Chip equipment

Abstract

The utility model relates to chip equipment, which comprises a first part and a second part, and at least one of the first part and the second part is not fixedly provided with a circuit board; a mounting cavity is formed in the first part and / or the second part, an opening is formed in the connecting side of the first part and the second part in the mounting cavity, and a circuit board of the chip equipment passes through the opening and is mounted in the mounting cavity. According to the chip equipment, the circuit board can be conveniently installed in the chip equipment through the arrangement of the installation cavity with the opening. Meanwhile, the second part does not need to be provided with a control module, so that the second part is small in size and can be produced in a single-piece injection molding mode, the second part can be matched with the first parts of different structures, namely, the second part is high in universality, and therefore the production cost and the management cost of the chip equipment can be reduced.

Description

[0001] This application claims priority to Chinese Patent Application No. 202421662978.X, filed on July 12, 2024, entitled “Reprocessing Equipment,” Chinese Patent Application No. 202422096798.6, filed on August 27, 2024, entitled “Reprocessing Equipment,” and Chinese Patent Application No. 202422124827.5, filed on August 29, 2024, entitled “Reprocessing Equipment,” all of which are incorporated by reference in their entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of printing consumables, and in particular to a chip device. BACKGROUND

[0003] A printer is a commonly used office equipment. The printer is installed with consumables such as ink cartridges and developing cartridges. The consumables are provided with chips. The chips are used to store relevant information about the consumables, such as: consumable model, production date, manufacturer, serial number, and chip program version. After the consumables are produced or recycled, the information stored in the chips needs to be programmed through a chip device, which is called reprocessing.

[0004] The existing chip device includes a hand-held part and a test head. Both the hand-held part and the test head are provided with a control module. After the two are connected, the control modules communicate. The device has a large volume, which is not conducive to the universal production and management of device components, and makes the cost of the chip device higher. UTILITARIAN CONTENT

[0005] The present application provides a chip device to solve the problem of high cost of the chip device.

[0006] The chip device provided by the embodiments of the present application includes: a first part and a second part, at least one of the first part and the second part is not fixedly provided with a circuit board; the first part and / or the second part has a mounting cavity, the mounting cavity has an opening on the connecting side of the first part and the second part, and the opening is used to pass and install the circuit board of the chip device into the mounting cavity.

[0007] In a possible design, when the circuit board is installed in the mounting cavity, the first part and the second part are non-detachably connected; one end of the circuit board is fixedly connected with the first part, and the other end of the circuit board is accommodated in the mounting cavity of the second part; or, one end of the circuit board is fixedly connected with the second part, and the other end of the circuit board is accommodated in the mounting cavity of the first part.

[0008] In a possible design, the first part is a test head, and the second part is a hand-held part.

[0009] In a possible design, the test head end is provided with a test part and a positioning part, the test part is used for burning a chip on a processing box, and the positioning part is used for positioning the processing box and fixing the chip device to the processing box.

[0010] In a possible design, the positioning part is a positioning column, which is used for cooperating with a positioning groove on the processing box.

[0011] In a possible design, the test part has a probe, which is used for abutting against a contact on the chip; the positioning part is a positioning convex part, which is located on a side of the test part provided with the probe; when the probe abuts against the contact on the chip, the test part and the positioning convex part are clamped on two sides of a clamped part on the processing box respectively.

[0012] In a possible design, the positioning convex part includes a plurality of sub-positioning convex parts, and the plurality of sub-positioning convex parts are arranged at intervals along a vertical clamping direction.

[0013] In a possible design, the sub-positioning convex part includes two positioning sheets arranged oppositely, and a distance between the two positioning sheets gradually decreases along an extending direction of the sub-positioning convex part.

[0014] In a possible design, a cross section of the positioning column is trapezoidal or rectangular with a cutout.

[0015] In a possible design, the positioning part is a clamping part, and the clamping part is used for clamping a cooperating part on the processing box.

[0016] In a possible design, the clamping part includes two positioning blocks arranged at intervals, the cooperating part can be clamped between the two positioning blocks, and the two clamping parts are located on two sides of the test part.

[0017] In a possible design, the clamping part includes one positioning block, the positioning blocks of the two clamping parts are staggered on two sides of the test part, and the cooperating part can be clamped between the two positioning blocks.

