Heat dissipation cover mounting mechanism

Abstract

The utility model relates to the technical field of surface mounting, in particular to a heat dissipation cover surface mounting mechanism which comprises a mounting frame and a surface mounting device, the surface mounting device is arranged on the mounting frame, and an execution piece used for adsorbing a workpiece is arranged on the surface mounting device; and the heat source device comprises a heating block, the heating block can move towards the execution part to make contact with the execution part and heat the execution part, and the heating block can also move away from the execution part and stop heating the execution part. According to the invention, the heating block is controlled to move towards or away from the working surface of the mounting device, so that the heat dissipation cover can be uniformly heated while the mounting device adsorbs the heat dissipation cover and presses the heat dissipation cover on the chip, the indium sheet is uniformly heated and melted, and the heat source device is controlled to move away from the working surface, stop supplying heat to the heat dissipation cover and dissipate heat and cool the heat dissipation cover. The heat dissipation cover mounting mechanism does not need to use soldering flux in the use process, so that quality defects such as cavities are avoided, and the chip packaging effect and the heat dissipation performance of the chip are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of mounting, in particular to a heat dissipation cover mounting mechanism. BACKGROUND

[0002] It is a common heat dissipation method to introduce a heat dissipation cover into a packaging structure to enhance heat dissipation. In the process of mounting the heat dissipation cover, a thermal interface material (TIM) is usually added between the heat dissipation cover and the back of the chip to enhance the heat dissipation efficiency of the heat dissipation path. Among them, indium material is the most common as a typical thermal interface material.

[0003] A common method of introducing an indium sheet into a packaging structure is to first automatically suck the tape-wrapped indium sheet on the chip by a chip mounter, and temporarily fix the indium sheet on the chip by spraying flux and other colloids to avoid displacement of the indium sheet in subsequent processes. The indium sheet is transferred to a packaging heat dissipation cover station by a trolley or manually, and the heat dissipation cover is mounted by an automatic cover mounter. Finally, the indium sheet is melted and the chip packaging is completed through the heat process in the packaging process. However, the flux and other colloids applied cannot completely volatilize after the heat process and remain at the interface, resulting in the formation of voids and affecting the overall heat dissipation performance.

[0004] In order to eliminate the adverse effects of flux and other colloids, the industry has begun to explore a process of not using flux and other indium sheet pre-fixing materials, but directly mounting the heat dissipation cover and the indium sheet on the chip to complete the packaging. CONTENT OF THE UTILITY MODEL

[0005] The technical problem to be solved by the present application is that in the existing heat dissipation cover mounting mechanism, the indium sheet needs to be fixed on the chip using flux, which results in poor mounting quality between the heat dissipation cover and the chip after mounting.

[0006] Therefore, the present application provides a heat dissipation cover mounting mechanism. In the mounting device, a heat source assembly capable of moving towards the mounting operation surface is arranged, so that the heat dissipation cover can be uniformly heated while being sucked and pressed onto the chip by the mounting device, thereby uniformly heating and melting the indium sheet. In the process of mounting the heat dissipation cover using the heat dissipation cover mounting mechanism, the positions of the chip and the indium sheet can remain unchanged, so that the indium sheet does not need to be fixed using flux, thereby avoiding the generation of quality defects such as voids and improving the chip packaging effect and the heat dissipation performance of the chip.

[0007] According to the heat dissipation cover mounting mechanism of the present application, the heat dissipation cover mounting mechanism comprises,

[0008] a mounting frame, and

[0009] a mounting device, the mounting device is arranged on the mounting frame, and an actuator for sucking a workpiece is arranged on the mounting device.

[0010] The heat source device comprises a heating block capable of moving towards the execution piece in contact with and heating the execution piece, and moving away from the execution piece and stopping heating the execution piece.

[0011] The beneficial effect of the utility model is that the heating block moves towards or away from the working surface of the mounting device, so that the mounting device can adsorb the heat dissipation cover and press the chip on the heat dissipation cover at the same time, the heating block uniformly heats the heat dissipation cover, so that the indium sheet is uniformly heated and melted, and the heat source device moves away from the working surface and stops heating the heat dissipation cover, so that the heat dissipation cover dissipates heat and cools down. The chip and the indium sheet position can be kept stationary during the process of the heat dissipation cover press mounting mechanism, the heat dissipation cover press mounting mechanism heats the heat dissipation cover and the indium sheet at the same time, so that the indium sheet does not need to be fixed by using the flux, the heat dissipation cover press mounting mechanism can make the indium sheet melt uniformly, simplify the heat dissipation cover mounting process, so that the generation of quality defects such as cavities is avoided, and the chip packaging effect and the heat dissipation performance of the chip are improved.

