Pulse laser range finder

Abstract

The utility model discloses a pulse laser range finder, which belongs to the technical field of laser ranging and comprises a connecting assembly, a heat conducting assembly is arranged in the middle of the connecting assembly, the connecting assembly comprises a driving circuit board, and a DA controller is mounted at the upper end of the driving circuit board. According to the technical scheme, all parts of a connecting assembly and all parts of a heat conduction assembly are matched with each other, a laser emission system is optimized, the emission power or energy of laser is improved, the laser can be transmitted to a farther distance and is effectively received, and for application scenes needing long-distance distance measurement, the laser emission power or energy of the laser is improved. The device is very important for geodetic survey, aerospace and the like, the laser modulation and focusing technology is improved, laser beams are more concentrated, the directivity is better, and energy loss in the propagation process is reduced, so that a farther target can be reached, an echo signal which is strong enough is returned, and farther-distance measurement is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to laser ranging technical field more specifically, relate to a kind of pulse laser range finder. BACKGROUND

[0002] Laser emission module is the most need to determine part in whole system, responsible for converting pulse electric signal into pulse light signal output, due to the difference of different water body, it will have certain influence to the selection of laser band, but blue-green light 400nm-550nm transmission window is still a more ideal band for water bottom light transmission, wherein the energy carried by blue laser is relatively more, using the band laser can better improve underwater transmission distance, select semiconductor laser as the driving light source of system, not only can reduce the space area occupied by system, facilitate deployment optical angle also can greatly improve the working distance of system.

[0003] However, in general, the absolute accuracy of pulse laser range finder is relatively low, usually only to the precision level of meter, for some very high precision measurement requirement application scenarios, such as high-precision construction, precision instrument manufacturing, etc., the existing pulse laser range finder may not meet the demand, easily affected by environmental interference precision: environmental factors have greater influence on measurement accuracy, for example, temperature change can cause the change of laser propagation speed, thereby affecting the accuracy of distance measurement, dust, water vapor and other atmospheric conditions can also cause scattering and absorption of laser propagation, so that the received echo signal is weakened or distorted, reduces the measurement accuracy, although pulse laser range finder can realize long-distance measurement, but in some cases, for very far target, due to the attenuation of laser energy in the propagation process and the weak echo signal, the measurement distance may be limited, for example, in long-distance geodetic survey or space exploration applications, the existing pulse laser range finder may not reach the required measurement distance, in close-range measurement, due to the response time of laser emission and receiving system and the delay of signal processing, there may be a certain measurement blind area, that is, it cannot accurately measure very close distance, which will bring certain inconvenience to some scenes that need to measure accurately in close range, such as indoor decoration, small object size measurement, etc.

[0004] Therefore, a pulse laser range finder is proposed to solve the above problems. UTILITY MODEL CONTENT

[0005] In order to overcome the shortcomings of the prior art, the purpose of the utility model is to provide a pulse laser range finder to solve the above problems.

[0006] The above technical purpose of the utility model is realized by the following technical scheme:

[0007] A pulse laser range finder, comprising a connecting assembly, a heat conduction assembly is arranged in the middle of the connecting assembly;

[0008] The connecting assembly comprises a driving circuit board, a DA control is mounted on the upper end of the driving circuit board, a driving signal is mounted on the upper end of the driving circuit board, and a power supply interface is also mounted on the upper end of the driving circuit board.

[0009] Further, a driving chip is integrated on the upper end of the driving circuit board, and a laser positive electrode and a laser negative electrode are mounted on one end of the driving circuit board.

[0010] Further, the heat conduction assembly comprises a lower ceramic sheet fixedly connected to the lower end of the driving circuit board.

[0011] Further, the heat conduction assembly comprises heat-conducting silica gel fixedly connected to the upper end of the driving circuit board, and an upper ceramic sheet is fixedly connected to the upper end of the heat-conducting silica gel.