[0018] In a possible design, a clamping distance between the positioning blocks gradually decreases along an extending direction of the positioning block.

[0019] In a possible design, a surface of the positioning block used for clamping the cooperating part is provided with a guide recess, and the guide recess is located on an end of the positioning block away from the hand-held part.

[0020] In a possible design, the positioning block is provided with a protruding column on a surface clamping the fitting part, and the protruding column is in abutment with the fitting part when the clamping part clamps the fitting part.

[0021] In the present application, the mounting cavity with an opening is arranged, so that the circuit board can be conveniently mounted in the chip device. Since the second part of the present application does not need to be provided with a control module, the volume of the second part is smaller, and the second part can be produced by single injection molding, and the second part can cooperate with the first part of different structures, that is, the second part has higher universality, so that the production cost and management cost of the chip device can be reduced.

[0022] It should be understood that the above general description and the following detailed description are only exemplary and do not limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 The structural schematic diagram of the chip device provided by the present application is shown in the following figure;

[0024] Figure 2 The structural schematic diagram of the handheld part in the chip device provided by the present application is shown in the following figure; Figure 1

[0025] Figure 3 The structural schematic diagram of the test head in the chip device provided by the present application is shown in the following figure; Figure 1

[0026] Figure 4 The structural schematic diagram of the handheld part in the chip device provided by the present application is shown in the following figure; Figure 2

[0027] The structural schematic diagram of the chip device provided by the present application is shown in the following figure; Figure 5

[0028] The processing box adapted to the chip device in the present application is shown in the following figure; Figure 6 Figure 5 The structural schematic diagram of the chip device provided by the present application is shown in the following figure;

[0029] Figure 7 The structural schematic diagram of the fitting part of the processing box adapted to the chip device in the present application is shown in the following figure;

[0030] Figure 8 Figure 7 The structural schematic diagram of the chip device in the present application is shown in the following figure;

[0031] Figure 9 The structural schematic diagram of the chip device in the present application is shown in the following figure; Figure 7 Figure 8 The structural schematic diagram of the chip device in the present application is shown in the following figure;

[0032] Figure 10 Figure 7 The side view of the chip device in the present application is shown in the following figure;​​​​​​

[0033] Figure 11 for Figure 7 A front view of the chip device;

[0034] Figure 12 for Figure 10 A magnified view of a portion of the test head;

[0035] Figure 13 for Figure 7 A bottom view of the chip device;

[0036] Figure 14 This is a schematic diagram of the structure of the chip device provided in this application in Embodiment 3;

[0037] Figure 15 for Figure 14 Side view of the chip device;

[0038] Figure 16 for Figure 14 A bottom view of the chip device;

[0039] Figure 17 This is a schematic diagram of the structure of the chip device provided in this application in Embodiment 4;

[0040] Figure 18 for Figure 17 Side view of the chip device;

[0041] Figure 19 for Figure 17 A bottom view of the chip device;

[0042] Figure 20 This is a schematic diagram of the structure of the chip device provided in this application in Embodiment 5;

[0043] Figure 21 As a kind of Figure 20 Processing boxes that adapt to chip devices in the system;

[0044] Figure 22 For another kind of Figure 20 Processing boxes that are compatible with chip devices.

[0045] Figure label:

[0046] 1-Handheld part;

[0047] 11-First fastening part;

[0048] 12-Fixed recess;

[0049] 13-Receiving cavity;

[0050] 14-Connecting slot;

[0051] 15 - External connection port;

[0052] 16-indicator light;

[0053] 2-test head;

[0054] 21-second buckling part;

[0055] 22-fixing convex part;

[0056] 23-test part;

[0057] 231-probe;

[0058] 24-clamping part;

[0059] 241-positioning block;

[0060] 241a-guiding recess;

[0061] 242-convex column

[0062] 25-positioning convex part;

[0063] 251-sub positioning convex part;

[0064] 3-processing box;

[0065] 31-chip;

[0066] 32-chip mounting position;

[0067] 33-mating part;

[0068] 34-foolproof part.

[0069] The accompanying drawings, which are incorporated herein and constitute part of the specification, illustrate embodiments consistent with the application and, together with the description, serve to explain the principles of the application. DETAILED DESCRIPTION

[0070] For better understanding of the technical solutions of the present application, the embodiments of the present application are described in detail below with reference to the drawings.