[0012] According to an embodiment of the utility model, the mounting device is connected with the mounting frame through the rotating device, and an installation shaft for connecting with the mounting device is arranged on the output shaft of the rotating device.

[0013] According to an embodiment of the utility model, the heat source device further comprises,

[0014] The center shaft pipe is hollow, one end of the center shaft pipe is in abutment with the heating block, the center shaft pipe is used for air cooling and cooling the execution piece, and the center shaft pipe extends to the mounting device through the installation shaft;

[0015] The heat source driving piece is connected with the center shaft pipe and is used for controlling the center shaft pipe to move towards or away from the execution piece.

[0016] According to an embodiment of the utility model, the mounting device is installed at the end of the installation shaft, and the mounting device comprises,

[0017] The fixed block is internally provided with a through slot;

[0018] The mounting ring is connected on the fixed block and is used for being connected with the installation shaft;

[0019] The mounting block is installed at the bottom of the fixed block and is used for adsorbing the workpiece, the heating cavity is arranged on the mounting block and is opposite to and communicated with the through slot, the heating cavity is opposite to the working surface, and the working surface is arranged at the bottom of the mounting block.

[0020] According to one embodiment of the present application, the mounting block is detachably connected with the fixing block.

[0021] According to one embodiment of the present application, the heating block is located in the heating cavity, and a reset spring is arranged between the mounting block and the bottom of the heating cavity.

[0022] According to one embodiment of the present application, a temperature sensor is arranged in the central shaft tube, the temperature sensor is used for detecting the temperature of the heating block, an observation hole is arranged on the actuator and is in communication with the heating cavity, and the observation hole is opposite to the temperature sensor.

[0023] According to one embodiment of the present application, the heat source device comprises a power supply assembly, and the power supply assembly comprises:

[0024] An electric slip ring is mounted on the mounting seat, the electric slip ring is located between the mounting seat and the mounting device, and a through hole is arranged on the electric slip ring and is penetrated by the mounting shaft.

[0025] A power supply seat is located between the mounting device and the electric slip ring, the power supply seat is sleeved on the mounting shaft, and the power supply seat is provided with a conductive column which is matched with the electric slip ring to supply power to the heating block.

[0026] An adapter seat is mounted on the fixing block, an electrode sheet is arranged on the adapter seat and abuts against the conductive column, and a connecting line is arranged between the electrode sheet and the heating block.

[0027] According to one embodiment of the present application, the conductive column penetrates the power supply seat and is slidably matched with the power supply seat along the Z-axis direction, a spring is arranged between the conductive column and the power supply seat, and when the spring is in a natural state, one end of the conductive column away from the electric slip ring is located on one side of the power supply seat close to the mounting device.

[0028] According to one embodiment of the present application, a flow channel is arranged on the mounting shaft, an air channel is arranged in the fixing block and is in communication with the flow channel, and a plurality of adsorption holes are arranged on the mounting block and are in communication with one side of the actuator.

[0029] According to one embodiment of the present application, a heat conduction plate is embedded on the actuator, and openings of the adsorption holes on the actuator are distributed around the heat conduction plate.

[0030] According to one embodiment of the present application, a pressure sensor is further arranged on the mounting frame and is used for monitoring the mounting pressure.

[0031] According to one embodiment of the present application, the back plate is provided with a limiting block, and the limiting block is used for limiting the stroke length of the Z-axis driving device moving back and forth along the Z-axis direction.

[0032] According to one embodiment of the present application, the Z-axis driving device comprises a guide rail, a sliding base and a driving mechanism, the guide rail is installed on the back plate along the Z-axis direction, the sliding base is slidably connected with the guide rail, the mounting frame is installed on the sliding base, the back plate is connected with a grating ruler distance measuring assembly and an original point photoelectric sensor, the sliding base is connected with a baffle, the grating ruler distance measuring assembly is used for detecting the moving distance of the sliding base, and when the Z-axis driving device controls the mounting frame to move to an initial position, the baffle is opposite to the original point photoelectric sensor.

