Wafer detection system

Abstract

The utility model relates to the technical field of wafer detection, and particularly discloses a wafer detection system which comprises a base, a suction cup, an imaging device and a heat insulation assembly. Wherein the suction cup is arranged at the top of the base, and the suction cup is used for bearing a wafer and transmitting heat of the heating element to the wafer; the imaging device is arranged on the side portion of the base and located on one side of the suction cup. The heat insulation assembly is arranged on the side portion of the base and located between the imaging device and the suction cup, and the heat insulation assembly and the imaging device are arranged at intervals. The heat insulation assembly can effectively block heat radiated by the suction cup, in addition, the heat insulation assembly and the imaging device are arranged in a spaced mode, air between the heat insulation assembly and the imaging device can be fully utilized, the heat radiation rate is further reduced, therefore, the temperature of all devices in the imaging device is reduced, the expansion degree is improved, and the imaging effect is improved. Precision of a light propagation path is guaranteed, and positioning precision is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer detection technical field especially relates to a wafer detection system. BACKGROUND

[0002] Wafer automatic detection system has image processing function system, in image processing process, need place wafer on suction disc and carry out adsorption fixed, through second camera (i.e. E1 camera) detects the position of the solder pad on the wafer, through first camera (i.e. E2 camera) detects the position of the probe, and through the mutual calibration of the position detected by two cameras, ensure that the probe can be accurately stuck on the wafer solder pad. Conventional detection tends to mature, but with the gradual improvement of the requirement of wafer performance, the wafer on the suction disc needs to be heated to a high temperature state greater than 150 DEG C during detection.

[0003] The existing wafer automatic detection system is switched from normal temperature working environment to high temperature working environment, because the first camera is close to the high temperature suction disc, the first camera and the device connected with the first camera expand, the path of light propagation deviates, and finally the positioning accuracy of the wafer is reduced.

[0004] Therefore, it is urgent to study a wafer monitoring system to solve the above problems. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a wafer detection system to solve the problem of reduced positioning accuracy of wafer in high temperature environment in the prior art.

[0006] To achieve the above purpose, the utility model adopts the following technical scheme:

[0007] Wafer detection system, comprising:

[0008] Base;

[0009] Suction disc, the suction disc is arranged on the top of the base, and the suction disc is used for carrying wafer and can transmit the heat of heating element to the wafer;

[0010] Imaging device, arranged on the side of the base facing the suction disc, and located on one side of the suction disc;

[0011] Thermal insulation assembly, the thermal insulation assembly is arranged on the side of the base facing the suction disc, and located between the imaging device and the suction disc, and the thermal insulation assembly is arranged apart from the imaging device.

[0012] As an optional technical scheme of a wafer detection system, the side of the thermal insulation assembly facing the suction disc has a reflecting surface, and the reflecting surface is used for reflecting the heat radiated from the suction disc to the thermal insulation assembly.

[0013] As an optional technical scheme of the wafer detection system, the heat insulation assembly comprises a first heat insulation piece in a plate shape, and a side of the first heat insulation piece forms the reflecting surface towards the suction disc.

[0014] As an optional technical scheme of the wafer detection system, the heat insulation assembly further has a heat insulation cavity, and the heat insulation cavity can cover the imaging device at least in the direction from the suction disc to the imaging device.

[0015] As an optional technical scheme of the wafer detection system, the heat insulation assembly further comprises a fan, and the heat insulation assembly further has an air inlet and an air outlet connected to the heat insulation cavity, the inlet of the fan is connected to the air outlet, and the outlet of the fan is away from the imaging device.

[0016] As an optional technical scheme of the wafer detection system, the heat insulation assembly comprises a first heat insulation piece, a second heat insulation piece and a heightening piece, the first heat insulation piece and the second heat insulation piece are both in a plate shape, the first heat insulation piece and the second heat insulation piece are arranged at intervals in the direction from the suction disc to the imaging device, and the heightening piece is clamped between the first heat insulation piece and the second heat insulation piece, the first heat insulation piece, the second heat insulation piece and the heightening piece form the heat insulation cavity, the air outlet is arranged on the second heat insulation piece, and the fan is fixed on the second heat insulation piece.