[0071] It should be clear that the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0072] The terms used in the embodiments of the present application are only for the purpose of describing the specific embodiments, and are not intended to limit the present application. The singular forms "a", "an" and "the" used in the embodiments of the present application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0073] It should be understood that the term "and / or" used herein is only to describe an association relationship of associated objects, which means that there can be three relationships, for example, A and / or B can represent three cases of A existing alone, A and B existing together, and B existing alone. In addition, the character " / " herein generally represents an "or" relationship between the front and rear associated objects.

[0074] It should be noted that the terms "upper", "lower", "left", "right" and the like described in the embodiments of the present application are described from the angle shown in the drawings, and should not be understood as a limitation on the embodiments of the present application. In addition, in the context, it should also be understood that when referring to an element connected to another element "on" or "under", it can be directly connected to another element "on" or "under", or indirectly connected to another element "on" or "under" through an intermediate element.

[0075] The present application provides a chip device for burning a chip 31 on a processing box 3. The chip device comprises a first part and a second part, at least one of the first part and the second part is not fixedly provided with a circuit board; the first part and / or the second part has a mounting cavity, the mounting cavity has an opening on the connecting side of the first part and the second part, and the opening is used to mount the circuit board of the chip device into the mounting cavity.

[0076] When the circuit board is mounted in the mounting cavity, the first part and the second part are non-detachably connected; one end of the circuit board is fixedly connected with the first part, and the other end of the circuit board is accommodated in the mounting cavity of the second part; or, one end of the circuit board is fixedly connected with the second part, and the other end of the circuit board is accommodated in the mounting cavity of the first part.

[0077] In the present embodiment, by providing the mounting cavity with the opening, the circuit board can be conveniently mounted in the chip device, and the circuit board can be kept stable in the chip device relative to the chip device. The non-detachable connection of the first part and the second part can not only make the connection of the first part and the second part more reliable, but also can increase the difficulty for competitors to understand the internal structure of the chip device, and prevent competitors from recycling the chip device.

[0078] At the same time, since the second part does not need to be provided with a control module, the volume of the second part is smaller, and the second part can be produced by single injection molding, and the second part can be matched with first parts of different structures, i.e. the second part has high universality, so as to reduce the production cost and management cost of the chip device.

[0079] Wherein, the non-detachable connection refers to that the connected parts cannot be detached during use, and if forcibly detached, part of the structure of the parts can be damaged. This connection mode is characterized in that the parts can be damaged when detached, and is therefore usually used in occasions where frequent detachment is not required.

[0080] In an embodiment of the present application, the first part is an upper cover, the second part is a lower cover, the upper cover can be buckled with the lower cover, and the circuit board is located between the upper cover and the lower cover. Wherein, the circuit board can be fixedly arranged on the upper cover or the lower cover, or can be independently arranged between the upper cover and the lower cover, preferably, the lower cover is close to the test end, and the test probe can be directly welded and fixed on the circuit board.

[0081] In another embodiment of the present application, the first part is a front cover, the second part is a rear cover, the front cover can be buckled with the rear cover, and the circuit board is located between the front cover and the rear cover. Wherein, the circuit board can be fixedly arranged on the front cover or the rear cover, or can be independently arranged between the front cover and the rear cover, preferably, the front cover is close to the side of the human body for observation during operation, and the test probe can be directly welded and fixed on the circuit board.

[0082] In a specific embodiment, the first part is a test head 2, and the second part is a handheld part 1. As shown in Figure 1 , the test head 2 is arranged separately from the handheld part 1. When burning chips 31 on processing cartridges 3 of different structures, test heads 2 of different structures are required, so by arranging the test head 2 separately from the handheld part 1, the handheld part 1 can be connected with different test heads 2 as required, thereby improving the versatility of the handheld part 1.

[0083] Specifically, as shown in Figure 1 , the handheld part 1 is provided with a first buckling part 11 at one end for connecting with the test head 2, and the test head 2 is provided with a second buckling part 21 at one end for connecting with the handheld part 1. When the first buckling part 11 is buckled with the second buckling part 21, the test head 2 is connected to the handheld part 1.

[0084] Wherein, one of the first buckling part 11 and the second buckling part 21 is a male head, and the other is a female head.

