Heat dissipation system and three-dimensional printing equipment

Abstract

The utility model provides a heat dissipation system and three-dimensional printing equipment, the heat dissipation system comprises a semiconductor refrigeration part, the semiconductor refrigeration part comprises a refrigeration end and a heat dissipation end, the refrigeration end is connected with a heating mechanism to cool the heating mechanism, and the heat dissipation end is connected with the heat dissipation mechanism to dissipate heat through the heat dissipation mechanism; the constant current driving unit is used for controlling the magnitude of the current input into the semiconductor refrigeration part so as to adjust the temperature of the heating mechanism; the reverse connection and backward flow prevention unit is electrically connected with the constant-current driving unit and the semiconductor refrigeration part and used for absorbing backward voltage generated at the moment of connection and disconnection of the constant-current driving unit and the semiconductor refrigeration part; noise generated in the heat dissipation process can be reduced while the heat dissipation efficiency is improved, the influence of reverse voltage generated at the moment of power-on or power-off on the heat dissipation efficiency is avoided, and the safety performance is high.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of 3D printing, and particularly relates to a heat dissipation system and a stereoscopic printing device. BACKGROUND

[0002] 3D printing is a manufacturing process of creating physical objects by layering materials according to a three-dimensional digital model, and the main principle is to melt powder materials by high temperature and stack them layer by layer to manufacture the final product. With the maturity of 3D printing technology, 3D printers have been widely used in industrial design, mold manufacturing, medicine and other fields.

[0003] A 3D printer usually generates a large amount of heat during printing, and needs to be cooled in time to prevent the generated heat from affecting the printer and the printed model. The existing heat dissipation device is mostly through a fan to blow air for heat dissipation, and the heat dissipation effect is general when the temperature of the equipment is high. The heat cannot be quickly and efficiently reduced, which reduces the service life of the 3D printer. Moreover, the vibration of the fan also affects the printing speed and the stability of the printing equipment, so that the quality of the printed model cannot be guaranteed. CONTENT OF THE INVENTION

[0004] The application provides a heat dissipation system and a stereoscopic printing device, which can improve the heat dissipation efficiency while reducing the noise generated during the heat dissipation process, and has high safety performance.

[0005] In order to solve the above technical problems, the application provides a heat dissipation system, which comprises:

[0006] A semiconductor refrigeration component, comprising a refrigeration end and a heat dissipation end, the refrigeration end is connected with a heat generating mechanism to cool the heat generating mechanism, and the heat dissipation end is connected with a heat dissipation mechanism to dissipate heat through the heat dissipation mechanism;

[0007] A constant current driving unit for controlling the current size input to the semiconductor refrigeration component to adjust the temperature of the heat generating mechanism;

[0008] A reverse connection backflow prevention unit electrically connected with the constant current driving unit and the semiconductor refrigeration component, for absorbing the reverse voltage generated in the instant of turning on and turning off of the constant current driving unit and the semiconductor refrigeration component.

[0009] As a further improvement of the application, the constant current driving unit comprises a voltage regulator and a feedback resistor assembly connected with the reverse connection backflow prevention unit;

[0010] The first end of the voltage regulator is connected to a direct current power supply, the feedback resistor assembly comprises a first feedback resistor assembly arranged between the second end of the voltage regulator and the third end of the voltage regulator, and a second feedback resistor assembly arranged between the first feedback resistor assembly and the anti-reverse connection backflow unit, and the resistance values of the first feedback resistor assembly and the second feedback resistor assembly are adjusted to adjust the current size input to the semiconductor refrigeration device.

[0011] As a further improvement of the present application, the anti-reverse connection backflow unit comprises a first field effect transistor and a first voltage stabilizing tube arranged in anti-parallel across the first field effect transistor.

[0012] The first end of the first field effect transistor is connected to the constant current driving unit, the second end of the first field effect transistor is connected to the semiconductor refrigeration device, and the third end of the first field effect transistor is connected to the first voltage stabilizing tube after being connected to a first resistor and then grounded.

