High-speed backboard connecting line for server

Abstract

The utility model discloses a high-speed backboard connecting line for a server, which comprises a conductor, an insulating layer, a foaming belt layer, a shielding layer and a mylar layer, and is characterized in that the conductor is a linear metal conductor with a preset size; the insulating layer coats the side surface of the conductor; the foaming belt layer coats the outer side surface of the insulating layer; the shielding layer coats the outer side surface of the foaming belt layer; the mylar layer coats the outer side surface of the shielding layer; the shielding layer is formed by rolling a metal sheet with a preset thickness on the outer side surface of the foaming belt layer, the shielding layer comprises a coating part and a lap joint part, and the coating part is tightly attached to the side surface of the foaming belt layer; the lap joint part is arranged on the edge of one side of the wrapping part, and the lap joint part crosses the joint of the wrapping part and extends by a preset width. According to the high-speed backboard connecting line for the server, the lap joint part crosses the joint part of the coating part and extends by the preset width, so that the lap joint part can cover the joint part of the coating part, and the shielding performance of the shielding layer is enhanced.

Description

TECHNICAL FIELD

[0001] The utility model relates to high -speed backboard connecting line technical field especially relates to a server high -speed backplate connecting line. BACKGROUND

[0002] With the high -speed development of AI artificial intelligence, as in the network environment provides the specific IT equipment - server's data transmission amount of computing capacity and runs software application program is more and more big, so in order to satisfy the huge data throughput of server, the high -speed connecting line in server also needs upgrading urgently. Server high -speed backplate connecting line is a kind of connecting component specially designed for high -speed data transmission, mainly used in server and high -speed communication in data center. They are usually used for high-density, high-speed signal transmission inside the server or between multiple servers. Specifically, high-speed backplane connecting lines are used to connect high-speed channels between mainboards and expansion cards (such as network adapters, storage devices) or modules, while providing high-speed interconnection between switches, storage devices and servers, and can also be used to support high-speed communication between nodes in supercomputing clusters. Generally, high-speed backplane connecting lines support transmission rates of up to 10 Gbps, 25 Gbps or even higher, meeting the demand for large bandwidth in modern data centers. Existing connecting lines use shielding design to reduce signal reflection and crosstalk, while ensuring low latency during high-speed data transmission and supporting multi-channel connection to save wire installation space.

[0003] The existing high-speed communication line attenuation bandwidth can only reach 40GHz without resonance, which cannot meet the requirement of 224G transmission interface attenuation bandwidth 80GHz without resonance. Due to large data transmission volume, the use of high-speed transmission lines in servers increases exponentially, but the space in servers is limited, and the size of high-speed transmission lines is more stringent. The existing high-speed transmission line has a drain wire on each side of the metal shielding layer. However, the drain wire in the above high-speed backplane connecting line greatly increases the size of the wire, and the differential signal transmission attenuation in the wire is large. UTILITY MODEL CONTENTS

[0004] Therefore, it is necessary to provide a server high-speed backplane connecting line to solve the technical problems of large wire size and large differential signal transmission attenuation of the existing high-speed backplane connecting line.

[0005] A server high-speed backplane connecting line, the server high-speed backplane connecting line includes conductor, insulating layer, foaming tape layer, shielding layer and Mylar layer, the conductor is set as a wire-shaped metal conductor of a preset size; the insulating layer is wrapped on the side surface of the conductor; the foaming tape layer is wrapped on the outer side surface of the insulating layer; the shielding layer is wrapped on the outer side surface of the foaming tape layer; the Mylar layer is wrapped on the outer side surface of the shielding layer.

[0006] The shielding layer is rolled on the outer side surface of the foamed tape layer by a metal sheet with a preset thickness, and the shielding layer comprises a cladding part and a lap joint part. The cladding part is arranged in a relatively closed cylindrical cladding structure, and is tightly attached to the side surface of the foamed tape layer. The lap joint part is arranged at one side edge of the cladding part, and extends beyond the joint of the cladding part by a preset width, so that the lap joint part can cover the joint of the cladding part.

[0007] In one embodiment, the foamed tape layer is wound on the outer side surface of the insulating layer in a winding manner.

[0008] In one embodiment, the overlapping rate of the overlapping part of the foamed tape is controlled to be between 45% and 50% during the winding of the foamed tape layer, so as to ensure the sealing property of the foamed tape layer.

[0009] In one embodiment, the foamed tape layer is wound by a PTFE foamed tape.

[0010] In one embodiment, the foamed tape layer is wound by a PP foamed tape.

[0011] In one embodiment, the insulating layer is formed on the side surface of the conductor by extrusion.

[0012] In one embodiment, the insulating layer is formed by extrusion of one of FEP, polypropylene, polyethylene, polytetrafluoroethylene and ethylene-tetrafluoroethylene copolymer.

[0013] In one embodiment, the shielding layer is one of PP aluminum foil, PET aluminum foil, pure copper tape, PP copper foil and PET copper foil.

[0014] In one embodiment, the Mylar layer is one of PET film, PI film and PP film.

