Wafer inspection device
By designing a wafer inspection device and using an interval arrangement between the wafer fixing part and the wafer tank, the problems of contamination and high labor intensity caused by wafer contact in silicon wafer inspection are solved, and efficient non-contact inspection is achieved.
Patent Information
- Application Number
- CN202422979891.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-12-04
AI Technical Summary
In existing technologies, operators need to directly contact the wafers during silicon wafer inspection, which leads to contamination that affects product quality, and results in high labor intensity and low efficiency.
Design a wafer inspection device that enables non-contact inspection of multiple wafers by setting a wafer fixing part on the carrier and setting wafer slots at intervals in different directions, thereby reducing labor intensity and improving efficiency.
It enables non-contact inspection of multiple wafers, reducing the labor intensity of operators and improving inspection efficiency, while avoiding wafer contamination and operational errors.
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Figure CN223598673U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor production equipment, in particular to a wafer inspection device. BACKGROUND
[0002] In the production process of semiconductor chips, the sticking of silicon wafer products can affect the yield and reliability of products and devices, and therefore higher requirements are put forward for the online inspection of silicon wafers.
[0003] In the prior art, the inspection of silicon wafer products usually adopts the method of using tweezers and other tools to clamp the silicon wafer and observing with the naked eye. The direct contact between the silicon wafer and the tweezers can easily cause sticking and affect the quality of the product, and the labor intensity of the operator is high and the inspection efficiency is low. CONTENT OF THE UTILITY MODEL
[0004] The wafer inspection device provided by the embodiments of the present application can greatly facilitate the operator to observe the condition of multiple wafers with the naked eye, without directly contacting the wafers to prevent contamination of the wafers, and can complete the inspection of multiple wafers at one time, thereby reducing the labor intensity of the operator and improving the inspection efficiency.
[0005] In a first aspect, the wafer inspection device according to the embodiments of the present application is used for visually inspecting multiple wafers in a wafer basket, and includes a bearing seat and a wafer fixing part. The wafer fixing part is fixedly arranged on the surface of the bearing seat, and includes a fixing surface. Wafer grooves are arranged on the fixing surface in a second direction. The wafer grooves are also arranged on the fixing surface in a first direction, so that the wafers embedded in the wafer grooves are staggered in the first direction. The first direction intersects the second direction.
[0006] According to an aspect of the embodiments of the present application, the fixing surface is tangent to the surface of the bearing seat on which the wafer fixing part is fixedly arranged.
[0007] According to an aspect of the embodiments of the present application, the fixing surface is recessed towards the side close to the bearing seat.
[0008] According to an aspect of the embodiments of the present application, the intersection line between the fixing surface and the plane formed by the intersection of the first direction and the second direction is a parabola.
[0009] According to an aspect of the embodiments of the present application, the fixing surface is a plane.
[0010] According to an aspect of the embodiments of the present application, the number of wafer grooves arranged on the fixing surface is 12-13.
[0011] According to an aspect of the embodiments of the present application, the bearing seat includes a bearing body and a sliding groove arranged on the surface of the bearing body. The sliding groove is used for slidably connecting the wafer basket in the first direction, and the wafer fixing part is arranged on the bottom surface of the sliding groove.
[0012] According to an aspect of the embodiment of the present application, the size of the wafer fixing part along the third direction is smaller than the size of the sliding groove along the third direction, and the third direction intersects with the plane formed by the first direction and the second direction.
[0013] According to an aspect of the embodiment of the present application, the size of the wafer slot along the third direction is greater than the flat side size of the wafer.
[0014] According to an aspect of the embodiment of the present application, the wafer checking device further comprises a base, the base bearing the bearing seat, the bearing seat being obliquely arranged in the base, and one end of the wafer fixing part being arranged close to the base, and the setting range of the oblique angle between the bearing seat and the base being 45°-90°.
[0015] The wafer checking device provided by the embodiment of the present application has the wafer slots arranged on the fixing surface of the wafer fixing part not only along the second direction, but also along the first direction, so that the wafers embedded in the wafer slots can be staggered along the first direction, and the stacked multiple wafers can be checked at the same time, without directly contacting the wafers and improving the checking efficiency and reducing the labor intensity. BRIEF DESCRIPTION OF DRAWINGS
[0016] The features, advantages, and technical effects of the exemplary embodiments of the present application will be described below with reference to the accompanying drawings.
