Plasma combustion device for semiconductor tail gas treatment
By combining the inner and outer double-layer air-cooling cavity and water-cooling cavity design, the problem of uneven air-cooling in semiconductor exhaust gas treatment is solved, achieving more efficient and safer exhaust gas cooling and water washing treatment.
Patent Information
- Application Number
- CN202423205855.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-12-25
AI Technical Summary
In existing technologies, the air-cooling effect of the plasma combustion device in semiconductor exhaust gas treatment is poor and uneven, which affects the efficiency and safety of subsequent water washing treatment.
It adopts a double-layer air-cooled cavity structure, combined with a water-cooled cavity design. Uniform cooling is achieved through the alternating arrangement of cooling air channels and guide plates in the inner and outer cavities, and the water-cooled cavity further improves the cooling efficiency.
This achieves a more uniform cooling effect during semiconductor exhaust gas treatment, improves safety and the efficiency of water washing, and ensures safe exhaust gas emissions.
Smart Images
Figure CN223595944U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to semiconductor tail gas treatment technical field, concretely is a kind of plasma combustion device for semiconductor tail gas treatment. BACKGROUND
[0002] With the continuous promotion of sustainable development, the control of pollution sources in various industries is becoming more and more strict, especially the discharge requirement of industrial waste gas is higher, that is, the requirement of tail gas treatment technology is also higher and higher. Among them, a large amount of harmful gases such as hydrogen gas will be produced in the production process of semiconductor industry, and these tail gases will cause great harm to the operators if their concentration in the workshop exceeds the standard, and direct discharge will also cause great safety risk to the environment, so it is necessary to handle and release them in time. In the prior art, the hydrogen treatment method mainly adopts combustion method, and plasma combustion is a common combustion treatment method. In production practice, the temperature generated by combustion is high, and it needs to be reduced to the set temperature before entering the water washing equipment, and then discharged outward. At present, the commonly used methods are air cooling or water cooling. The air cooling has low cost, but it generally has the problems of poor cooling effect and uneven cooling. SUMMARY
[0003] The utility model discloses a kind of plasma combustion devices for semiconductor tail gas treatment, it solves the technical problem that the cooling effect of combustion main cavity air cooling is poor in prior art, and the technical effect that cooling is good and cooling is uniform is had with reasonable structure. The technical scheme as follows is used:
[0004] A kind of plasma combustion device for semiconductor tail gas treatment, including main cavity and plasma generator, the plasma generator is used to emit charged particles to main cavity, a plurality of first gas inlet pipes for introducing hydrogen tail gas are connected in the main cavity, the import end of the first gas inlet pipe is arranged in circumference and is communicated with the upper portion of main cavity, the upper portion of main cavity is also communicated with third gas inlet pipe, air or oxygen can enter the main cavity through third gas inlet pipe to assist combustion, the lower portion of main cavity is communicated with water washing equipment, air cooling cavity is formed outside the main cavity, the air cooling cavity includes inner cavity and outer cavity, the inner cavity is arranged around the main cavity and is downwardly open, the outer cavity is arranged outside the inner cavity and is communicated with the inner cavity by a plurality of circumferentially arranged first through holes, and the outer cavity is communicated with second gas inlet pipe.
[0005] On the basis of the above technical scheme, the end port of the second gas inlet pipe inserted into the outer cavity is closed, and a plurality of through holes are arranged in circumference on the side wall close to the end.
[0006] On the basis of the above technical scheme, the third gas inlet pipe is communicated with the main cavity through the gas inlet cavity, the gas inlet cavity is sleeved outside the main cavity, and the annular passage, which is communicated between the gas inlet cavity and the main cavity, has an angle that is inclined downward from outside to inside.
[0007] On the basis of the above technical solutions, a refractory layer is arranged on the inner wall surface of the main cavity near the first air inlet pipe.
[0008] On the basis of the above technical solutions, a water cooling cavity is arranged outside the inner cavity, the upper portion of the water cooling cavity is communicated with the water outlet, and the lower portion of the water cooling cavity is communicated with the water inlet.
[0009] On the basis of the above technical solutions, the water cooling cavity is arranged above the outer cavity and flush with the outer wall surface of the outer cavity.
[0010] On the basis of the above technical solutions, the inner cavity extends downward to form an extension portion outside the main cavity.
[0011] On the basis of the above technical solutions, a guide plate is arranged on the inner wall surface above the first through hole, the guide plate has an angle that is inclined downward from outside to inside, and the guide plate and the main cavity form an annular gap to guide and cool the burned exhaust gas.