[0017] As an optional technical scheme of the wafer detection system, the heat insulation assembly comprises a plurality of heightening pieces in a strip shape, the first heat insulation piece is located between the second heat insulation piece and the suction disc, the plurality of heightening pieces are clamped between the first heat insulation piece and the second heat insulation piece, and are arranged according to the contour of the second heat insulation piece and have a gap, and the gap forms the air inlet.

[0018] As an optional technical scheme of the wafer detection system, a side of the first heat insulation piece away from the second heat insulation piece forms a reflecting surface; and / or,

[0019] In the direction from the suction disc to the imaging device, the first heat insulation piece can cover the second heat insulation piece, and the second heat insulation piece can cover the imaging device.

[0020] As an optional technical scheme of the wafer detection system, the wafer detection system further comprises a third heat insulation piece in a cylinder shape, the third heat insulation piece is sleeved on the outer periphery of the suction disc, and is used for blocking the heat of the suction disc from spreading outward.

[0021] As an optional technical scheme of the wafer detection system, a gap is left between the third heat insulation piece and the suction disc; and / or,

[0022] The third heat insulation member is screwed to the plurality of connecting members.

[0023] The utility model discloses the beneficial effects are:

[0024] The utility model provides a wafer detection system, the wafer detection system includes sucking disc, imaging device and heat insulation subassembly, wherein, sucking disc can bear wafer and can transmit the heat of heating element to wafer, imaging device is located one side of sucking disc, and heat insulation subassembly is located between sucking disc and imaging device, and heat insulation subassembly is arranged at intervals with imaging device, can effectively keep out the heat of sucking disc radiation, thereby reduce the heat of high temperature sucking disc radiation outward, improve the degree of expansion of each device in imaging device, be favorable to guarantee the precision of light propagation path, ensure positioning accuracy. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 It is structure schematic diagram of wafer detection system first visual angle in the utility model embodiment;

[0026] Figure 2 It is structure schematic diagram of wafer detection system second visual angle in the utility model embodiment;

[0027] Figure 3 It is Figure 2 the sectional view along A-A direction in;

[0028] Figure 4 It is Figure 3 the enlarged view of J in;

[0029] Figure 5 It is cooperation schematic drawing of sucking disc and connecting member in the utility model embodiment;

[0030] Figure 6 It is structure schematic drawing of fixed part in the utility model embodiment;

[0031] Figure 7 It is gas flow path schematic drawing in the utility model embodiment.

[0032] In the drawing:

[0033] 100, base;

[0034] 200, sucking disc;

[0035] 300, imaging device;310, imaging bottom plate;320, imaging component;330, fixed part;331, first connecting part;332, second connecting part;333, fastening screw hole;334, clamping surface;

[0036] 400, heat insulation assembly; 410, first heat insulation member; 411, reflecting surface; 420, second heat insulation member; 430, spacer; 440, fan; 450, heat insulation cavity; 451, air inlet; 452, air outlet;

[0037] 500, third heat insulation member; 510, connecting member; 511, first plate; 5111, fixing screw hole; 512, second plate. DETAILED DESCRIPTION

[0038] The technical solutions of the present application will be described clearly and completely below in conjunction with the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0039] In the description of the present application, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", etc. are only for the purpose of description, and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions, and moreover, the "above", "upper" and "upper surface" of the first feature relative to the second feature include the vertical direction of the first feature above and obliquely above the second feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature relative to the second feature include the vertical direction of the first feature below and obliquely below the second feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0040] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0041] The embodiments of the present application are described below in detail, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary only, and are used for explaining the present application, and should not be understood as limiting the present application.

[0042] As Figures 1 to 7 shown, the present embodiment provides a wafer detection system, which comprises a base 100, a suction disc 200, an imaging device 300 and a heat insulation assembly 400. Wherein, the suction disc 200 is arranged on the top of the base 100, and the suction disc 200 is used for carrying a wafer and can transmit the heat of a heating element to the wafer; the imaging device 300 is arranged on the side of the base 100 facing the suction disc 200, that is, the suction disc 200 and the imaging device 300 are arranged on the same side of the base 100, and the imaging device is located on one side of the suction disc 200; the heat insulation assembly 400 is arranged on the side of the base 100 facing the suction disc 200, and is located between the imaging device 300 and the suction disc 200, the heat insulation assembly 400 is arranged in interval with the imaging device 300, and the heat insulation assembly 400 is also arranged in interval with the suction disc 200. In the present embodiment, the imaging device 300 is used for shooting a probe.