[0085] Preferably, as shown in Figure 2 and Figure 3 , the first buckling part 11 is provided with a fixing recess 12, the second buckling part 21 is provided with a fixing protrusion 22, the fixing protrusion 22 is clamped in the fixing recess 12, and the handheld part 1 and the test head 2 are connected in a non-detachable manner, so that the connection of the handheld part 1 and the test head 2 is more stable. In addition, common non-detachable connection modes also include: bonding, welding, edge folding connection, etc. The edge folding connection is a connection mode in which the flange structure on the standard part is clamped with the opening plate under the action of a press head, and the flange is bent and formed into an interlocking structure by a mold.

[0086] Optionally, the fixed recess 12 is symmetrically arranged on both sides of the first buckling part 11, and the fixed convex part 22 is symmetrically arranged on both sides of the second buckling part 21, further improving the connection stability of the first buckling part 11 and the second buckling part 21.

[0087] It can be understood that the first buckling part 11 and the second buckling part 21 can also be connected by magnetic attraction, screw connection and the like.

[0088] Specifically, as shown in Figure 2 , the handheld part 1 is provided with a containing cavity 13, one end of the containing cavity 13 penetrates the first buckling part 11, and the circuit board and the like can be loaded into the containing cavity 13 from the one end of the handheld part 1 provided with the first buckling part 11. At the same time, the circuit board can also be electrically connected with the test head 2 through the one end of the handheld part 1 provided with the first buckling part 11.

[0089] More specifically, both sides of the containing cavity 13 are provided with a communication groove 14 in communication with the containing cavity 13, and the size of the communication groove 14 is smaller than that of the containing cavity 13. The circuit board is a plate-shaped structure, and since the edge of the circuit board is generally not provided with electronic components, the two side edges of the circuit board can extend into the communication groove 14 along the direction of loading the circuit board into the containing cavity 13. The communication groove 14 can limit the movement range of the circuit board in the containing cavity 13, so that the position of the circuit board in the containing cavity 13 is relatively determined.

[0090] In an embodiment of the present application, as shown in Figure 4 , the handheld part 1 is also provided with an external connection port 15 for external power supply or transmission of electrical signals. Preferably, the external connection port 15 is arranged on the other side of the handheld part 1 provided with the first buckling part 11. The external connection port 15 can use a USB interface.

[0091] In addition, as shown in Figure 2 and Figure 4 , an indicating lamp 16 is arranged on one surface of the handheld part 1, and the indicating lamp 16 is used to indicate whether the chip device is in the burning state. For example, when the chip device is burning the chip 31, the indicating lamp is on; when the chip device is not burning the chip 31, the indicating lamp is off. It can be understood that the indicating lamp 16 can also be replaced by a burning button, and the chip device burns when the operator presses the burning button. The surface of the handheld part 1 provided with the indicating lamp 16 or the burning button is defined as the indicating surface.

[0092] Embodiment one

[0093] In this embodiment, as shown in Figure 5 , the test head 2 is provided with a test part 23 and a positioning part at one end, the test part 23 is used to burn the chip 31 on the processing box 3, and the positioning part is used to position the processing box 3 and fix the chip device to the processing box 3.

[0094] In the embodiment, the positioning part positions the processing box 3 so that the test part 23 can be aligned with the chip 31 to burn the chip 31, and the positioning part fixes the chip device on the processing box 3 so that the test part 23 remains stable relative to the chip 31 during the burning process, and the operator's hands are free. Meanwhile, when the operator holds the chip device by hand, the hand may shake, affecting the success rate of burning. The positioning part makes the chip device not shake relative to the chip 31, thus improving the success rate of burning the chip 31.

[0095] As shown in Figure 6 , the processing box 3 is provided with a chip mounting position 32, and the chip 31 is mounted on the chip mounting position 32.

[0096] Optionally, the positioning part is a positioning column (not shown in the figure), and the processing box 3 is provided with a positioning groove (not shown in the figure) near the chip mounting position, and the positioning column can cooperate with the positioning groove to realize positioning and fixing.

[0097] In an embodiment of the application, the cross section of the positioning column is trapezoidal or rectangular with a cutout, so as to facilitate the insertion of the positioning column into the positioning groove. The rectangular with a cutout means that a part of the rectangle is cut off so that its shape is no longer a rectangle.

