Cooling assembly, cooling device and server
The cooling components, designed with a housing, distribution elements, and cooling structure, combined with the housing radiator and pump system, achieve efficient circulation of coolant and vapor, solving the problem of low server heat dissipation efficiency and improving the server's operational stability and heat dissipation efficiency.
Patent Information
- Application Number
- CN202520289993.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-21
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2035-02-21
AI Technical Summary
Existing server cooling methods have low heat dissipation efficiency, which cannot meet the needs of high-performance servers. Furthermore, heat sinks obstruct airflow and have high production costs.
The cooling assembly, designed with a shell, flow divider, and cooling structure, utilizes the evaporation and condensation of coolant in the inner cavity and achieves coolant flow through connecting holes. Combined with the shell radiator and pump system, it achieves efficient circulation of coolant and vapor.
It improves the server's operational stability and heat dissipation efficiency, reduces coolant consumption and production costs, and ensures rapid cooling effect of the coolant.
Smart Images

Figure CN223598200U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of servers, and in particular to a cooling assembly, a cooling device and a server. BACKGROUND
[0002] At present, the rapid development of server technology makes high-performance computing possible, but also brings serious heat dissipation challenges. A large number of high-performance integrated circuits (such as central processing units, graphics processing units, etc.) integrated in the server case will generate significant heat when running, which poses a great threat to the stability of the system and the service life of the equipment. High temperature not only leads to performance degradation, increases the failure rate, and even causes permanent damage to critical components, seriously affecting the reliability and data security of the server.
[0003] At present, the heat dissipation method of the server mainly relies on the combination of heat sinks and fans, but this method has limitations. Although the heat sink can directly contact the heat source and absorb heat, due to its solid-state heat dissipation characteristics, the heat dissipation efficiency is limited, especially under high load operation, the heat conduction speed of the heat sink cannot keep up with the heat generation rate of the computing components, resulting in poor heat dissipation effect. In addition, the heat sink often occupies a large space, hindering the free circulation of air inside the case, reducing the heat dissipation efficiency of the server. More importantly, the complex structure design and manufacturing process of the heat sink result in high production cost, which not only increases the initial investment of the server, but also to a certain extent limits the further optimization and innovation of the heat dissipation technology.
[0004] With the continuous improvement of server performance, the requirement for heat dissipation technology also increases. The heat dissipation technology in the prior art is not capable of dealing with high-density and high-heat computing environments, and these limitations cannot meet the demand for stable operation and long service life of high-performance servers. CONTENT OF THE UTILITY MODEL
[0005] The present application provides a cooling assembly, a cooling device and a server to at least solve the problem of low heat dissipation efficiency of the heat dissipation method of the server in the related art, which cannot meet the demand of the server.
[0006] The present application provides a cooling assembly, a cooling device and a server to at least solve the problem of low heat dissipation efficiency of the heat dissipation method of the server in the related art, which cannot meet the demand of the server.
[0007] The application provides a cooling assembly, comprising: a housing having a receiving cavity and a housing inlet and a housing outlet respectively communicating with the receiving cavity; a flow divider arranged in the receiving cavity to divide the receiving cavity into an inner cavity located on the inner side of the flow divider and an outer cavity located on the outer side of the flow divider, the inner cavity being used for accommodating at least part of a component to be cooled, the housing inlet communicating with the inner cavity, the housing outlet communicating with the outer cavity, and the flow divider being provided with a communication hole for communicating the inner cavity and the outer cavity; and a cooling structure, at least part of the cooling structure being arranged in the inner cavity and communicating with the housing inlet to spray the cooling liquid flowing in from the housing inlet to the inner cavity.
[0008] Further, the cooling structure comprises a first flow guide pipe and a liquid discharge pipe connected with each other, the first flow guide pipe being arranged at the housing inlet, and the liquid discharge pipe being arranged in the inner cavity to spray the cooling liquid to the inner cavity.
[0009] Further, the first flow guide pipe comprises a fixed pipe section and a rotating pipe section connected with each other, one end of the fixed pipe section away from the rotating pipe section penetrating through the housing inlet to reach outside the housing, and the other end of the rotating pipe section away from the fixed pipe section being connected with the liquid discharge pipe, the rotating pipe section being rotatably arranged relative to the fixed pipe section to drive the liquid discharge pipe to rotate relative to the fixed pipe section.
[0010] Further, the rotating pipe section comprises a middle pipe body and a plurality of branch pipe bodies connected with the middle pipe body respectively, and the plurality of branch pipe bodies are arranged at intervals around the middle pipe body; the number of the liquid discharge pipes is plural, and the plurality of liquid discharge pipes are connected with the plurality of branch pipe bodies one by one.
[0011] Further, the liquid discharge pipe comprises a main pipe body and a plurality of sub-pipe bodies arranged at intervals on the main pipe body, the main pipe body being used for being connected with the first flow guide pipe, and each sub-pipe body being used for spraying the cooling liquid.
[0012] Further, the liquid discharge pipe further comprises a liquid discharge spoiler arranged in the sub-pipe body.
[0013] Further, the flow divider comprises a top bent plate and two side plates connected with the top bent plate respectively, and the two side plates are arranged on opposite sides of the top bent plate respectively to jointly form the flow divider with a cross section in the shape of an inverted U.
[0014] Further, the number of the communication holes is plural, and the plural communication holes comprise: a first communication hole arranged on the top bent plate; and / or a second communication hole arranged on at least one of the two side plates.
[0015] Further, the number of the housing outlets is plural, and the plural housing outlets comprise a cooling liquid outlet and a gas outlet, the cooling liquid outlet and the gas outlet both communicating with the outer cavity, and the cooling liquid outlet being located below the gas outlet.
[0016] Further, the cooling assembly comprises a drain pipe arranged at the cooling liquid outlet and / or a second flow guide pipe arranged at the gas outlet.
[0017] Further, the cooling assembly comprises a housing radiator arranged at the inner side of the housing.
