Liquid cooling heat dissipation structure of CPU and memory

Abstract

The utility model relates to a liquid cooling heat dissipation structure of a CPU and a memory, which belongs to the technical field of mainboard liquid cooling heat dissipation and comprises a metal plate, two liquid cooling heat dissipation plates are fixed on the rear side of the metal plate, a CPU frame is fixed on the rear side of each liquid cooling heat dissipation plate, a processor is fixed in each CPU frame, and the processor is connected with the liquid cooling heat dissipation plates. Connecting plates extending to the outer portions of the two liquid cooling heat dissipation plates are fixed to the front faces of the two liquid cooling heat dissipation plates, and a front flow channel plate, a middle flow channel plate and a rear flow channel plate which can improve the heat conduction speed are sequentially arranged on the back faces of the connecting plates and located on the leftmost side, the middle side and the rightmost side of the two liquid cooling heat dissipation plates respectively. A plurality of memory banks are fixed to the front faces of the front flow channel plate, the middle flow channel plate and the rear flow channel plate, and cooling assemblies capable of rapidly taking away heat are arranged on the front faces of the two liquid cooling heat dissipation plates. According to the liquid cooling heat dissipation structure of the CPU and the memory, heat conducted in the front flow channel plate, the middle flow channel plate and the rear flow channel plate is taken away through the cooling liquid in the cooling assembly, and the good heat dissipation effect is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the mainboard liquid cooling heat dissipation technical field, concretely is a liquid cooling heat dissipation structure of CPU and memory. BACKGROUND

[0002] CPU and memory can produce a large amount of heat in the working process, for example, when CPU carries out complex operation task (such as 3D game rendering, video coding etc.), its power consumption will increase significantly, and the heat produced cannot be dissipated in time, CPU will trigger the overheat protection mechanism, and automatically reduces the frequency to reduce power consumption, which will lead to the computer performance declines greatly, so it needs the heat dissipation structure to carry out effective heat dissipation for it.

[0003] For example, a kind of heat sink for mainboard CPU in Chinese patent (announcement number for CN218866443U), including: mainboard placing rack, including placing table, placing table is equipped with the connecting plate for fixing mainboard, the connecting plate is vertically arranged, the placing rack is equipped with air inlet, air inlet is opposite the connecting plate;Heat dissipation fan, communication with air inlet;Air duct, for connecting heat dissipation fan and mainboard placing rack, the air duct is flexible hose;The utility model discloses a wind channel for connecting heat dissipation fan and mainboard placing rack, and the air duct is flexible hose, therefore, the heat dissipation fan and mainboard placing rack rigid connection in prior art is improved to flexible connection, greatly reduce the influence caused to CPU by vibration, and flexible hose can be freely adjusted orientation, increase the use scene.

[0004] But the heat dissipation device heat dissipation effect is not good enough, since the wind that heat dissipation fan blows in is normal temperature wind, and the heat dissipation effect is limited, simultaneously, the heat transfer effect between elements is not good, and it is easy to cause the poor heat dissipation effect, therefore, a kind of liquid cooling heat dissipation structure of CPU and memory is presented to solve the above problems. Utility model content

[0005] In view of the deficiency of prior art, the utility model provides a kind of liquid cooling heat dissipation structure of CPU and memory, with good heat dissipation effect and other advantages, solve the problem of poor heat dissipation effect when CPU and memory work.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a liquid cooling structure for CPU and memory, comprising sheet metal, two liquid cooling plates fixed to the rear side of the sheet metal, a CPU frame fixed to the rear side of each liquid cooling plate, a processor fixed inside each CPU frame, a connecting plate extending beyond the two liquid cooling plates fixed to the front side of the two liquid cooling plates, a front flow channel plate, a middle flow channel plate, and a rear flow channel plate arranged sequentially on the back side of the connecting plate and located at the leftmost, between, and rightmost sides of the two liquid cooling plates respectively, which can improve the heat conduction speed; multiple memory modules are fixed to the front side of the front flow channel plate, the middle flow channel plate, and the rear flow channel plate; and a cooling component that can quickly remove heat is provided on the front side of the two liquid cooling plates.

