Rubber-coated chip tray
By using a PET-coated chip tray design, the problem of scratches and chipping caused by chip displacement during transportation is solved, thus improving the chip yield.
Patent Information
- Application Number
- CN202423184871.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-12-24
AI Technical Summary
During chip transportation, the pallet can easily cause the chip to move relative to the container space, resulting in scratches or chipping, increasing the defect rate.
The chip tray features a rubber-coated design with an inner frame consisting of long and short rods. The rubber coating is made of PET material and includes a tubular layer and pads. The pads have snap-fit notches to securely hold the chips in place and prevent displacement.
It effectively prevents chips from shifting during transportation, reduces the risk of scratches and chipping, and improves chip yield.
Smart Images

Figure CN223591285U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of trays, and particularly relates to a chip tray coated with rubber. BACKGROUND
[0002] In the prior art, an automatic handling device is generally used to place a single chip into a containing space of a tray, and then a large number of chips are transported to a required place through layer-by-layer placement of the tray. However, during movement, circulation or transportation of the chip-carrying tray, the chips are prone to relative movement in the containing space, so that the chips are damaged, use is affected, and the defective rate is increased. CONTENT OF THE UTILITY MODEL
[0003] The application provides a chip tray coated with rubber to solve the above technical problems.
[0004] To solve the above technical problems, the application adopts the following technical scheme: a chip tray coated with rubber, comprising an outer frame and an inner frame sleeved on the inner side of the outer frame; the inner frame comprises two parallel long rods and a plurality of groups of short rods connected perpendicularly to the long rods; the outer frame and the long rods are connected through a plurality of groups of first connecting columns arranged in parallel; the short rods of the outer frame are connected through a plurality of groups of second connecting columns arranged in parallel; wherein the connecting ends of the short rods and the long rods are each provided with a rubber coating layer for carrying chips.
[0005] Further, the rubber coating layer comprises a rubber pipe layer and a cushion block, the rubber pipe layer is sleeved on the connecting end of the short rod and the long rod, and the cushion block is arranged on the side of the rubber pipe layer away from the connecting end.
[0006] Further, the cushion block comprises a first cushion block on the upper side of the rubber pipe layer and a second cushion block and a third cushion block on the lower side of the rubber pipe layer; wherein the first cushion block is provided with a clamping notch.
[0007] Further, the thickness of the third cushion block is greater than that of the second cushion block, and the width of the third cushion block is smaller than that of the second cushion block.
[0008] Further, the rubber coating layer is made of PET material.
[0009] Further, a plurality of long frame strips parallel to the long rods are arranged between the outer frame and the long rods, and a plurality of short frame strips parallel to the short rods are arranged between the outer frame and the short rods; wherein the long frame strips and the short frame strips are connected to each other.
[0010] Further, the outer frame is provided with a supporting plate on both sides.
[0011] The beneficial effects of the present application are: the present application is formed by secondary encapsulation of the inner frame to distinguish the traditional clamping column integrated with the tray. The encapsulation layer is made of PET material, which is relatively soft and not easy to wear, can effectively clamp the chip in the inner frame, and at the same time, it is not easy to scratch the chip, and reduces the defective rate. BRIEF DESCRIPTION OF DRAWINGS
[0012] Figure 1 is a structural schematic diagram of an embodiment of the encapsulated chip tray of the present application;
[0013] Figure 2 is a top view structural schematic diagram of an embodiment of the encapsulated chip tray of the present application;
[0014] Figure 3 is Figure 1 a structural schematic diagram of region A in DETAILED DESCRIPTION
[0015] The technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application.
[0016] As Figures 1-3 shown, the present application provides an encapsulated chip tray, which comprises an outer frame 1 and an inner frame 2 sleeved on the inner side of the outer frame 1; the inner frame 2 comprises two parallel long rods 21 and a plurality of groups of short rods 22 connected perpendicularly to the long rods 21; the outer frame 1 and the long rods 21 are connected by a plurality of groups of first connecting columns 3 arranged in parallel; the short rods 22 of the outer frame 1 are connected by a plurality of groups of second connecting columns 4 arranged in parallel; wherein the connecting ends of the short rods 22 and the long rods 21 are provided with an encapsulation layer 5 for bearing chips. The short rods 22 in the above design can form a chip placement unit, and the encapsulation layer 5 can effectively clamp the chips therein to prevent displacement of the chips during transportation.