[0018] Further, the housing radiator comprises a plurality of housing radiators arranged at intervals in the outer cavity and connected with the housing, each of the housing radiators comprises a fluid cavity for fluid to pass through, a flow divider pipe is arranged in the fluid cavity, and the outer wall surface of the flow divider pipe is arranged at intervals with the cavity wall surface of the fluid cavity; wherein the cross-sectional area of the fluid cavity gradually increases in the direction close to the housing outlet.
[0019] Further, the housing radiator comprises a strip-shaped top plate and two strip-shaped side plates connected with the opposite ends of the strip-shaped top plate respectively, a top inclined surface is arranged at the side close to the flow divider pipe of the strip-shaped top plate, a side inclined surface is arranged at the side close to the flow divider pipe of each of the strip-shaped side plates, and the top inclined surface and the two side inclined surfaces jointly enclose the fluid cavity; and / or the housing radiator further comprises a spiral radiator arranged on the outer surface of the housing radiator, and one or more spiral radiators are arranged on each of the housing radiators.
[0020] The application provides a cooling device comprising a cooling assembly, wherein the cooling assembly is the above-mentioned cooling assembly, the housing has a plurality of housing outlets, and the plurality of housing outlets comprise a cooling liquid outlet and a gas outlet; the cooling device further comprises a cooling liquid tank, a liquid pumping device and a gas pumping device, the inlet of the liquid pumping device is connected with the liquid outlet of the cooling liquid tank, the outlet of the liquid pumping device is connected with the inlet of the housing, the inlet of the gas pumping device is connected with the gas outlet, the outlet of the gas pumping device is connected with the gas inlet of the cooling liquid tank, and the cooling liquid outlet is connected with the liquid inlet of the cooling liquid tank.
[0021] Further, the cooling device further comprises a gas siphon main pipe connected with the inlet of the gas pumping device, a gas siphon branch pipe installed on the gas siphon main pipe, a gas siphon branch pipe connected with the gas siphon branch pipe, and a gas communication pipe connected with the gas outlet; and / or a liquid siphon main pipe connected with the outlet of the liquid pumping device, a liquid siphon branch pipe installed on the liquid siphon main pipe, a liquid siphon branch pipe connected with the liquid siphon branch pipe, and a liquid communication pipe connected with the inlet of the housing; and / or a drain main pipe, one end of the drain main pipe is connected with the cooling liquid outlet, and the other end of the drain main pipe is connected with the liquid inlet of the cooling liquid tank.
[0022] Further, the cooling device comprises a plurality of cooling modules, each of which comprises a plurality of cooling components; wherein the number of the gas siphon branch pipes and the gas communication pipes is plural, the plurality of gas siphon branch pipes and the plurality of gas communication pipes are connected one by one, the plurality of gas communication pipes are arranged one by one with the plurality of cooling modules, each of the gas communication pipes is connected with the gas outlets of the plurality of cooling components in the corresponding cooling module; and / or the number of the liquid siphon branch pipes and the liquid communication pipes is plural, the plurality of liquid siphon branch pipes and the plurality of liquid communication pipes are connected one by one, the plurality of liquid communication pipes are arranged one by one with the plurality of cooling modules, each of the liquid communication pipes is connected with the shell inlets of the plurality of cooling components in the corresponding cooling module; and / or the number of the drain main pipes is plural, the plurality of drain main pipes are arranged one by one with the plurality of cooling modules, each of the gas communication pipes is connected with the cooling liquid outlets of the plurality of cooling components in the corresponding cooling module.
[0023] Further, the cooling device further comprises: a cooler arranged inside the cooling liquid tank; and / or a tank radiator arranged in the cooling liquid tank; and / or a temperature detection component arranged inside the cooling liquid tank for detecting the temperature of the inside of the cooling liquid tank; and / or a liquid level detection component arranged in the cooling liquid tank for detecting the liquid level of the cooling liquid in the cooling liquid tank; and / or a tank heat sink arranged inside the cooling liquid tank.
[0024] The application further provides a server comprising the above cooling device; the server further comprises a tank and a central processing unit, the tank has a mounting space, the cooling device and the central processing unit are arranged in the mounting space, and the central processing unit is a component to be cooled.
[0025] According to this application, the cooling assembly includes a housing, a flow divider, and a cooling structure. The flow divider is disposed in the receiving cavity of the housing to divide the receiving cavity into an inner cavity and an outer cavity. The inner cavity is used to accommodate at least a portion of the component to be cooled. The housing inlet communicates with the inner cavity, and the housing outlet communicates with the outer cavity. The flow divider is provided with a connecting hole. At least a portion of the cooling structure is disposed in the inner cavity and communicates with the housing inlet to spray the coolant flowing in from the housing inlet into the inner cavity. In the cooling assembly of this application, the coolant enters the inner cavity 101 through the housing inlet 11, contacts the component 1500 to be cooled, and absorbs heat. The coolant evaporates into vapor under the action of heat, and the vapor enters the outer cavity 102 through the connecting hole 20, and then flows out from the housing outlet. In this way, by utilizing the evaporation and condensation of the coolant in the inner cavity 101, the heat of the component 1500 to be cooled can be effectively absorbed. The connecting hole 20 ensures that the coolant can flow smoothly from the inner cavity 101 to the outer cavity 102, realizing the flow of coolant. When the component 1500 to be cooled is the central processing unit of a server, the stability and efficiency of the server's operation are improved. This solves the problem that the heat dissipation efficiency of the server's heat dissipation method in related technologies is low and cannot meet the needs of the server. It also solves the problem that the heat sinks used for the central processing unit of the server in related technologies often obstruct airflow and have relatively complex structural designs, resulting in high production costs. This ensures rapid cooling of the coolant and achieves the technical effects of effectively controlling the temperature of the component 1500 to be cooled, enhancing the cooling speed, and improving the heat dissipation efficiency. Attached Figure Description
