of the functional area caused by diffusion of cracks to the functional area can be avoided, so that the damage of the chip is avoided, and the practicability is higher.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of wafers, in particular to a wafer and a clamping jig applied to the wafer. BACKGROUND

[0002] The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, is called a wafer due to a circular shape, and generally comprises a semiconductor substrate, a functional area and a dielectric layer. The functional area is located in the semiconductor substrate, and the dielectric layer is located on the semiconductor substrate and internally provided with a circuit area. The circuit area is internally formed with a conductive structure and connected with electronic devices in the functional area. In the chip production process, the wafer needs to be cut and transferred, and the wafer needs to be fixed by a clamping jig during the transfer. In the prior art, when the wafer is cut, a crack is easily formed at the cutting position, the crack is easily diffused to the functional area and causes damage to the functional area, thereby causing damage to the chip. The clamping jig is generally fixed, can only fix a wafer of a single size, needs to be replaced when facing wafers of different sizes, and has poor flexibility and applicability, and is troublesome to operate. Therefore, the application provides a wafer and a clamping jig applied to the wafer. CONTENT OF THE UTILITY MODEL

[0003] The application aims to solve the technical problems that a crack is easily formed at a cutting position when a wafer is cut, the crack is easily diffused to a functional area and causes damage to the functional area, thereby causing damage to a chip, a clamping jig is generally fixed, can only fix a wafer of a single size, needs to be replaced when facing wafers of different sizes, has poor flexibility and applicability, and is troublesome to operate. The application provides a wafer and a clamping jig applied to the wafer.

[0004] In order to achieve the above-mentioned purpose, the application specifically adopts the following technical scheme:

[0005] A wafer comprises a semiconductor substrate, a plurality of functional areas arranged in the semiconductor substrate and a plurality of dielectric layers arranged on the semiconductor substrate. The dielectric layer is internally provided with a circuit area. The semiconductor substrate is internally provided with a plurality of cutting grooves. A cutting channel is formed between two adjacent dielectric layers. The cutting channel is in communication with the cutting groove. The longitudinal depth of the cutting groove is greater than that of the functional area. The cutting groove is internally provided with a separation dielectric. The separation dielectric is internally provided with a cutting mark line.

[0006] A clamping jig is applied to the wafer and comprises:

[0007] The fixed frame is configured in a U shape and is installed on a mechanical arm, a moving frame is slidably arranged on the fixed frame, a cylinder push rod connected with the moving frame is arranged on the fixed frame, two extension rods are symmetrically arranged on the moving frame, a plurality of suction disc pieces are arranged on the extension rods, two limiting pieces are arranged on the fixed frame and the moving frame, and the limiting piece comprises a bottom block, a cylindrical block and a top block connected in sequence, and the cylindrical block is in abutting engagement with the circumferential surface of the wafer.

[0008] Further, a movable groove is formed in the fixed frame, and a roller is rotatably arranged on the moving frame and in rolling engagement with the movable groove.

[0009] Further, a plurality of protective strips are arranged on the fixed frame and in abutting engagement with the bottom of the wafer, and the height of the protective strip is the same as the height of the bottom block.

[0010] Further, the top surface of the suction disc piece is located on the same horizontal plane as the top surface of the fixed frame.

[0011] Further, the bottom block and the top block are both configured in a tapered shape.

[0012] Further, a sliding groove is formed in the cylindrical block, a sliding block connected with the top block is slidably arranged in the sliding groove, and a screw rod is rotatably arranged in the sliding groove and in threaded engagement with the sliding block.

[0013] Further, a plurality of scale grooves are formed in the sliding block.

[0014] The beneficial effects of the present application are as follows:

[0015] 1. In the present application, the cutting mark is regarded as a cutting track for cutting, and in the cutting process, the setting of the isolation medium can reduce the probability of crack generation to a certain extent. Since the depth of the cutting groove is greater than the depth of the functional area, even if a crack is generated during cutting, the crack can be prevented from spreading to the functional area and causing damage to the functional area, thereby avoiding damage to the chip, and therefore the present application is more practical.