[0007] The cooling assembly includes an inlet pipe fixedly connected to the front flow channel plate, a connecting pipe fixedly connected to the outlet end of the front flow channel plate, the connecting pipe passing through the liquid cooling heat sink on the left side and fixedly connected to the middle flow channel plate, a conveying pipe fixedly connected to the output end of the middle flow channel plate, the conveying pipe passing through the liquid cooling heat sink on the right side and fixedly connected to the rear flow channel plate, a return pipe fixedly connected to the output end of the rear flow channel plate, the end of the return pipe away from the rear flow channel plate being fixedly connected to the liquid cooling heat sink on the right side, a bridging pipe fixedly connected to the output end of the liquid cooling heat sink and fixedly connected to the input end of another liquid cooling heat sink, and an outlet pipe extending outside the front flow channel plate fixedly connected to the output end of the liquid cooling heat sink on the left side.

[0008] Furthermore, the front flow channel plate includes a front bottom plate fixed to the back of the connecting plate. A cooling groove is provided on the front of the front bottom plate. A front heat pipe is fixed to the inner bottom wall of the cooling groove. Two front copper plates are fixed to the front of the front heat pipe. A front liquid cooling plate is fixed at the connection of the two front copper plates.

[0009] Furthermore, the intermediate flow channel plate includes an intermediate base plate fixed to the connecting plate. The front side of the intermediate base plate has two U-shaped grooves that are interconnected. An intermediate liquid cooling plate that penetrates the intermediate base plate is fixed to the back side of the intermediate base plate. Intermediate heat pipes are fixed in both U-shaped grooves. The back sides of both intermediate heat pipes abut against the front side of the intermediate liquid cooling plate. Two intermediate copper sheets are fixed to the front side of each intermediate heat pipe, and a thermal pad is fixed to the front side of each intermediate copper sheet.

[0010] Furthermore, the rear flow channel plate includes a rear bottom plate fixed to the connecting plate. A clearance groove is provided on the front side of the rear bottom plate. A rear heat pipe is fixed to the inner bottom wall of the clearance groove. Two rear copper plates are fixed to the front side of the rear heat pipe. A rear liquid cooling plate is fixed at the connection point of the two rear copper plates.

[0011] Further, the input end of the front liquid cooling plate is fixedly communicated with the water inlet pipe, and the output end of the front liquid cooling plate is fixedly communicated with the communication pipe.

[0012] Further, the input end of the middle liquid cooling plate is fixedly communicated with the communication pipe, and the output end of the middle liquid cooling plate is fixedly communicated with the conveying pipe.

[0013] Further, the input end of the rear liquid cooling plate is fixedly communicated with the conveying pipe, and the output end of the rear liquid cooling plate is fixedly communicated with the return pipe.

[0014] Further, the front surface of the sheet metal is fixedly provided with a handle, and the handle is in a curved shape.

[0015] Compared with the prior art, the technical scheme has the following beneficial effects:

[0016] The liquid cooling heat dissipation structure of the CPU and the memory, the front flow channel plate, the middle flow channel plate and the rear flow channel plate can significantly improve the heat dissipation effect, and the front copper sheet, the middle copper sheet and the rear copper sheet are used to compensate for the poor heat dissipation effect at the end, so as to evenly distribute the heat of the invalid section, and the cooling liquid in the cooling assembly can take away the heat conducted in the front flow channel plate, the middle flow channel plate and the rear flow channel plate, so as to achieve good heat dissipation effect. BRIEF DESCRIPTION OF DRAWINGS

[0017] Fig. 1 It is a structural schematic view of the utility model;

[0018] Fig. 2 It is a structural schematic view of the cooling assembly;

[0019] Fig. 3 It is a three-dimensional explosion view of the front flow channel plate;

[0020] Fig. 4 It is a three-dimensional explosion view of the middle flow channel plate;

[0021] Fig. 5 It is a three-dimensional explosion view of the rear flow channel plate.