[0012] On the basis of the above technical solutions, the guide plate is inclined downward from outside to inside by 30-60°, and the width of the annular gap is 1.5-5 mm.
[0013] On the basis of the above technical solutions, the water washing device comprises a cooling water pipe, and the cooling water pipe is provided with a water outlet hole facing the outer wall surface of the extension portion.
[0014] Beneficial effects
[0015] The utility model discloses a reasonable structure, and the air cooling cavity is arranged outside the main cavity, and comprises the inner cavity and the outer cavity arranged inside and outside, wherein the cooling air that enters the outer cavity through the second air inlet pipeline enters the inner cavity through a plurality of first through holes to exchange heat with the main cavity, wherein the first through hole is arranged below, and the cooling air that flows in through the first through hole enters the inner cavity upward and downward, and the cooling air that enters the inner cavity extension portion downward can cool the high-temperature tail gas entering the water washing box well, the cooling air that enters the inner cavity upward, on one hand, the gas in the inner cavity flows fast, promotes the heat exchange efficiency between the water cooling cavity and the main cavity, and the cooling uniformity is improved greatly, on the other hand, it is favorable to improve the air cooling effect, and the cooling air diffuses to the outer cavity first, the cooling air in the outer cavity enters the inner cavity through a plurality of first through holes, the flow rate of the cooling air is reduced greatly, the contact time with the main cavity is increased, and then the air cooling effect is improved, and on the other hand, the guide plate is further arranged above the first through hole, the cooling air forms annular airflow curtain at the guide plate, can also block the high-temperature gas discharged from the main cavity from diffusing to the inner cavity, and is favorable to improve the use safety, and the arrangement of the guide plate also makes the cooling air and the exhaust gas flow from the main cavity consistent, so that the burned exhaust gas can be guided to discharge outward, and the exhaust gas can be cooled continuously, and the water washing effect is improved.
[0016] The water cooling cavity is arranged above the outer cavity, and the water cooling cavity can further improve the cooling efficiency. BRIEF DESCRIPTION OF DRAWINGS
[0017] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only one embodiment of the present application, and for those skilled in the art, other embodiments can be obtained from the provided drawings without creative labor.
[0018] Figure 1 The structure schematic diagram of the front view of the present application;
[0019] Figure 2 : Figure 1 The structure schematic diagram of the section structure of B-B direction in the present application;
[0020] Figure 3 : Figure 2 The structure schematic diagram of the local enlarged structure of A in the present application;
[0021] Figure 4 : Figure 2 The structure schematic diagram of the local enlarged structure of B in the present application; DETAILED DESCRIPTION
[0022] The following description and drawings are illustrative of specific embodiments thereof and are not intended to limit the scope of the embodiments. Parts and features of some embodiments can be included or substituted in other embodiments. The scope of the embodiments described herein is encompassed by the entire scope of the claims, and all available equivalents of the claims. Herein, the terms "first", "second", and the like, are used to distinguish one element from another, and do not require or imply any actual relationship or order between such elements. In fact, the first element could be named the second element and, conversely, the second element could be named the first element. Also, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a structure, device, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such structure, device, or apparatus. Without further limitation, an element defined by an "includes a" statement does not exclude the presence of additional identical elements in the structure, device, or apparatus that includes the element. Various embodiments are described in a progressive manner, each focusing on the differences from other embodiments, and the same or similar parts between embodiments are referred to each other.
[0023] The terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate the orientation or positional relationship shown in the drawings, and are used herein and in the description only to facilitate the description and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In the description herein, unless otherwise specified and limited, the terms "mount", "connect", "connection" should be interpreted broadly, for example, it can be a mechanical connection or an electrical connection, it can be a communication between two elements inside, it can be a direct connection, or an indirect connection through an intermediate medium, and the specific meaning of the above terms can be understood by those skilled in the art according to the specific circumstances.
[0024] Herein, unless otherwise specified, the term "a plurality of" means two or more.
[0025] Herein, the character " / " represents an "or" relationship between the objects before and after it. For example, A / B means: A or B.
[0026] Herein, the term "and / or" is a description of the relationship between the objects, which means that there can be three relationships. For example, A and / or B means: A or B, or, A and B, the three relationships.
[0027] As Figures 1-4The semiconductor exhaust gas treatment plasma combustion device shown includes a main cavity 1 and a plasma generator 13. The emission port of the plasma generator 13 is in communication with the upper port of the main cavity 1. When current passes through the plasma generator 13, it generates a large number of free electrons and positive ions. These charged particles interact with hydrogen and oxygen in the air. Hydrogen molecules are excited to a higher energy state after being collided by the charged particles, making them more likely to react with oxygen.
