Lead frame electroplating shielding structure

Abstract

The utility model discloses a lead frame electroplating shielding structure, and belongs to the technical field of electroplating. A lead frame electroplating shielding structure is applied to a lead frame, the surface of the lead frame is divided into a functional area and a non-functional area, the functional area is arranged in a rectangular shape and comprises at least one shielding part, the shielding part is fixed to the non-functional area, preferably, the shielding part is fixed to the non-functional area in an electroplating mode, and the shielding part is made of a conductive material, preferably silver. The shielding part comprises a horizontal part and a vertical part which are orthogonal, the horizontal part is parallel to the upper and lower edges of the functional area, and the vertical part is parallel to the left and right edges of the functional area. By arranging the shielding part, the electric field linear density of the edge of the functional area can be reduced, the current density of the edge of the functional area is reduced, the grain growth speed of the edge of the functional area in the electroplating process is hindered, and the electroplating range of products is reduced.

Description

Technical Field

[0001] This utility model relates to the field of electroplating technology, and more specifically, to a lead frame electroplating shielding structure. Background Technology

[0002] Currently, lead frame products undergo several main electroplating processes, including surface cleaning, pre-plating with copper, pre-immersion in silver, and electroplating with silver. There are two main types of electroplating products: sheet-type and roll-type. Sheet-type electroplating involves single-sheet electroplating, with each sheet plated intermittently, a few seconds between each sheet. This allows for strong controllability and stable density, virtually eliminating silver burning and roughness issues. However, its electroplating efficiency is lower. Roll-type electroplating involves multiple sheets on a single roll, with each sheet containing multiple plates. Electroplating is continuous, one sheet after another, resulting in higher speed. However, burning and roughness often occur at the edges, with a thickness difference of approximately 7μm between the edge and center areas. Nevertheless, its electroplating efficiency is 500% higher than sheet-type electroplating.

[0003] A search revealed a patent document with publication number CN214572325U that provides an electroplating cathode shielding device. By setting a shielding frame outside the electroplating area and exposing the conductive material inside the shielding frame, it is used to attract electric field lines and increase the uniformity of the electric field line arrangement. This is used to counteract excess electric field lines at the edges and the tip effect, thereby making the copper thickness distribution in the board tend to be stable.

[0004] Because the structure of the lead frame differs from that of the circuit board, the above-mentioned technical solutions cannot be directly applied to the electroplating process of the lead frame. Therefore, we propose a lead frame electroplating shielding structure. Utility Model Content

[0005] 1. Technical problems to be solved

[0006] The purpose of this invention is to provide a lead frame electroplating shielding structure to solve the problems mentioned in the background art.

[0007] 2. Technical Solution

[0008] This utility model is achieved through the following technical solution:

[0009] An electroplated shielding structure for a lead frame is provided. The surface of the lead frame is divided into a functional area and a non-functional area. The functional area is rectangular and includes at least one shielding part. The shielding part is fixed to the non-functional area. The shielding part is made of conductive material. The shielding part includes a horizontal part and a vertical part. The horizontal part and the vertical part are orthogonal. The horizontal part is parallel to the upper and lower edges of the functional area, and the vertical part is parallel to the left and right edges of the functional area.

[0010] As an optional solution to the technical solution of this application, the shielding part is fixed to the non-functional area by electroplating.

[0011] As an optional solution to the technical solution in this application, the material of the shielding part is silver.

[0012] As an optional solution to the technical solution of this application, there are two shielding parts, which are located on both sides of the lead frame, and there are two horizontal parts, which are located at both ends of the vertical part.

[0013] As an optional solution to the technical solution of this application, the length of the horizontal part is 22 micrometers, the length of the vertical part is 72 micrometers, and the width of the horizontal part and the vertical part is 1 micrometer.

[0014] As an optional solution to the technical solution of this application, there are four shielding parts, which are located at the four corners of the functional area, and there is one horizontal part and one vertical part.

[0015] As an optional solution to the technical solution of this application, the length of the horizontal part is 22 micrometers, the length of the vertical part is 25 micrometers, and the width of the horizontal part and the vertical part is 1 micrometer.

[0016] As an optional solution to the technical solution of this application, the length of the horizontal part is 9.9 micrometers, the length of the vertical part is 11.2 micrometers, and the width of the horizontal part and the vertical part is 1.4 micrometers.

[0017] As an optional solution to the technical solution of this application, the length of the horizontal part is 9.5 micrometers, the length of the vertical part is 10.8 micrometers, and the width of the horizontal part and the vertical part is 1 micrometer.

[0018] 3. Beneficial effects

[0019] Compared with the prior art, the beneficial effects of this utility model are:

[0020] This application reduces the electroplating quality of the product by electroplating silver in the non-functional areas of the lead frame, adjusting the current density in the functional areas, hindering the grain growth rate at the edge of the functional areas during the electroplating process, and avoiding the problems of scorching and coarse silver at the edge of the functional areas of the lead frame during the roll-to-roll electroplating process. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of a lead frame electroplating shielding structure in Embodiment 1;

[0022] Figure 2 This is a schematic diagram of the overall structure of a lead frame electroplating shielding structure in Embodiment 2;

[0023] Figure 3 This is a schematic diagram of the overall structure of a lead frame electroplating shielding structure in Example 3;

[0024] Figure 4 This is a schematic diagram of the overall structure of a lead frame electroplating shielding structure in Example 4;

[0025] In the diagram: 1. Obstruction area; 101. Horizontal area; 102. Vertical area; 201. Functional area; 202. Non-functional area. Detailed Implementation

[0026] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings.