[0017] The encapsulation layer 5 comprises a rubber tube layer 51 and a cushion block, the rubber tube layer 51 is sleeved on the connecting end of the short rod 22 and the long rod 21, and the cushion block is arranged on the side of the rubber tube layer 51 away from the connecting end. The rubber tube layer 51 in the above design is used to tightly connect the inner frame 2, and the cushion block therein is used to support and place the chips.
[0018] The cushion block comprises a first cushion block 52 on the upper side of the rubber tube layer 51 and a second cushion block 53 and a third cushion block 54 on the lower side of the rubber tube layer 51; wherein the first cushion block 52 is provided with a clamping notch. The clamping notch in the above design can effectively clamp the chip from the bottom.
[0019] The third cushion block 54 has a thickness greater than that of the second cushion block 53 and a width smaller than that of the second cushion block 53. The second cushion block 53 can press the chip on the lower tray from above, and the third cushion block 54 can clamp the chip from the upper side, further preventing displacement of the chip.
[0020] The encapsulation layer 5 is made of PET. PET has excellent physical and mechanical properties in a wide temperature range, and can be used for a long time at a temperature of up to 120°C. It has excellent electrical insulation properties, and even at high temperature and high frequency, its electrical properties are still good. In addition, it has excellent creep resistance, fatigue resistance, friction resistance, and dimensional stability. It can effectively prevent chip scratches or edge collapse and improve yield.
[0021] A plurality of long frame strips 11 parallel to the long rod 21 are arranged between the outer frame 1 and the long rod 21, and a plurality of short frame strips 12 parallel to the short rod 22 are arranged between the outer frame 1 and the short rod 22. The long frame strips 11 and the short frame strips 12 are connected to each other. The long frame strips 11 and the short frame strips 12 in the above design can increase the connection strength of the outer frame 1 and the inner frame body, ensuring the overall firmness of the supporting plate 13.
[0022] The outer frame 1 is provided with a supporting plate 13 on both sides. The supporting plate 13 in the above design facilitates mechanical or manual lifting of the tray.
[0023] Specific working principle, the chip is placed on the upper side of the inner frame 2, the edge of the chip is placed in the clamping notch of the first cushion block 52, so that the first cushion block 52 is firmly clamped with the chip. When the tray is stacked, the second cushion block 53 at the bottom of the upper tray can press the chip from above, and the third cushion block 54 can clamp the chip from the side end of the upper side, further preventing displacement of the chip. Since each cushion block is made of PET material, the hardness is lower than that of the chip, reducing the risk of chip edge collapse and reducing the chip failure rate.
[0024] The above only describes the embodiments of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation using the contents of the specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. An encapsulated chip tray, characterized by, The application relates to a frame structure, which comprises an outer frame and an inner frame sleeved in the inner side of the outer frame; the inner frame comprises two long rods arranged in parallel and a plurality of groups of short rods connected perpendicularly to the long rods; the outer frame and the long rods are connected through a plurality of groups of first connecting columns arranged in parallel; the outer frame and the short rods are connected through a plurality of groups of second connecting columns arranged in parallel; wherein the connecting ends of the short rods and the long rods are provided with encapsulation layers for bearing chips. The encapsulation layer comprises a rubber tube layer and a cushion block; the rubber tube layer is sleeved at the connecting ends of the short rods and the long rods; and the cushion block is arranged on the side of the rubber tube layer far away from the connecting ends.
2. An encapsulated chip tray as claimed in claim 1, characterized in that The cushion block comprises a first cushion block arranged on the upper side of the rubber tube layer and a second cushion block and a third cushion block arranged on the lower side of the rubber tube layer; wherein the first cushion block is provided with a clamping notch.
3. An encapsulated chip tray as claimed in claim 2, characterized in that The thickness of the third cushion block is greater than that of the second cushion block, and the width of the third cushion block is smaller than that of the second cushion block.
4. The potted chip tray of claim 3, wherein, The encapsulation layer is made of PET material.
5. An encapsulated chip tray as claimed in claim 4, characterized in that A plurality of long frame strips arranged in parallel to the long rods are arranged between the outer frame and the long rods; a plurality of short frame strips arranged in parallel to the short rods are arranged between the outer frame and the short rods; wherein the long frame strips and the short frame strips are connected to each other.
6. An encapsulated chip tray as claimed in claim 1, wherein, The outer frame is provided with a supporting plate on both sides.
7. An encapsulated chip tray as claimed in claim 1, wherein,