[0012] Further, a pair of symmetrical heat dissipation interfaces are arranged in the middle of the driving circuit board.

[0013] Further, a pair of symmetrical circular interfaces are arranged in the middle of the lower ceramic sheet, the heat-conducting silica gel and the upper ceramic sheet.

[0014] In summary, the utility model has the following beneficial effects:

[0015] (1) The scheme optimizes the laser emission system through the cooperation between the parts of the connecting assembly and the parts of the heat conduction assembly, improves the emission power or energy of the laser, makes the laser propagate to a farther distance and be effectively received, which is very important for application scenarios requiring long-distance ranging, such as geodetic surveying, aerospace, etc., improves the modulation and focusing technology of the laser, makes the laser beam more concentrated and directional, reduces the energy loss in the propagation process, so as to reach a farther target and return a strong enough echo signal to realize measurement of a farther distance.

[0016] (2) The scheme reduces the overall power consumption of the range finder by adopting advanced power management technology and low-power electronic components, which not only prolongs the use time of the range finder and reduces the frequency of battery replacement or charging, but also meets the requirements of energy saving and environmental protection, and can automatically reduce power consumption in standby mode, quickly wake up when there is a measurement demand, further save energy, and improve the endurance of the range finder. BRIEF DESCRIPTION OF DRAWINGS

[0017] Fig. 1 is the overall structure schematic diagram in the embodiment;

[0018] Fig. 2 is the overall split structure schematic diagram in the embodiment;

[0019] Fig. 3 It is the schematic diagram of the overall structure of the connecting assembly in the embodiment.

[0020] The reference signs in the drawing: 1, connecting assembly; 2, heat conduction assembly; 101, driving circuit board; 102, DA control; 103, driving signal; 104, power supply interface; 105, driving chip; 106, positive electrode of laser; 107, negative electrode of laser; 201, lower ceramic sheet; 202, heat conduction silicone; 203, upper ceramic sheet. DETAILED DESCRIPTION

[0021] The utility model will be described in further detail below in combination with the drawings.

[0022] Wherein, same parts are denoted by same reference signs. It should be noted that the words "front", "back", "left", "right", "up" and "down" used in the following description refer to the directions in the drawings, and the words "bottom surface" and "top surface", "inner" and "outer" refer to the directions towards or away from the geometric center of a particular component.

[0023] Referring to Figs. 1-3 Fig. 1, a pulse laser range finder in a preferred embodiment of the utility model comprises a connecting assembly 1, and a heat conduction assembly 2 is arranged at the middle part of the connecting assembly 1.

[0024] The connecting assembly 1 comprises a driving circuit board 101, and a DA control 102 is mounted at the upper end of the driving circuit board 101, a driving signal 103 is mounted at the upper end of the driving circuit board 101, and a power supply interface 104 is also mounted at the upper end of the driving circuit board 101.

[0025] Referring to Figs. 1-3 Fig. 2, a driving chip 105 is integrated at the upper end of the driving circuit board 101, and a positive electrode 106 and a negative electrode 107 of laser are mounted at one end of the driving circuit board 101.

[0026] The scheme aims at the problem that the laser and the high-power driving chip will generate more heat, adopts laminated heat dissipation ceramic sheets to expand the contact surface area of the chip, so that the heat dissipated by the chip is transmitted to the bottom substrate more quickly, improves the heat conduction efficiency of the chip, and increases the overall heat dissipation area by adhering the semiconductor laser to the overall substrate of the system through heat conduction silicone, and improves the heat dissipation efficiency, as shown in Fig. 2 Fig. 3.

[0027] Referring to Fig. 2 Fig. 4, the heat conduction assembly 2 comprises a lower ceramic sheet 201 fixedly connected at the lower end of the driving circuit board 101.

[0028] Referring to Fig. 2As shown, the heat-conducting assembly 2 includes a heat-conducting silica gel 202 fixedly connected to the upper end of the driving circuit board 101, and the upper end of the heat-conducting silica gel 202 is fixedly connected with an upper ceramic sheet 203.