[0022] In the drawing: 1 sheet metal, 2 cooling assembly, 201 water inlet pipe, 202 communication pipe, 203 conveying pipe, 204 return pipe, 205 bridging pipe, 206 water outlet pipe, 3 front flow channel plate, 301 front bottom plate, 302 front heat pipe, 303 front copper sheet, 304 front liquid cooling plate, 4 middle flow channel plate, 401 middle bottom plate, 402 middle heat pipe, 403 middle liquid cooling plate, 404 middle copper sheet, 405 heat-conducting pad, 5 rear flow channel plate, 501 rear bottom plate, 502 rear heat pipe, 503 rear copper sheet, 504 rear liquid cooling plate, 6 liquid cooling heat dissipation plate, 7 connecting plate. DETAILED DESCRIPTION

[0023] Clearly, the described embodiments are merely a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0024] Please refer to Figs. 1-2 The CPU and memory liquid cooling heat dissipation structure in the embodiment comprises sheet metal 1, the sheet metal 1 is used to improve the stability effect of two liquid cooling heat dissipation plates 6, the rear side of the sheet metal 1 is fixed with two liquid cooling heat dissipation plates 6, the two liquid cooling heat dissipation plates 6 have good thermal conductivity, can quickly transfer the heat generated by the processor to the liquid cooling heat dissipation plate 6, and then input the cooling liquid through the cooling assembly 2 to take away the heat, the rear side of each liquid cooling heat dissipation plate 6 is fixed with a CPU frame, each CPU frame is fixed with a processor, the front surface of the two liquid cooling heat dissipation plates 6 is fixed with a connecting plate 7 extending to the outside of the two liquid cooling heat dissipation plates 6, the connecting plate 7 can provide stable connecting force for the front flow channel plate 3, the middle flow channel plate 4 and the rear flow channel plate 5, the back surface of the connecting plate 7 and located at the leftmost side, between and the rightmost side of the two liquid cooling heat dissipation plates 6 are sequentially provided with the front flow channel plate 3, the middle flow channel plate 4 and the rear flow channel plate 5 capable of improving the heat conduction speed, and the front surface of the front flow channel plate 3, the middle flow channel plate 4 and the rear flow channel plate 5 is fixed with a plurality of memory banks, and the front surface of the two liquid cooling heat dissipation plates 6 is provided with the cooling assembly 2 capable of quickly taking away the heat.

[0025] In addition, the cooling assembly 2 comprises a water inlet pipe 201 fixedly communicated with the front flow channel plate 3, a communication pipe 202 fixedly communicated with the water outlet end of the front flow channel plate 3, the water inlet pipe 201 can smoothly transfer the cooling liquid to the front flow channel plate 3 to take away the heat on the front flow channel plate 3, the communication pipe 202 passes through the liquid cooling heat dissipation plate 6 located on the left side and is fixedly communicated with the middle flow channel plate 4, the output end of the middle flow channel plate 4 is fixedly communicated with a conveying pipe 203, the conveying pipe 203 passes through the liquid cooling heat dissipation plate 6 located on the right side and is fixedly communicated with the rear flow channel plate 5, the output end of the rear flow channel plate 5 is fixedly communicated with a return pipe 204, one end of the return pipe 204 away from the rear flow channel plate 5 is fixedly communicated with the liquid cooling heat dissipation plate 6 located on the right side, through the circulation and flow of the water inlet pipe 201, the communication pipe 202, the conveying pipe 203, the return pipe 204, the bridging pipe 205 and the water outlet pipe 206, the heat on the front flow channel plate 3, the middle flow channel plate 4 and the rear flow channel plate 5 and the two liquid cooling heat dissipation plates 6 is sequentially taken away, a good heat dissipation effect is realized, the output end of the liquid cooling heat dissipation plate 6 is fixedly communicated with the bridging pipe 205 fixedly communicated with the input end of the other liquid cooling heat dissipation plate 6, and the output end of the liquid cooling heat dissipation plate 6 located on the left side is fixedly communicated with the water outlet pipe 206 extending to the outside of the front flow channel plate 3.