[0043] The arrangement of the heat insulation assembly 400 described above can effectively block the heat radiated by the suction disc 200, thereby reducing the heat radiated outward by the high-temperature suction disc 200, improving the expansion degree of each device in the imaging device 300, and being beneficial to guaranteeing the accuracy of the light propagation path and ensuring the positioning accuracy of the wafer.

[0044] The imaging device 300 comprises an imaging bottom plate 310 and an imaging assembly 320, the imaging bottom plate 310 is installed on the base 100 and is located on the same side of the base 100 with the suction disc 200, and is located on the side of the heat insulation assembly 400 away from the suction disc 200, the imaging assembly 320 is fixed on the side of the imaging bottom plate 310 away from the suction disc 200, and the imaging bottom plate 310 is arranged in interval with the heat insulation assembly 400. The above arrangement can effectively reduce the heat radiated by the suction disc 200 to the imaging bottom plate 310, thereby improving the expansion degree of the imaging bottom plate 310, and also reducing the expansion degree of the imaging assembly 320.

[0045] Regarding the installation of the imaging bottom plate 310, in some embodiments, the imaging device 300 further comprises a fixing piece 330, the heat insulation assembly 400 has a mounting channel, the fixing piece 330 is arranged in the mounting channel, and one end of the fixing piece 330 is connected with the imaging bottom plate 310, and the other end of the fixing piece 330 is connected with the base 100. This kind of arrangement can fix the heat insulation assembly 400 and the imaging bottom plate 310 at the same time through the fixing piece 330, simplify the installation process, and improve the assembly efficiency.

[0046] The fixing member 330 is in a columnar shape and comprises a first connecting portion 331 and a second connecting portion 332 connected with each other. The first connecting portion 331 is provided with a thread on the outer periphery, and can be screwed into a threaded hole on the imaging base plate 310. The second connecting portion 332 is connected with the base 100. Further, an end surface of the second connecting portion 332 away from the first connecting portion 331 is concavely provided with a fastening screw hole 333. A fastening screw passes through a fastening hole on the base 100 and can be screwed into the fastening screw hole 333, so as to fixedly connect the fixing member 330 with the base 100. The outer periphery of the second connecting portion 332 is provided with two planar clamping surfaces 334, which are symmetrically arranged about the axis of the second connecting portion 332, and are used for clamping by a wrench during installation.

[0047] In the embodiment, the diameter of the first connecting portion 331 is smaller than the diameter of the second connecting portion 332. The imaging base plate 310 abuts against the stepped surface between the first connecting portion 331 and the second connecting portion 332. The length of the second connecting portion 332 is greater than the thickness of the heat insulation assembly 400. A spacer ring is sleeved on the second connecting portion 332, and is arranged between the heat insulation assembly 400 and the imaging base plate 310, so as to leave a space between the heat insulation assembly 400 and the imaging base plate 310.

[0048] Further, in order to reduce the heat radiation from the suction cup 200 to the heat insulation assembly 400, the side of the heat insulation assembly 400 facing the suction cup 200 is provided with a reflecting surface 411. The reflecting surface 411 is used for reflecting the heat radiated from the suction cup 200 to the heat insulation assembly 400, so as to further reduce the temperature of the imaging device 300, improve the expansion degree of each device, and be beneficial to guarantee the precision of the light propagation path and the positioning precision. At the same time, since the heat radiated from the suction cup 200 is reflected back due to the arrangement of the reflecting surface 411, the heat loss of the suction cup 200 is reduced, which is beneficial to reduce the energy consumption.

[0049] In some embodiments, the heat insulation assembly 400 comprises a first heat insulation member 410 in a plate shape, and the side of the first heat insulation member 410 facing the suction cup 200 forms the reflecting surface 411. This kind of arrangement makes the first heat insulation member 410 have both heat insulation capability and anti-radiation capability, and greatly reduces the heat transferred from the suction cup 200 to the imaging device 300.

[0050] Further, the heat insulation assembly 400 further has a heat insulation cavity 450, which at least covers the imaging device 300 in the direction from the suction cup 200 to the imaging device 300. The heat insulation cavity 450 can further reduce the amount of heat transferred in the direction of the imaging device 300 under the blocking action of the heat insulation cavity 450, and improve the heat insulation capability of the heat insulation assembly 400.

