Radiating cover offset detection jig

Abstract

The utility model relates to a heat dissipation cover offset detection jig which comprises a rack, a material suction assembly, a data sensing module, a lower fixing jig and a positioning assembly. The material suction assembly comprises a lifting arm, a driving piece and a material suction piece. The positioning assembly comprises two separation blades and limiting sensors, the separation blades are connected with the limiting sensors, and the two limiting sensors are oppositely arranged; the baffle is connected with a push rod. The utility model has the advantages that the sensing data module sequentially measures and uploads the sizes of the packaging substrate without the heat dissipation cover and the packaging substrate with the heat dissipation cover, and automatically compares the sizes through the database, so that the deviation problem of the heat dissipation cover can be quickly and accurately detected, the accuracy of detection data can be greatly improved, and the detection efficiency is improved. The occurrence rate of product damage caused by manual operation of personnel is reduced; the limiting sensor can avoid the situation that the target detection product between the two separation blades is obliquely placed or not flatly placed, and the problem that the outer wall of the product is scratched or the accuracy of measured data is affected is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, especially a heat dissipation cover offset detection fixture. BACKGROUND

[0002] In order to meet the heat dissipation requirement, the substrate needs to be attached with a heat dissipation cover. However, due to the relatively small size of the semiconductor packaging product, the heat dissipation cover may be offset during attachment, affecting the product quality.

[0003] The existing heat dissipation cover offset detection method mainly uses a photosensitive lens to determine the offset distance by detecting the color difference between the heat dissipation cover and the substrate, or checks whether there is a heat dissipation cover offset problem by visually observing the profile difference between the heat dissipation cover and the substrate. With the change of design specifications, there are many special design products at present, and there is no obvious distance profile between the heat dissipation cover and the substrate, so manual inspection and photosensitive lens cannot effectively detect the heat dissipation cover offset distance of such products. Manual measurement of data through an electron microscope has the problems of product damage caused by manual product taking and measurement data error, and low work efficiency, which cannot meet the needs of packaging production line mass production.

[0004] Therefore, for the packaging product with no obvious distance profile between the heat dissipation cover and the substrate, the heat dissipation cover attachment offset detection problem needs to be solved urgently. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a heat dissipation cover offset detection fixture, which can improve the heat dissipation cover offset detection yield and improve the work efficiency.

[0006] In order to achieve the above utility model purposes, the utility model provides a heat dissipation cover offset detection fixture, which comprises a rack, a suction assembly, a sensing data module, a lower fixed jig and a positioning assembly.

[0007] The suction assembly is located above the lower fixed jig through the rack, and the suction assembly comprises a lifting arm, a driving part and a suction part, the suction part is connected to the bottom end of the lifting arm, and the driving part is connected to the suction part.

[0008] The positioning assembly is located above the sensing data module through the lower fixed jig, and the positioning assembly comprises two baffle plates and limit sensors, the baffle plates are connected to the limit sensors, and the two limit sensors are oppositely arranged; the baffle plate is connected with a push rod.

[0009] Preferably, the rack is provided with one or more suction assemblies, and the number and position of the positioning assemblies are matched with the number and position of the suction assemblies.

[0010] As a further improvement of the utility model, the lower fixing jig is provided with a guide slide rail, and the baffle is connected with the guide slide rail.

[0011] As a further improvement of the utility model, the bottom of the material suction member is provided with a suction nozzle.

[0012] The utility model discloses a heat dissipation cover offset detection jig, through material suction member, the packaging substrate without pasting heat dissipation cover is sucked and is lowered to the lower fixed jig through the lifting arm, and the existing drive equipment is connected with push rod to realize electric drive, and the packaging substrate without pasting heat dissipation cover is clamped between two baffles, when the baffle moves and gradually approaches the packaging substrate without pasting heat dissipation cover, the opposite two limit sensors sense the distance between the baffle and the packaging substrate without pasting heat dissipation cover, when the baffle is close to the side wall of the packaging substrate without pasting heat dissipation cover, the limit sensor triggers the switch state change, and the baffle stops moving, and the sensing data module below measures the moving distance of the baffle and transmits to the terminal, and the terminal records the opposite side size of the packaging substrate without pasting heat dissipation cover this time, then, the lifting arm rises, and the baffle resets, and the existing motor can be driven, and the material suction member is rotated 90 DEG, and the packaging substrate without pasting heat dissipation cover is rotated and then lowered between the two baffles below, so that the other opposite side of the packaging substrate without pasting heat dissipation cover is clamped by the two baffles, and the displacement distance of the baffle is measured through the sensing data module, so that the size data of the other opposite side of the packaging substrate without pasting heat dissipation cover are obtained, after the packaging substrate without pasting heat dissipation cover is reset and rises, the heat dissipation cover is pasted on the substrate, and the size of two opposite sides of the packaging substrate with pasted heat dissipation cover is measured and uploaded to the terminal according to the above mode, and the terminal compares the data of the packaging substrate without pasting heat dissipation cover and the packaging substrate with pasted heat dissipation cover recorded, so as to verify whether the heat dissipation cover pasting position is offset.