[0026] In the embodiment, the heat dissipation assembly 2, the front flow channel plate 3, the middle flow channel plate 4, the rear flow channel plate 5 and the two liquid cooling heat dissipation plates 6 are matched with each other, so that the heat dissipation effect on the processor and the memory bar is effectively improved.

[0027] Please refer to Figs. 1-2 and Figs. 3-5 again, in order to further improve the heat dissipation effect, the front flow channel plate 3 in the embodiment comprises a front bottom plate 301 fixed on the back surface of the connecting plate 7, the front surface of the front bottom plate 301 is provided with a cooling groove, the inner bottom wall of the cooling groove is fixed with a front heat pipe 302, the front surface of the front heat pipe 302 is fixed with two front copper sheets 303, the connecting position of the two front copper sheets 303 is fixed with a front liquid cooling plate 304, the input end of the front liquid cooling plate 304 is fixedly communicated with the water inlet pipe 201, the output end of the front liquid cooling plate 304 is fixedly communicated with the communication pipe 202, the front surface of the front bottom plate 301 is fixed with a plurality of memory bars, the front heat pipe 302 and the front copper sheet 303 abut against the plurality of memory bars, so as to quickly take away the heat generated by the memory bar, and good cooling effect is achieved, and the heat enters the front liquid cooling plate 304, so as to be quickly taken away by the heat dissipation assembly 2.

[0028] It needs to be further explained that the middle flow channel plate 4 comprises a middle bottom plate 401 fixed on the connecting plate 7, the front surface of the middle bottom plate 401 is provided with two U-shaped grooves, the two U-shaped grooves are communicated with each other, the back surface of the middle bottom plate 401 is fixed with a middle liquid cooling plate 403 penetrating through the middle bottom plate 401, the two U-shaped grooves are fixed with a middle heat pipe 402, the back surface of the two middle heat pipes 402 abuts against the front surface of the middle liquid cooling plate 403, the front surface of each middle heat pipe 402 is fixed with two middle copper sheets 404, the front surface of each middle copper sheet 404 is fixed with a heat conduction pad 405, the input end of the middle liquid cooling plate 403 is fixedly communicated with the communication pipe 202, the output end of the middle liquid cooling plate 403 is fixedly communicated with the conveying pipe 203, since the plurality of memory bars are respectively located on the upper and lower sides of the two liquid cooling heat dissipation plates 6, the middle heat pipe 402 must be U-shaped in order to ensure the stability of the connection, the two U-shaped middle heat pipes 402 transmit the heat to the middle liquid cooling plate 403, the heat on the middle liquid cooling plate 403 is quickly taken away by the heat dissipation assembly 2, and high-efficiency cooling is realized.

[0029] It can be known that the rear flow channel plate 5 comprises a rear bottom plate 501 fixed with the connecting plate 7, the front surface of the rear bottom plate 501 is provided with a displacement slot, the inner bottom wall of the displacement slot is fixed with a rear heat pipe 502, the front surface of the rear heat pipe 502 is fixed with two rear copper sheets 503, and the connecting position of the two rear copper sheets 503 is fixed with a rear liquid cooling plate 504. The input end of the rear liquid cooling plate 504 is fixedly communicated with the conveying pipe 203, the output end of the rear liquid cooling plate 504 is fixedly communicated with the return pipe 204, the front surfaces of the middle bottom plate 401 and the rear bottom plate 501 are fixed with the back surfaces of the plurality of memory strips, and the heat generated by the memory strips is transmitted to the rear liquid cooling plate 504 through the two rear copper sheets 503 and the two rear heat pipes 502, so that the heat exchange of the heat dissipation assembly 2 is facilitated.

[0030] In addition, the front surface of the metal plate 1 is fixed with a handle, the handle is curved, and the handle can facilitate a user to quickly carry the structure.