[0016] 2. In the present application, wafers of different diameters and thicknesses can be fixed, and when wafers of different diameters and thicknesses are encountered, the clamping jig does not need to be replaced, the use is flexible and applicable, and the operation is convenient, and therefore the present application is more practical. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a schematic view of the cross-sectional structure of the wafer of the present application;

[0018] Figure 2 is an enlarged view of position A in the present application Figure 1

[0019] Figure 3 ​This is a three-dimensional structural view of the clamping fixture of this application;

[0020] Figure 4 This is a three-dimensional structural view of the fixing frame of this application;

[0021] Figure 5 This is a three-dimensional structural view of the mobile frame of this application;

[0022] Figure 6 This is a partial three-dimensional view of the clamping fixture of this application;

[0023] Figure 7 This application Figure 6 A three-dimensional sectional view;

[0024] Figure 8 This application Figure 7 Enlarged view of point B in the middle.

[0025] Reference numerals: 1. Semiconductor substrate; 2. Functional area; 3. Dielectric layer; 4. Circuit area; 5. Cutting groove; 6. Cutting track; 7. Isolation medium; 8. Cutting mark; 9. Fixing frame; 10. Moving frame; 11. Cylinder push rod; 12. Extension rod; 13. Suction cup; 14. Base block; 15. Cylindrical block; 16. Top block; 17. Movable groove; 18. Roller; 19. Protective strip; 20. Slide groove; 21. Slider; 22. Screw; 23. Scale groove. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0027] like Figures 1-2 As shown, an embodiment of this application proposes a wafer including a semiconductor substrate 1, multiple functional regions 2 all disposed within the semiconductor substrate 1, and multiple dielectric layers 3 all disposed on the semiconductor substrate 1. The semiconductor substrate 1 has a first surface and a second surface that are relatively distributed. The dielectric layer 3 is located on the first surface. A circuit region 4 is disposed within the dielectric layer 3. A conductive structure is formed within the circuit region 4. The conductive structure is connected to electronic devices in the functional regions 2. Multiple dicing grooves 5 are constructed on the semiconductor substrate 1. The dicing grooves 5 are constructed in a barn shape. A dicing channel 6 is formed between two adjacent dielectric layers 3. The dicing channel 6 is connected to the dicing groove 5. The depth of the dicing groove 5 is greater than the depth of the functional regions 2. An isolation medium 7 is disposed within the dicing groove 5. In this embodiment, the material of the isolation medium 7 is polyimide. Polyimide refers to a type of polymer containing an imide ring in its main chain. It is one of the organic polymer materials with the best comprehensive performance, so that mechanical cutting can be used instead of laser cutting, thereby reducing cutting costs. A cutting mark 8 is provided on the isolation medium 7. The cutting mark 8 corresponds to the axis of the dicing groove 5.

[0028] In the cutting of the wafer, the cutting mark 8 is regarded as the cutting track for cutting. In the cutting process, the setting of the isolation medium 7 can reduce the probability of crack generation to a certain extent. Since the depth of the cutting groove 5 is greater than the depth of the functional area 2, even if a crack is generated during cutting, the crack can be prevented from spreading to the functional area 2 to cause damage to the functional area 2, thereby avoiding chip damage, and thus the utility is higher.

[0029] As shown in Figures 3-8 In some embodiments, the clamping jig applied to the wafer described above comprises:

[0030] The fixing frame 9 is configured in a U shape and is installed on the mechanical arm. The fixing frame 9 is in a horizontal direction. A plurality of mounting holes and a U-shaped groove are configured on the fixing frame 9. The fixing frame 9 is installed on the mechanical arm through the mounting holes. The moving frame 10 is slidably arranged on the fixing frame 9. The moving frame 10 is in a horizontal direction and is slidably arranged in the U-shaped groove. The cylinder push rod 11 connected with the moving frame 10 is arranged on the fixing frame 9. The cylinder push rod 11 is in a horizontal direction and is fixedly arranged on the fixing frame 9. The movable end of the cylinder push rod 11 is fixedly connected with the moving frame 10. Two extension rods 12 are symmetrically arranged on the moving frame 10. The extension rods 12 are in a horizontal direction and are fixedly arranged on the moving frame 10. A plurality of suction disc pieces 13 are arranged on the extension rods 12. In actual use, the suction disc pieces 13 can be vacuum suction discs, electrostatic suction discs, Bernoulli suction discs, etc. In this embodiment, the suction disc pieces 13 are Bernoulli suction discs. The suction disc pieces 13 act on the bottom of the wafer and exert suction force on the wafer. Two limiting pieces are arranged on the fixing frame 9 and the moving frame 10. The limiting piece comprises a bottom block 14, a cylindrical block 15 and a top block 16 connected in sequence. The bottom block 14, the cylindrical block 15 and the top block 16 are distributed in sequence from bottom to top. The bottom block 14 is fixedly arranged on the fixing frame 9 or the moving frame 10. The cylindrical block 15 is in abutting engagement with the circumferential surface of the wafer;

[0031] In the initial state, the moving frame 10 is located at the limit position, the movable end of the cylinder push rod 11 is extended, when transferring the wafer, the fixed frame 9 is installed on the mechanical arm, the fixed frame 9 is driven to move by the mechanical arm, the fixed frame 9 moves first in the horizontal direction to below the wafer, and then moves upward until the four cylindrical blocks 15 correspond to the circumferential surface of the wafer, then the movable end of the cylinder push rod 11 is retracted, the moving frame 10 is driven to slide to the initial position, until the four cylindrical blocks 15 are in contact with the circumferential surface of the wafer, through the cooperation of the bottom block 14 and the top block 16, the vertical displacement of the wafer is avoided, and then the suction cup piece 13 is used to apply suction force to the bottom of the wafer, so that the wafer is fixed, and finally the fixed frame 9 is moved, so that the wafer is transferred, conversely, the movable end of the cylinder push rod 11 is extended, the moving frame 10 is driven to slide to the limit position, and then the suction force applied to the bottom of the wafer by the suction cup piece 13 is removed, so that the wafer is released;

[0032] In summary, the wafer of different diameters can be fixed in use, without replacing the clamping jig when facing the wafer of different diameters, the use flexibility and applicability are strong, and the operation is convenient, so that the wafer is more practical.

[0033] As shown in Figures 4-5 some embodiments, the movable slot 17 is formed in the fixed frame 9, the movable slot 17 is in the horizontal direction and communicates with the U-shaped slot, the rolling wheel 18 rotatingly arranged on the moving frame 10 is in rolling cooperation with the movable slot 17, and the rolling wheel 18 is in the horizontal direction.

[0034] Referring to the above, when the moving frame 10 slides, the rolling wheel 18 rolls in the movable slot 17, so that the friction is reduced, the sliding of the moving frame 10 is smoother, and the abrasion is reduced.

[0035] As shown in Figure 5 some embodiments, the fixed frame 9 is provided with a plurality of protection strips 19 in contact with the bottom of the wafer, the protection strips 19 are in the horizontal direction and are fixed on the fixed frame 9, and the height of the protection strips 19 is the same as that of the bottom block 14.

[0036] Referring to the above, when the fixed frame 9 moves upward, the protection strips 19 are in contact with the bottom of the wafer, at this time, the cylindrical blocks 15 automatically correspond to the circumferential surface of the wafer, and the use is more convenient.

[0037] As shown in Figure 3 some embodiments, the top surface of the suction cup piece 13 is located on the same horizontal plane as the top surface of the fixed frame 9.

[0038] Referring to the above, when the suction force is applied to the bottom of the wafer by the suction cup piece 13, the suction cup piece 13 and the bottom of the wafer are not in contact, so that the damage to the bottom of the wafer is avoided.

[0039] AsFigure 6 As shown, in some embodiments, both the bottom block 14 and the top block 16 are constructed in a conical shape;

[0040] Referring to the above, when the moving frame 10 slides to the initial position, the bottom block 14 and the top block 16 are both constructed in a conical shape, which can avoid damage to the bottom and top of the wafer.