[0026] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0027] Figure 1 A schematic diagram of a cooling assembly in one direction is provided for the first embodiment of this application;
[0028] Figure 2 for Figure 1 The diagram shows the structure of the cooling assembly in another direction;
[0029] Figure 3 for Figure 2 A cross-sectional view of the cooling assembly shown along the HH direction;
[0030] Figure 4 for Figure 1 A top view of the cooling assembly shown;
[0031] Figure 5 for Figure 4a sectional view of the cooling assembly shown along the direction of M-M;
[0032] Figure 6 for Figure 4 a sectional view of the cooling assembly shown along the direction of N-N;
[0033] Figure 7 for Figure 4 a sectional view of the cooling assembly shown along the direction of P-P;
[0034] Figure 8 for Figure 4 a sectional view of the cooling assembly shown along the direction of Q-Q;
[0035] Figure 9 for Figure 1 a front view of the cooling assembly shown;
[0036] Figure 10 for Figure 9 a sectional view of the cooling assembly shown along the direction of T-T;
[0037] Figure 11 for Figure 10 a close-up view of the cooling assembly shown at E;
[0038] Figure 12 a sectional view of a cooling assembly provided for the second embodiment of the present application;
[0039] Figure 13 for Figure 12 a front view of the cooling assembly shown;
[0040] Figure 14 for Figure 13 a sectional view of the cooling assembly shown along the direction of A-A;
[0041] Figure 15 for Figure 13 a sectional view of the cooling assembly shown along the direction of J-J;
[0042] Figure 16 for Figure 13 a sectional view of the cooling assembly shown along the direction of S-S;
[0043] Figure 17 for Figure 12 a structural schematic view of the housing heat sink of the cooling assembly shown in one direction;
[0044] Figure 18 for Figure 17 a structural schematic view of the housing heat sink shown in another direction;
[0045] Figure 19 for Figure 17A left side view of the housing radiator is shown;
[0046] Figure 20 A left side view of the housing radiator is shown; Figure 17 A right side view of the housing radiator is shown;
[0047] Figure 21 A right side view of the housing radiator is shown; Figure 1 An internal view of the cooling device when installed in a server is shown;
[0048] Figure 22 An internal view of the cooling device when installed in a server is shown; Figure 21 A partial enlarged view of B of the cooling device is shown.
[0049] Wherein, the above figures include the following reference signs:
[0050] 1. housing; 10, accommodating cavity; 101, inner cavity; 102, outer cavity; 11, housing inlet; 12, cooling liquid outlet; 13, gas outlet; 14, socket; 15, housing radiator; 151, housing radiating member; 1510, fluid cavity; 1511, strip-shaped top plate; 1512, strip-shaped side plate; 152, spiral radiating member;
[0051] 2. flow dividing member; 20, communication hole; 201, first communication hole; 202, second communication hole; 21, top bent plate; 22, side plate;
[0052] 3. cooling structure; 31, first flow guide pipe; 311, fixed pipe section; 312, rotating pipe section; 3121, intermediate pipe body; 3122, branch pipe body; 32, liquid discharge pipe; 321, main pipe body; 322, branch pipe body; 323, liquid discharge spoiler;
[0053] 4. second flow guide pipe;
[0054] 5. discharge pipe;
[0055] 100, cooling assembly; 200, cooling liquid tank; 300, liquid pumping pump; 400, gas pumping pump; 500, cooler; 600, radiator; 700, gas siphon main pipe; 800, gas siphon branch pipe; 900, gas communication pipe; 1000, liquid siphon main pipe; 1100, liquid siphon branch pipe; 1200, liquid communication pipe; 1300, discharge main pipe; 1400, cooling module; 1500, component to be cooled; 1600, tank. DETAILED DESCRIPTION
[0056] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.
[0057] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. The terms "mount", "connect", "connect" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the communication between two elements. The terms "parallel", "perpendicular", "equal" include the described case and the approximate case similar to the described case, and the approximate case is within an acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art considering the measurement being discussed and the error related to the measurement of a specific quantity (i.e. the limitation of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, wherein the acceptable deviation range of approximate parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and approximate perpendicular, wherein the acceptable deviation range of approximate perpendicular can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either. For a person of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood in specific cases.
[0058] In order for those skilled in the art to better understand the technical solutions of the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.
[0059] Embodiment one
[0060] As Figures 1 to 11As shown, the present application provides a cooling assembly, comprising: a housing 1, the housing 1 having a receiving cavity 10 and a housing inlet 11 and a housing outlet 12 respectively communicating with the receiving cavity 10; a flow divider 2, the flow divider 2 being arranged in the receiving cavity 10 to divide the receiving cavity 10 into an inner cavity 101 located inside the flow divider 2 and an outer cavity 102 located outside the flow divider 2, the inner cavity 101 being used to accommodate at least part of a component to be cooled 1500, the housing inlet 11 communicating with the inner cavity 101, the housing outlet 12 communicating with the outer cavity 102, the flow divider 2 being provided with a communication hole 20 for communicating the inner cavity 101 and the outer cavity 102; a cooling structure 3, at least part of the cooling structure 3 being arranged in the inner cavity 101 and communicating with the housing inlet 11 to spray the cooling liquid flowing in from the housing inlet 11 to the inner cavity 101.
[0061] In the cooling assembly of the present application, the cooling liquid enters the inner cavity 101 through the housing inlet 11, contacts and absorbs heat from the component to be cooled 1500, and evaporates into vapor under the action of heat, the vapor enters the outer cavity 102 through the communication hole 20, and then flows out from the housing outlet. In this way, the heat of the component to be cooled 1500 can be effectively absorbed by the evaporation and condensation of the cooling liquid in the inner cavity 101, and the smooth flow of the cooling liquid from the inner cavity 101 to the outer cavity 102 can be ensured by providing the communication hole 20, realizing the flow of the cooling liquid, so that the temperature of the component to be cooled 1500 is effectively controlled, the cooling effect is enhanced, and the heat dissipation efficiency is improved. When the component to be cooled 1500 is the central processor of the server, the running stability and working efficiency of the server are improved, the problem of low heat dissipation efficiency of the heat dissipation mode of the server in the related art, which cannot meet the needs of the server, is solved, the problem of the cooling fin for the central processor of the server in the related art often hindering the circulation of air and the relatively complex structure design, which leads to high production cost, is solved, and the rapid cooling of the cooling liquid is ensured.