[0033] Other features and advantages of the present application will be illustrated in the following description, and some of them will become apparent from the description, or will be understood by those skilled in the art through implementation of the present application. The purposes and other advantages of the present application are realized and obtained through the structures specifically indicated in the description, claims and drawings.

[0034] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the following preferred embodiments are specifically described, and the accompanying drawings are used for detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0035] The present application will be further described below in combination with the drawings and embodiments.

[0036] Figure 1 It is the overall structure schematic diagram of the heat dissipation cover mounting mechanism in the present application.

[0037] Figure 2 It is the structure schematic diagram of the Z-axis driving device in the present application.

[0038] Figure 3 It is the schematic diagram of the position relationship between the baffle and the original point photoelectric sensor.

[0039] Figure 4 It is the mounting schematic diagram of the rotating device in the present application.

[0040] Figure 5 It is the mounting schematic diagram of the central shaft pipe in the present application.

[0041] Figure 6 It is the structure schematic diagram of the power supply assembly in the present application.

[0042] Figure 7 It is the structure schematic diagram of the mounting device in the present application.

[0043] Figure 8Is the structure diagram of the heating block in the utility model.

[0044] Figure 9 Is the schematic diagram of the position relation between the heat conduction plate and the adsorption hole in the utility model.

[0045] In the figure: 1, back plate;11, pull spring;12, limit block;13, grating ruler distance measuring assembly;14, origin photoelectric sensor;15, baffle;2, mounting frame;21, base plate;22, support plate;23, shell;3, Z axis driving device;31, guide rail;32, sliding seat;4, heat source device;41, heating block;42, center shaft tube;43, power supply assembly;431, electric slip ring;432, power supply seat;433, adapter seat;434, conductive column;435, spring;436, opening;437, electrode sheet;44, temperature sensor;5, heat source driving piece;6, mounting device;61, fixed block;611, through slot;612, airway;62, mounting block;621, heating cavity;622, actuator;623, adsorption hole;624, reset spring;625, guide rod;626, heat conduction plate;63, mounting ring;7, rotating device;71, mounting shaft;711, flow channel;8, pressure sensor;9, visual mechanism. DETAILED DESCRIPTION

[0046] The utility model will be explained in further detail in combination with the drawings. These drawings are all simplified schematic diagrams, and only illustrate the basic structure of the utility model in a schematic manner, so they only show the structure related to the utility model.

[0047] In the description of the utility model, it is understood that the orientation or position relation indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" is based on the orientation or position relation shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and is not indicative or implicit of the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, so it cannot be understood as a limitation on the utility model. In addition, the features limited as "first", "second" can be explicitly or implicitly include one or more of the features. In the description of the utility model, unless otherwise specified, the meaning of "multiple" is two or more.

[0048] In the description of the utility model, it is necessary to explain, unless there is definite stipulation and limitation, the term '' install '' '' connect '' should be broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connected, can be mechanical connection, also can be electrical connection, can be direct connection, also can be indirectly connected through the intermediate medium, can be the intercommunication of two elements. For ordinary skilled in the art, the specific meaning of the above-mentioned term in the utility model can be understood according to specific circumstances.

[0049] A heat dissipation cover mounting mechanism, including backplate 1, heat source device 4, heat source driving part 5, mounting device 6, rotating device 7 and Z-axis driving device 3. Z-axis driving device 3 is installed on backplate 1, Z-axis driving device 3 is provided as linear motor moving along Z-axis direction, heat source device 4, heat source driving part 5, mounting device 6, rotating device 7 are all connected on Z-axis driving device 3 through mounting frame 2, Z-axis driving device 3 controls heat source device 4, heat source driving part 5, mounting device 6, rotating device 7 synchronous movement along Z-axis direction.

