Vapor chamber
By setting square recesses and protrusions on the inner wall of the lower cover, the capillary effect of the heat dissipation plate is enhanced, solving the problem of insufficient heat dissipation capacity of existing VC heat dissipation plates and achieving a highly efficient heat dissipation effect.
Patent Information
- Application Number
- CN202423206902.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-12-25
AI Technical Summary
Existing VC heat sinks have limited heat dissipation capacity and cannot meet the heat dissipation requirements under high-heat conditions.
Square recessed and raised structures are set on the inner wall of the lower cover to form a microstructure, which, together with the mesh layer, enhances capillary action and improves the reflux capacity of the cooling medium.
The heat dissipation capacity of the heat spreader has been enhanced, which can meet the heat dissipation requirements under high heat conditions.
Smart Images
Figure CN223596621U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of heat dissipation, especially relates to a uniform heating plate. BACKGROUND
[0002] VC uniform heating plate is a kind of efficient, accurate temperature control tool, by its working principle relying on thermoelectric effect, can provide stable and uniform temperature control in a variety of application scenarios.VC uniform heating plate is a vacuum cavity with maintaining structure on inner wall, usually made of copper / stainless steel, when heat is conducted to VC cavity by heat source, cooling liquid in cavity begins to produce gasification phenomenon after being heated, liquid vaporization absorbs heat, volume expands rapidly to fill the whole cavity, when gas phase working medium contacts a relatively cold area, condensation phenomenon occurs, by condensation release the heat absorbed before, condensed cooling liquid will return to evaporation heat source by microstructure capillary (the driving force of whole cycle is capillary force), this process will be carried out in cavity.
[0003] Prior art VC uniform heating plate generally includes upper cover, mesh layer and lower cover three layers of structure, refer to Figure 1 , normal uniform heating plate inner cavity's capillary backwater and water storage only rely on the capillary action of mesh layer, there is no any feature on the heat source surface of uniform heating plate, the heat dissipation capacity of uniform heating plate is limited, cannot meet the heat dissipation demand of product under some high heat generation working conditions. SUMMARY
[0004] The utility model discloses a kind of uniform heating plates, for improving the limit heat dissipation capacity of itself, meet the heat dissipation demand of product under some high heat generation working conditions.
[0005] The utility model discloses the purpose is realized by the following technical scheme:
[0006] The utility model provides a kind of uniform heating plate, with heat source surface and non heat source surface, including upper cover, screen layer and lower cover sequentially arranged along non heat source surface to heat source surface, the upper cover is sealed along the side and forms sealed space with lower cover, liquid phase cooling medium is provided in the sealed space, the lower cover has inner side wall and outer side wall, the inner side wall of the lower cover is towards the sealed space, the screen layer is housed in the sealed space and is attached with the inner side wall of the lower cover, a plurality of square recessed structures are provided on the inner side wall of the lower cover, and the square recessed structure is formed with protruding structure between it;
[0007] Wherein, when the uniform heating plate is heated, liquid phase cooling medium evaporates and forms gas phase cooling medium in the sealed space close to non heat source surface side, and gas phase cooling medium liquefies and re-forms liquid phase cooling medium in the sealed space close to heat source surface side.
[0008] Preferably, the lower cover has a cavity recessed from the inner side wall to the outer side wall to form a sealed space when the upper cover is connected with the lower cover.
[0009] Preferably, the lower cover is provided with a connecting edge along the periphery for sealed connection with the upper cover.
[0010] Preferably, the mesh layer is attached to the protruding structure.
[0011] Preferably, the upper cover is provided with a plurality of columns for attaching the mesh layer to the protruding structure when the upper cover is connected with the lower cover.
[0012] Preferably, the column has a frustum structure.
[0013] Preferably, the upper cover and the lower cover are both stainless steel stamping parts.
[0014] Preferably, the lower cover has a length direction along the X direction and a width direction along the Y direction, and the plurality of square recessed structures are uniformly distributed on the inner side wall of the lower cover along the X and Y directions.
[0015] Preferably, the square recessed structure is a square groove or a rectangular groove.