[0062] Specifically, the cooling assembly of the present application can more effectively spray the cooling liquid to the component to be cooled through the synergistic effect of the housing, the flow divider and the cooling structure, improve the heat dissipation efficiency, and the vapor flowing out from the housing outlet can be condensed and recycled to be cooled again into cooling liquid, and the cooled cooling liquid can also enter the housing 1 again through the housing inlet 11 to be recycled.
[0063] In an embodiment of the present application, the housing 1 includes a socket 14 communicating with the inner cavity 101 of the receiving cavity 10, one end of the component to be cooled 1500 can be inserted into the inner cavity 101 through the socket 14, and the other end of the component to be cooled 1500 is used to connect with other components.
[0064] As Figures 1 to 11As shown, the cooling structure 3 comprises a first drainage pipe 31 connected with a drainage pipe 32, the first drainage pipe 31 is arranged at the housing inlet 11, and the drainage pipe 32 is arranged in the inner cavity 101 for spraying the cooling liquid to the inner cavity 101.
[0065] In this way, the cooling liquid is first introduced from the housing inlet 11 through the first drainage pipe 31, and then uniformly sprayed on the component to be cooled 1500 through the drainage pipe 32, which increases the flowability and spraying range of the cooling liquid, increases the contact area of the cooling liquid with the component to be cooled 1500, thereby improving the heat dissipation efficiency and cooling effect of the component to be cooled 1500, and reducing the consumption of the cooling liquid.
[0066] As shown in Figure 5 and Figure 11 , the first drainage pipe 31 comprises a fixed pipe section 311 and a rotating pipe section 312 connected with each other, one end of the fixed pipe section 311 away from the rotating pipe section 312 passes through the housing inlet 11 to the outside of the housing 1, the other end of the rotating pipe section 312 away from the fixed pipe section 311 is connected with the drainage pipe 32, and the rotating pipe section 312 is rotatably arranged relative to the fixed pipe section 311 to drive the drainage pipe 32 to rotate relative to the fixed pipe section 311.
[0067] In this way, the rotation of the rotating pipe section 312 drives the drainage pipe 32 to rotate, which can automatically adjust the spraying direction of the cooling liquid, improve the contact efficiency of the cooling liquid with the component to be cooled 1500, and further improve the heat dissipation effect, adapt to the component to be cooled 1500 at different positions, and improve the adaptability and flexibility of the cooling assembly.
[0068] Specifically, a rotating connection member such as a bearing is arranged between the fixed pipe section 311 and the rotating pipe section 312.
[0069] As shown in Figure 11 , the rotating pipe section 312 comprises a middle pipe body 3121 and a plurality of branch pipe bodies 3122 connected with the middle pipe body 3121 respectively, and the plurality of branch pipe bodies 3122 are arranged at intervals around the middle pipe body 3121; the number of the drainage pipes 32 is plural, and the plurality of drainage pipes 32 are connected with the plurality of branch pipe bodies 3122 one by one. The rotating pipe section 312 of the present application realizes the spraying of the cooling liquid in multiple directions through the combination of the middle pipe body 3121 and the plurality of branch pipe bodies 3122, further improves the contact area and cooling efficiency of the cooling liquid with the component to be cooled 1500, makes the distribution of the cooling liquid more uniform, improves the cooling effect, reduces the consumption of the cooling liquid, and improves the adaptability and flexibility of the cooling assembly.
[0070] Specifically, the rotating pipe section 312 comprises a middle pipe body 3121 and two branch pipe bodies 3122 connected with the middle pipe body 3121 respectively, and the plurality of branch pipe bodies 3122 are located at opposite sides of the middle pipe body 3121 respectively to jointly form a "T" shaped rotating pipe section 312; the number of the liquid discharge pipes 32 is two, and the two liquid discharge pipes 32 are connected with the two branch pipe bodies 3122 respectively.
[0071] As shown in Figure 11 , the liquid discharge pipe 32 comprises a main pipe body 321 and a plurality of branch pipe bodies 322 arranged on the main pipe body 321, the main pipe body 321 is used for connecting with the first drainage pipe 31, and each branch pipe body 322 is used for spraying the cooling liquid, which realizes the multi-point spraying of the cooling liquid, further improves the contact area and cooling efficiency of the cooling liquid with the component 1500 to be cooled, makes the distribution of the cooling liquid more uniform, improves the cooling effect, reduces the consumption of the cooling liquid, and improves the adaptability and flexibility of the cooling assembly.
[0072] Preferably, the liquid discharge pipe 32 further comprises a liquid discharge spoiler 323 arranged in the branch pipe body 322, and the spraying of the cooling liquid can be more uniform through the spoiler effect of the liquid discharge spoiler 323, which improves the heat exchange efficiency of the cooling liquid with the component 1500 to be cooled, thereby improving the cooling effect and reducing the consumption of the cooling liquid.
[0073] Specifically, the liquid discharge spoiler 323 can be a spiral spoiler plate.
[0074] As shown in Figure 3 , Figure 5 , Figures 6 to 8 and Figure 10 , the flow divider 2 comprises a top bent plate 21 and two side plates 22 connected with the top bent plate 21 respectively, and the two side plates 22 are arranged at opposite sides of the top bent plate 21 respectively to jointly form a flow divider 2 with a cross section of inverted U type.
[0075] In this way, the structure with a cross section of inverted U type formed by the combination of the top bent plate 21 and the two side plates 22 can effectively separate the containing cavity 10 into the inner cavity 101 and the outer cavity 102, which is beneficial to the circulating flow of the cooling liquid and the vapor, ensures the smooth flow of the cooling liquid and the gas, and avoids local overheating.