[0050] Specifically, Z-axis driving device 3 includes guide rail 31, sliding seat 32 and driving mechanism, guide rail 31 is provided along Z-axis direction, guide rail 21 can be provided with multiple along horizontal direction, guide rail 31 is installed on backplate 1, sliding seat 32 is slidably connected with sliding rail 31, mounting frame 2 is installed on sliding seat 32, in order to improve the stability of mounting frame 2 installation, sliding seat 32 can be provided with multiple, driving mechanism is used to drive sliding seat 32 to move along Z-axis direction, limit block 12 is installed on backplate 1, limit block 12 is used to limit the stroke length of Z-axis driving device 3 reciprocating movement along Z-axis direction. Backplate 1 is connected with grating ruler distance measuring assembly 13 and origin photoelectric sensor 14, sliding seat 32 is connected with baffle 15, grating ruler distance measuring assembly 13 is used to detect the moving distance of sliding seat 32, when Z-axis driving device 3 controls mounting frame 2 to move to initial position, baffle 15 is opposite to origin photoelectric sensor 14.

[0051] Mounting frame 2 includes base plate 21, support plate 22 connected below base plate 21 through multiple support rods and shell 23, rotating device 7 is arranged between base plate 21 and support plate 22, mounting device 6 is arranged below support plate 22, rotating device 7 is used to control mounting device 6 to rotate, shell 23 is arranged between base plate 21 and support plate 22 for protecting rotating device 7. Heat source driving part 5 is arranged on the top of base plate 21, heat source device 4 includes heating block 41 and power supply assembly 43, power supply assembly 43 is arranged on the bottom of support plate 22, is used to power supply for heating block 41, heat source driving part 5 controls heat source device 4 to move along Z-axis direction.

[0052] Specifically, the rotating device 7 is a rotating motor, the rotating motor is connected between the base plate 21 and the support plate 22, an installation shaft 71 is connected to an output shaft of the rotating motor, the output shaft of the rotating motor and the installation shaft 71 are hollowly arranged, the central shaft tube 42 penetrates the output shaft and the installation shaft 71, and the installation shaft 71 penetrates the support plate 22.

[0053] The mounting device 6 comprises a fixed block 61 and a mounting block 62, the fixed block 61 is connected to an end of the installation shaft 71 through a mounting ring 63, and the mounting ring 63 is connected to a top of the fixed block 61.

[0054] It should be noted that the installation shaft 71 is provided with a flow channel 711, the fixed block 61 is provided with an air channel 612, the mounting block 62 is provided with an adsorption hole 623, and an actuator 622 for adsorbing a workpiece is arranged on an end of the mounting block 62 away from the fixed block 61. One end of the flow channel 711 is connected with a vacuum adsorption system, and the other end is connected with the air channel 612. One end of the adsorption hole 623 is in communication with the air channel 612 to form an air passage, and the other end is in communication with one side of the actuator 622. The vacuum adsorption system adsorbs the heat dissipation cover on the actuator 622 through the air channel 612, the adsorption hole 623 and the adsorption hole. Further, a heat conduction plate 626 is embedded at a central position of the actuator 622, and openings at one end of the adsorption hole on the actuator 622 are uniformly distributed around the heat conduction plate 626. The heat conduction plate 626 can be a copper alloy sheet for quickly conducting heat to the product LID cover.

[0055] The heat source driving element 5 is a cylinder, the cylinder is connected to a top of the base plate 21, an output end of the cylinder is connected with the central shaft tube 42, the central shaft tube 42 penetrates the base plate 21, the power supply assembly 43 and extends into the mounting device 6, and the base plate 21 is provided with a protective shell for covering the cylinder. A limiting groove is arranged at a top of the heating block 41, an end of the central shaft tube 42 is inserted into the limiting groove, the central shaft tube 42 is inserted into the limiting groove and pushes the heating block 41 towards the actuator 622 as the central shaft tube 42 moves towards the actuator 622, and the heating block 41 is used for heating the mounting device 6. The central shaft tube 42 is hollowly arranged, air is blown towards the heating block 41 through an end of the central shaft tube 42 away from the heating block 41, so that the cooling of the heating block 41 and the actuator 622 can be realized.

[0056] The power supply assembly 43 is connected with the mounting device 6, and the power supply assembly 43 is used for stably supplying power to the heating block 41.