[0016] Preferably, the protruding structure is distributed on the inner side wall of the lower cover between the square recessed structures; and / or,
[0017] The surface of the protruding structure is arc-shaped.
[0018] Compared with the prior art, the utility model has at least the following beneficial effects:
[0019] The square recessed structure and the protruding structure formed on the lower cover form a microstructure based on the square recessed structure on the inner side wall of the lower cover, which, in cooperation with the mesh layer, increases the strength of the capillary action in the sealed space of the heat plate, enhances the ability of the liquid cooling medium to return to the lower cover, makes the cooling medium circulate in the heat plate with higher heat absorption and release efficiency, enhances the ultimate heat dissipation capacity of the heat plate, and meets the heat dissipation demand of the product under some high heat generation working conditions. BRIEF DESCRIPTION OF DRAWINGS
[0020] Figure 1 is a structure schematic view of the heat plate in the prior art;
[0021] Figure 2 is a structure schematic view of the heat plate provided by the utility model;
[0022] Figure 3 is a structure schematic view of the upper cover of the utility model;
[0023] Figure 4 is the enlarged structural schematic view of A in the utility model Figure 3
[0024] Figure 5 is the structural schematic view of the lower cover of the utility model embodiment;
[0025] Figure 6 is the enlarged structural schematic view of B in the utility model Figure 5 is the sectional structural schematic view along B-B direction;
[0026] Figure 7 is the structural schematic view of C in the utility model Figure 6
[0027] Figure 8 is the partial sectional structural schematic view of the lower cover of the utility model;
[0028] Figure 9 is the partial sectional structural schematic view of the utility model in the assembled state of the vaporizing plate;
[0029] Figure 10 is the enlarged structural schematic view of D in the utility model Figure 9
[0030] In the drawing:
[0031] 10, upper cover; 11, stand column;
[0032] 20, screen layer;
[0033] 30, lower cover; 31, square recess structure; 32, protruding structure; 33, connecting edge;
[0034] 40, sealing space. DETAILED DESCRIPTION
[0035] Example implementations will now be described more fully with reference to the accompanying drawings. Example implementations may, however, be implemented in many different forms and should not be construed as limited to the implementations set forth herein; rather, these implementations are provided so that this disclosure will be thorough and complete, and fully convey the inventive aspects of example implementations to those skilled in the art. Like reference numerals refer to like elements throughout the figures, and description of the same elements will not be repeated.
[0036] The words expressing position and direction described in the utility model are all illustrated by taking the drawings as examples, but changes can also be made according to needs, and the changes made are all included in the protection scope of the utility model.
[0037] Referring to Figure 1 The existing heat plate generally comprises three layers of structure of an upper cover 10, a mesh layer 20 and a lower cover 30, wherein the lower cover 30 is generally processed by stamping, and no feature or improvement for enhancing the heat dissipation performance of the lower cover 30 is generally arranged on the lower cover 30, so that the water return and storage circulation of the cooling medium in the heat plate is only relied on the capillary action of the mesh layer 20, and the existing heat plate has the problem of insufficient limit heat dissipation performance of the heat dissipation capacity, and cannot meet the heat dissipation demand under some high heat generation conditions.