[0076] Specifically, the number of the communication holes 20 is multiple, and the multiple communication holes 20 include: a first communication hole 201 arranged on the top bent plate 21; and / or a second communication hole 202 arranged on at least one of the two side plates 22. By arranging the first communication hole 201 and the second communication hole 202, the present application can ensure that the cooling liquid and the steam can flow smoothly between the inner cavity 101 and the outer cavity 102, avoid local overheating, and improve the cooling efficiency. The implementation effect is that the flow of the cooling liquid and the steam is more uniform, the cooling effect is improved, and the consumption of the cooling liquid is reduced.
[0077] Preferably, the number of the first communication holes 201 is multiple, and the multiple first communication holes 201 are arranged on the top of the top bent plate 21. The number of the second communication holes 202 is multiple, and the multiple second communication holes 202 are arranged on at least one of the two side plates 22 in an array.
[0078] As shown in Figures 1 to 8 and Figure 10 , the number of the shell outlets is multiple, and the multiple shell outlets include a cooling liquid outlet 12 and a gas outlet 13. The cooling liquid outlet 12 and the gas outlet 13 are both in communication with the outer cavity 102. The cooling liquid outlet 12 is located below the gas outlet 13 to realize the separation of the cooling liquid and the steam, ensure that the cooling liquid can flow out smoothly through the cooling liquid outlet 12, and the steam can flow out through the gas outlet 13, avoid the mixing of the cooling liquid and the steam at the shell outlet, and improve the cooling efficiency.
[0079] As shown in Figures 1 to 8 and Figure 10 , the cooling assembly includes: a drain pipe 5 arranged at the cooling liquid outlet 12; and / or a second flow guide pipe 4 arranged at the gas outlet 13. By arranging the drain pipe 5 and the second flow guide pipe 4, the cooling assembly of the present application realizes the connection with the refrigerant flow pipeline outside the cooling assembly, ensures the efficient flow of the cooling liquid and the steam, ensures that the cooling liquid and the steam can flow out smoothly from the cooling assembly, and improves the cooling efficiency.
[0080] The cooling process of the cooling assembly of the present application is as follows:
[0081] (1) The low-temperature cooling liquid from outside the cooling assembly is introduced into the drain pipe 32 through the first flow guide pipe 31 of the cooling structure 3, and the cooling liquid is sprayed into the inner cavity 101 through the drain pipe 32. When the cooling liquid contacts and absorbs heat from the to-be-cooled component 1500 in the inner cavity 101, the temperature of the cooling liquid will rise. When the cooling liquid reaches its boiling point, it will begin to boil and transform into steam. The generation process of the steam absorbs a large amount of heat, thereby effectively reducing the temperature of the to-be-cooled component 1500 in the inner cavity 101.
[0082] (2) When the fixed pipe section 311 guides the cooling liquid into the rotating pipe section 312, the liquid is guided through the rotating pipe section 312 to the two liquid discharge pipes 32, and the driving of the cooling liquid in the two oppositely arranged liquid discharge pipes 32 causes the rotating pipe section 312 to rotate relative to the fixed pipe section 311 (when the cooling liquid flows into the entry sub-pipe body 322 of the liquid discharge pipe 32, the flow direction of the cooling liquid changes, an impact force is generated, and due to the arrangement of the rotating pipe section 312 and the rotating connecting piece, the impact force acts on the rotating connecting piece, so that the rotating pipe section 312 can automatically rotate); at the same time, the cooling liquid is sprayed out of the sub-pipe body 322 of the liquid discharge pipe 32 to form a fountain effect, so as to achieve the purposes of rotating spraying and stirring the cooling liquid.
[0083] (3) The steam flows out of the top of the flow divider 2 to the outer cavity 102 through the first communication hole 201, and is located at the top of the outer cavity 102, and then flows out of the shell 1 through the second drainage pipe 4; part of the cooling liquid flows out of the side of the flow divider 2 to the outer cavity 102 through the second communication hole 202, and is located at the bottom of the outer cavity 102, and then flows out of the shell 1 through the drainage pipe 5.
[0084] Embodiment Two
[0085] As shown in Figures 12 to 20 , the embodiment two of the present application is a further limitation of the embodiment one. The cooling assembly of the present application further comprises a shell radiator 15 arranged on the inner side of the shell 1, which increases the heat dissipation area of the shell 1, improves the heat dissipation efficiency of the cooling assembly, and reduces the consumption of the cooling liquid.
[0086] The shell radiator 15 comprises a plurality of shell radiator pieces 151 arranged in the outer cavity 102 and connected with the shell 1, and each shell radiator piece 151 comprises a fluid cavity 1510 for passing fluid, the flow divider 2 is arranged in the fluid cavity 1510, and the outer wall surface of the flow divider 2 is arranged in the cavity wall surface of the fluid cavity 1510; the cross-sectional area of the fluid cavity 1510 gradually increases in the direction close to the shell outlet, which not only increases the contact area with the cooling liquid and the steam, thereby increasing the heat dissipation area of the cooling liquid and the steam, but also plays a role of one-way drainage, so as to guide the cooling liquid and the steam from the narrower side to the wider side, optimize the flow path of the cooling liquid and the steam, speed up the drainage speed, prevent backflow, realize smooth transition and diffusion of the cooling liquid and the steam, improve the heat dissipation efficiency of the cooling assembly, improve the discharge efficiency of the cooling liquid and the steam, and thus ensure the smooth progress of the cooling process.
[0087] As shown in Figures 17 to 20As shown, the shell heat dissipation piece 151 includes a strip-shaped top plate 1511 and two strip-shaped side plates 1512 respectively connected with opposite ends of the strip-shaped top plate 1511; a top inclined surface is arranged on a side of the strip-shaped top plate 1511 close to the flow dividing piece 2, and a side inclined surface is arranged on a side of each strip-shaped side plate 1512 close to the flow dividing piece 2, and the top inclined surface and the two side inclined surfaces jointly enclose a fluid cavity 1510.
[0088] Specifically, the shell heat dissipation piece is a horn-shaped sheet.