[0013] As a further improvement of the present application, the first field effect transistor is a PMOS transistor, and the on-voltage drop of the PMOS transistor is greater than the withstand voltage of the semiconductor refrigeration device.

[0014] As a further improvement of the present application, the heat dissipation system further comprises a power supply unit for outputting a direct current power supply to the constant current driving unit.

[0015] As a further improvement of the present application, the heat dissipation mechanism comprises a heat sink, and the heat sink is an aluminum heat sink or a copper heat sink.

[0016] As a further improvement of the present application, a heat-conducting silica gel is arranged between the refrigeration end and the heat generating mechanism.

[0017] As a further improvement of the present application, the heat generating mechanism is a driving chip, and the refrigeration end of the semiconductor refrigeration device is connected to the driving chip.

[0018] As a further improvement of the present application, the heat generating mechanism is a printing nozzle, and the refrigeration end of the semiconductor refrigeration device is connected to a throat guide block of the printing nozzle.

[0019] Based on the above-mentioned heat dissipation system, the present application further provides a stereoscopic printing device, which comprises:

[0020] a housing, wherein a printing cavity and an electrical cavity are arranged in the housing;

[0021] and the heat dissipation system of any one of the above;

[0022] The semiconductor refrigeration part is arranged between the printing cavity and the electrical cavity, a refrigeration end of the semiconductor refrigeration part is arranged in the electrical cavity to cool the electrical cavity, and a heating end of the semiconductor refrigeration part is arranged in the printing cavity to heat the printing cavity.

[0023] Compared with the prior art, the heat dissipation system and the stereoscopic printing device provided by the embodiment of the application have the following advantages: the refrigeration end of the semiconductor refrigeration part is connected with the heating mechanism, the heat dissipation end of the semiconductor refrigeration part is connected with the heat dissipation mechanism, the current size input into the semiconductor refrigeration part is controlled by the constant current driving unit, thereby the size of the heat absorbed and dissipated by the semiconductor refrigeration part is controlled, the heating mechanism is cooled by the refrigeration end, and the heat dissipation mechanism is used for heat dissipation by the heat dissipation end, thereby the temperature of the heating mechanism is adjusted, meanwhile, the anti-reverse connection backflow unit is arranged between the constant current driving unit and the semiconductor refrigeration part, the refrigeration end and the heat dissipation end of the semiconductor refrigeration part are prevented from being exchanged, the reverse voltage is further prevented from damaging the heating mechanism, the heat dissipation efficiency is high, the noise is low, and the safety performance is high, and the use experience of the user is effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only constitute some embodiments of the application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0025] Figure 1 is a structural schematic diagram of the heat dissipation system provided by the embodiment of the application;

[0026] Figure 2 is a circuit principle diagram of the constant current driving unit in the heat dissipation system provided by the embodiment of the application;

[0027] Figure 3 is a circuit principle diagram of the anti-reverse connection backflow unit in the heat dissipation system provided by the embodiment of the application;

[0028] Figure 4 is an application embodiment of the heat dissipation system provided by the embodiment of the application Figure 1 ;

[0029] Figure 5 is an application embodiment of the heat dissipation system provided by the embodiment of the application Figure 2 ;

[0030] Figure 6 is a structural schematic diagram of the stereoscopic printing device provided by the embodiment of the application;

[0031] Explanation of reference signs:

[0032] 1 - first feedback resistor component; 2 - second feedback resistor component; 10 - semiconductor refrigeration piece; 101 - refrigeration end; 102 - heat dissipation end; 11 - heat dissipation mechanism; 12 - driving IC; 13 - mainboard; 14 - printing nozzle; 15 - throat pipe cold guide block; 16 - nozzle plate; 20 - shell; 21 - printing cavity; 22 - electrical cavity; 23 - cavity back plate. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be further described in detail below with reference to the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not intended to limit the present application.

[0034] In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly and specifically limited. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between the components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion.

[0035] In order to make the description of the present disclosure more detailed and complete, the following describes the embodiments of the present application and specific examples; but this is not the only form of implementation or use of the specific embodiments of the present application. The embodiments include the features of the specific embodiments and the method steps and their order for constructing and operating these specific embodiments. However, other specific embodiments can also be used to achieve the same or equivalent functions and step sequences.