[0038] In order to solve the problem of insufficient heat dissipation capacity of the existing heat plate, with reference to Figures 2 to 10 The utility model provides a kind of heat plate, with heat source surface and non heat source surface, including upper cover 10, mesh layer 20 and lower cover 30 are sequentially arranged along non heat source surface to heat source surface, wherein, upper cover 10 and lower cover 30 are stainless steel stamping parts, mesh layer 20 can be mesh layer, mesh layer is a kind of network structure, when inside heat plate, it has capillary action, it is helpful to make the circulation of cooling medium in heat plate, make heat plate heat absorption in non heat source surface and heat release in heat source surface, upper cover 10 is sealedly connected with lower cover 30 along perimeter side and forms sealed space 40, sealed space 40 is in vacuum state, liquid phase cooling medium is provided in sealed space 40, liquid phase cooling medium can be pure water, heat plate can not only increase heat conduction path and surface area by mesh layer, improve heat conduction efficiency, and when liquid phase cooling medium is pure water, it can be returned and stored by the capillary action of itself, guarantee the heat dissipation performance of heat plate, lower cover 30 has inner side wall and outer side wall, the inner side wall of lower cover 30 is towards sealed space 40, wherein, lower cover 30 has cavity by inner side wall recessed to outer side wall, to help form sealed space 40 when upper cover 10 is connected with lower cover 30.Mesh layer 20 is contained in sealed space 40 and is attached with the inner side wall of lower cover 30, a plurality of square recessed structures 31 are provided on the inner side wall of lower cover 30, square recessed structure 31 can be square groove or rectangular groove, raised structure 32 is formed between square recessed structure 31, specifically, raised structure 32 is distributed on the inner side wall of lower cover 30 between square recessed structure 31, the surface of raised structure 32 is arc-shaped, by the arrangement of square recessed structure 31 and raised structure 32, the part of lower cover 30 between raised structure 32 can form communicating groove with square recessed structure 31, after heat plate is assembled, it can cooperate with mesh layer 20 to enhance the strength of capillary action inside sealed space 40, improve the efficiency of liquid phase cooling medium backflow to upper cover 10 of non heat source surface.
[0039] It should be noted that the square recess structure 31 can be formed on the lower cover 30 in an embossing manner. When the square recess structure 31 is formed, the part of the lower cover 30 between the square recess structures 31 is deformed and protrudes under the extrusion action, forming the protruding structure 32 on the inner side wall of the lower cover 30. When the upper cover 10 and the lower cover 30 are assembled into one body, the mesh layer 20 is attached to the protruding structure 32.
[0040] When the heat plate is heated, the liquid-phase cooling medium evaporates in the sealing space 40 near the non-heat-source side to form a gas-phase cooling medium, and the gas-phase cooling medium liquefies in the sealing space 40 near the heat-source side to re-form the liquid-phase cooling medium.
[0041] Therefore, the heat plate forms the square recess structure 31 and the protruding structure 32 on the lower cover 30, forms the microstructure based on the square recess structure 31 that communicates with each other on the inner side wall of the lower cover 30, and increases the strength of the capillary action in the sealing space 40 of the heat plate after cooperating with the mesh layer 20. The ability of the liquid-phase cooling medium to return to the lower cover 30 is enhanced, the heat absorption and release efficiency of the cooling medium circulating in the heat plate is higher, the limit heat dissipation capacity of the heat plate is enhanced, and the heat dissipation demand of the product under some high-heat-generation working conditions can be met.
[0042] In some optional embodiments, with reference to Figures 5 to 7 The lower cover 30 is provided with a connecting edge 33 along the circumferential side for sealing connection with the upper cover 10. Specifically, the connecting edge 33 is integrally formed along the circumferential edge of the cavity formed on the inner side wall of the lower cover 30. The sealing connection of the upper cover 10 and the lower cover 30 in a vacuum environment can keep the vacuum state in the sealing space 40.
[0043] In some optional embodiments, with reference to Figure 3 and Figure 4 The upper cover 10 is provided with a plurality of columns 11. When the upper cover 10 is connected with the lower cover 30, the columns 11 are used to attach the mesh layer 20 to the protruding structure 32. Specifically, the column 11 can be in a circular truncated cone structure. The column 11 can also be formed on the upper cover 10 in an embossing manner. In this way, the side of the column 11 away from the sealing space 40 can be hollow, effectively avoiding the increase in weight of the upper cover 10 when the column 11 is formed, and helping to keep the heat plate light in quality.