[0051] Further, the heat insulation assembly 400 further comprises a fan 440, and the heat insulation assembly 400 further has an air inlet 451 and an air outlet 452 which are in communication with the heat insulation cavity 450, the inlet of the fan 440 is in communication with the air outlet 452, and the outlet of the fan 440 is away from the imaging device 300. The fan 440 can replace the hot air in the heat insulation cavity 450, reduce the air temperature in the heat insulation cavity 450, thereby reducing the heat transferred to the imaging device 300.

[0052] In the direction of the gas flow, the air inlet 451 and the fan 440 are located on both sides of the imaging device 300, so that the hot air in the heat insulation cavity 450 opposite to the imaging device 300 can be effectively replaced, and the temperature of the heat insulation assembly 400 opposite to the imaging device 300 is reduced as a whole, thereby reducing the heat transferred to the imaging device 300.

[0053] The heat insulation assembly 400 comprises a first heat insulation member 410, a second heat insulation member 420 and a heightening member 430, the first heat insulation member 410 and the second heat insulation member 420 are both plate-shaped structures, and the first heat insulation member 410 and the second heat insulation member 420 are arranged in a spaced manner in the direction from the suction cup 200 to the imaging device 300, and the heightening member 430 is clamped between the first heat insulation member 410 and the second heat insulation member 420; the first heat insulation member 410, the second heat insulation member 420 and the heightening member 430 enclose the heat insulation cavity 450, the air outlet 452 is arranged on the second heat insulation member 420, and the fan 440 is fixed on the second heat insulation member 420. This kind of arrangement makes the volume of the heat insulation cavity 450 adjustable according to the thickness of the heightening member 430, so as to adapt to different heat insulation requirements.

[0054] The heat insulation assembly 400 comprises a plurality of long strip-shaped heightening members 430, the first heat insulation member 410 is located between the second heat insulation member 420 and the suction cup 200, the plurality of heightening members 430 are clamped between the first heat insulation member 410 and the second heat insulation member 420, and are arranged according to the contour of the second heat insulation member 420 and have a gap, the gap forms the air inlet 451, in other words, the position between the first heat insulation member 410 and the second heat insulation member 420 where the heightening member 430 is not arranged forms the air inlet 451. In other embodiments, the air inlet 451 can also be arranged on the second heat insulation member 420.

[0055] In this embodiment, the side of the first heat insulation member 410 away from the second heat insulation member 420 forms a reflecting surface 411. This kind of arrangement makes the heat insulation assembly 400 have the functions of physical heat insulation, cavity heat insulation and heat reflection to prevent heat from being transferred to the imaging device 300.

[0056] In the direction from the chuck 200 to the imaging device 300, the first heat insulation member 410 can cover the second heat insulation member 420, and the second heat insulation member 420 can cover the imaging device 300. This arrangement enables the heat insulation assembly 400 to achieve all-round heat insulation between the chuck 200 and the imaging device 300 through the first heat insulation member 410, the second heat insulation member 420, and the heat insulation cavity 450 formed therebetween.

[0057] To further improve the heat insulation effect, in some embodiments, the wafer detection system further comprises a third heat insulation member 500 in the shape of a cylinder, which is sleeved on the outer periphery of the chuck 200 and is used to block the heat of the chuck 200 from spreading outward. This arrangement enables the heat of the chuck 200 to be blocked by the third heat insulation member 500 first, and then blocked and / or reflected by the heat insulation assembly 400, which is a step-by-step heat insulation manner, greatly reducing the heat of the chuck 200 radiated to the imaging device 300.

[0058] In some embodiments, a gap is left between the third heat insulation member 500 and the chuck 200 to reduce the heat of the chuck 200 radiated to the third heat insulation member 500. As for the connection manner of the third heat insulation member 500, in some embodiments, the outer periphery of the chuck 200 is arranged with a plurality of connecting members 510 at intervals around the axis thereof, and the third heat insulation member 500 is screwed to the plurality of connecting members 510. The connecting member 510 comprises a first plate 511 and a second plate 512 connected to each other and perpendicular to each other, wherein the first plate 511 is provided with a fixed screw hole 5111, a fixed screw is passed through a fixed hole of the third heat insulation member 500 and screwed into the fixed screw hole 5111, and the second plate 512 is screwed to the bottom of the chuck 200.

