Industrial computer with water-cooling heat dissipation function

Abstract

The utility model provides an industrial computer with a water-cooling heat dissipation function. The industrial computer comprises a shell, a heating element and a water-cooling unit. The heating element is fixed in the shell and connected with the water cooling unit in an attached mode. The water cooling unit is fixed in the shell, the water cooling unit comprises heat dissipation pieces, and each heat dissipation piece is correspondingly connected with one heating element in an attached mode; the input assembly is connected with the heat dissipation piece; the output assembly is connected with the heat dissipation piece, the heat dissipation piece is located between the input assembly and the output assembly, the heating element generates heat, cooling liquid is injected into the water cooling unit, the cooling liquid is transmitted into the heat dissipation piece through the input assembly, the heat dissipation piece and the heating element generate temperature difference, and the output assembly is connected with the heat dissipation piece. The heating element transmits heat into the output assembly. Through the structure, the heat dissipation efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of industrial computers, in particular to an industrial computer with water-cooled heat dissipation. BACKGROUND

[0002] Industrial computers are gradually popularizing water-cooled heat dissipation. Due to its advantages of high-efficiency heat dissipation, improving equipment stability and prolonging service life, it meets the demand of high-performance computing equipment in the field of industrial automation, and with the continuous innovation of technology and the promotion of energy-saving and environmental protection trend, water-cooled heat dissipation has broad application prospects in the field of industrial computers.

[0003] However, some industrial computers do not have modular input and output components in water-cooled heat dissipation, and the heat dissipation capacity of the system under different workloads is difficult to adjust flexibly. For example, when the work load of the heat generating element increases, the system cannot cope with this change by adjusting the input and output of the cooling liquid, which may result in poor overall heat dissipation effect. Therefore, an industrial computer with water-cooled heat dissipation is needed. CONTENT OF THE INVENTION

[0004] Therefore, it is necessary to provide an industrial computer with water-cooled heat dissipation to improve the heat dissipation efficiency and solve the above problems.

[0005] Embodiments of the present application provide an industrial computer with water-cooled heat dissipation, comprising:

[0006] a housing;

[0007] a water-cooled unit fixed in the housing;

[0008] a heat generating element fixed in the housing and connected with the water-cooled unit;

[0009] the water-cooled unit comprises:

[0010] a heat dissipation piece corresponding to the heat generating element;

[0011] an input component connected with the heat dissipation piece;

[0012] an output component connected with the heat dissipation piece, the heat dissipation piece being located between the input component and the output component, wherein the heat generating element generates heat, the water-cooled unit injects cooling liquid into the heat dissipation piece through the input component, the heat dissipation piece generates a temperature difference with the heat generating element, and the heat generating element transfers heat to the output component.

[0013] In at least one embodiment of the present application, the water-cooled unit comprises:

[0014] a first water-cooled module arranged along the height direction of the housing and fixed in the housing, and connected with the output component;

[0015] A second water cooling module is arranged along the height direction of the shell, fixed in the shell, and connected with the first water cooling module. The second water cooling module is connected with the input assembly.

[0016] In at least one embodiment of the present application, the water cooling module comprises:

[0017] A water cooling component is fixed in the shell and arranged along the height direction of the shell;

[0018] A first fan group is arranged along the height direction of the shell and located on one side of the water cooling component.

[0019] In at least one embodiment of the present application, the water cooling module further comprises:

[0020] A second fan group is arranged along the height direction of the shell and arranged opposite to the first fan group, and located on the other side of the water cooling component. The water cooling component is located between the first fan group and the second fan group.

[0021] In at least one embodiment of the present application, the input assembly comprises:

[0022] An input tank is fixed in the shell, and the input end of the input tank is connected with the second water cooling module;

[0023] An input water pump is connected with the output end of the input tank, and the output end of the water pump is connected with the heat dissipation component.

[0024] In at least one embodiment of the present application, the output assembly comprises:

[0025] An output water pump is connected with the heat dissipation component;

[0026] An output tank is connected with the output water pump and the first water cooling module.