[0041] like Figure 8 As shown, in some embodiments, a groove 20 is provided in the cylindrical block 15. The groove 20 is vertical. A slider 21 connected to the top block 16 is slidably disposed in the groove 20. The slider 21 slides in the vertical direction and its top is fixedly connected to the top block 16. A screw 22 is rotatably disposed in the groove 20. The screw 22 is vertical. The slider 21 and the screw 22 are threadedly engaged.

[0042] Referring to the above, in the initial state, both the top block 16 and the slider 21 are in their initial positions, with the top block 16 abutting against the cylindrical block 15. During use, the screw 22 can be driven to rotate forward, causing the slider 21 to slide upward within the groove 20 due to the thread action, thus moving the top block 16 away from the cylindrical block 15. This makes it suitable for wafers of different thicknesses, allowing for the fixing of wafers of different thicknesses. When dealing with wafers of different thicknesses, there is no need to change the clamping fixture, improving the flexibility and applicability of use.

[0043] like Figure 8 As shown, in some embodiments, the slider 21 has multiple scale grooves 23, which are arranged in an array along the vertical direction;

[0044] Referring to the above, in the initial state, all the scale grooves 23 are retracted into the slide groove 20. When the top block 16 moves away from the cylindrical block 15, the scale grooves 23 make it easy to confirm the height position of the top block 16, so that the four top blocks 16 are at the same height, making it more convenient to use.

[0045] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer comprising a semiconductor substrate (1), a plurality of functional regions (2) each arranged in the semiconductor substrate (1), and a plurality of dielectric layers (3) each arranged on the semiconductor substrate (1), a circuit region (4) being arranged in the dielectric layer (3), characterized in that, A plurality of cutting grooves (5) are formed on the semiconductor substrate (1), and a cutting channel (6) is formed between two adjacent dielectric layers (3), the cutting channel (6) communicates with the cutting groove (5), the depth of the cutting groove (5) is greater than the depth of the functional area (2), an isolation medium (7) is arranged in the cutting groove (5), and a cutting mark line (8) is arranged on the isolation medium (7).

2. A clamping jig for use with the wafer of claim 1, wherein, It comprises: A fixing frame (9) is configured in a U shape and is installed on a mechanical arm, a moving frame (10) is slidably arranged on the fixing frame (9), a cylinder push rod (11) connected with the moving frame (10) is arranged on the fixing frame (9), two extension rods (12) are symmetrically arranged on the moving frame (10), a plurality of suction disc pieces (13) are arranged on the extension rods (12), two limiting pieces are arranged on the fixing frame (9) and the moving frame (10), the limiting piece comprises a bottom block (14), a cylindrical block (15) and a top block (16) connected in sequence, and the cylindrical block (15) is in abutting engagement with the circumferential surface of the wafer.

3. The clamping fixture of claim 2, wherein, An activity groove (17) is formed on the fixing frame (9), and a roller (18) in rolling cooperation with the activity groove (17) is rotatably arranged on the moving frame (10).

4. The clamping fixture of claim 2, wherein, A plurality of protection strips (19) are arranged on the fixing frame (9) and are in abutting engagement with the bottom of the wafer, and the height of the protection strip (19) is the same as the height of the bottom block (14).

5. The clamping fixture of claim 2, wherein, The top surface of the suction disc piece (13) is located on the same horizontal plane as the top surface of the fixing frame (9).

6. The clamping fixture of claim 2, wherein, The bottom block (14) and the top block (16) are both configured in a tapered shape.

7. The clamping fixture of claim 2, wherein, A sliding groove (20) is formed in the cylindrical block (15), a sliding block (21) connected with the top block (16) is slidably arranged in the sliding groove (20), and a screw rod (22) is rotatably arranged in the sliding groove (20), and the sliding block (21) and the screw rod (22) are in threaded cooperation.

8. The clamping fixture of claim 7, wherein, A plurality of scale grooves (23) are formed on the sliding block (21).

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