Wafer automatic transposition device

Abstract

The utility model discloses an automatic wafer transposition device which comprises a transposition device and a tray fixing device. The transposition device comprises a lifting device and a suction cup, a sliding part of the lifting device is connected with the suction cup through a cantilever, the suction cup can suck a wafer on the lower portion of the suction cup under the action of negative pressure, and the wafer is made to suspend at the bottom of the suction cup; the tray fixing device comprises a base, a tray groove and a positioning device; the tray groove is formed in the top of the base, the structure of the tray groove is matched with that of the graphite tray, and the positioning device is arranged on the base and used for positioning the graphite tray in the tray groove. According to the wafer automatic transposition device, non-contact movement of the wafer is achieved through the suction cup, the wafer is prevented from being polluted in the transfer process, the yield of the wafer is improved, and the production cost of the wafer is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer manufacturing technology field, concretely is a wafer automatic transposition device. BACKGROUND

[0002] Wafer processing is a highly precise and extremely demanding manufacturing process, and wafer processing is usually carried out in a dust-free workshop. In the wafer processing process, surface electroplating treatment is a key step, which aims to enhance the electrical conductivity, corrosion resistance of the wafer or as a protective layer for subsequent processes by plating one or more layers of metal or non-metallic materials (such as gold, carbon, etc.). This step is crucial to ensure the reliability and stability of the wafer in subsequent packaging, testing and final application.

[0003] In the vacuum electroplating process of the wafer, a mechanical arm is used to take and place the wafer sheet through a suction cup. At this time, the wafer sheet is located at the top of the suction cup. The mechanical arm moves the wafer to the position of the graphite tray. Then, a vacuum pen is used by artificial to suck the wafer sheet on the suction cup. Then, the wafer sheet is moved to the graphite tray. Then, the wafer sheet is electroplated. The vacuum pen is a tool designed using the principle of negative pressure. The suction cup generates a suction force when it is turned on to firmly adsorb the wafer. However, this operation method has a significant disadvantage: since the vacuum pen needs to suck the air around the suction cup when adsorbing the wafer, this process may cause dust to accumulate around the mouth of the suction cup. Although the environment of the dust-free workshop is highly clean, any tiny dust particles may contaminate the surface of the wafer. The dust may adhere to the surface of the wafer. Any contamination on the surface of the wafer may cause hidden troubles in the electroplating process. During the electroplating process, these contaminants may become "weak points" of poor adhesion of the plated layer, causing the plated layer to be more easily detached during subsequent processing or use, thereby affecting the electrical connection performance, mechanical strength and long-term reliability of the wafer. SUMMARY

[0004] In view of the problems existing in the prior art, the utility model provides a wafer automatic transposition device, which realizes automatic transfer and transposition of wafer sheets between the mechanical arm and the graphite tray, improves the electroplating efficiency and yield of the wafer sheets.

[0005] The utility model is realized through the following technical schemes:

[0006] A wafer automatic transposition device, comprising a transposition device and a tray fixing device;

[0007] The transposition device comprises a lifting device and a suction cup. The sliding part of the lifting device is connected to the suction cup through a cantilever. The suction cup can suck the wafer sheet below under the action of negative pressure and make the wafer sheet suspended at the bottom of the suction cup;

[0008] The tray fixing device comprises a base, a tray slot and a positioning device.

[0009] The tray groove is arranged on the top of the base, the structure of the tray groove is matched with the structure of the graphite tray, and the positioning device is arranged on the base and used for positioning the graphite tray in the tray groove.

[0010] Preferably, the lifting device comprises a linear module, the linear module is vertically arranged on the support base, the cantilever is horizontally arranged, one end of the cantilever is connected with a sliding block of the linear module, and the suction disc is arranged at the bottom of the other end of the support arm.

[0011] Preferably, one side of the linear module is connected with the support base through a support plate, the cantilever is of an L-shaped structure, a vertical plate of the cantilever is fixedly connected with the sliding block, and the suction disc is fixed at the bottom of the end of a horizontal plate of the cantilever.