[0036] Please refer to Figures 1-6 The embodiments of the present application provide a heat dissipation system and a stereoscopic printing device, which can improve the heat dissipation efficiency while reducing the noise generated during the heat dissipation process, avoid the influence of the reverse voltage generated in the instant of power-on or power-off on the heat dissipation efficiency, have high safety performance, and ensure the operation safety of users.

[0037] Please refer to Figure 1 The structure diagram of the heat dissipation system provided by the embodiments of the present application is shown, which includes a semiconductor refrigeration piece, a constant current driving unit, and an anti-reverse connection backflow unit electrically connected with the semiconductor refrigeration piece and the constant current driving unit.

[0038] As an optional embodiment, the semiconductor refrigeration device generally comprises a refrigeration end and a heat dissipation end, and is mainly based on the Peltier effect, and utilizes the thermoelectric effect of a P-N junction to achieve the refrigeration principle. An N-type semiconductor material and a P-type semiconductor material are connected to form an electric couple. When a direct current is connected in the circuit, energy transfer occurs. The current from the N-type element to the joint of the P-type element absorbs heat to become the refrigeration end, and the current from the P-type element to the joint of the N-type element releases heat to become the heat dissipation end. The refrigeration end absorbs heat, and the heat generated by the heat dissipation end is dissipated, thereby having the advantages of small size, low energy consumption, no vibration, small noise and easy control compared with traditional heat sinks and heat dissipation fans.

[0039] It can be understood that the size of the heat absorbed and dissipated by the semiconductor refrigeration device can be determined by the size of the current and the number of N-type and P-type semiconductor materials in the semiconductor refrigeration device. Therefore, the size of the current of the semiconductor refrigeration device can be controlled to achieve high-precision temperature control.

[0040] In the embodiments of the present application, the constant current driving unit is used to control the size of the current input to the semiconductor refrigeration device, thereby controlling the size of the heat absorbed and dissipated by the semiconductor refrigeration device, and achieving the adjustment of the temperature of the heat generating mechanism.

[0041] Further, the anti-reverse connection backflow unit is arranged between the constant current driving unit and the semiconductor refrigeration device. The anti-reverse connection backflow unit is arranged to absorb the reverse voltage generated during the conduction and disconnection of the constant current driving unit and the semiconductor refrigeration device. Since the reverse voltage is generated during the conduction and disconnection of the constant current driving unit and the semiconductor refrigeration device, the reverse voltage may cause the refrigeration end and the heat dissipation end of the semiconductor refrigeration device to be exchanged. At this time, the end that should dissipate heat becomes a heating end, causing damage to the heat generating mechanism. The anti-reverse connection backflow unit can simultaneously play the roles of anti-reverse connection and anti-backflow, effectively avoiding damage to the heat generating mechanism caused by the reverse voltage.

[0042] The refrigeration end of the semiconductor refrigeration device is connected to the heat generating mechanism, and the heat dissipation end of the semiconductor refrigeration device is connected to the heat dissipation mechanism. The size of the current input to the semiconductor refrigeration device is controlled by the constant current driving unit, thereby controlling the size of the heat absorbed and dissipated by the semiconductor refrigeration device. The heat generating mechanism is cooled by the refrigeration end, and the heat dissipation mechanism is cooled by the heat dissipation end, thereby adjusting the temperature of the heat generating mechanism. The anti-reverse connection backflow unit is arranged between the constant current driving unit and the semiconductor refrigeration device, thereby avoiding the exchange of the refrigeration end and the heat dissipation end of the semiconductor refrigeration device, and further avoiding damage to the heat generating mechanism caused by the reverse voltage.