[0089] Further, the shell heat sink 15 further includes a spiral heat dissipation piece 152 arranged on an outer surface of the shell heat dissipation piece 151, and one or more spiral heat dissipation pieces 152 are arranged on each shell heat dissipation piece 151; wherein the spiral heat dissipation piece 152 is located on a side of the corresponding shell heat dissipation piece 151 close to the flow dividing piece 2, can generate a centrifugal stirring action, and can generate disturbance to the cooling liquid and the vapor passing through the shell heat dissipation piece, form a vortex flow, which helps to increase the turbulence degree of the cooling liquid and the vapor, and increases the contact area of the cooling liquid and the vapor with the shell heat sink, further prolongs the flow path of the cooling liquid and the vapor, improves the heat exchange efficiency, and reduces the consumption of the cooling liquid. In addition, the arrangement of the spiral heat dissipation piece can also enhance the structural stability of the shell heat dissipation piece, so as to ensure that the shell heat dissipation piece will not be deformed or damaged due to air flow impact when the fluid passes at high speed.
[0090] As shown in Figure 21 and Figure 22 The present application provides a cooling device, which includes a cooling assembly 100, and the cooling assembly 100 is the above-mentioned cooling assembly, the shell 1 has a plurality of shell outlets, and the plurality of shell outlets include a cooling liquid outlet 12 and a gas outlet 13; the cooling device further includes a cooling liquid tank 200, a liquid pump 300 and a gas pump 400, the inlet of the liquid pump 300 is connected with the liquid outlet of the cooling liquid tank 200, the outlet of the liquid pump 300 is connected with the shell inlet 11, the inlet of the gas pump 400 is connected with the gas outlet 13, the outlet of the gas pump 400 is connected with the gas inlet of the cooling liquid tank 200, and the cooling liquid outlet 12 is connected with the liquid inlet of the cooling liquid tank 200.
[0091] The cooling device of the present application realizes the recycling of the cooling liquid by arranging the cooling assembly 100, the cooling liquid tank 200, the liquid pump 300 and the gas pump 400, improves the cooling efficiency, reduces the operating cost, reduces the consumption of the cooling liquid, and improves the operation stability and working efficiency of the to-be-cooled component 1500.
[0092] Firstly, the cooling liquid is pumped out from the cooling liquid tank 200 by the liquid pump 300, and then enters the inner cavity 101 through the shell inlet 11, contacts the component to be cooled 1500 and absorbs heat, and part of the cooling liquid evaporates into steam under the action of heat, the steam enters the outer cavity 102 through the first communication hole 201, and then the steam is extracted by the gas pump 400 through the gas outlet 13 and is condensed and recovered by the cooling liquid tank 200, and the remaining cooling liquid that absorbs heat flows back to the cooling liquid tank 200 through the cooling liquid outlet 12.
[0093] As shown in Figure 21 and Figure 22 , the cooling device further comprises: a gas siphon main pipe 700, a gas siphon branch pipe 800 and a gas communication pipe 900, the gas siphon main pipe 700 is connected with the inlet of the gas pump 400, the gas siphon branch pipe 800 is installed on the gas siphon main pipe 700, the gas siphon branch pipe 800 is connected with the gas communication pipe 900, and the gas communication pipe 900 is connected with the gas outlet 13; and / or a liquid siphon main pipe 1000, a liquid siphon branch pipe 1100 and a liquid communication pipe 1200, the liquid siphon main pipe 1000 is connected with the outlet of the liquid pump 300, the liquid siphon branch pipe 1100 is installed on the liquid siphon main pipe 1000, the liquid siphon branch pipe 1100 is connected with the liquid communication pipe 1200, and the liquid communication pipe 1200 is connected with the shell inlet 11; and / or a drainage main pipe 1300, one end of the drainage main pipe 1300 is connected with the cooling liquid outlet 12, and the other end of the drainage main pipe 1300 is connected with the liquid inlet of the cooling liquid tank 200. In this way, the cooling liquid and the steam are efficiently circulated, the cooling efficiency is improved, the operation cost is reduced, the consumption of the cooling liquid is reduced, and the operation stability and efficiency of the component to be cooled 1500 are improved.
[0094] The cooling liquid flowing out of the outlet of the liquid pump 300 enters the shell inlet 11 through the liquid siphon main pipe 1000, the liquid siphon branch pipe 1100 and the liquid communication pipe 1200, and then enters the inner cavity 101, contacts the component to be cooled 1500 and absorbs heat, part of the cooling liquid evaporates into steam under the action of heat, the steam enters the outer cavity 102 through the first communication hole 201, and then the steam is extracted by the gas pump 400 through the gas outlet 13 and is condensed and recovered by the cooling liquid tank 200, and the remaining cooling liquid that absorbs heat flows back to the cooling liquid tank 200 through the cooling liquid outlet 12 and then through the drainage main pipe 1300.
[0095] Specifically, the gas siphon branch pipe 800 and the liquid siphon branch pipe 1100 are J-shaped siphon pipes.
[0096] As shown in Figure 21 and Figure 22As shown, the cooling device comprises a plurality of cooling modules 1400, each of which comprises a plurality of cooling assemblies 100; wherein the number of gas siphon branch pipes 800 and gas communication pipes 900 is multiple, the plurality of gas siphon branch pipes 800 and the plurality of gas communication pipes 900 are connected one by one, the plurality of gas communication pipes 900 are arranged one by one with the plurality of cooling modules 1400, each gas communication pipe 900 is connected with the gas outlet 13 of the plurality of cooling assemblies 100 in the corresponding cooling module 1400; and / or the number of liquid siphon branch pipes 1100 and liquid communication pipes 1200 is multiple, the plurality of liquid siphon branch pipes 1100 and the plurality of liquid communication pipes 1200 are connected one by one, the plurality of liquid communication pipes 1200 are arranged one by one with the plurality of cooling modules 1400, each liquid communication pipe 1200 is connected with the shell inlet 11 of the plurality of cooling assemblies 100 in the corresponding cooling module 1400; and / or the number of drain main pipes 1300 is multiple, the plurality of drain main pipes 1300 are arranged one by one with the plurality of cooling modules 1400, each gas communication pipe 900 is connected with the cooling liquid outlet 12 of the plurality of cooling assemblies 100 in the corresponding cooling module 1400. In this way, through the arrangement of the plurality of cooling modules 1400, the plurality of components to be cooled 1500 can be cooled at the same time, the efficient circulation of the cooling liquid and the vapor is realized, the cooling efficiency is improved, and the operation cost is reduced.