[0028] As shown in the drawings, Figure 2 The main cavity 1 is cylindrical and open at the bottom. The main cavity 1 is connected to a plurality of first gas inlet pipes 2 for introducing hydrogen exhaust gas. The inlet ends of the plurality of first gas inlet pipes 2 are arranged circumferentially and in communication with the upper part of the main cavity 1. The first gas inlet pipe 2 further includes a corrugated pipe section 21, which helps to reduce noise and reduce the vibration of the gas flow to the combustion device. A refractory layer is provided on the inner wall surface of the main cavity 1 near the first gas inlet pipe 2. According to the prior art, the skilled person can select according to the needs.
[0029] The upper part of the main cavity 1 is also in communication with a third gas inlet pipe 3. Air or oxygen can enter the main cavity 1 through the third gas inlet pipe 3 to assist combustion. The third gas inlet pipe 3 is in communication with the main cavity 1 through a gas inlet cavity 4. Figure 2 As shown in the drawings, Figure 4 The upper part of the main cavity 1 includes a reduced diameter section. The first gas inlet pipe 2 and the gas inlet cavity 4 are arranged corresponding to the reduced diameter section of the main cavity 1. The gas inlet cavity 4 is sleeved outside the reduced diameter section of the main cavity 1, and the annular channel in communication with the reduced diameter section of the main cavity 1 has an angle that is inclined downward from the outside to the inside. In this way, the combustion-supporting gas of air or oxygen can be diffused annularly into the main cavity 1, more fully contacting the exhaust gas, which is conducive to improving the combustion completeness.
[0030] The opening at the bottom of the main cavity 1 is in communication with a water washing device 5. The exhaust gas after combustion is discharged outwardly after passing through the water washing device 5. The water washing device 5 for hydrogen exhaust gas is prior art, which will not be described here.
[0031] In production practice, when the exhaust gas is combusted, on the one hand, it is necessary to ensure that the center of the main cavity 1 has a stable high-temperature environment, and on the other hand, it is necessary to quickly and efficiently cool the exhaust gas after combustion to smoothly complete the water washing process. Therefore, it is necessary to provide a cooling cavity outside the main cavity 1.
[0032] As shown in the drawings, Figure 2 A wind cooling cavity 6 is formed outside the main cavity 1. The wind cooling cavity 6 includes an inner cavity 61 and an outer cavity 62. The inner cavity 61 is arranged around the main cavity 1 and extends upward to near the gas inlet cavity 4. The inner cavity 61 forms an annular opening downwardly, from which the cooling air that has completed heat exchange with the main cavity 1 is discharged. The outer cavity is arranged near the lower part of the main cavity 1 and is sleeved outside the inner cavity 61. The outer cavity 62 is in communication with the inner cavity 61 through a plurality of circumferentially arranged first through holes 10.
[0033] As Figure 2 shown, the outer cavity 62 is in communication with the second air inlet pipe 8, the end of the second air inlet pipe 8 extending into the outer cavity 62 is closed, and a plurality of through holes are arranged on the side wall near the end in a circumferential direction, so that the gas entering the outer cavity 62 through the second air inlet pipe 8 can be more evenly diffused in the outer cavity 62, and then the gas can be more evenly introduced into the inner cavity 61 through the first through hole 10.
[0034] As Figure 2 shown, the inner cavity 61 extends downward out of the main cavity 1 to form an extension 11, the extension 11 extends into the water washing device 5, and the bottom surface of the extension is lower than the lower opening of the main cavity 1. A guide plate 9 is fixed on the inner wall surface of the inner cavity 61 above the first through hole 10, the guide plate 9 has an angle that is inclined downward from outside to inside, and the guide plate 9 and the outer wall surface of the main cavity 1 form an annular gap, as Figure 3 shown, the guide plate 9 is inclined downward by 45° from outside to inside, and the width of the annular gap is 2.5mm, so that a part of the cooling air flow that diffuses upward through the annular gap after entering the inner cavity 61 through the first through hole 10 can still maintain a relatively high flow rate, and after entering the inner cavity 61 upward, it touches the inner top surface of the inner cavity 61, and then folds back to be discharged downward, which is beneficial to further improve the cooling effect. At the same time, another part of the cooling air flows downward along the extension 11, and this part of the cooling air is consistent with the flow direction of the exhaust gas discharged from the main cavity 1, so that the exhaust gas after combustion can be guided to continue to be discharged outward after being discharged from the main cavity 1, enter the water washing device 5, and also play a role of guiding and continuing to cool the exhaust gas.