[0043] In an optional embodiment, please refer to Figure 2As can be seen from the circuit principle diagram of the constant current driving unit in the heat dissipation system provided in the embodiment of the present application, the constant current driving unit provided in the present application comprises a voltage regulator and a feedback resistor assembly connected with the anti-reverse connection backflow unit, and it can be observed that the first end of the voltage regulator is used for connecting a direct current power supply, the feedback resistor assembly comprises a first feedback resistor assembly 1 arranged between the second end of the voltage regulator and the third end of the voltage regulator, and a second feedback resistor assembly 2 is further arranged between the first feedback resistor assembly 1 and the anti-reverse connection backflow unit, and the resistance values of the first feedback resistor assembly 1 and the second feedback resistor assembly 2 can be adjusted to adjust the current size input into the semiconductor refrigeration element.

[0044] Specifically, since the semiconductor refrigeration element is a current conversion type element, that is, the size of the heat absorbed and dissipated by the semiconductor refrigeration element can be controlled by controlling the input current, therefore, the embodiment of the present application can control the current size input into the semiconductor refrigeration element by adjusting the resistance values of the first feedback resistor assembly 1 and the second feedback resistor assembly 2, which is more accurate than the traditional voltage driving mode.

[0045] Further, as can be seen, the first end VIN of the voltage regulator VREG is connected with a direct current power supply VIN, the second end OUT of the voltage regulator VREG is connected with the first feedback resistor assembly 1, the source of a MOS tube Q2 is connected with the second end OUT of the voltage regulator VREG, the gate of the MOS tube Q2 is connected with the fourth end PGOOD of the voltage regulator VREG, the drain of the MOS tube Q2 is connected with the inductor L1, and a diode D2 is further connected between the drain of the MOS tube Q2 and the inductor L1, and the other end of the diode D2 is grounded.

[0046] In the embodiment of the present application, the first feedback resistor assembly 1 comprises resistors R2 and R3 connected in sequence, the second feedback resistor assembly 2 comprises resistors R4, R5 and R6 connected in sequence, the resistors R2 and R3 are connected in sequence between the inductor L1 and the third end FB of the voltage regulator VREG, and the resistor R3 is further connected with a resistor R8 after being connected with the third end FB of the voltage regulator VREG, and the other end of the resistor R8 is grounded.

[0047] Further, a triode Q3 is further arranged between the first feedback resistor assembly 1 and the second feedback resistor assembly 2, the emitter of the triode Q3 is connected between the resistor R2 and the resistor R4, the collector of the triode Q3 is connected between the resistor R2 and the resistor R3, and the base of the triode Q3 is connected between the resistor R4 and the resistor R5, the resistor R4 is connected with the anti-reverse connection backflow unit after being connected with the emitter of the triode Q3, and the input current is provided for the semiconductor refrigeration element.

[0048] Optionally, the constant current driving unit provided by the application further comprises a comparator U1, which ensures that the semiconductor refrigeration device works in a preset working voltage range, the same direction input end of the comparator U1 is connected to a reference voltage through a resistor R11 and a sampling resistor R12, a resistor R13 is connected between the resistor R11 and the sampling resistor R12, the other end of the resistor R13 is grounded, the opposite direction input end of the comparator U1 is connected to a resistor R9 and a resistor R10, the other end of the resistor R10 is grounded, and the output end of the comparator U1 is further connected to a diode D3, the other end of the diode D3 is connected to the resistor R5 and the resistor R6, and the reference voltage can be adjusted to, for example, 5V or 12V according to actual needs, so that the semiconductor refrigeration device works in the preset working voltage range.

[0049] It can be understood that each resistor in the first feedback resistor assembly 1 and the second feedback resistor assembly 2 can be directly set as an adjustable resistor, so that the resistance of each resistor in the first feedback resistor assembly 1 and the second feedback resistor assembly 2 can be directly adjusted, and the size of the input current of the semiconductor refrigeration device can be further adjusted.

[0050] As an optional embodiment, the anti-reverse connection backflow unit provided by the application comprises a first field effect tube connected between the constant current driving unit and the semiconductor refrigeration device unit, and a first voltage stabilizing tube connected in parallel at both ends of the first field effect tube, so that the on-voltage drop of the first field effect tube is greater than the withstand voltage of the semiconductor refrigeration device, thereby avoiding damage to the heating mechanism caused by reverse voltage generated in the on and off transient.