[0017] Figure 1 is a schematic diagram of the overall structure of a wafer checking device provided by the first aspect of the embodiment of the present application;
[0018] Figure 2 is Figure 1 a side view structural diagram of
[0019] Figure 3 is a schematic diagram of the side view structure of another wafer checking device provided by the first aspect of the embodiment of the present application;
[0020] Figure 4 is a schematic diagram of the wafer checking device cooperating with the wafer basket structure provided by the first aspect of the embodiment of the present application.
[0021] Among them:
[0022] 100-wafer checking device;
[0023] 10-bearing seat; 11-bearing body; 12-sliding groove;
[0024] 20-wafer fixing part; 21-fixing surface; 211-wafer slot; 22-fixing part; 23-connection column;
[0025] 30-base; 31-baffle;
[0026] 200 - tray; 210 - wafer;
[0027] X - first direction; Y - second direction; Z - third direction.
[0028] In the drawings, the same components have the same reference numerals, and the drawings are not drawn to scale. DETAILED DESCRIPTION
[0029] Features and exemplary embodiments of various aspects of the present application will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to one of ordinary skill in the art that the present application can be practiced without some or all of these specific details. The description of the embodiments is merely illustrative of the present application and is not intended to limit the present application, as is apparent to one of ordinary skill in the art. In the drawings and description below, well-known structures and techniques have not been shown or described in detail in order not to obscure the application. Also, in the following description and in the claims, the terms "include" and "have" are intended to be inclusive in a manner similar to the term "comprising" as an open transition term without precluding any additional or other elements. Furthermore, the description herein of certain examples, embodiments, arrangements, modifications, alternatives, and permutations is not intended to create limitations of the present application. In particular, acts, elements, and features can be interchanged with one another or eliminated altogether without departing from the scope of the application as defined by the appended claims.
[0030] It is to be noted that, in the present document, relational terms such as first and second, and the like can be used solely to distinguish one entity or action from another entity or action without necessarily implying any actual relationship or order between such entities or actions. Also, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.
[0031] The orientation words appearing in the following description are the directions shown in the drawings, and are not intended to limit the specific structure of the wafer inspection device of the present application. In the description of the present application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set", "connected" should be understood broadly, for example, can be fixedly connected, or can be detachably connected, or integrally connected; can be directly connected, or indirectly connected. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0032] Figure 1 The overall structure of a wafer inspection device 100 provided by the first aspect embodiment of the present application is shown, Figure 2The side view structure of the application is shown in Figure 1 , Figure 4 The overall structure of the wafer inspection device 100 provided by the first aspect of the application and the structure of the wafer basket 200 is shown.
[0033] Please refer to Figure 1 , Figure 2 and Figure 4 , the first aspect, the embodiment of the application provides a wafer inspection device 100 for visually inspecting multiple wafers 210 in a wafer basket 200, comprising a bearing seat 10 and a wafer fixing part 20, the wafer fixing part 20 is fixedly arranged on the surface of the bearing seat 10, the wafer fixing part 20 comprises a fixing surface 21, and the fixing surface 21 is provided with wafer grooves 211 spaced apart along a second direction Y, and the wafer grooves 211 are also provided on the fixing surface 21 along a first direction X, so that the wafers 210 embedded in the wafer grooves 211 are staggered along the first direction X, and the first direction X intersects with the second direction Y.
[0034] The first aspect, the wafer inspection device 100 provided by the embodiment of the application, through the wafer grooves 211 provided on the fixing surface 21 of the wafer fixing part 20, not only are spaced apart along the second direction Y, adapt to the wafer spacing of different wafer baskets 200 to realize smooth film inversion, but also are spaced apart along the first direction X, so that the wafers 210 embedded in the wafer grooves 211 can be staggered along the first direction X, realize the simultaneous inspection of the stacked multiple wafers 210, and the labor intensity is low.