[0098] Optionally, the positioning part is a clamping structure, and the processing box 3 is provided with a cooperating structure (not shown in the figure) near the chip mounting position 32, and the clamping structure can clamp the cooperating structure to realize positioning and fixing.

[0099] Embodiment Two

[0100] This embodiment changes the positioning part based on Embodiment One. As shown in Figures 7-9 , in this embodiment, the positioning part is a clamping part 24, which is used to clamp a cooperating part 33 on the processing box 3, and two clamping parts 24 are located on the two sides of the test part 23.

[0101] As shown in Figure 9 , the clamping part 24 is located on the opposite sides of the test part 23, and the cooperating part 33 is located on the opposite sides of the chip mounting position 32. When the test part 23 abuts against the chip 31, the clamping part 24 clamps the cooperating part 33 on the opposite sides of the chip 31, so that the chip device can be stably connected to the processing box 3, ensuring the smooth progress of the burning process.

[0102] Meanwhile, there is enough gap between the two clamping parts 24 to avoid the structure of the chip mounting position 32, which will not interfere with the cooperation between the test part 23 and the chip 31.

[0103] Preferably, the clamping surfaces of the two clamping portions 24 and the two cooperating portions 33 are in a straight line, so that the positioning and fixing of the positioning portions to the chip device are more reliable.

[0104] It can be understood that the two clamping portions 24 can also be located on the two sides adjacent to the testing portion 23, and the cooperating portion 33 is located on the two sides adjacent to the chip mounting position 32.

[0105] In addition, when the chip device is not matched with the processing box 3, the clamping portion 24 can protect the testing portion 23. Preferably, the extension length of the clamping portion 24 is longer than the extension length of the testing portion 23, so that the protection effect of the clamping portion 24 on the testing portion 23 is better, and the contact area between the clamping portion 24 and the cooperating portion 33 is larger, and the stability of the clamping portion 24 clamping the cooperating portion 33 is better.

[0106] Specifically, as shown in Figure 9 and Figure 10 , the clamping portion 24 includes two positioning blocks 241 arranged at intervals, and the cooperating portion 33 can be clamped between the two positioning blocks 241. Along the extension direction of the positioning block 241, the clamping distance between the two positioning blocks 241 gradually decreases, so that the extension end of the clamping portion 24 has a larger clamping force on the cooperating portion 33, avoiding the cooperating portion 33 from sliding out of the two positioning blocks 241, and improving the reliability of the clamping portion 24 clamping the cooperating portion 33.

[0107] More specifically, as shown in Figure 10 , the surface of the two positioning blocks 241 for clamping the cooperating portion 33 is provided with a guide recess 241a, and the guide recess 241a is located on the end of the positioning block 241 away from the hand-held portion 1. The guide recess 241a can guide the cooperating portion 33, so that the cooperating portion 33 can more easily enter between the two positioning blocks 241. Among them, the guide recess 241a can be formed by guiding the surfaces of the two positioning blocks 241 towards each other.

[0108] Optionally, as shown in Figure 11 , the width d1 of the positioning block 241 satisfies: 1mm≤d1≤6mm. For example, the width d1 of the positioning block 241 can be specifically: 1mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm, 5mm, 5.5mm, 6mm, etc.

[0109] The width d1 of the positioning block 241 should not be too large or too small. If the width of the positioning block 241 is too large (for example, greater than 6 mm), the volume of the positioning block 241 is too large, which increases the weight of the chip device and affects the stability of the clamping portion 24 clamping the cooperating portion 33. If the width of the positioning block 241 is too small (for example, less than 1 mm), the clamping area of the clamping portion 24 clamping the cooperating portion 33 is small, which affects the stability of the clamping portion 24 clamping the cooperating portion 33. Therefore, the width d1 of the positioning block 241 should be selected within a suitable range.

[0110] It can be understood that the width of the positioning block 241 of the two clamping portions 24 can be the same or different, which can be adapted to the cooperating portion on the processing box 3.

[0111] Optionally, as shown in Figure 12 , the maximum distance d2 between the two positioning blocks 241 of the clamping portion 24 is 1.5 mm, and the minimum distance d3 between the two positioning blocks 241 of the clamping portion 24 is 0.8 mm.