[0015] In one embodiment, the Mylar layer is wound on the outer side surface of the shielding layer in a winding manner, and the pitch of the winding of the Mylar layer is less than 1.2 mm.

[0016] In one embodiment, the conductor is one of silver-plated copper, bare copper conductor, tin-plated copper conductor, gold-plated copper conductor and nickel-plated copper conductor.

[0017] In one embodiment, the server high-speed backplane connection line is provided with two conductors arranged in parallel and accommodated in the same foamed tape layer.

[0018] In one embodiment, the two conductors are independently covered by the insulating layer.

[0019] The server high-speed backboard connecting line extends through the joint of the covering part by the lap joint part by a preset width, and then the lap joint part covers the joint of the covering part, so that the shielding performance of the shielding layer is improved. Compared with the conventional high-speed backboard connecting line, the server high-speed backboard connecting line of the utility model discards the drainage wire, and takes into account the drainage effect through the shielding layer, greatly reduces the wire size, and at the same time, the foamed tape layer wound outside the insulating layer can effectively reduce the dielectric constant of the transmission medium, and then reduce the attenuation of the differential signal in the conductor, solve the problem of insufficient attenuation bandwidth of the existing high-speed backboard connecting line, and then meet the requirement of no resonance in the 80GHz attenuation bandwidth required by the 224G transmission interface. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a structural schematic view of the server high-speed backboard connecting line in an embodiment. DETAILED DESCRIPTION

[0021] In order to make the above-mentioned purposes, characteristics and advantages of the utility model more obvious and easy to understand, the specific embodiments of the utility model are described in detail below. In the following description, many specific details are set forth in order to fully understand the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0022] In the description of the utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation of the utility model.

[0023] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the utility model, the meaning of "multiple" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0024] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0025] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0026] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0027] Please see Figure 1The utility model discloses a kind of server high-speed backplane connecting wires 10, the server high-speed backplane connecting wires 10 including conductor 100, insulating layer 200, foamed tape layer 300, shielding layer 400 and Mylar layer 500, conductor 100 is set to the line-shaped metal conductor 100 of preset size;Insulating layer 200 is covered in the side surface of conductor 100;Foamed tape layer 300 is covered in the outside surface of insulating layer 200;Shielding layer 400 is covered in the outside surface of foamed tape layer 300;Mylar layer 500 is covered in the outside surface of shielding layer 400.Wherein, shielding layer 400 adopts the metal sheet of preset thickness and is rolled on the outside surface of foamed tape layer 300, and, shielding layer 400 includes covering portion 410 and lap joint portion 420, covering portion 410 is set to the covering structure of relatively closed cylinder, and, covering portion 410 is closely attached to the side surface of foamed tape layer 300;Lap joint portion 420 is set to one side edge of covering portion 410, and, lap joint portion 420 extends preset width beyond the joint of covering portion 410, in turn makes lap joint portion 420 can cover the joint of covering portion 410, to this strengthens the shielding performance of shielding layer 400.Based on this, compared with traditional high-speed backplane connecting wire, the server high-speed backplane connecting wire 10 of the utility model removes drainage line, and through shielding layer 400, drainage effect is considered, greatly reduces wire size, while, the dielectric constant of transmission medium can be effectively reduced by winding foamed tape layer 300 outside insulating layer 200, in turn reduces the attenuation of differential signal in conductor 100, solve the problem of insufficient attenuation bandwidth of existing high-speed backplane connecting wire, in turn meet the requirement of 224G transmission interface in 80GHz attenuation bandwidth without resonance.

[0028] Further, foamed tape layer 300 adopts foamed tape of strip structure to be wound on the outside surface of insulating layer 200 in winding mode, so that foamed tape layer 300 as a part of medium effectively reduces the dielectric constant of wire insulating layer 200, thereby effectively reducing the attenuation of differential signal in wire transmission process.Specifically, during the winding of foamed tape layer 300, the overlap rate of the overlapping part of foamed tape is controlled between 45%-50%, so as to ensure the closed property of foamed tape layer 300.In one embodiment, foamed tape layer 300 is wound by PTFE foamed tape, and the PTFE foamed tape has ultra-low dielectric constant, thereby being able to bring lower signal loss, suitable for wider frequency range and performance-sensitive high-speed transmission, and the PTFE has excellent high-temperature resistance and chemical corrosion resistance, and performs excellently in high temperature and harsh environment.In another embodiment, foamed tape layer 300 is wound by PP foamed tape, and the PP foamed tape has higher flexibility, and the connecting wire maintains good performance when being curled and bent, and the PP foamed tape has lower cost, and selection according to application scenario can effectively reduce the production cost of the connecting wire.

[0029] Further, the insulating layer 200 is formed on the side surface of the conductor 100 by extrusion, and specifically, the insulating layer 200 is formed by extrusion of one of FEP, polypropylene, polyethylene, polytetrafluoroethylene and ethylene-tetrafluoroethylene copolymer, so as to ensure the insulation performance between the conductor 100 and the shielding layer 400.