[0013] Compared with the prior art, the utility model discloses a heat dissipation cover offset detection jig has the advantages of:

[0014] (1) the sensing data module measures and uploads the size of the packaging substrate without pasting heat dissipation cover and the packaging substrate with pasted heat dissipation cover in turn, and automatically compares through the database, so as to quickly and accurately detect the heat dissipation cover offset problem, can greatly improve the detection data accuracy, and reduce the product damage rate caused by manual operation of personnel;

[0015] (2) the limit sensor can avoid the target detection product between the two baffles to be placed skew or not to be placed flat, and prevent the product outer wall from being scratched or the measurement data accuracy from being affected. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a heat dissipation cover offset detection jig structure schematic view of the utility model;

[0017] Figure 2A material placing diagram of the packaging substrate without the heat dissipation cover is shown in Fig. 1;

[0018] Figure 3 A measurement diagram of the packaging substrate without the heat dissipation cover is shown in Fig. 2;

[0019] Figure 4 A material placing diagram of the packaging substrate with the heat dissipation cover is shown in Fig. 3;

[0020] Figure 5 A measurement diagram of the packaging substrate with the heat dissipation cover is shown in Fig. 4. DETAILED DESCRIPTION

[0021] The specific implementation of the present application will be further described in detail below in combination with the accompanying drawings.

[0022] As shown in Fig. 1, the heat dissipation cover offset detection jig of the present application comprises a rack 1, a material suction assembly 2, a sensing data module 3, a lower fixing jig 4, and a positioning assembly 5. Figure 1 The material suction assembly 2 is located above the lower fixing jig 4 through the rack 1, and comprises a lifting arm 21, a driving member 22, and a material suction member 23.

[0023] The positioning assembly 5 is located above the sensing data module 3 through the lower fixing jig 4, and comprises two blocking sheets 51 and limiting inductors 52.

[0024] The blocking sheet 51 is connected with a push rod 6.

[0025] As shown in Fig. 1, the heat dissipation cover offset detection jig of the present application comprises a rack 1, a material suction assembly 2, a sensing data module 3, a lower fixing jig 4, and a positioning assembly 5. Figure 2 The material suction member 23 sucks the packaging substrate 7 without the heat dissipation cover and lowers it to the lower fixing jig 4 through the lifting arm 21, and the push rod 6 is connected with the existing driving equipment to realize electric driving. Figure 3As shown, the packaged substrate 7 without a heat sink cover is clamped between two baffles 51 by a push rod 6. As the baffles 51 move and gradually approach the packaged substrate 7 without a heat sink cover, two opposing limit sensors 52 sense the distance between the baffles 51 and the packaged substrate 7 without a heat sink cover. When the baffles 51 are in close contact with the side wall of the packaged substrate 7 without a heat sink cover, the limit sensors 52 trigger a switch state change, and the baffles 51 stop moving. The sensing data module 3 below measures the moving distance of the baffles 51 and transmits it to the terminal. The terminal records the movement of the packaged substrate 7 without a heat sink cover. The dimensions of the opposite side are then determined; subsequently, the lifting arm 21 rises, the baffle 51 resets, and the drive unit 22 (which can be an existing motor) drives the suction unit 23 to rotate 90°. The packaging substrate 7 without a heat sink cover rotates and then descends between the two baffles 51 below, so that the other opposite side of the packaging substrate 7 without a heat sink cover is clamped by the two baffles 51. The displacement distance of the baffles 51 is measured by the sensing data module 3 to obtain the dimension data of the other opposite side of the packaging substrate 7 without a heat sink cover; after the packaging substrate 7 without a heat sink cover rises and resets, a heat sink cover is attached to the substrate, such as... Figures 4-5 As shown, the dimensions of the two opposite sides of the package substrate 8 with the heat sink attached are measured and uploaded to the terminal in the manner described above. The terminal compares the recorded data of the package substrate 7 without the heat sink attached and the package substrate 8 with the heat sink attached to check whether the heat sink attachment position has been offset.

[0026] The frame 1 is equipped with one or more suction components 2. The number and position of the positioning components 5 are matched with the number and position of the suction components 2, so as to realize the simultaneous detection of the heat sink cover mounting positions of multiple products and meet the batch production line requirements.

[0027] The lower fixed fixture 4 is equipped with a guide rail 41, and the baffle 51 is connected to the guide rail 41. The guide rail 41 guides the movement of the baffle 51, preventing the baffle 51 from shifting and affecting the accuracy of the test results.

[0028] The bottom of the suction component 23 is provided with a suction nozzle 24, which can be connected to a negative pressure pipeline. The negative pressure suction nozzle firmly adsorbs the substrate, which neither damages the surface of the substrate nor causes the substrate to fall during rotation and lifting.

[0029] The preferred embodiments of this utility model have been described in detail above, but this utility model is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this utility model, and these equivalent modifications or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A fixture for detecting heat sink cover offset, characterized in that, Includes a frame, a material suction assembly, a sensing data module, a lower fixing fixture, and a positioning assembly; The material suction assembly is located above the lower fixed fixture via the frame. The material suction assembly includes a lifting arm, a driving component, and a material suction component. The material suction component is connected to the bottom end of the lifting arm, and the driving component is connected to the material suction component. The positioning component is located above the sensing data module via the lower fixing fixture. The positioning component includes two baffles and a limit sensor. The baffles are connected to the limit sensors, and the two limit sensors are arranged opposite to each other. The baffles are connected to a push rod.

2. The heat sink cover offset detection fixture as described in claim 1, characterized in that, The frame is provided with one or more of the material suction components, and the number and position of the positioning components are adapted to the number and position of the material suction components.

3. The heat sink cover offset detection fixture as described in claim 1, characterized in that, The lower fixing fixture is provided with a guide slide rail, and the baffle is connected to the guide slide rail.

4. The heat sink cover offset detection fixture as described in claim 1, characterized in that, The bottom of the suction component is equipped with a suction nozzle.

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