[0112] Optionally, the positioning block 241 has elasticity and can be elastically deformed when subjected to an external force, so as to facilitate the cooperation of the clamping portion 24 and the cooperating portion 33. When the positioning block 241 is elastically deformed, the distance between the two positioning blocks 241 can be changed between 0.8 mm and 1.5 mm.

[0113] In an embodiment of the present application, since the components on the circuit board are generally concentrated on the same surface of the circuit board, by making the surface of the circuit board on which no components or fewer components are arranged away from the indicating surface of the hand-held portion 1, the position of the circuit board in the accommodating cavity 13 is more reasonable, and the accommodating capacity of the accommodating cavity 13 is stronger.

[0114] In an embodiment of the present application, as shown in Figure 13 , in order to facilitate the connection of the test head 2 and the circuit board, the test portion 23 and the clamping portion 24 are also arranged away from the indicating surface, that is, the test portion 23 and the clamping portion 24 are arranged away from the center of the test head 2.

[0115] In the embodiment, the clamping portion 24 of the chip device first contacts the cooperating portion 33, and the cooperating portion 33 gradually extends into the positioning block 241 under the guidance of the guide recess 241a. In this process, since the minimum distance d3 between the two positioning blocks 241 of the clamping portion 24 is smaller than the thickness of the cooperating portion 33, the clamping portion 24 is in interference fit with the cooperating portion 33, and the clamping force between them is large and the clamping effect is good.

[0116] Embodiment Three

[0117] The embodiment changes the clamping portion 24 on the basis of Embodiment Two. In the embodiment, as shown in Figures 14-16As shown, two positioning blocks 241 are used to clamp the surface of the fitting part 33, and the fitting part 33 is provided with a protruding column 242. When the clamping part 24 clamps the fitting part 33, the protruding column 242 abuts against the fitting part 33.

[0118] In this embodiment, by abutting the protruding column 242 against the fitting part 33, the distance between the two positioning blocks 241 of the clamping part 24 can be increased, and the difficulty of the fitting part 33 extending into the positioning blocks 241 is reduced, so that the guiding recess 241a does not need to be provided on the positioning blocks 241, and the distance between the two positioning blocks 241 does not need to be gradually reduced along the extension direction of the positioning blocks 241.

[0119] Specifically, the positioning blocks 241 are provided with mounting holes, and the protruding column 242 is movably connected in the mounting holes. The protruding column 242 extends from the mounting hole on one positioning block 241 to the other positioning block 241. The protruding column 242 can be provided on only one positioning block 241 of one clamping part 24, or can be provided on the two positioning blocks 241 of one clamping part 24.

[0120] Optionally, the protruding column 242 is made of a material with elasticity, so that the protruding column 242 can be deformed when being pressed by the fitting part 33.

[0121] Optionally, a mounting ring is arranged in the mounting hole, and an elastic mechanism is arranged in the mounting ring. The protruding column 242 is connected with the elastic mechanism, so that the protruding column 242 can slide and shrink into the mounting ring when being pressed by the fitting part 33.

[0122] It can be understood that the protruding column 242 can also be other structures that can be deformed slightly.

[0123] Embodiment Four

[0124] This embodiment changes the clamping part 24 based on the embodiment two. In this embodiment, as shown in the figure, Figures 17-19 the clamping part 24 only includes one positioning block 241, and the positioning blocks 241 of the two clamping parts 24 are staggered on the two sides of the testing part 23. The fitting part 33 can be clamped between the two positioning blocks 241.

[0125] Specifically, compared with the embodiment two, the two clamping parts 24 in this embodiment can respectively retain the positioning blocks 241 close to the indicating surface and away from the indicating surface, so that the distance between the two positioning blocks 241 and the indicating surface is different, and the fitting part 33 can be clamped between the two positioning blocks 241.

[0126] Embodiment Five

[0127] This embodiment changes the positioning part based on the embodiment one. In this embodiment, as shown in the figure, Figure 20As shown, the test part 23 has a probe 231 for abutting with the contact on the chip 31; the positioning part is a positioning protrusion 25 located on the side of the test part 23 where the probe 231 is arranged; when the probe 231 abuts with the contact on the chip 31, the test part 23 and the positioning protrusion 25 are respectively clamped on both sides of the clamped part on the processing box 3, so as to fix the chip device on the processing box 3, to free the hands of the operator, and to ensure the stability of the test part 23 relative to the chip 31 during the burning process, and to improve the success rate of burning. At the same time, when the chip device is not installed on the processing box 3, the positioning protrusion 25 can protect the probe 231 from being damaged.