[0059] To reduce the deformation amount of the imaging base plate 310 after absorbing heat, in some embodiments, the thermal expansion coefficient of the material of the imaging base plate 310 is smaller than the thermal expansion coefficient of the material of stainless steel. In this embodiment, the material of the imaging base plate 310 can be Invar (FeNi36), super Invar (FeNi31C05), or stainless Invar. In other embodiments, the material of the imaging base plate 310 can also be other materials with a thermal expansion coefficient smaller than that of stainless steel.

[0060] Obviously, the above embodiments of the present application are only examples for clearly illustrating the present application, and are not intended to limit the implementation manners of the present application. Based on the above description, other different forms of changes or variations can be made by those skilled in the art. Here, it is not necessary and impossible to enumerate all the implementation manners. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present application shall be included in the protection scope of the claims of the present application.

Claims

1. A wafer inspection system, characterized by, The application relates to a heat insulation assembly for a wafer inspection device. The heat insulation assembly comprises a base (100), a chuck (200) arranged on the top of the base (100) and used for carrying a wafer and transferring heat of a heating element to the wafer, an imaging device (300) arranged on the side of the base (100) facing the chuck (200) and located on one side of the chuck (200), and the heat insulation assembly (400) arranged on the side of the base (100) facing the chuck (200) and located between the imaging device (300) and the chuck (200), and the heat insulation assembly (400) is arranged apart from the imaging device (300). The side of the heat insulation assembly (400) facing the chuck (200) is provided with a reflecting surface (411) used for reflecting heat radiated from the chuck (200) to the heat insulation assembly (400). The heat insulation assembly (400) comprises a first heat insulation element (410) in the form of a plate, and the side of the first heat insulation element (410) facing the chuck (200) forms the reflecting surface (411). The heat insulation assembly (400) is further provided with a heat insulation cavity (450) capable of covering at least the imaging device (300) in the direction from the chuck (200) to the imaging device (300).

2. The wafer inspection system of claim 1, wherein The heat insulation assembly (400) further comprises a fan (440), and the heat insulation assembly (400) is further provided with an air inlet (451) and an air outlet (452) communicating with the heat insulation cavity (450), the inlet of the fan (440) communicates with the air outlet (452), and the outlet of the fan (440) is away from the imaging device (300).

3. The wafer inspection system of claim 2, wherein, The heat insulation assembly (400) comprises the first heat insulation element (410), a second heat insulation element (420) and a heightening element (430), the first heat insulation element (410) and the second heat insulation element (420) are both in the form of a plate, the first heat insulation element (410) and the second heat insulation element (420) are arranged apart in the direction from the chuck (200) to the imaging device (300), and the heightening element (430) is arranged between the first heat insulation element (410) and the second heat insulation element (420), the first heat insulation element (410), the second heat insulation element (420) and the heightening element (430) form the heat insulation cavity (450), the air outlet (452) is arranged on the second heat insulation element (420), and the fan (440) is fixed on the second heat insulation element (420).

4. The wafer inspection system of claim 1, wherein, The heat insulation assembly (400) comprises a plurality of heightening elements (430) in the form of long strips, the first heat insulation element (410) is located between the second heat insulation element (420) and the chuck (200), the plurality of heightening elements (430) are arranged between the first heat insulation element (410) and the second heat insulation element (420) according to the contour of the second heat insulation element (420) and are provided with gaps, and the gaps form the air inlet (451).

5. The wafer inspection system of claim 4, wherein, ​ 6. The wafer inspection system of claim 5, wherein, ​ 7. The wafer inspection system of claim 6, wherein ​ 8. The wafer inspection system of claim 6, wherein, The side of the first heat insulation member (410) away from the second heat insulation member (420) forms a reflective surface (411); and / or, In the direction from the chuck (200) to the imaging device (300), the first heat insulation member (410) can cover the second heat insulation member (420), and the second heat insulation member (420) can cover the imaging device (300).

9. The wafer inspection system of any of claims 1-8, wherein, The wafer detection system further comprises a third heat insulation member (500) in the shape of a cylinder, which is sleeved on the outer periphery of the chuck (200) and is used to block the heat of the chuck (200) from spreading outward.

10. The wafer inspection system of claim 9, wherein, A gap is left between the third heat insulation member (500) and the chuck (200); and / or, The outer periphery of the chuck (200) is spaced apart around its own axis by a plurality of connecting members (510), and the third heat insulation member (500) is screwed on the plurality of connecting members (510).

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