[0035] As Figure 2 shown, the inner cavity 61 is sleeved with a water cooling cavity 7, the upper part of the water cooling cavity 7 is in communication with a water outlet 72, and the lower part of the water cooling cavity 7 is in communication with a water inlet 71. The water cooling cavity 7 is arranged above the outer cavity 62 and flush with the outer wall surface of the outer cavity 62, which is beneficial to maintain the flatness of the appearance.
[0036] In addition, the water washing device 5 includes a cooling water pipe 12, the cooling water pipe 12 is provided with a water outlet hole facing the outer wall surface of the extension, so as to achieve the effects of water washing and cooling.
[0037] The above has described the utility model by way of example, but the utility model is not limited to the above specific embodiments, and any modification or variation made based on the utility model belongs to the scope of protection required by the utility model.
Claims
1. A plasma combustion device for semiconductor exhaust gas treatment, characterized by comprising: The application relates to a hydrogen gas tail gas treatment device, which comprises a main cavity (1) and a plasma generator (13) for emitting charged particles into the main cavity (1), a plurality of first gas inlet pipes (2) for introducing hydrogen gas tail gas are connected to the main cavity (1), the inlet ends of the first gas inlet pipes (2) are arranged in a circle and communicate with the upper part of the main cavity (1), a third gas inlet pipe (3) is further connected to the upper part of the main cavity (1), air or oxygen can enter the main cavity (1) through the third gas inlet pipe (3) to assist combustion, the lower part of the main cavity (1) communicates with a water washing device (5), a wind cooling cavity (6) is formed outside the main cavity (1), the wind cooling cavity (6) comprises an inner cavity (61) and an outer cavity (62), the inner cavity (61) is arranged around the main cavity (1) and opens downward, the outer cavity (62) is arranged outside the inner cavity (61) and communicates with the inner cavity (61) through a plurality of first through holes (10) arranged in a circle, and the outer cavity (62) communicates with a second gas inlet pipe (8).
2. The plasma combustion apparatus for semiconductor exhaust gas treatment according to claim 1, characterized by The end port of the second gas inlet pipe (8) extending into the outer cavity (62) is closed, and a plurality of through holes are arranged in a circle on the side wall near the end.
3. The plasma combustion apparatus for semiconductor exhaust gas treatment according to claim 1, characterized by The third gas inlet pipe (3) communicates with the main cavity (1) through a gas inlet cavity (4), the gas inlet cavity (4) is sleeved outside the main cavity (1), and the annular channel, through which the gas inlet cavity (4) communicates with the main cavity (1), has an angle that inclines downward from outside to inside.
4. The plasma combustion apparatus for semiconductor exhaust gas treatment according to claim 1, characterized by A refractory layer is arranged on the inner wall of the main cavity (1) near the first gas inlet pipe (2).
5. The plasma combustion apparatus for semiconductor exhaust gas treatment according to any one of claims 1 to 4, characterized by A water cooling cavity (7) is sleeved outside the inner cavity (61), the upper part of the water cooling cavity (7) communicates with a water outlet (72), and the lower part of the water cooling cavity (7) communicates with a water inlet (71).
6. The plasma combustion apparatus for semiconductor exhaust gas treatment according to claim 5, characterized by The water cooling cavity (7) is arranged above the outer cavity (62) and is flush with the outer wall of the outer cavity (62).
7. The plasma combustion apparatus for semiconductor exhaust gas treatment according to claim 5, characterized by The inner cavity (61) extends downward outside the main cavity (1) to form an extension (11).
8. The plasma combustion apparatus for semiconductor exhaust gas treatment according to claim 7, characterized by A guide plate (9) is fixed on the inner wall above the first through hole (10), the guide plate (9) has an angle that inclines downward from outside to inside, and the guide plate (9) and the main cavity (1) form an annular gap to guide and cool the burned waste gas.
9. The plasma combustion apparatus for semiconductor exhaust gas treatment according to claim 8, characterized by The guide plate (9) inclines downward from outside to inside by 30-60 degrees, and the width of the annular gap is 1.5-5 mm.
10. The plasma combustion apparatus for semiconductor exhaust gas treatment according to any one of claims 7 to 9, characterized by The water washing device (5) comprises a cooling water pipe (12) provided with a water outlet hole facing the outer wall of the extension (11).