[0057] The power supply assembly 43 comprises an electric slip ring 431, a power supply seat 432 and an adapter seat 433. The electric slip ring 431 and the power supply seat 432 are located between the mounting ring 63 and the support plate 22. The electric slip ring 431 is fixedly connected to the bottom of the support plate 22. The electric slip ring 431 is provided with a through hole through which the mounting shaft 71 penetrates. The power supply seat 432 is mounted on the portion of the mounting shaft 71 that penetrates the electric slip ring 431. The power supply seat 432 is provided with a conductive column 434 mounted thereon. The conductive column 434 is slidingly arranged on the power supply seat 432 along the Z-axis direction. The power supply seat 432 is provided with a mounting hole for mounting the conductive column 434. The conductive column 434 is inserted into the mounting hole. A spring 435 is sleeved on the conductive column 434. One end of the spring 435 is connected to the conductive column 434, and the other end is connected to the inner wall of the mounting hole. When the spring 435 is in a natural state, the end of the conductive column 434 away from the electric slip ring 431 is located on the side of the mounting hole close to the mounting device 6, and the conductive column 434 cooperates with the electric slip ring 431. The adapter seat 433 is connected to the two sides of the fixed block 61. The side of the adapter seat 433 facing the power supply seat 432 is provided with an opening 436. The bottom of the opening 436 is provided with an electrode sheet 437.

[0058] A through slot 611 is arranged in the fixed block 61. The mounting block 62 is detachably mounted on the bottom of the fixed block 61 by bolts. The mounting block 62 is provided with a heating cavity 621 opposite to and communicating with the through slot 611. The heating cavity 621 penetrates the bottom of the mounting block 62. The heating block 41 is located in the heating cavity 621. The heating block 41 is connected with the electrode sheet 437 through a connecting wire. When the heating block 41 moves towards the actuator 622 and contacts the actuator 622, the actuator 622 is heated. Since the heat-conducting plate 626 is embedded on the actuator 622, the heating block 41 can contact the heat-conducting plate 626 to accelerate the heat transfer. A plurality of guide rods 625 are arranged in the heating cavity 621. The guide rods 625 are arranged along the Z-axis direction. The guide rods 625 penetrate the heating block 41 to provide guidance for the movement of the heating block 41. The guide rods 625 are sleeved with return springs 624. The return springs 624 are connected with the heating block 41. The end portions of the return springs 624 can abut against the bottom surface and the top surface of the heating cavity 621. When the return springs 624 are in a natural state, the heating block 41 is spaced apart from the bottom surface of the heating cavity 621.

[0059] The center shaft pipe 42 extends through the through groove 611 into the heating cavity 621. The cylinder controls the center shaft pipe 42 to move towards the heating block 41. The center shaft pipe 42 is inserted into the limiting groove, and the heating block 41 is pushed to move towards the bottom surface of the heating cavity 621 and abuts against the bottom surface of the heating cavity 621. Heat is transmitted from the bottom surface of the heating cavity 621 to the executive part 622. When the cylinder controls the center shaft pipe 445 to move away from the heating block 41, the heating block 41 moves away from the heating cavity 621 under the action of the return spring 624. Further, the fixing block 61 and the mounting block 62 are made of high-temperature-resistant materials with heat preservation performance. Specifically, the fixing block 61 and the mounting block 62 can be made of peek material.

[0060] When the fixing seat is connected with the mounting shaft 71, part of the power supply seat 432 is inserted into the gap 436, the electrode sheet 437 abuts against the conductive column 434, the conductive column 434 is pressed by the electrode sheet 437 and moves towards the electric slip ring 431. Under the action of the spring 435, the conductive column 434 abuts against the electric slip ring 431, so that when the mounting device 6 rotates, the heating block 41 can also be stably powered.

[0061] In order to monitor and adjust the mounting pressure in real time, the pressure sensor 8 is arranged on the substrate 21. In order to detect the temperature of the heating block 41, the temperature sensor 44 is arranged in the heating block 41 and moves with the heating block 41. The temperature sensor 44 penetrates the heating block 41. In other embodiments, an observation hole can be arranged on the executive part 622, which is in communication with the heating cavity 621, for observing the position of the temperature sensor 44. Further, the temperature sensor 44 is also arranged on the mounting block 62, which is used to detect the temperature of the executive part 622 on the mounting block.

[0062] It should be noted that the back plate 1 and the mounting frame 2 are provided with the tension spring 11. The tension spring 11 is provided with two, which are respectively located on the two sides of the back plate 1, so as to balance the weight of the equipment on the mounting frame 2. One end of the tension spring 11 is connected with the side wall of the back plate 1, and the other end is connected with the mounting frame 2. The connection between the tension spring 11 and the mounting frame 2 is located below the connection between them and the back plate 1, so that when the Z-axis driving device 3 is powered off and fails, the device on the mounting frame 2 will not fall quickly.