[0035] The wafer fixing part 20 is the part protruding from the surface of one side of the bearing seat 10, the fixing surface 21 on the wafer fixing part 20 not only extends along the second direction Y, but also extends along the first direction X, so that the wafer grooves 211 on the fixing surface 21 are not only spaced apart in the second direction Y, which can correspond to the wafer spacing in the wafer basket 200 in the prior art, but also can be spaced apart in the first direction X, so that the multiple wafers 210 can also be staggered in the first direction X, and the operator can inspect the non-overlapping part between any two adjacent wafers 210, realize the rapid visual observation of multiple wafers 210 at a time, and improve the inspection efficiency.
[0036] The area of the non-overlapping part between the wafers 210 is negatively correlated with the setting interval of the wafer grooves 211 along the first direction X. The greater the setting interval of the wafer grooves 211 along the first direction X, the smaller the area of the non-overlapping part between the wafers 210, the more the operator can visually inspect, and the higher the inspection reliability.
[0037] And the setting interval of the wafer grooves 211 along the first direction X is positively correlated with the size of the fixing surface 21 along the first direction X under the premise that the number of wafer grooves 211 is the same.
[0038] Please refer toFigure 4 The wafer basket 200 is pushed along the surface of the bearing seat 10, the wafer fixing part 20 passes through the wafer basket 200 and sequentially contacts the wafer 210 carried in the wafer basket 200, so that the wafer 210 is embedded in the corresponding wafer groove 211, and the wafer groove 211 fixes the position of the wafer 210 so that the plurality of wafers 210 are arranged at the same position as the wafer groove 211, and the wafer groove 211 is arranged at intervals along the first direction X, so that the wafers 210 are staggered along the first direction X, facilitating the operator to visually observe a plurality of wafers 210 at a time.
[0039] When all the wafers 210 in the wafer basket 200 are embedded in the wafer groove 211, the wafer basket 200 is stopped.
[0040] When the inspection is completed, since the wafers 210 can be put in and taken out only from the side facing the operator, i.e. the side where the operator pushes the wafer basket 200, the wafer basket 200 can be directly pulled towards the operator to make the plurality of wafers 210 in the wafer basket 200 return to the original position without manually clamping and putting back in sequence, without contacting the wafers 210, and further improving the inspection efficiency and reducing the labor intensity.
[0041] Figure 3 A side view structure of another wafer inspection device 100 provided by the first aspect of the application is shown.
[0042] Please refer to Figure 3 In some embodiments, the wafer inspection device 100 provided by the first aspect of the application is tangent to the surface of the bearing seat 10 on which the wafer fixing part 20 is fixedly arranged.
[0043] In these embodiments, the wafer inspection device 100 provided by the first aspect of the application enables the wafers 210 in the wafer basket 200 to continue to be smoothly pushed after contacting the fixing surface 21, preventing the risk of interference between the wafer basket 200 and the wafer fixing part 20 and the inability to smoothly embed all the wafers 210 in the wafer groove 211.
[0044] Please refer to Figure 3 In some embodiments, the wafer inspection device 100 provided by the first aspect of the application is recessed towards the side close to the bearing seat 10.
[0045] In these embodiments, the wafer inspection device 100 provided by the first aspect of the application enables the recessed arrangement of the fixing surface 21 to arrange a larger number of wafer grooves 211 at the same size along the first direction X, to carry a larger number of wafers 210, and the recess towards the side of the bearing seat 10 enables the fixing surface 21 itself to limit and carry the wafers 210, preventing the risk of uneven force on the wafers 210 and falling due to tilting.
[0046] Please refer to Figure 3 In some embodiments, the wafer inspection device 100 provided by the first aspect of the present application is characterized in that the intersection between the fixing surface 21 and the plane formed by the first direction X and the second direction Y is a parabola.
[0047] In these embodiments, the wafer inspection device 100 provided by the first aspect of the present application is characterized in that the cross-sectional shape of the fixing surface 21 is a parabola, which can further reduce the stress concentration problem of the fixing surface 21, further increase the number of wafer grooves 211, and further increase the number of wafers 210 carried.
[0048] In addition to the dimensions of the fixing surface 21 in the first direction X and the second direction Y, the fixing surface 21 also has a width dimension in the third direction Z. Generally, in the third direction Z, the fixing surface 21 is a smooth surface, so the intersection between the fixing surface 21 and the plane formed by the first direction X and the second direction Y is the cross-sectional shape of the fixing surface 21, which is always consistent in the third direction Z.