[0029] With reference to Fig. 3 As shown, the middle part of the driving circuit board 101 is provided with a pair of symmetrically arranged heat-dissipating interfaces;

[0030] The present scheme considers that the microprocessor chip has a large working current when working, and generates a large amount of heat. Therefore, the chip is left empty, and a windowed gold sinking process is performed to increase the heat dissipation area and improve the heat dissipation efficiency. Further, a drill hole for mounting a heat dissipation module is reserved to further improve the working stability.

[0031] With reference to Fig. 2 As shown, the middle part of the lower ceramic sheet 201, the heat-conducting silica gel 202 and the upper ceramic sheet 203 are each provided with a pair of symmetrically arranged circular interfaces.

[0032] By setting the assembly / mechanism, what effect is achieved by using the remaining parts.

[0033] Specific implementation process: first, the drive circuit board 101, as the core control part of the whole laser emission system, it is responsible for coordinating and controlling the work of each related component, the various elements installed on it work together to realize the emission and related control functions of laser, DA control 102, digital analog control DA control element on the drive circuit board, mainly responsible for converting digital signals into analog signals, in the pulse laser range finder, it may participate in the accurate control of laser emission parameters such as emission power, pulse frequency, etc., by receiving digital instructions from other control units, it converts them into appropriate analog signals, and then adjusts the related characteristics of laser emission to meet different ranging needs, drive signal 103, provides the necessary driving energy signal for laser emission, after being processed by the relevant circuit on the drive circuit board, it can drive the laser to emit pulsed laser according to the predetermined requirements, its characteristics such as amplitude, frequency, pulse width, etc. directly affect the emission state of the laser, thereby affecting the accuracy, distance range, etc. of the ranging, power supply interface 104, is the entrance for the whole drive circuit board and each component connected to it to obtain electrical energy, it receives the electrical energy provided by the external power supply and distributes it to each element on the drive circuit board that needs power supply, such as DA control, drive signal generation circuit and subsequent drive chip, etc., to ensure that each element can work normally and provide stable power support for laser emission, drive chip 105, integrated at the upper end of the drive circuit board, is the key chip for controlling the operation of the laser, which can accurately control the working state of the laser according to the received analog signals converted from the DA control and other related control signals, including adjusting the emission power, pulse frequency, pulse width and other parameters of the laser. Through fine adjustment of these parameters, the optimization of laser emission is realized to adapt to different ranging scenarios and target characteristics, laser positive 106 and laser negative 107 are connected at one end of the drive circuit board, respectively, they are directly connected with the laser, forming the power supply circuit of the laser. When the power supply enters the drive circuit board through the power supply interface, and is processed by the drive chip and other related elements, appropriate electrical energy is transmitted to the laser through the laser positive and negative, providing the energy for the laser to work normally and emit pulsed laser, heat conducting component 2, lower ceramic sheet 201, fixedly connected at the lower end of the drive circuit board 101, mainly plays the role of heat conduction. In the process of laser emission, some elements on the drive circuit board such as the drive chip will generate heat, the lower ceramic sheet can quickly conduct these heat away to prevent the elements from being damaged or degraded due to overheating. It has good heat conduction performance and can effectively transfer heat to the surrounding environment or other heat dissipation components to maintain the elements within the appropriate working temperature range, heat conducting silicone 202, located at the upper end of the drive circuit board 101, on the one hand, it is in close contact with the drive circuit board and can conduct the heat generated on the drive circuit board out, on the other hand, it is connected with the upper ceramic sheet 203 above, playing the role of connection and further heat conduction,The heat-conducting silica gel has good heat conductivity and flexibility, can well fill the tiny gaps between different components, and ensure that heat can be smoothly transmitted from the driving circuit board to the upper ceramic sheet, so as to realize more efficient heat dissipation. The upper ceramic sheet 203 is fixedly connected to the upper end of the heat-conducting silica gel 202, and is similar to the lower ceramic sheet, which is mainly used for heat dissipation. The heat conducted through the heat-conducting silica gel can be further dissipated by the upper ceramic sheet to the surrounding environment. The upper ceramic sheet has a large heat dissipation area and good heat dissipation performance, which can effectively dissipate the heat conducted from the driving circuit board, reduce the temperature of the entire system, and ensure the normal work of each component. The middle part of the driving circuit board 101 is provided with a pair of symmetric heat dissipation interfaces. These heat dissipation interfaces provide an additional channel for heat dissipation. They can be connected with external heat dissipation devices such as heat dissipation fans, heat dissipation fins, etc. When the elements on the driving circuit board generate heat, part of the heat can be directly conducted to the external heat dissipation device through these heat dissipation interfaces, further enhancing the heat dissipation capacity of the entire system, and helping to maintain the stable operation of the system. The middle part of the lower ceramic sheet 201, the heat-conducting silica gel 202 and the upper ceramic sheet 203 are each provided with a pair of symmetric circular interfaces. These circular interfaces may have multiple functions. On the one hand, they can be used for positioning of components during assembly, ensuring that each component can be accurately and correctly installed together, and ensuring the heat conduction performance and structural stability of the entire heat conduction assembly. On the other hand, they can also participate in the heat conduction or heat dissipation process to some extent, for example, when cooperating with other heat dissipation components, as an auxiliary channel for heat transfer, further optimizing the heat dissipation effect of the entire system. In actual work process, first, the external power supply provides power for the driving circuit board 101 through the power supply interface 104. The DA control 102 on the driving circuit board converts the received digital signal into an analog signal, which is then received by the driving chip 105 together with other control signals. The driving chip accurately controls the power transmitted to the laser by the laser anode 106 and the laser cathode 107 according to these signals, so that the laser emits pulsed laser according to the predetermined parameters such as power, pulse frequency and pulse width. During laser emission, relevant elements on the driving circuit board will generate heat, which is quickly conducted away through the heat conduction assembly composed of the lower ceramic sheet 203, the heat-conducting silica gel 202 and the upper ceramic sheet 203, and the heat dissipation interfaces on the driving circuit board, maintaining the normal working temperature of the system, so as to ensure that the pulsed laser range finder can continuously and stably work.