[0063] The Z-axis driving device 3 is also connected with the visual mechanism 9. The visual mechanism 9 is used to identify the chip, so as to judge the mounting angle of the heat dissipation cover adsorbed by the mounting device 6, cooperate with the rotating device to adjust the mounting device 6, and ensure that the heat dissipation cover is accurately mounted with the chip.

[0064] The implementation principle of the present application is:

[0065] Firstly, the visual mechanism 9 is controlled to move above the chip to be mounted to take a picture of the chip to be mounted; then the mounting device 6 is controlled to suck the heat dissipation cover, the heat dissipation cover is adjusted in angle by rotating device, and the mounting structure drives the heat dissipation cover to move towards the chip.

[0066] The heat dissipation cover is pressed on the chip, the pressing force is controlled by the pressure sensor 8, the center shaft tube 42 and the heating block 41 in the heat source driving part 5 are driven to move towards the bottom of the heating cavity 621 until the heating block 41 abuts against the bottom of the heating cavity 621, the heat is transmitted to the executing part 622, so that the indium sheet between the chip and the heat dissipation cover is uniformly melted, and the heat dissipation cover is pressed on the chip to keep pressure.

[0067] After the indium sheet is uniformly melted, the center shaft tube 42 is controlled to move away from the heating block 41, and the heating block 41 is driven to move away from the executing part 622 under the action of the reset spring 624, at this time, the center shaft tube 42 can be used to blow air to the heating cavity to cool the heat dissipation cover and the indium sheet.

[0068] The heat source assembly in the heat dissipation cover mounting mechanism in the application can move towards the mounting executing part 622, so that the position of the chip and the indium sheet can be kept unchanged during the process of mounting the heat dissipation cover by using the heat dissipation cover mounting mechanism and the heat dissipation cover is sucked by the mounting device 6, therefore, the indium sheet does not need to be fixed by using the flux, the heat dissipation cover is pressed on the chip, and the heat dissipation cover is uniformly heated at the same time, so that the indium sheet is uniformly melted, and the generation of quality defects such as cavities is avoided, and the chip packaging effect and the heat dissipation performance of the chip are improved.

[0069] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the description of the present application, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0070] Based on the above ideal embodiments according to the present application, through the above description, relevant personnel can make various changes and modifications without deviating from the technical idea of the present application. The technical scope of the present application is not limited to the content in the specification, and must be determined by the scope of the claims.

Claims

1. A heat dissipation cap mounting mechanism characterized by comprising: The mounting frame (2) comprises a mounting shaft (71) and a mounting base (21), and the mounting base (21) is provided with a mounting frame (2) and a mounting device (6) arranged on the mounting frame (2), and the mounting device (6) is provided with an execution part (622) for adsorbing a workpiece. The heat source device (4) comprises a heating block (41), and the heating block (41) can move towards the execution part (622) to contact and heat the execution part (622), and the heating block (41) can also move away from the execution part (622) to stop heating the execution part (622). The mounting device (6) is connected with the mounting frame (2) through a rotating device (7), and the output shaft of the rotating device (7) is provided with the mounting shaft (71) for connecting with the mounting device (6). The heat source device (4) further comprises a center shaft pipe (42), which is hollow, and one end of the center shaft pipe (42) extends through the mounting shaft (71) into the mounting device (6) and abuts against the heating block (41), and the center shaft pipe (42) is used for air cooling and cooling the execution part (622).

2. The heat spreader lid attachment mechanism of claim 1, wherein, The heat source driving part (5) is connected with the center shaft pipe (42) and is used for controlling the center shaft pipe (42) to move towards or away from the execution part (622).

3. The heat spreader lid attachment mechanism of claim 2, wherein, The mounting device (6) is mounted at the end of the mounting shaft (71), and the mounting device (6) comprises a fixed block (61) and a mounting block (62). The mounting block (62) is mounted at the bottom of the fixed block (61) and is used for adsorbing a workpiece, and the mounting block (62) is provided with a heating cavity (621) opposite to and communicating with the through slot (611), the heating cavity (621) penetrates the bottom of the mounting block (62), and the heating cavity (621) is used for accommodating the heating block (41). The mounting block (62) is detachably connected with the fixed block (61).