[0027] In at least one embodiment of the present application, the inside of the shell is composed of a water cooling area and a heat dissipation area. The water cooling area and the heat dissipation area are arranged side by side along the length direction of the shell.

[0028] The first water cooling module and the second water cooling module are located in the water cooling area.

[0029] The heat generating component, the heat dissipation component, the input assembly, and the output assembly are located in the heat dissipation area.

[0030] In at least one embodiment of the present application, the heat dissipation area is divided into a first layer and a second layer along the height of the shell, the first layer is located close to the placement end of the shell, and the second layer is away from the placement end, and the heat generating element, the heat dissipation element, the input assembly and the output assembly are located in the second layer.

[0031] In at least one embodiment of the present application, the shell is provided with a ventilation net, and the ventilation net is located in the water cooling area.

[0032] In at least one embodiment of the present application, the heat generating element comprises:

[0033] The CPU is connected with the first heat dissipation element in a fit manner, the first heat dissipation element is connected with the input assembly;

[0034] The first mainboard is connected with the second heat dissipation element in a fit manner, the second heat dissipation element is connected with the first heat dissipation element;

[0035] The second mainboard is connected with the third heat dissipation element in a fit manner, the third heat dissipation element is connected with the second heat dissipation element, and the third heat dissipation element is connected with the output assembly.

[0036] The industrial computer with water cooling heat dissipation provided above can flexibly adjust the flow rate of input and output of the cooling liquid through the input assembly and the output assembly. According to different work loads and heat generating characteristics, the adjustment can enhance the adaptability and expansibility of the water cooling system. BRIEF DESCRIPTION OF DRAWINGS

[0037] Figure 1 It is a perspective view of the industrial computer with water cooling heat dissipation provided in the present application;

[0038] Figure 2 It is a schematic view of the internal structure of the industrial computer with water cooling heat dissipation provided in the present application;

[0039] Figure 3 It is a schematic view of the internal water cooling module of the water cooling area provided in the present application;

[0040] Figure 4 It is Figure 2 It is a partial enlarged view of B-B;

[0041] Figure 5 It is Figure 2 It is a partial enlarged view of A-A.

[0042] Explanation of main element symbols

[0043] 100, industrial computer with water cooling; 10, shell; 20, heating element; 30, water cooling unit; 31, heat dissipation member; 32, input assembly; 33, output assembly; 34, first water cooling module; 35, second water cooling module; 341, water cooling member; 342, first fan group; 343, second fan group; 321, input tank; 322, input water pump; 331, output water pump; 332, output tank; 11, water cooling area; 12, heat dissipation area; 121, first layer; 122, second layer; 40, ventilation net; 21, CPU; 22, first mainboard; 23, second mainboard; 311, first heat dissipation member; 312, second heat dissipation member; 313, third heat dissipation member; F1, height direction of shell; F2, length direction of shell. DETAILED DESCRIPTION

[0044] The embodiments of the present application will be described below in conjunction with the drawings, which are obviously a part of the embodiments of the present application, but not all the embodiments of the present application.

[0045] It should be noted that when one component is considered to be "connected" to another component, it can be directly connected to the other component or can exist a middle component at the same time. When one component is considered to be "provided on" another component, it can be directly provided on the other component or can exist a middle component at the same time. The terms "top", "bottom", "upper", "lower", "left", "right", "front", "back", and the like used herein are for illustrative purposes only.

[0046] Some embodiments of the present application will be described in detail below in conjunction with the drawings. The following embodiments and features in the embodiments can be combined with each other without conflict.

[0047] Please refer to Figures 1-5 The embodiments of the present application provide an industrial computer with water cooling 100, which comprises a shell 10, a heating element 20 and a water cooling unit 30. The heating element 20 is fixed in the shell 10, and the heating element 20 is connected to the water cooling unit 30. The water cooling unit 30 is fixed in the shell 10. The water cooling unit 30 comprises a heat dissipation member 31, an input assembly 32 and an output assembly 33. One heat dissipation member 31 is connected to one heating element 20. The input assembly 32 is connected to the heat dissipation member 31. The output assembly 33 is connected to the heat dissipation member 31. The heat dissipation member 31 is located between the input assembly 32 and the output assembly 33. The heating element 20 generates heat, the water cooling unit 30 injects cooling liquid into the heat dissipation member 31 through the input assembly 32, the heat dissipation member 31 generates temperature difference with the heating element 20, and the heating element 20 transmits heat to the output assembly 33.