[0097] It should be noted that when the cooling liquid reaches the liquid siphon main pipe 1000, it can be diverted to the inside of the plurality of liquid communication pipes 1200 through the siphon effect of the plurality of liquid siphon branch pipes 1100; similarly, when the vapor reaches the plurality of gas communication pipes 900, it can be diverted into the gas siphon main pipe 700 through the siphon effect of the plurality of gas siphon branch pipes 800. In this way, by using the siphon effect, even without the direct power of the liquid pump 300 and the gas pump 400, the cooling liquid can be automatically transferred between the cooling assembly 100 and the cooling liquid tank 200 when the cooling liquid and the vapor reach a certain height difference, which can reduce the need for additional mechanical pumps and reduce energy consumption and maintenance costs.
[0098] As shown in Figure 21 The cooling device further comprises: a cooler 500 arranged inside the cooling liquid tank 200; and / or a tank radiator 600 arranged in the cooling liquid tank 200, which can be located at least one of the inside and the outside of the cooling liquid tank 200; and / or a temperature detection component arranged inside the cooling liquid tank 200 for detecting the temperature inside the cooling liquid tank 200; and / or a liquid level detection component arranged in the cooling liquid tank 200 for detecting the liquid level of the cooling liquid in the cooling liquid tank 200; and / or a tank cooling fin arranged inside the cooling liquid tank 200.
[0099] Thus, the application further cools and dissipates the heat of the coolant in the coolant tank 200 by setting the cooler 500 and the tank radiator 600, monitors the state of the coolant in the coolant tank 200 in real time through the temperature detection component and the liquid level detection component, ensures the normal operation of the coolant tank 200, and increases the heat dissipation area of the coolant tank 200 through the tank fins, thereby improving the cooling efficiency of the coolant. The cooled coolant can be recycled by the liquid pumping pump 300, realizing efficient cooling and recycling of the coolant, reducing the consumption of the coolant, and ensuring the normal operation of the cooling device, thereby improving the operation stability and efficiency of the cooling device.
[0100] Specifically, the number of tank fins is multiple, and the multiple tank fins are arranged at intervals on the inner side of the coolant tank 200; the tank fin is a coiled spiral fin, which is sleeved on the cooler 500, can reduce the dead zone of fluid flow, i.e., the area that is not easily flushed by fluid, ensure that the heat inside the entire coolant tank 200 can be effectively taken away, can significantly increase the surface area in contact with the coolant and the vapor, and help to more effectively exchange heat to further enhance the cooling effect, and the coiled spiral fin has good stability and strength, and can maintain the integrity of the structure and the stability of the function even when subjected to high-pressure or high-speed flowing coolant in the coolant tank 200.
[0101] The application also provides a server comprising the above cooling device; the server further comprises a tank 1600 and a central processor, the tank 1600 has a mounting space therein, and the cooling device and the central processor are arranged in the mounting space, and the central processor is a to-be-cooled component 1500.
[0102] When the server is running, the central processor, the graphics processor and other high-performance computing elements inside the server will generate a large amount of heat. The application can efficiently introduce low-temperature electrolyte (i.e., coolant) to the heat dissipation cover tank inside the server by integrating the cooling device into the server, thereby ensuring the rapid cooling and recycling of the coolant. The application realizes efficient heat dissipation of the central processor and other high-performance computing elements, reduces the temperature of the central processor and other high-performance computing elements, improves the operation stability and efficiency of the server, and reduces energy consumption.
[0103] The above describes in detail the cooling assembly, the cooling device and the server provided by the application. The principles and implementation modes of the application are described by applying specific examples. The above description of the embodiments is only used to help understand the method of the application and its core idea. It should be pointed out that those skilled in the art can make some improvements and modifications to the application without departing from the principles of the application, and these improvements and modifications also fall within the protection scope of the claims of the application.
Claims
1. A cooling assembly, characterized in that, include: The housing (1) has a receiving cavity (10) and a housing inlet (11) and a housing outlet respectively communicating with the receiving cavity (10); A diverter (2) is disposed in the receiving cavity (10) to divide the receiving cavity (10) into an inner cavity (101) located inside the diverter (2) and an outer cavity (102) located outside the diverter (2). The inner cavity (101) is used to receive at least a portion of the component (1500) to be cooled. The housing inlet (11) communicates with the inner cavity (101), and the housing outlet communicates with the outer cavity (102). The diverter (2) is provided with a communication hole (20) for communicating the inner cavity (101) and the outer cavity (102). A cooling structure (3), at least a portion of which is disposed within the inner cavity (101) and communicates with the housing inlet (11) to spray coolant flowing in from the housing inlet (11) into the inner cavity (101).
2. The cooling assembly according to claim 1, characterized in that, The cooling structure (3) includes a first drain pipe (31) and a drain pipe (32) connected to each other. The first drain pipe (31) passes through the inlet (11) of the housing, and the drain pipe (32) Located within the inner cavity (101) for spraying coolant into the inner cavity (101); The first drainage tube (31) includes a fixed tube section (311) and a rotating tube section (312) connected to each other. The end of the fixed pipe section (311) away from the rotating pipe section (312) passes through the housing inlet (11) and reaches the outside of the housing (1). The end of the rotating pipe section (312) away from the fixed pipe section (311) is connected to the drain pipe (32). The drain pipe (32) is rotatably disposed relative to the fixed pipe section (311) so as to drive the drain pipe (32) to rotate relative to the fixed pipe section (311).