[0031] In the embodiment, the front flow channel plate 3, the middle flow channel plate 4 and the rear flow channel plate 5 are all made of aluminum, and the front heat pipe 302, the middle heat pipe 402 and the rear heat pipe 502 are respectively soldered on the front bottom plate 301, the middle bottom plate 401 and the rear bottom plate 501. Because the heat dissipation position of the memory strip shoulder is at the two ends of the front heat pipe 302, the middle heat pipe 402 and the rear heat pipe 502, and the invalid end flat end 4-6mm and the gas exhaust end 8-11mm of the memory strip have particularly poor heat conduction capacity, the front copper sheet 303, the middle copper sheet 404 and the rear copper sheet 503 are sequentially soldered on the upper part of the invalid end of the front heat pipe 302, the middle heat pipe 402 and the rear heat pipe 502, so as to evenly divide the heat of the invalid end part.

[0032] It can be understood that the front heat pipe 302, the middle heat pipe 402 and the rear heat pipe 502 are heat transfer elements with extremely high heat conduction performance, which transmit heat through evaporation and condensation of liquid in a fully closed vacuum pipe, and utilize fluid principles such as capillary action to have an effect similar to that of a refrigerator compressor, and have a series of advantages such as high heat conductivity, excellent isothermality, variable heat flow density, reversible heat flow direction, long-distance heat transfer, constant temperature characteristics and the like. The heat exchanger composed of the heat pipes has advantages of high heat transfer efficiency, compact structure and small fluid resistance loss, and the heat is taken away by the heat dissipation assembly 2, so that the heat dissipation effect is effectively improved.

[0033] The electrical elements in the present application are electrically connected with the controller and the power supply, the control mode of the present application is controlled by the controller, the control circuit of the controller can be realized by simple programming of the person skilled in the art, the power supply is also a common knowledge in the art, and the present application is mainly used for protecting the mechanical device, so the control mode and the circuit connection are not explained in detail.

[0034] The working principle of the above embodiment is as follows:

[0035] In use, the cooling liquid is pumped into the cooling assembly 2 by a liquid pump, and then the cooling liquid first passes through the front liquid cooling plate 304 on the front flow channel plate 3 to take away the heat in the front flow channel plate 3, then enters the middle liquid cooling plate 403 through the communication pipe 202 to take away the heat in the middle flow channel plate 4, enters the rear liquid cooling plate 504 through the transmission pipe 203 to take away the heat in the rear flow channel plate 5, and finally enters the two liquid cooling heat dissipation plates 6 through the return pipe 204 and the bridging pipe 205 to take away the heat generated by the processor, and then flows out through the outlet pipe 206. The front heat pipe 302, the middle heat pipe 402 and the rear heat pipe 502 are superconductors, and have good heat conduction effect.

[0036] It should be noted that, in this document, the terms such as first and second are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between such entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus including a series of elements includes not only those elements, but also other elements not explicitly listed, or other elements inherent in such a process, method, article or apparatus. Without more limitations, the element defined by the statement "comprising a" does not exclude the presence of other identical elements in the process, method, article or apparatus including the element.

[0037] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application.