[0048] Before the specific description, it is necessary to note that any existing connection structure (such as pipe connection) between the components of the water cooling unit 30 can be used to achieve the circulation of the coolant between the components. The flow process of the coolant includes the following steps:

[0049] After the water cooling unit 30 is filled with coolant, the pipe connection between the input tank 321 and the input water pump 322 is established, so that the coolant flows from the input tank 321 to the input water pump 322.

[0050] The input water pump 322 is in pipe connection with the first heat dissipation member 311 attached to the CPU 21 of the heat generating element 20. Under the drive of the input water pump 322, the coolant flows to the first heat dissipation member 311. The coolant and the CPU 21 generate a temperature difference, and the flowing coolant absorbs the heat of the CPU 21.

[0051] The output pipe of the first heat dissipation member 311 is connected to the input port of the second heat dissipation member 312. The second heat dissipation member 312 is attached to the first mainboard 22, and the CPU 21 is located above the first mainboard 22. The coolant flows from the first heat dissipation member 311 to the second heat dissipation member 312. The coolant and the first mainboard 22 generate a temperature difference, and the flowing coolant absorbs the heat of the first mainboard 22.

[0052] The output pipe of the second heat dissipation member 312 is connected to the input port of the third heat dissipation member 313. The third heat dissipation member 313 is attached to the second mainboard 23, and the first mainboard 22 is located above the second mainboard 23. The coolant flows from the second heat dissipation member 312 to the third heat dissipation member 313. The coolant and the second mainboard 23 generate a temperature difference, and the flowing coolant absorbs the heat of the second mainboard 23.

[0053] The output pipe of the third heat dissipation member 313 is connected to the output water pump 331. Under the drive of the output water pump 331, the coolant flows to the output tank 332, the first water cooling module 34 and the second water cooling module 35 in sequence. The second water cooling module 35 is in pipe connection with the input tank 321, forming a closed loop circulation system.

[0054] The coolant is cooled in the water cooling member 341, which is a cold row. When the coolant enters the water cooling member 341, the fine liquid pipes in the water cooling member 341 will distribute the coolant, so that the surface area of the coolant will be greatly increased. The metal fins of the water cooling member 341 absorb the heat in the coolant to the metal material through conduction, and then dissipate the heat to the air through contact with the air.

[0055] The first fan group 342 and the second fan group 343 are oppositely arranged in terms of air direction. The first fan group 342 is directly adjacent to one side of the water cooling component 341 and removes the heat absorbed by the water cooling component 341 from the shell 10 by forced air flow. The main function of the first fan group 342 is to accelerate air flow and help the cooling liquid dissipate heat faster through cooling on one side of the water cooling component 341. The presence of the fan makes the entire water cooling system not only rely on the flow of liquid but also combine air flow to improve heat dissipation efficiency.

[0056] The second fan group 343 is also arranged along the height direction F1 of the shell and is opposite to the first fan group 342, located on the other side of the water cooling component 341. The second fan group 343 is adjacent to the other side of the water cooling component 341 and cooperates with the first fan group 342 to form a two-way air flow system, thereby cooling the water cooling component 341 in all directions. The main function of the second fan group 343 is to work with the first fan group 342 to form a closed air flow loop, making the cooling effect more significant. Through the synergistic effect of the double-sided fans, the air flow can more effectively take away the heat emitted by the water cooling component 341.

[0057] Arranging the water cooling component 341 between the first fan group 342 and the second fan group 343 means that air will directly pass through the fins of the water cooling component 341 instead of bypassing externally. This design maximizes the contact area between air and fins, further improving the efficiency of heat dissipation. The heat released by the cooling liquid inside the fins can be quickly taken away by the flowing air, ensuring that the temperature in the system remains within a safe and stable range.