[0128] It can be understood that, in addition to being directly arranged on the test part 23, the probe 231 can also be arranged on a part of the circuit board extending out of the test head 2.

[0129] Specifically, the positioning protrusion 25 includes a plurality of sub-positioning protrusions 251, which are arranged in a direction perpendicular to the clamping direction. That is, when the test part 23 and the positioning protrusion 25 are respectively clamped on both sides of the clamped part, the plurality of sub-positioning protrusions 251 are located on the same side of the clamped part. The number of sub-positioning protrusions 251 can be two, three or more.

[0130] More specifically, the sub-positioning protrusion 251 includes two positioning pieces arranged oppositely, and the distance between the two positioning pieces gradually decreases along the extension direction of the sub-positioning protrusion 251, so that the distance between the sub-positioning protrusion 251 and the test part 23 gradually increases along the extension direction of the sub-positioning protrusion 251, thereby playing a guiding role when the chip device cooperates with the processing box, and reducing the difficulty of the clamped part extending into the test part 23 and the positioning protrusion 25.

[0131] In an embodiment of the present application, the minimum distance between the test part 23 and the positioning protrusion 25 is less than the thickness of the clamped part, so that the chip device is in interference fit with the clamped part, and the stability of the chip device clamped on the clamped part is ensured.

[0132] In an embodiment of the present application, the positioning piece has elasticity, and can be deformed to a small extent when the clamped part extends into the test part 23 and the positioning protrusion 25.

[0133] Preferably, the ends of the two positioning pieces abut with each other along the extension direction of the sub-positioning protrusion 251, to form a sharp end guiding structure.

[0134] As Figure 21As shown, some processing boxes 3 are provided with a foolproof part 34, which includes a plurality of foolproof grooves. The chip 31 is installed in a chip installation position 32, and the contacts on the chip 31 face away from the foolproof part 34.

[0135] When the chip device is matched with the processing box 3, Figure 21 As shown, when the processing box 3 is matched, the probes 231 of the test part 23 abut against the chip 31 from below in the direction of the figure, and the plurality of sub-positioning protrusions 251 respectively extend into the foolproof grooves. At this time, the part between the chip 31 and the foolproof part 34 is a clamped part. That is, the foolproof part 34 and the chip 31 are arranged on both sides of the clamped part.

[0136] In an embodiment of the present application, the size of the foolproof groove can be slightly smaller than the size of the sub-positioning protrusion 251, so that the sub-positioning protrusion 251 is in interference fit with the foolproof groove, and the stability of the chip device clamped in the clamped part is improved.

[0137] Specifically, the foolproof part 34 includes three foolproof grooves, which can be in communication or not in communication with each other. When the positioning protrusion 25 includes three sub-positioning protrusions 251, the three sub-positioning protrusions 251 respectively extend into the three foolproof grooves to realize the positioning and fixing of the chip device; when the positioning protrusion 25 includes two sub-positioning protrusions 251, the two sub-positioning protrusions 251 can be arranged to respectively extend into two foolproof grooves on the two sides or adjacent two foolproof grooves to realize the positioning and fixing of the chip device.

[0138] As shown, Figure 22 As shown, some processing boxes 3 are provided with a foolproof part 34, which includes a plurality of foolproof grooves. The chip 31 is installed in a chip installation position 32, and the contacts on the chip 31 face away from the foolproof part 34.

[0139] When the chip device is matched with the processing box 3, Figure 22 As shown, when the processing box 3 is matched, the probes 231 of the test part 23 abut against the chip 31 from below in the direction of the figure, and the plurality of sub-positioning protrusions 251 respectively extend into the foolproof grooves. At this time, the part between the chip 31 and the foolproof part 34 is a clamped part. That is, the foolproof part 34 and the chip 31 are arranged on both sides of the clamped part.

[0140] Specifically, the thickness of the clamped part is greater than the minimum distance between the test part 23 and the positioning protrusion 25, so that the clamped part is in interference fit with the test part 23 and the positioning protrusion 25, and the stability of the chip device clamped in the clamped part is improved.