[0034] The basic principle and main features of the present application and the advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A pulsed laser rangefinder comprising a connection assembly (1), characterized in that: The middle part of the connecting assembly (1) is provided with a heat conduction assembly (2); The connecting assembly (1) comprises a driving circuit board (101), the upper end of the driving circuit board (101) is provided with a DA control (102), the upper end of the driving circuit board (101) is provided with a driving signal (103), and the upper end of the driving circuit board (101) is further provided with a power supply interface (104).

2. A pulsed laser range finder according to claim 1, characterized in that: The upper end of the driving circuit board (101) is integrated with a driving chip (105), and one end of the driving circuit board (101) is provided with a laser positive electrode (106) and a laser negative electrode (107).

3. The pulsed laser range finder of claim 1, wherein: The heat conduction assembly (2) comprises a lower ceramic sheet (201) fixedly connected to the lower end of the driving circuit board (101).

4. A pulsed laser range finder according to claim 3, wherein: The heat conduction assembly (2) comprises a heat-conducting silica gel (202) fixedly connected to the upper end of the driving circuit board (101), and the upper end of the heat-conducting silica gel (202) is fixedly connected with an upper ceramic sheet (203).

5. The pulsed laser range finder of claim 1, wherein: The middle part of the driving circuit board (101) is provided with a pair of symmetrical heat dissipation interfaces.

6. A pulsed laser range finder according to claim 3, wherein: The middle part of the lower ceramic sheet (201), the heat-conducting silica gel (202) and the upper ceramic sheet (203) are all provided with a pair of symmetrical circular interfaces.

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