[0058] Specifically, the shell 10 is the external structure of the entire industrial computer, used to accommodate and protect various electronic components inside. The heat generating component 20 and the water cooling unit 30 are fixed inside the shell 10, forming a closed system. The shell 10 not only provides physical protection but also supports and fixes the internal components, and it can also be designed as a sealed structure to prevent external environment from affecting the internal components, such as dust and moisture.

[0059] The heat generating component 20 is the key component that generates heat in the industrial computer, usually including CPU 21, motherboard, etc. The heat generating component 20 is fixed inside the shell 10 and is in close contact with the heat sink 31 in the water cooling unit 30 for direct contact to achieve heat conduction.

[0060] The heat generating component 20 generates a large amount of heat during operation, which must be quickly removed through an efficient heat dissipation system to avoid overheating and damage to the component.

[0061] The water cooling unit 30 is the core heat dissipation system of the industrial computer, responsible for conducting the heat generated by the heat generating component 20 to the outside. It includes a heat sink 31, an input component 32, and an output component 33.

[0062] The water cooling unit 30 conducts heat from the heat generating element 20 to the heat sink 31 through the circulation of the coolant, and then transfers the heat from the heat sink 31 to the input and output assembly 33, and finally discharges the heat out of the system.

[0063] The heat sink 31 is a component of the water cooling unit 30 that directly contacts the heat generating element 20 and conducts heat. The main function of the heat sink 31 is to effectively conduct the heat generated by the heat generating element 20 into the coolant through physical contact, and then remove the heat by the coolant. The heat sink 31 is suitable for high-performance computing devices that require rapid heat dissipation, such as the core processing unit of an industrial computer.

[0064] The input assembly 32 is the entrance of the coolant into the heat dissipation system, including the input tank 321 and the input water pump 322, etc. The input assembly 32 is connected with the heat sink 31, and is responsible for delivering the coolant to the heat sink 31.

[0065] The input assembly 32 pushes the coolant to the heat sink 31 through the water pump, thereby removing the heat generated by the heat generating element 20.

[0066] The output assembly 33 is the exit of the coolant from the heat dissipation system, including the output water pump 331 and the output tank 332, etc.

[0067] The output assembly 33 is connected with the heat sink 31, and discharges the heated coolant from the heat sink 31, taking out the heat. The function of the output assembly 33 is to remove the heat in the heat sink 31 through the coolant, ensuring the continuous operation of the heat dissipation cycle.

[0068] The output assembly 33 is also applied to industrial environments that require continuous and efficient heat dissipation, such as industrial computer devices that operate for a long time.

[0069] In a specific embodiment, the water cooling unit 30 includes a first water cooling module 34 and a second water cooling module 35. The first water cooling module 34 is arranged along the height direction F1 of the shell, and is fixed in the shell 10. The first water cooling module 34 is connected with the output assembly 33. The second water cooling module 35 is arranged along the height direction F1 of the shell, and is fixed in the shell 10. The second water cooling module 35 is connected with the first water cooling module 34, and is connected with the input assembly 32.

[0070] Specifically, the first water cooling module 34 is a key component of the water cooling unit 30, and is connected to the output assembly 33, downstream of the heat sink 31, for receiving the coolant with heat, and transferring the heat in the coolant to the external air through the output assembly 33, to achieve the purpose of cooling the coolant.

[0071] The main function of the first water cooling module 34 is to absorb heat from the cooling liquid, creating a temperature difference between the cooling liquid and the air. The heat is then transferred from the first water cooling module 34 to the air, and the cooled liquid is circulated back into the system through the output assembly 33. Its position and structure ensure that the cooling liquid can effectively remove heat when flowing through the entire system.

[0072] The components of the second water cooling module 35 are the same as those of the first water cooling module 34. The second water cooling module 35 is located upstream of the heat dissipation component 31 and is connected to the input assembly 32, responsible for introducing cooled cooling liquid into the system. The second water cooling module 35 is connected to the first water cooling module 34, forming a continuous cooling loop. This ensures smooth and efficient flow of cooling liquid throughout the entire system. Through the connection with the first water cooling module 34, the second water cooling module 35 forms a complete circulation system, allowing flexible adjustment of the flow and flow rate of the cooling liquid according to the needs of the device.