[0049] The parabolic cross-sectional shape can maximize the reduction of stress concentration of the fixing surface 21 after carrying the wafers 210, and avoid the risk of structural damage of the fixing surface 21 due to excessive number of wafers 210 carried.
[0050] Please continue to refer to Figure 1 and Figure 2 In some embodiments, the wafer inspection device 100 provided by the first aspect of the present application is characterized in that the fixing surface 21 is a plane.
[0051] In these embodiments, the wafer inspection device 100 provided by the first aspect of the present application is characterized in that the fixing surface 21 is a plane, which facilitates production and processing and enables rapid re-development according to the wafer spacing of different wafer baskets 200 and the number of wafers 210 carried, thereby improving development and production efficiency.
[0052] Please continue to refer to Figure 1 and Figure 2 In some embodiments, the wafer inspection device 100 provided by the first aspect of the present application is characterized in that the number of wafer grooves 211 arranged on the fixing surface 21 is 12-13.
[0053] In these embodiments, the wafer inspection device 100 provided by the first aspect of the present application is characterized in that one wafer push can inspect 12-13 wafers 210, thereby avoiding the risk of operation errors by the operator.
[0054] Optionally, the operator now carries out a single piece of film inversion of the 25-piece slot piece basket 200 filled with 25 wafers 210 and the 12-piece slot piece basket 200, obtains a 12-piece slot full piece basket 200 and a 25-piece slot piece basket 200 with 13 wafers 210 left, and then carries out two times of visual inspection of the two piece baskets 200 in cooperation with the wafer inspection device 100 provided in the first aspect of the present application, realizes the inspection of multiple wafers 210, and then re-inverts the 12 wafers 210 in the 12-piece slot piece basket 200 into the 25-piece slot piece basket 200, realizes the online inspection of the 25 wafers 210, and the labor intensity of the operator is low and the inspection efficiency is high.
[0055] Please continue to refer to Figure 1 and Figure 2 In some embodiments, the wafer inspection device 100 provided in the first aspect of the present application, the bearing seat 10 includes a bearing body 11 and a chute 12 arranged on the surface of the bearing body 11, the chute 12 is used for being slidably connected with the piece basket 200 along the first direction X, and the wafer fixing part 20 is arranged on the bottom surface of the chute 12.
[0056] In these embodiments, the wafer inspection device 100 provided in the first aspect of the present application, the chute 12 can realize the limiting of the piece basket 200 and the sliding along the first direction X, further reducing the labor intensity of the operator and further improving the inspection efficiency.
[0057] When the inspection is completed, the operator only needs to push the piece basket 200 along the chute 12 in the reverse direction to reposition the wafer 210, further reducing the labor intensity of the operator and further improving the inspection efficiency.
[0058] Please continue to refer to Figure 1 In some embodiments, the wafer inspection device 100 provided in the first aspect of the present application, the wafer fixing part 20 along the third direction Z is smaller than the size of the chute 12 along the third direction Z, and the third direction Z intersects with the plane formed by the first direction X and the second direction Y.
[0059] In these embodiments, the wafer inspection device 100 provided in the first aspect of the present application, the wafer fixing part 20 does not interfere with the arrangement of the chute 12, so that the piece basket 200 can slide along the chute 12 while being in contact with the wafer fixing part 20, and the inspection process is successfully realized.
[0060] Please refer to Figure 1 In some embodiments, the wafer inspection device 100 provided in the first aspect of the present application, the wafer slot 211 along the third direction Z is larger than the flat side size of the wafer 210.
[0061] In these embodiments, the wafer inspection device 100 provided by the first aspect of the present application can effectively support and push the wafer 210 regardless of the position of the flat edge of the wafer 210, thereby preventing the direction of the force applied by the wafer slot 211 to the wafer from deviating and causing the wafer 210 to fall.
[0062] Optionally, the wafer fixing portion 20 comprises two fixing sub-portions 22 arranged opposite to each other along the third direction Z, and the two fixing sub-portions 22 are fixedly connected through the connecting column 23. The wafer fixing portion 20 is arranged in a manner that can realize the light weight of the entire wafer inspection device 100, and the relative positions of the two fixing sub-portions 22 are adjusted along the direction of the connecting column 23, so that the size of the wafer fixing portion 20 along the third direction Z is adjusted conveniently to adapt to the inspection operation steps of wafers 210 of different sizes.