[0030] Further, the shielding layer 400 is made of one of PP aluminum foil, PET aluminum foil, pure copper strip, PP copper foil and PET copper foil, so as to ensure the shielding performance of the shielding layer 400 and optimize the processing performance of the shielding layer 400.

[0031] Further, the Mylar layer 500 is made of one of PET film, PI film and PP film, and specifically, the Mylar layer 500 is wound on the outer surface of the shielding layer 400 in a winding manner, and the pitch of the Mylar layer 500 is less than 1.2 mm, so as to ensure the integrity of the Mylar layer 500 on the wire.

[0032] Further, the conductor 100 is made of one of silver-plated copper, bare copper conductor 100, tin-plated copper conductor 100, gold-plated copper conductor 100, nickel-plated copper conductor 100 and other copper conductors 100 with or without metal plating, so as to ensure the conductivity of the conductor 100 under complex working conditions.

[0033] Further, the server high-speed backplane connection line 10 is provided with two conductors 100, and the two conductors 100 are arranged in parallel and accommodated in the same foaming tape layer 300. Specifically, the two conductors 100 are independently covered with insulating layers 200, so as to ensure the insulation between the two conductors 100 and avoid short circuit.

[0034] In summary, the server high-speed backplane connection line disclosed in the utility model extends a predetermined width through the joint of the cladding part by the lap joint part, so that the lap joint part can cover the joint of the cladding part, thereby strengthening the shielding performance of the shielding layer. Based on this, compared with the traditional high-speed backplane connection line, the server high-speed backplane connection line of the utility model removes the drain wire, and takes into account the drainage effect through the shielding layer, greatly reduces the size of the wire, and at the same time, the foaming tape layer wound outside the insulating layer can effectively reduce the dielectric constant of the transmission medium, thereby reducing the attenuation of the differential signal in the conductor, solving the problem of insufficient attenuation bandwidth of the existing high-speed backplane connection line, and further meeting the requirement of no resonance within the 80GHz attenuation bandwidth required by the 224G transmission interface.

[0035] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but as long as the combinations of the technical features do not exist, they should be considered as within the scope of the present disclosure.

[0036] The above-described embodiments only express several implementation manners of the utility model, the description is more specific and detailed, but can not therefore be understood as the limitation of the utility model patent range. It should be pointed out that for ordinary skilled person in the art, without departing from the utility model concept, several modifications and improvements can be made, which belong to the protection range of the utility model. Therefore, the protection range of the utility model patent should be subject to the appended claims.

Claims

1. A high-speed backplane connection cable for servers, characterized in that, include: The product comprises a conductor, an insulating layer, a foamed tape layer, a shielding layer, and a Mylar layer, wherein the conductor is configured as a linear metal conductor of a predetermined size; The insulating layer covers the side surface of the conductor; the foamed tape layer covers the outer surface of the insulating layer; the shielding layer covers the outer surface of the foamed tape layer; the Mylar layer covers the outer surface of the shielding layer. The shielding layer is made of a metal sheet of a predetermined thickness rolled onto the outer surface of the foamed tape layer. The shielding layer includes a covering portion and an overlapping portion. The covering portion is configured as a relatively closed cylindrical covering structure and is tightly attached to the side surface of the foamed tape layer. The overlapping portion is located at one edge of the covering portion and extends a predetermined width beyond the joint of the covering portion, so that the overlapping portion can cover the joint of the covering portion.

2. The high-speed backplane connection cable for servers according to claim 1, characterized in that, The foamed tape layer is made of a strip-shaped foamed tape wound around the outer surface of the insulation layer.

3. The high-speed backplane connection cable for servers according to claim 2, characterized in that, During the winding process of the foamed tape layer, the overlap rate of the overlapping parts of the foamed tape is controlled between 45% and 50% to ensure the sealing of the foamed tape layer.

4. The high-speed backplane connection cable for servers according to claim 3, characterized in that, The foamed tape layer is made of PTFE foamed tape.

5. The high-speed backplane connection cable for servers according to claim 4, characterized in that, The foamed tape layer is made of PP foamed tape.

6. The high-speed backplane connection cable for servers according to claim 5, characterized in that, The insulating layer is formed on the side surface of the conductor by extrusion.

7. The high-speed backplane connection cable for servers according to claim 6, characterized in that, The insulating layer is obtained by extrusion molding of one of the following: FEP, polypropylene, polyethylene, polytetrafluoroethylene, and ethylene-tetrafluoroethylene copolymer.

8. The high-speed backplane connection cable for servers according to claim 7, characterized in that, The shielding layer is made of one of the following: PP aluminum foil, PET aluminum foil, pure copper strip, PP copper foil, and PET copper foil.

9. The high-speed backplane connection cable for servers according to claim 8, characterized in that, The Mylar layer is made of one of PET film, PI film, and PP film.

10. The high-speed backplane connection cable for servers according to claim 9, characterized in that, The Mylar layer is wound around the outer surface of the shielding layer, and the pitch of the Mylar layer is less than 1.2 mm.

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