[0073] In a specific embodiment, the water cooling module includes a water cooling component 341, a first fan group 342, and a second fan group 343. The water cooling component 341 is fixed inside the housing 10, and the water cooling component 341 is arranged along the height direction F1 of the housing. The first fan group 342 is arranged along the height direction F1 of the housing, and the first fan group 342 is located on one side of the water cooling component 341. The second fan group 343 is arranged along the height direction F1 of the housing, and the second fan group 343 is arranged opposite to the first fan group 342. The second fan group 343 is located on the other side of the water cooling component 341, and the water cooling component 341 is located between the first fan group 342 and the second fan group 343.

[0074] It should be noted that the water cooling module includes the first water cooling module 34 and the second water cooling module 35. Both the first water cooling module 34 and the second water cooling module 35 include a water cooling component 341, a first fan group 342, and a second fan group 343.

[0075] In a specific embodiment, the interior of the housing 10 is divided into a water cooling area 11 and a heat dissipation area 12, and the water cooling area 11 and the heat dissipation area 12 are arranged side by side along the length direction F2 of the housing. The first water cooling module 34 and the second water cooling module 35 are both located in the water cooling area 11. The heat generating component 20, the heat dissipation component 31, the input assembly 32, and the output assembly 33 are all located in the heat dissipation area 12.

[0076] Specifically, the division of the areas physically separates the water cooling system and the heat dissipation system, reducing interference in heat conduction, thereby optimizing the overall heat dissipation efficiency.

[0077] The water cooling module is located in the water cooling area 11, responsible for absorbing and conducting heat, preventing excessive heat from entering the heat dissipation area 12, and ensuring that the temperature of the heat generating element 20 is controlled within a suitable range.

[0078] The heat dissipation area 12 is provided with heat generating elements 20, heat dissipation elements 31, input components 32 and output components 33, which directly exchange heat with the external air of the shell 10. The heat generating elements 20 in the heat dissipation area 12 conduct heat to the outside of the shell 10 through the heat dissipation elements 31, while the input components 32 and the output components 33 help control the circulation of the cooling liquid, ensuring that heat can be effectively discharged.

[0079] In a specific embodiment, the heat dissipation area 12 is divided into a first layer 121 and a second layer 122 along the height of the shell 10, the first layer 121 is located near the placement end of the shell 10, and the second layer 122 is away from the placement end, the heat generating elements 20, the heat dissipation elements 31, the input components 32 and the output components 33 are all located in the second layer 122.

[0080] Specifically, the first layer 121 is located near the placement end of the shell 10, i.e. the reference surface of the device installation or placement.

[0081] The first layer 121 is usually used to place elements that are not directly related to heat dissipation, such as power supply modules, hard drives, etc. The location near the placement end of the shell 10 makes it more convenient to maintain and replace these components, while avoiding direct contact with high-heat areas.

[0082] The second layer 122 is away from the placement end of the shell 10, and is the centralized installation area of the heat generating elements 20, the heat dissipation elements 31, the input components 32 and the output components 33.

[0083] The second layer 122 is specially used to accommodate heat generating elements 20 and heat dissipation components, providing a centralized and isolated environment that helps to centrally manage heat and avoid affecting other parts of the device. The input components 32 and the output components 33 are located in the second layer 122, ensuring that the flow path of the cooling liquid is optimized, improving the heat dissipation efficiency.

[0084] In a specific embodiment, the shell 10 is provided with a ventilation net 40, and the ventilation net 40 is located in the water cooling area 11.

[0085] Specifically, the ventilation net 40 is part of the shell 10, allowing external air to flow into the water cooling area 11, enhancing the cooling effect. The air flow through the ventilation net 40 can assist in heat dissipation, helping the cooling liquid and the water cooling components in the water cooling area 11 to dissipate heat faster, maintaining the stability of the internal temperature.