4. The heat spreader lid attachment mechanism of claim 3, wherein, A reset spring (624) is arranged between the mounting block (62) and the bottom of the heating cavity (621), and when the reset spring (624) is in a natural state, the heating block (41) is spaced apart from the bottom surface of the heating cavity (621). A temperature sensor (44) is arranged in the center shaft pipe (42), the temperature sensor (44) is used for detecting the temperature of the heating block (41), and an observation hole is arranged in the execution part (622) and communicates with the heating cavity (621), and the observation hole is opposite to the temperature sensor (44). The heat source device (4) comprises a power supply assembly (43), and the power supply assembly (43) comprises an electric slip ring (431) mounted on a mounting seat, the electric slip ring (431) is located between the mounting seat and the mounting device (6), and the electric slip ring (431) is provided with a through hole for the mounting shaft (71) to penetrate.

5. The heat spreader lid attachment mechanism of claim 4, wherein, ​ 6. The heat spreader lid attachment mechanism of claim 4, wherein, ​ 7. The heat spreader lid attachment mechanism of claim 4, wherein, ​ 8. The heat spreader lid attachment mechanism of claim 4, wherein, ​ ​ A power supply seat (432) is located between the mounting device (6) and the electric slip ring (431), the power supply seat (432) is sleeved on the mounting shaft (71), the power supply seat (432) is provided with a conductive column (434) matched with the electric slip ring (431) to supply power to the heating block (41); An adapter seat (433) is mounted on the fixed block (61), the adapter seat (433) is provided with an electrode sheet (437) abutting against the conductive column (434), and the electrode sheet (437) is connected with the heating block (41) through a connecting wire.

9. The heat spreader lid attachment mechanism of claim 8, wherein, The conductive column (434) penetrates through the power supply seat (432) and is in sliding fit with the power supply seat (432) along the Z-axis direction, a spring (435) is arranged between the conductive column (434) and the power supply seat (432), when the spring (435) is in a natural state, one end of the conductive column (434) away from the electric slip ring (431) is located outside the power supply seat (432) close to one side of the mounting device (6).

10. The heat spreader lid attachment mechanism of claim 4, wherein, A flow channel (711) is arranged on the mounting shaft (71), the fixed block (61) is provided with an air channel (612) in communication with the flow channel (711), and the mounting block (62) is provided with a plurality of adsorption holes (623) in communication with one side of the actuator (622), and the adsorption holes (623) are in communication with the air channel (612).

11. The heat spreader lid attachment mechanism of claim 10, wherein, A heat-conducting plate (626) is embedded on the actuator (622), and the openings of the adsorption holes (623) on the actuator (622) are distributed around the heat-conducting plate (626).

12. The heat spreader lid attachment mechanism of claim 1, wherein, A pressure sensor (8) is further arranged on the mounting frame (2) for monitoring the mounting pressure.

13. The heat spreader lid attachment mechanism of claim 1, wherein, A back plate (1) and a Z-axis driving device (3) are further included, and the mounting frame (2) is slidably arranged on the back plate (1) through the Z-axis driving device (3) along the Z-axis direction.

14. The heat spreader lid attachment mechanism of claim 13, wherein, A limiting block (12) is mounted on the back plate (1), and the limiting block (12) is used for limiting the stroke length of the Z-axis driving device (3) moving back and forth along the Z-axis direction.

15. The heat spreader lid attachment mechanism of claim 13, wherein, The Z-axis driving device (3) comprises a guide rail (31), a sliding seat (32) and a driving mechanism, the guide rail (31) is mounted on the back plate (1) along the Z-axis direction, the sliding seat (32) is in sliding connection with the guide rail (31), the mounting frame (2) is mounted on the sliding seat (32), a grating ruler distance measuring assembly (13) and an original photoelectric sensor (14) are connected to the back plate (1), and a baffle (15) is connected to the sliding seat (32), the grating ruler distance measuring assembly (13) is used for detecting the moving distance of the sliding seat (32), and when the Z-axis driving device (3) controls the mounting frame (2) to move to an initial position, the baffle (15) is opposite to the original photoelectric sensor (14).

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