[0141] Therefore, the chip device in the embodiment can be matched with at least the processing boxes 3 shown in Figure 21 and Figure 22 Therefore, the chip device in the embodiment can be matched with at least the processing boxes 3 shown in

[0142] It can be understood that the sub-positioning protrusion 251 can also be a single columnar structure to simplify the structure of the positioning protrusion 25 and facilitate processing.

[0143] In an embodiment of the present application, the cross section of the columnar body structure gradually decreases along the extending direction of the positioning protrusion 251, so that the columnar body is more easily extended into the fool-proof slot. In addition, a protrusion or a curved surface can be arranged on the columnar body structure, so that the columnar body structure is not easily detached from the fool-proof slot after being extended into the fool-proof slot.

[0144] It can be understood that, in the present embodiment, the test unit 23 can be in various forms such as a USB interface, a spring sheet, etc. in addition to the form of the probe 231.

[0145] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A chip device, characterized by The chip device comprises a first part and a second part, at least one of the first part and the second part is not fixedly provided with a circuit board; the first part and / or the second part is provided with a mounting cavity, the mounting cavity is provided with an opening on the connecting side of the first part and the second part, and the opening is used for mounting the circuit board of the chip device into the mounting cavity.

2. The chip device of claim 1, wherein, The first part and the second part are not detachably connected when the circuit board is mounted in the mounting cavity; One end of the circuit board is fixedly connected with the first part, and the other end of the circuit board is accommodated in the mounting cavity of the second part; Or, One end of the circuit board is fixedly connected with the second part, and the other end of the circuit board is accommodated in the mounting cavity of the first part.

3. The chip device of claim 2, wherein, The first part is a test head (2), and the second part is a handheld part (1).

4. The chip device of claim 3, wherein, The test head (2) is provided with a test part (23) and a positioning part at one end, the test part (23) is used for burning a chip (31) on a processing box (3), and the positioning part is used for positioning the processing box (3) and fixing the chip device on the processing box (3).

5. The chip device of claim 4, wherein, The positioning part is a positioning column, and the positioning column is used for cooperating with a positioning groove on the processing box (3).

6. The chip device of claim 5, wherein, The test part (23) is provided with a probe (231), and the probe (231) is used for abutting against a contact on the chip (31); The positioning part is a positioning convex part (25), and the positioning convex part (25) is located on one side of the test part (23) provided with the probe (231); When the probe (231) abuts against the contact on the chip (31), the test part (23) and the positioning convex part (25) are clamped on both sides of a clamped part on the processing box (3), respectively.

7. The chip device of claim 6, wherein, The positioning convex part (25) comprises a plurality of sub-positioning convex parts (251), and the plurality of sub-positioning convex parts (251) are arranged at intervals along the direction of the vertical clamping direction.

8. The chip device of claim 7, wherein, The sub-positioning convex part (251) comprises two positioning sheets arranged oppositely, and the distance between the two positioning sheets gradually decreases along the extension direction of the sub-positioning convex part (251).

9. The chip device of claim 5, wherein, The cross section of the positioning column is trapezoidal or rectangular with a notch.

10. The chip device of claim 4, wherein, The positioning part is a clamping part (24), and the clamping part (24) is used for clamping a matching part (33) on the processing box (3).

11. The chip device of claim 10, wherein, The clamping part (24) comprises two positioning blocks (241) arranged at intervals, and the matching part (33) can be clamped between the two positioning blocks (241); The two clamping parts (24) are located on both sides of the test part (23).

12. The chip device of claim 10, wherein, The clamping part (24) comprises one positioning block (241), and the positioning blocks (241) of the two clamping parts (24) are staggered on both sides of the test part (23), and the matching part (33) can be clamped between the two positioning blocks (241).

13. The chip device according to claim 11 or 12, characterized in that Along the extension direction of the positioning block (241), the clamping distance between the positioning blocks (241) gradually decreases.

14. The chip device according to claim 11 or 12, characterized by The positioning block (241) is used for clamping the surface of the fitting part (33), and a guide recess (241a) is arranged on the end of the positioning block (241) away from the hand-held part (1).

15. The chip device of claim 10, wherein, The clamping part (24) is arranged on the surface of the fitting part (33), and a convex column (242) is arranged on the clamping part (24), and when the clamping part (24) clamps the fitting part (33), the convex column (242) abuts against the fitting part (33).

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