Claims

1. A liquid cooling heat dissipation structure of CPU and memory, comprising a sheet metal (1), characterized in that: The back side of the sheet metal (1) is fixed with two liquid cooling heat dissipation plates (6), the back side of each liquid cooling heat dissipation plate (6) is fixed with a CPU frame, the processor is fixed in each CPU frame, the front side of the two liquid cooling heat dissipation plates (6) is fixed with a connecting plate (7) extending to the outside of the two liquid cooling heat dissipation plates (6), the back side of the connecting plate (7) and respectively located at the leftmost side, between and the rightmost side of the two liquid cooling heat dissipation plates (6) are sequentially provided with front flow channel plates (3), middle flow channel plates (4) and rear flow channel plates (5) capable of improving the heat conduction speed, the front of the front flow channel plate (3), the middle flow channel plate (4) and the rear flow channel plate (5) is fixed with a plurality of memory banks, the front side of the two liquid cooling heat dissipation plates (6) is provided with a cooling assembly (2) capable of quickly taking away heat. The cooling assembly (2) comprises a water inlet pipe (201) fixedly communicated with the front flow channel plate (3), a communication pipe (202) fixedly communicated with the water outlet end of the front flow channel plate (3), the communication pipe (202) passes through the liquid cooling heat dissipation plate (6) located on the left side and is fixedly communicated with the middle flow channel plate (4), the output end of the middle flow channel plate (4) is fixedly communicated with a conveying pipe (203), the conveying pipe (203) passes through the liquid cooling heat dissipation plate (6) located on the right side and is fixedly communicated with the rear flow channel plate (5), the output end of the rear flow channel plate (5) is fixedly communicated with a return pipe (204), one end of the return pipe (204) away from the rear flow channel plate (5) is fixedly communicated with the liquid cooling heat dissipation plate (6) located on the right side, the output end of the liquid cooling heat dissipation plate (6) is fixedly communicated with a bridge pipe (205) fixedly communicated with the input end of the other liquid cooling heat dissipation plate (6), the output end of the liquid cooling heat dissipation plate (6) located on the left side is fixedly communicated with a water outlet pipe (206) extending to the outside of the front flow channel plate (3).

2. The CPU and memory liquid cooling structure of claim 1, wherein: The front flow channel plate (3) comprises a front bottom plate (301) fixed with the back side of the connecting plate (7), the front side of the front bottom plate (301) is provided with a cooling groove, the inner bottom wall of the cooling groove is fixed with a front heat pipe (302), the front side of the front heat pipe (302) is fixed with two front copper sheets (303), and the connection part of the two front copper sheets (303) is fixed with a front liquid cooling plate (304).

3. The liquid cooling heat dissipation structure for CPU and memory according to claim 1, characterized in that: The middle flow channel plate (4) comprises a middle bottom plate (401) fixed with the connecting plate (7), the front side of the middle bottom plate (401) is provided with two U-shaped grooves, the two U-shaped grooves are communicated with each other, the back side of the middle bottom plate (401) is fixed with a middle liquid cooling plate (403) penetrating through the middle bottom plate (401), the two U-shaped grooves are fixed with middle heat pipes (402), the back side of each middle heat pipe (402) abuts against the front side of the middle liquid cooling plate (403), the front side of each middle heat pipe (402) is fixed with two middle copper sheets (404), and the front side of each middle copper sheet (404) is fixed with a heat conduction pad (405).

4. The liquid cooling heat dissipation structure for CPU and memory according to claim 1, characterized in that: The rear flow channel plate (5) comprises a rear bottom plate (501) fixed with the connecting plate (7), the front face of the rear bottom plate (501) is provided with a let-position slot, the inner bottom wall of the let-position slot is fixed with a rear heat pipe (502), the front face of the rear heat pipe (502) is fixed with two rear copper sheets (503), and the connecting position of the two rear copper sheets (503) is fixed with a rear liquid cooling plate (504).

5. The liquid cooling heat dissipation structure for CPU and memory according to claim 2, characterized in that: The input end of the front liquid cooling plate (304) is fixedly communicated with the water inlet pipe (201), and the output end of the front liquid cooling plate (304) is fixedly communicated with the communicating pipe (202).

6. The liquid cooling heat dissipation structure of CPU and memory according to claim 3, characterized in that: The input end of the middle liquid cooling plate (403) is fixedly communicated with the communicating pipe (202), and the output end of the middle liquid cooling plate (403) is fixedly communicated with the conveying pipe (203).

7. The liquid cooling heat dissipation structure of CPU and memory according to claim 4, characterized in that: The input end of the rear liquid cooling plate (504) is fixedly communicated with the conveying pipe (203), and the output end of the rear liquid cooling plate (504) is fixedly communicated with the return pipe (204).

8. The liquid cooling heat dissipation structure of CPU and memory according to claim 1, characterized in that: The front face of the sheet metal (1) is fixedly provided with a handle, and the handle is in a curved shape.

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