[0051] Specifically, please refer to Figure 3 The circuit principle diagram of the anti-reverse connection backflow unit in the heat dissipation system provided by the embodiment of the application is shown in the figure, the first end (i.e., the source electrode) of the first field effect tube Q1 is connected to the constant current driving unit, the second end (i.e., the drain electrode) of the first field effect tube Q1 is connected to the semiconductor refrigeration device, and the third end (i.e., the gate electrode) of the first field effect tube Q1 is connected to the first resistor R1 and then grounded after being connected to the first voltage stabilizing tube D1.

[0052] In the embodiment of the application, the first voltage stabilizing tube D1 is used to protect the first field effect tube Q1, and the on-voltage drop of the first field effect tube Q1 is set to be greater than the withstand voltage of the semiconductor refrigeration device, and preferably the first field effect tube Q1 is a PMOS tube, and the resistance of the first resistor R1 is about 10K ohms, thereby playing a role in preventing reverse connection and backflow at the same time.

[0053] It should be noted that the constant current driving unit and the anti-reverse connection backflow unit provided above are an optional embodiment provided by the application, and other circuit structures capable of achieving the functions of the constant current driving unit and the anti-reverse connection backflow unit are feasible, Figure 2 and Figure 3The circuit structure shown is not as any limitation on the specific circuit structure of the constant current driving unit and the reverse connection backflow prevention unit of the present application.

[0054] As an optional embodiment, please continue to refer to Figure 1 The heat dissipation system provided by the present application further comprises a power supply unit connected with the constant current driving unit, specifically connected with the first end VIN of the voltage regulator VREG in the constant current driving unit, and further provides direct current to the semiconductor refrigeration element through the constant current driving unit and the reverse connection backflow prevention unit, and the direct current supply is cooled by the refrigeration end of the semiconductor refrigeration element.

[0055] Further, the heat dissipation mechanism can be provided in the form of a heat sink or a radiator, and is preferably made of aluminum or copper to achieve better heat dissipation.

[0056] On this basis, the present application is provided with heat-conducting silica gel between the heat generating mechanism and the refrigeration end, and the heat-conducting silica gel can also be provided between the heat dissipation mechanism and the heat dissipation end, which can play the role of fixing and conducting heat, and high-heat-conducting silica gel such as heat-conducting coefficient of about 12W / m.k is preferably selected, and the present application does not require the thickness and shape of the above-mentioned heat-conducting silica gel, and the thickness and shape that meet the high-heat-conducting and convenient fixing are sufficient, and the present application does not make too much repetition here.

[0057] As an optional embodiment, the heat dissipation system provided by the present application can be applied to a stereoscopic printing device such as a 3D printer, please refer to Figure 4 , the application example provided by the heat dissipation system provided by the present application Figure 1 The above-mentioned heat generating mechanism can be provided in the form of a driving IC (Integrated circuit Chip, chip), and is specifically applied to the heat dissipation of the motor driving IC in the 3D printer. The traditional motor driving IC heat dissipation is mainly combined by the way of metal heat sink and heat dissipation fan, but this heat dissipation method not only has slow heat dissipation, but also has the defects of large vibration noise and large power consumption.

[0058] The power supply unit, the constant current driving unit and the anti-reverse connection backflow unit are integrated on the mainboard 13, the mainboard 13 is connected with the driving IC 12, the heat-conducting silica gel (not shown in the figure) is arranged between the driving IC 12 and the semiconductor refrigeration piece 10, the driving IC 12 is connected with the refrigeration end 101 of the semiconductor refrigeration piece 10 through the heat-conducting silica gel, the heat dissipation end 102 of the semiconductor refrigeration piece 10 is connected with the heat dissipation mechanism 11, and the heat generated by the driving IC 12 is dissipated through the heat dissipation mechanism 11; compared with the traditional mode, the cooling and heat dissipation mode combining the semiconductor refrigeration piece 10 removes the heat dissipation fan arranged at the bottom, reduces the vibration and printing noise generated in the heat dissipation process, realizes higher heat dissipation efficiency, avoids the heat conduction and heat convection mode existing in the traditional heat dissipation mode, the heat-conducting silica gel is arranged to realize the close combination between the semiconductor refrigeration piece 10 and the driving IC 12, and higher reliability is realized, and the constant current driving unit can also control the current input into the semiconductor refrigeration piece 10 according to the actual temperature of the driving IC 12 and the current printing state of the stereoscopic printing equipment, so that the purpose of reducing the overall power consumption of the equipment is achieved.