[0086] The ventilation net 40 is directly connected with the water cooling area 11, which enables external air to flow into the water cooling area 11, and this design enhances the heat dissipation performance of the cooling liquid through natural or forced convection. Especially when the water cooling system is under high load, the presence of the ventilation net 40 can prevent the temperature in the water cooling area 11 from being too high, and ensure the persistence of the cooling effect.

[0087] The ventilation net 40 works in cooperation with the water cooling module. The water cooling module is responsible for absorbing the heat generated by the heat-generating element 20, and the ventilation net 40 helps these heat to be dissipated from the water cooling module more quickly by providing an air flow channel, thereby improving the efficiency of the entire water cooling system.

[0088] The above only describes the embodiments of the present application, and it should be pointed out that, for those skilled in the art, improvements can be made without departing from the creative concept of the present application, but these all belong to the protection scope of the present application.

Claims

1. An industrial computer with water-cooled heat dissipation, characterized in that, The application relates to a water-cooling device. The device comprises: a shell; a water-cooling unit fixed in the shell; a heating element fixed in the shell and connected with the water-cooling unit. The water-cooling unit comprises: a heat-dissipating element corresponding to the heating element; an input assembly connected with the heat-dissipating element; 2. The industrial computer with water-cooled heat dissipation of claim 1, wherein, an output assembly connected with the heat-dissipating element, and the heat-dissipating element is located between the input assembly and the output assembly. The heating element generates heat, the water-cooling unit injects cooling liquid, the cooling liquid is transmitted to the heat-dissipating element by the input assembly, the heat-dissipating element generates temperature difference with the heating element, and the heating element transmits heat to the output assembly. The water-cooling unit comprises:

3. The industrial computer with water-cooled heat dissipation of claim 2, wherein, a first water-cooling module arranged along the height direction of the shell and fixed in the shell and connected with the output assembly; a second water-cooling module arranged along the height direction of the shell and fixed in the shell and connected with the first water-cooling module and the input assembly. The water-cooling module comprises:

4. The industrial computer with water-cooled heat dissipation of claim 3, wherein, a water-cooling element fixed in the shell and arranged along the height direction of the shell; a first fan group arranged along the height direction of the shell and located on one side of the water-cooling element.

5. The industrial computer with water-cooled heat dissipation of claim 2, wherein, The water-cooling module further comprises: a second fan group arranged along the height direction of the shell and located on the other side of the water-cooling element and opposite to the first fan group, and the water-cooling element is located between the first fan group and the second fan group. The input assembly comprises:

6. The industrial computer with water-cooled heat dissipation of claim 2, wherein, an input tank fixed in the shell and having an input end connected with the second water-cooling module; an input water pump having an input end connected with the output end of the input tank and an output end connected with the heat-dissipating element. The output assembly comprises:

7. The industrial computer with water-cooled heat dissipation of claim 2, wherein, an output water pump connected with the heat-dissipating element; an output tank connected with the output water pump and the first water-cooling module. The shell is internally composed of a water-cooling area and a heat-dissipating area, and the water-cooling area and the heat-dissipating area are arranged side by side along the length direction of the shell.

8. The industrial computer with water-cooled heat dissipation of claim 7, wherein, The first water-cooling module and the second water-cooling module are located in the water-cooling area.

9. The industrial computer with water-cooled heat dissipation of claim 7, wherein, The heating element, the heat-dissipating element, the input assembly and the output assembly are located in the heat-dissipating area.

10. The industrial computer with water-cooled heat dissipation of claim 1, wherein, The heat-dissipating area is divided into a first layer and a second layer along the height direction of the shell, the first layer is located close to the placing end of the shell, and the second layer is located away from the placing end, and the heating element, the heat-dissipating element, the input assembly and the output assembly are located in the second layer. The shell is provided with a ventilation net, and the ventilation net is located in the water-cooling area. The heating element comprises: a CPU connected with a first heat-dissipating element connected with the input assembly; a first mainboard connected with a second heat-dissipating element connected with the first heat-dissipating element; a second mainboard connected with a third heat-dissipating element connected with the second heat-dissipating element and the output assembly.

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