[0044] In some optional embodiments, with reference to Figure 2 and Figure 5The lower cover 30 has a length direction along the X direction and a width direction along the Y direction, and the square recess structures 31 are uniformly distributed on the inner side wall of the lower cover 30 along the X and Y directions, specifically, the square recess structures 31 are uniformly distributed on the inner side wall of the lower cover 30 along the X and Y directions, so that the protruding structures 32 between the square recess structures 31 are also uniformly distributed on the inner side wall of the lower cover 30 along the X and Y directions. Therefore, the vapor chamber can form a microstructure intersecting each other on the inner side wall of the lower cover 30, which can increase the strength of capillary action in the sealed space 40 of the vapor chamber and the circulation capacity of the cooling medium, improve the efficiency of the liquid phase cooling medium after the gas phase cooling medium is liquefied on the upper cover 10 of the non-heat source surface back to the lower cover 30 and the square recess structure 31 of the heat source surface, and optimize the ultimate heat dissipation capacity of the vapor chamber product, so that the vapor chamber has stronger practicability.
[0045] It should be noted that in the process of forming the square recess structure 31 and the protruding structure 32 by embossing, the deformation degree of the protruding structure 32 between adjacent square recess structures 31 is greater than that of the protruding structure 32 between the corners of the square recess structure 31, that is, the thickness of the protruding structure 32 between adjacent square recess structures 31 is greater than that of the protruding structure 32 between the corners of the square recess structure 31. When the upper cover 10 and the lower cover 30 are assembled into one, the mesh layer 20 will be attached to the protruding structure 32 between the square recess structures 31, and will not be attached to the protruding structure 32 between the corners of the square recess structure 31. The square recess structures 31 on the lower cover 30 are connected to each other through the protruding structure 32 between the corners of the square recess structure 31 to form additional microstructures, which can cooperate with the mesh layer 20 to enhance the capillary action strength in the sealed space 40.
[0046] Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those skilled in the art can make changes, modifications, replacements and variations to the above embodiments without departing from the principles and purposes of the present application, and all these changes should be within the scope of the present application.
Claims
1. A vapor chamber having a heat source surface and a non-heat source surface, characterized by, The heat sink includes an upper cover (10), a mesh layer (20) and a lower cover (30) arranged in sequence from a non-heat source side to a heat source side, the upper cover (10) and the lower cover (30) are sealingly connected along the circumferential side to form a sealed space (40), the sealed space (40) is provided with a liquid phase cooling medium, the lower cover (30) has an inner side wall and an outer side wall, the inner side wall of the lower cover (30) faces the sealed space (40), the mesh layer (20) is accommodated in the sealed space (40) and is attached to the inner side wall of the lower cover (30), a plurality of square recess structures (31) are arranged on the inner side wall of the lower cover (30), and a convex structure (32) is formed between the square recess structures (31). When the heat sink is heated, the liquid phase cooling medium evaporates to form a gas phase cooling medium in the sealed space (40) near the non-heat source side, and the gas phase cooling medium liquefies to form a liquid phase cooling medium in the sealed space (40) near the heat source side.
2. The vapor chamber of claim 1, wherein The lower cover (30) has a cavity recessed from the inner side wall to the outer side wall, so that the upper cover (10) and the lower cover (30) form a sealed space (40) when connected.
3. The vapor chamber of claim 1, wherein The lower cover (30) is provided with a connecting edge (33) along the circumferential side for sealingly connecting with the upper cover (10).
4. The vapor chamber of claim 1, wherein The mesh layer (20) is attached to the convex structure (32), and the mesh layer (20) is a mesh layer.
5. The vapor chamber of claim 4, wherein The upper cover (10) is provided with a plurality of columns (11), and when the upper cover (10) is connected with the lower cover (30), the columns (11) are used to attach the mesh layer (20) to the convex structure (32).
6. The vapor chamber of claim 5, wherein The column (11) is in the shape of a circular truncated cone.
7. The vapor chamber of claim 1, wherein The upper cover (10) and the lower cover (30) are both stainless steel stamping parts.
8. The vapor chamber of claim 1, wherein The lower cover (30) has a length direction along the X direction and a width direction along the Y direction, and a plurality of square recess structures (31) are uniformly distributed on the inner side wall of the lower cover (30) along the X and Y directions.
9. The vapor chamber of claim 1, wherein The square recess structure (31) is a square groove or a rectangular groove.
10. The vapor chamber of claim 8, wherein The convex structure (32) is distributed on the inner side wall of the lower cover (30) between the square recess structures (31); and / or, The surface of the convex structure (32) is arc-shaped.