3. The cooling assembly according to claim 2, characterized in that, The rotating pipe section (312) includes an intermediate pipe body (3121) and a connecting section with the intermediate pipe body (3121). Multiple branch pipes (3122) are connected respectively, and the multiple branch pipes (3122) are arranged at intervals around the intermediate pipe (3121); there are multiple drain pipes (32), and the multiple drain pipes (32) are connected one-to-one with the multiple branch pipes (3122); and / or The drain pipe (32) includes a main body (321) and a plurality of branch pipes (322) spaced apart on the main body (321). The main body (321) is used to connect to the first drain pipe (31), and each branch pipe (322) is used to spray coolant. The drain pipe (32) also includes a drain baffle (323) disposed in the branch pipe (322).
4. The cooling assembly according to claim 1, characterized in that, The diverter (2) includes a top curved plate (21) and two side plates (22) respectively connected to the top curved plate (21). The two side plates (22) are respectively arranged on opposite sides of the top curved plate (21) to jointly form the diverter (2) with an inverted U-shaped cross section. The number of the connecting holes (20) is multiple, and the multiple connecting holes (20) include: a first connecting hole (201), which is disposed on the top curved plate (21); and / or a second connecting hole (202), the second connecting hole (202) being disposed on at least one of the two side plates (22); and / or The number of housing outlets is multiple, including a coolant outlet (12) and a gas outlet (13). Both the coolant outlet (12) and the gas outlet (13) are connected to the outer cavity (102), and the coolant outlet (12) is located below the gas outlet (13).
5. The cooling assembly according to claim 1, characterized in that, The cooling assembly includes a housing radiator (15) disposed inside the housing (1); the housing radiator (15) includes a plurality of housing heat sinks (151), which are spaced apart in the outer cavity (102) and connected to the housing (1); each housing heat sink (151) includes a fluid cavity (1510) for fluid to pass through; a flow divider (2) passes through the fluid cavity (1510), and the outer wall of the flow divider (2) is spaced apart from the cavity wall of the fluid cavity (1510); wherein the cross-sectional area of the fluid cavity (1510) gradually increases along the direction closer to the housing outlet.
6. The cooling assembly according to claim 5, characterized in that, The heat dissipation component (151) includes a strip-shaped top plate (1511) and two strip-shaped side plates (1512), the two strip-shaped side plates (1512) being connected to opposite ends of the strip-shaped top plate (1511); the top plate (1511) has a top slope on the side near the flow divider (2), and each of the strip-shaped side plates (1512) has a side slope on the side near the flow divider (2), the top slope and the two side slopes together forming the fluid cavity (1510); and / or The housing heat sink (15) further includes a spiral heat sink (152) disposed on the outer surface of the housing heat sink (151), and each housing heat sink (151) is provided with one or more of the spiral heat sinks (152).
7. A cooling device, characterized in that, The device includes a cooling assembly (100), which is the cooling assembly according to any one of claims 1 to 6. The housing (1) has a plurality of housing outlets, including a coolant outlet (12) and a gas outlet (13). The cooling device also includes a coolant tank (200), a liquid pump (300), and a gas pump (400). The inlet of the liquid pump (300) is connected to the liquid outlet of the coolant tank (200), and the outlet of the liquid pump (300) is connected to the housing inlet (11). The inlet of the gas pump (400) is connected to the gas outlet (13), and the outlet of the gas pump (400) is connected to the gas inlet of the coolant tank (200). The coolant outlet (12) is connected to the liquid inlet of the coolant tank (200).
8. The cooling device according to claim 7, characterized in that, The cooling device further includes: a gas siphon main pipe (700), gas siphon branch pipes (800), and a gas connecting pipe (900). The gas siphon main pipe (700) is connected to the inlet of the vacuum pump (400). The gas siphon branch pipes (800) are installed on the gas siphon main pipe (700) and connected to the gas connecting pipe (900). The gas connecting pipe (900) is connected to the gas outlet (13); and / or A liquid siphon main pipe (1000), liquid siphon branch pipes (1100), and a liquid connecting pipe (1200) are provided. The liquid siphon main pipe (1000) is connected to the outlet of the pump (300). The liquid siphon branch pipes (1100) are installed on the liquid siphon main pipe (1000) and connected to the liquid connecting pipe (1200). The liquid connecting pipe (1200) is connected to the housing inlet (11); and / or A drain manifold (1300) is provided, one end of which is connected to the coolant outlet (12), and the other end of which is connected to the liquid inlet of the coolant tank (200).
9. The cooling device according to claim 8, characterized in that, The cooling device includes multiple cooling modules (1400), and each cooling module (1400) includes multiple cooling components (100); wherein, There are multiple gas siphon branch pipes (800) and multiple gas connecting pipes (900), and the multiple gas siphon branch pipes (800) and multiple gas connecting pipes (900) are connected one-to-one. The multiple gas connecting pipes (900) are arranged one-to-one with the multiple cooling modules (1400), and each gas connecting pipe (900) is connected to the gas outlet (13) of the multiple cooling components (100) in the corresponding cooling module (1400); and / or There are multiple liquid siphon branch pipes (1100) and multiple liquid connecting pipes (1200), and the multiple liquid siphon branch pipes (1100) and multiple liquid connecting pipes (1200) are connected one-to-one. The multiple liquid connecting pipes (1200) are arranged one-to-one with the multiple cooling modules (1400), and each liquid connecting pipe (1200) is connected to the housing inlet (11) of multiple cooling components (100) in the corresponding cooling module (1400); and / or There are multiple drain manifolds (1300), and each drain manifold (1300) is provided in a one-to-one correspondence with a multiple cooling module (1400). Each gas connecting pipe (900) is connected to the coolant outlet (12) of a multiple cooling component (100) in the corresponding cooling module (1400).
10. A server, characterized in that, The server includes the cooling device according to any one of claims 7 to 9; the server further includes a chassis (1600) and a central processing unit, the chassis (1600) having an installation space, the cooling device and the central processing unit being disposed within the installation space, the central processing unit being the component (1500) to be cooled.