[0059] As an optional embodiment, the heat generation mechanism can be provided in the form of a printing nozzle 14 and applied to the heat dissipation of the printing nozzle 14 in the 3D printer. The heat dissipation of the traditional printing nozzle 14 is also combined by the form of the heat dissipation fan and the metal heat dissipation fin. However, since the temperature of the printing nozzle 14 is as high as two or three hundred degrees Celsius, the speed and reliability of the heat dissipation fan are greatly required. In addition, the printing nozzle 14 is in a moving state during the printing process, so the heat dissipation mode of the traditional heat dissipation fan will cause greater noise.

[0060] Please refer to Figure 5 The application embodiment provides the application embodiment of the heat dissipation system Figure 2 The power supply unit, the constant current driving unit and the anti-reverse connection backflow unit are integrated on the printing nozzle 14 of the printing nozzle 14, the refrigeration end 101 of the semiconductor refrigeration piece 10 is connected with the throat pipe cold guide block 15 of the printing nozzle 14, the heat dissipation end 102 of the semiconductor refrigeration piece 10 is connected with the heat dissipation mechanism 11 outward, and the heat generated during the printing process of the printing nozzle 14 is dissipated through the heat dissipation mechanism 11, so that the heat dissipation efficiency is effectively improved, and the noise generated in the heat dissipation process is reduced.

[0061] As an optional embodiment, the application further provides a stereoscopic printing equipment, which comprises a shell 20 and the heat dissipation system.

[0062] Specifically, please refer to Figure 6It can be observed from the schematic diagram of the mechanism of the stereoscopic printing device provided in the embodiments of the present application that the inside of the shell 20 is provided with a printing cavity 21 and an electrical cavity 22, the inside of the printing cavity 21 needs to be heated, and the inside of the electrical cavity 22 needs to be cooled, and it is difficult to take into account the temperature of the printing cavity 21 and the electrical cavity 22. The traditional setting mode needs to set an alternating current PTC ceramic heating sheet and a blowing fan between the printing cavity 21 and the electrical cavity 22, heat the printing cavity 21 through the alternating current PTC ceramic heating sheet, and cool the electrical cavity 22 through the blowing fan. However, this setting mode is high in cost and large in noise, needs to control the alternating current PTC ceramic heating sheet and the blowing fan according to the current temperature, and is low in reliability.

[0063] In the embodiments of the present application, the semiconductor refrigeration sheet is arranged between the printing cavity 21 and the electrical cavity 22, it can be observed that the side of the printing cavity 21 and the electrical cavity 22 close to each other is provided with a cavity back plate 23, the semiconductor refrigeration piece 10 is arranged between the cavity back plate 23 of the printing cavity 21 and the cavity back plate 23 of the electrical cavity 22, the refrigeration end 101 of the semiconductor refrigeration piece 10 is extended into the electrical cavity 22 to cool the electrical cavity 22, the heat dissipation end 102 of the semiconductor refrigeration piece 10 is extended into the printing cavity 21 to heat the printing cavity 21, and the heat dissipation mechanism 11 is arranged at the end of the refrigeration end 101 and the heat dissipation end 102. The heat dissipation mechanism 11 can heat the printing cavity 21 while cooling the electrical cavity 22, can avoid the influence of the air humidity in the printing cavity 21 on the printing model while generating heat in the electrical cavity 22, is high in reliability, and is lower in cost.

[0064] Of course, the heat dissipation system provided in the embodiments of the present application can also be applied to other application implementation scenarios that need to be cooled, and the heat dissipation system is not limited to the application scenarios of the stereoscopic printing device provided above, and those skilled in the art should know this.