[0027] This utility model provides an electroplated shielding structure for a lead frame, which is applied to a lead frame. The surface of the lead frame is divided into a functional area 201 and a non-functional area 202. The functional area 201 is rectangular. It includes at least one shielding part 1, which is fixed to the non-functional area 202. Preferably, the shielding part 1 is fixed to the non-functional area 202 by electroplating. The shielding part 1 is made of a conductive material, preferably silver. The shielding part 1 includes a horizontal part 101 and a vertical part 102. The horizontal part 101 and the vertical part 102 are orthogonal. The horizontal part 101 is parallel to the upper and lower edges of the functional area 201, and the vertical part 102 is parallel to the left and right edges of the functional area 201.

[0028] By setting the shielding part 1, the electric field line density at the edge of the functional area 201 can be reduced, the current density at the edge of the functional area 201 can be reduced, the grain growth rate at the edge of the functional area 201 during the electroplating process can be hindered, and the electroplating quality of the product can be reduced.

[0029] Example 1:

[0030] like Figure 1 As shown, this application provides a lead frame electroplating shielding structure. In this embodiment, two shielding parts 1 are provided, each located on one side of the lead frame. Two horizontal parts 101 are provided, each located at one end of a vertical part 102. The length of the horizontal part 101 is 22 micrometers, the length of the vertical part 102 is 72 micrometers, and the width of both the horizontal and vertical parts 101 is 1 micrometer.

[0031] Example 2:

[0032] like Figure 2As shown, this application provides a lead frame electroplating shielding structure, wherein there are four shielding parts 1, which are respectively located at the four corners of the functional area 201. There is one horizontal part 101 and one vertical part 102. The length of the horizontal part 101 is 22 micrometers, the length of the vertical part 102 is 25 micrometers, and the width of the horizontal part 101 and the vertical part 102 is 1 micrometer.

[0033] Example 3:

[0034] like Figure 3 As shown, this application provides a lead frame electroplating shielding structure, wherein there are four shielding parts 1, which are respectively located at the four corners of the functional area 201. There is one horizontal part 101 and one vertical part 102. The length of the horizontal part 101 is 9.9 micrometers, the length of the vertical part 102 is 11.2 micrometers, and the width of the horizontal part 101 and the vertical part 102 is 1.4 micrometers.

[0035] Example 4:

[0036] like Figure 4 As shown, this application provides a lead frame electroplating shielding structure, wherein there are four shielding parts 1, which are respectively located at the four corners of the functional area 201. There is one horizontal part 101 and one vertical part 102. The length of the horizontal part 101 is 9.5 micrometers, the length of the vertical part 102 is 10.8 micrometers, and the width of the horizontal part 101 and the vertical part 102 is 1 micrometer.

[0037] The experimental data obtained using the above implementation scheme are as follows:

[0038] Table 1: Electroplating Thickness Inspection Table

[0039]

[0040]

[0041] Note: The original version did not have a lead frame with shielding part 1.

[0042] By adopting the technical solution described in this application, the product quality variation during the lead frame electroplating process can be effectively reduced.

Claims

1. A lead frame electroplating shielding structure, applied to a lead frame, wherein the surface of the lead frame is divided into a functional area (201) and a non-functional area (202), the functional area (201) being rectangular in shape, characterized in that: It includes at least one shielding part (1), the shielding part (1) is fixed in the non-functional area (202), the shielding part (1) is made of conductive material, the shielding part (1) includes a horizontal part (101) and a vertical part (102), the horizontal part (101) and the vertical part (102) are orthogonal, the horizontal part (101) is parallel to the upper and lower edges of the functional area (201), and the vertical part (102) is parallel to the left and right edges of the functional area (201).

2. The lead frame electroplating shielding structure according to claim 1, characterized in that: The shielding part (1) is fixed to the non-functional area (202) by electroplating.

3. The lead frame electroplating shielding structure according to claim 1, characterized in that: The material of the shielding part (1) is silver.

4. The lead frame electroplating shielding structure according to claim 1, characterized in that: Two shielding parts (1) are provided, and the two shielding parts (1) are located on both sides of the lead frame. Two horizontal parts (101) are provided, and the two horizontal parts (101) are located at both ends of the vertical part (102).

5. The lead frame electroplating shielding structure according to claim 4, characterized in that: The horizontal portion (101) has a length of 22 micrometers, the vertical portion (102) has a length of 72 micrometers, and the width of the horizontal portion (101) and the vertical portion (102) is 1 micrometer.

6. The lead frame electroplating shielding structure according to claim 1, characterized in that: The shielding part (1) is provided in four parts, and the four shielding parts (1) are respectively located at the four corners of the functional area (201). The horizontal part (101) and the vertical part (102) are each provided.

7. The lead frame electroplating shielding structure according to claim 6, characterized in that: The horizontal portion (101) has a length of 22 micrometers, the vertical portion (102) has a length of 25 micrometers, and the width of the horizontal portion (101) and the vertical portion (102) is 1 micrometer.

8. The lead frame electroplating shielding structure according to claim 6, characterized in that: The horizontal portion (101) has a length of 9.9 micrometers, the vertical portion (102) has a length of 11.2 micrometers, and the width of the horizontal portion (101) and the vertical portion (102) is 1.4 micrometers.

9. The lead frame electroplating shielding structure according to claim 6, characterized in that: The horizontal portion (101) has a length of 9.5 micrometers, the vertical portion (102) has a length of 10.8 micrometers, and the width of the horizontal portion (101) and the vertical portion (102) is 1 micrometer.

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