[0063] Please refer to Figures 1 to 4 In some embodiments, the wafer inspection device 100 provided by the first aspect of the present application comprises a base 30, and the base 30 carries the carrier 10. The carrier 10 is arranged obliquely in the base 30, and one end of the wafer fixing portion 20 is arranged close to the base 30. The inclination angle between the carrier 10 and the base 30 is arranged in a range of 45° to 90°.
[0064] In these embodiments, the wafer inspection device 100 provided by the first aspect of the present application can provide further support for the carrier 10 while the base 30 can arrange the carrier 10 obliquely, thereby further facilitating the operator to push the wafer tray 200 and perform inspection, further reducing the labor intensity and improving the inspection efficiency.
[0065] The one end of the wafer fixing portion 20 arranged close to the base 30 can facilitate the use of gravity to achieve rapid pushing when the wafer tray 200 is pushed for the first time to make the wafer 210 contact the wafer fixing portion 20, thereby saving labor and reducing labor intensity.
[0066] Meanwhile, the oblique arrangement of the carrier 10 reduces the deviation between the wafer slot 211 and the second direction Y, further reduces the deviation between the dislocation expansion direction of the plurality of wafers 210 and the second direction Y, and further facilitates the operator to observe the plurality of wafers 210 with naked eyes, thereby further improving the inspection efficiency.
[0067] Optionally, the base 30 further comprises a baffle 31, which can limit the sliding of the wafer tray 200 along the sliding groove 12 on the carrier 10, so that when the wafer tray 200 is slid to the position, the wafer tray 200 is limited to continue to slide, thereby further saving labor and reducing labor intensity, and further improving the inspection efficiency.
[0068] Although the present application has been described with reference to preferred embodiments, various modifications can be made to the application without departing from the scope of the application. In particular, the technical features mentioned in the various embodiments can be combined in any way, provided that there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
Claims
1. A wafer inspection apparatus for visually inspecting multiple wafers within a wafer basket, characterized in that, The device includes a carrier and a wafer fixing part. The wafer fixing part is fixedly disposed on the surface of the carrier. The wafer fixing part includes a fixing surface, and wafer grooves are spaced apart along a second direction on the fixing surface. The wafer grooves are also spaced apart along a first direction on the fixing surface, so that the wafers embedded in the wafer grooves are staggered along the first direction. The first direction intersects the second direction.
2. The wafer inspection apparatus according to claim 1, characterized in that, The fixing surface is tangent to the surface of the carrier that is fixedly mounted on the wafer fixing part.
3. The wafer inspection apparatus according to claim 2, characterized in that, The fixing surface is recessed on the side closest to the bearing seat.
4. The wafer inspection apparatus according to claim 3, characterized in that, The line of intersection between the fixed surface and the plane formed by the intersection of the first direction and the second direction is a parabola.
5. The wafer inspection apparatus according to claim 1, characterized in that, The fixed surface is a plane.
6. The wafer inspection apparatus according to claim 1, characterized in that, The number of wafer trenches arranged on the fixed surface is 12 to 13.
7. The wafer inspection apparatus according to claim 1, characterized in that, The support includes a support body and a groove disposed on the surface of the support body. The groove is used to slidably connect with the wafer basket along the first direction, and the wafer fixing part is disposed on the bottom surface of the groove.
8. The wafer inspection apparatus according to claim 7, characterized in that, The dimension of the wafer fixing part along the third direction is smaller than the dimension of the slide along the third direction, and the third direction intersects the plane formed by the intersection of the first direction and the second direction.
9. The wafer inspection apparatus according to claim 8, characterized in that, The dimension of the wafer trench along the third direction is greater than the dimension of the flat edge of the wafer.
10. The wafer inspection apparatus according to claim 9, characterized in that, It also includes a base, which supports the carrier, the carrier is inclined inside the base, and one end of the carrier with the wafer fixing part is disposed close to the base, the inclination angle between the carrier and the base is set in the range of 45° to 90°.