[0065] For other details of the above-mentioned stereoscopic printing device for implementing the above-mentioned technical solutions, refer to the description of the heat dissipation system provided in the above-mentioned embodiments, which will not be repeated here.

[0066] It can be understood that the technical features of the above embodiments can be combined arbitrarily, and in order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.

[0067] The above embodiments are merely exemplary embodiments adopted for illustrating the principles of the present application, and the present application is not limited thereto. Various modifications and improvements can be made by those of ordinary skill in the art without departing from the spirit and essential characteristics of the present application, and such modifications and improvements are also considered to be within the scope of protection of the present application.

Claims

1. A heat dissipation system, characterized by, The application relates to a heat dissipation system. The heat dissipation system comprises: a semiconductor refrigerating device, which comprises a refrigerating end and a heat radiating end, the refrigerating end is connected with a heat generating mechanism to cool the heat generating mechanism, and the heat radiating end is connected with a heat radiating mechanism to radiate heat through the heat radiating mechanism; a constant current driving unit, which is used for controlling the current size input to the semiconductor refrigerating device to adjust the temperature of the heat generating mechanism; and an anti-reverse connection backflow unit, which is electrically connected with the constant current driving unit and the semiconductor refrigerating device and is used for absorbing reverse voltage generated in the instant of turning on and turning off of the constant current driving unit and the semiconductor refrigerating device. The constant current driving unit comprises a voltage regulator and a feedback resistance assembly connected with the anti-reverse connection backflow unit. A first end of the voltage regulator is used for accessing a direct current power supply, the feedback resistance assembly comprises a first feedback resistance assembly arranged between a second end of the voltage regulator and a third end of the voltage regulator and a second feedback resistance assembly arranged between the first feedback resistance assembly and the anti-reverse connection backflow unit, and the current size input to the semiconductor refrigerating device is adjusted by adjusting the resistance values of the first feedback resistance assembly and the second feedback resistance assembly.

2. The heat dissipating system of claim 1, wherein, The anti-reverse connection backflow unit comprises a first field effect transistor and a first voltage stabilizing tube arranged in reverse parallel at two ends of the first field effect transistor. A first end of the first field effect transistor is connected with the constant current driving unit, a second end of the first field effect transistor is connected with the semiconductor refrigerating device, and a third end of the first field effect transistor is connected with the first voltage stabilizing tube and then grounded through a first resistance.

3. The heat dissipating system of claim 1, wherein, The first field effect transistor is a PMOS tube, and the on-voltage drop of the PMOS tube is greater than the withstand voltage of the semiconductor refrigerating device. The heat dissipation system further comprises a power supply unit, which is used for outputting a direct current power supply to the constant current driving unit.

4. The heat dissipating system of claim 3, wherein, The heat radiating mechanism comprises a heat radiating fin, and the heat radiating fin is an aluminum heat radiating fin or a copper heat radiating fin.

5. The heat dissipating system of claim 1, wherein, Thermally conductive silica gel is arranged between the refrigerating end and the heat generating mechanism.

6. The heat dissipating system of claim 1, wherein, The heat generating mechanism is a driving chip, and the refrigerating end of the semiconductor refrigerating device is connected with the driving chip.

7. The heat dissipating system of claim 1, wherein, The heat generating mechanism is a printing nozzle, and the refrigerating end of the semiconductor refrigerating device is connected with a throat pipe cold guide block of the printing nozzle.

8. The heat dissipating system of claim 1, wherein, The application relates to a heat dissipation system.

9. The heat dissipating system of claim 1, wherein, The heat dissipation system comprises: a shell, a printing cavity and an electrical cavity are arranged in the shell; and the heat dissipation system as claimed in any one of claims 1-7; wherein the semiconductor refrigerating device is arranged between the printing cavity and the electrical cavity, the refrigerating end of the semiconductor refrigerating device is arranged in the electrical cavity to cool the electrical cavity, the heat generating end of the semiconductor refrigerating device is arranged in the printing cavity to heat the printing cavity, and the ends of the refrigerating end and the heat generating end are provided with the heat radiating mechanism.

10. A stereolithography apparatus, characterized in that ​ ​ ​ ​

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