[0012] Preferably, the linear module is further provided with stroke limiting devices, and the stroke limiting devices are used for limiting the movement stroke of the sliding block.

[0013] Preferably, the suction disc comprises a base disc, airflow holes and an airflow cavity.

[0014] The plurality of airflow holes are arranged in an array on the bottom surface of the base disc, the airflow cavity is arranged in the base disc, an air inlet of the airflow cavity is connected with an air source, outlets of the airflow cavity are respectively communicated with the airflow holes, airflow rotation directions of two adjacent airflow holes are opposite, and a vacuum cavity is formed at the center of the airflow hole.

[0015] Preferably, the base disc is provided with positioning angles, and the plurality of positioning angles are circumferentially arranged and used for positioning the wafer.

[0016] Preferably, the positioning angles are provided with positioning grooves.

[0017] Preferably, the tray groove is a circular groove formed on the surface of the base.

[0018] Preferably, the base is provided with an emptying groove, the emptying groove is located in the middle of the tray groove, and the emptying groove is communicated with the side wall of the base.

[0019] Preferably, the positioning device comprises a positioning cylinder, a positioning block and a positioning groove.

[0020] The positioning groove is a groove arranged on the edge of the surface of the base, the positioning cylinder is fixedly arranged on the side wall of the base, the positioning block is connected with a piston of the positioning cylinder, the positioning hole is located in the positioning groove, and the positioning cylinder can drive the positioning block to move along the positioning groove to the tray.

[0021] Compared with the prior art, the utility model has the following beneficial technical effects:

[0022] The wafer automatic position changing device provided by the application, the lifting device is moved to the wafer under the suction cup by the suction cup, so that the wafer is suspended at the bottom of the suction cup under the action of air pressure, the wafer is placed on the graphite tray by the movement of the lifting device, and the wafer is placed on the graphite tray under the action of gravity by controlling the air pressure, i.e., canceling the negative pressure effect of the suction cup on the wafer, so that the wafer is placed on the graphite tray, the second position changing of the wafer is realized, and the wafer is transported and changed position multiple times before the electroplating process, the wafer automatic position changing device realizes the non-contact movement of the wafer by the suction cup, avoids the wafer from being polluted in the transfer process, improves the yield of the wafer, and reduces the generation cost of the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the application, the drawings needed to be used in the embodiments will be briefly introduced as follows, and it should be understood that the following drawings only show some of the embodiments of the application, and therefore should not be regarded as a limitation on the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0024] Figure 1 It is a structure diagram of the non-contact wafer transfer system of the application;

[0025] Figure 2 It is a structure diagram of the wafer automatic position changing device of the application;

[0026] Figure 3 It is a structure diagram of the position changing device of the application;

[0027] Figure 4 It is a structure diagram of the lifting device of the application;

[0028] Figure 5 It is a structure diagram of the suction cup of the application;

[0029] Figure 6 It is an internal structure diagram of the suction cup of the application;

[0030] Figure 7 It is a structure diagram of the tray fixing device of the application;

[0031] Figure 8 It is a structure diagram of the tray positioning device of the application.

[0032] In the figure: 1, transposition device; 2, tray fixing device; 4, suction cup; 11, support seat; 12, support plate; 13, linear module; 14, sliding block; 15, cantilever; 16, air nozzle; 17, limiting plate; 18, photoelectric switch; 21, base; 22, tray groove; 23, clearance groove; 24, positioning cylinder; 25, positioning block; 26, positioning groove; 41, air flow hole; 42, positioning angle; 43, positioning column; 44, air flow cavity; 200, workbench. DETAILED DESCRIPTION

[0033] To make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor are within the scope of protection of the present application.

[0035] Wafer, is the silicon wafer used for silicon semiconductor integrated circuit manufacturing, because its shape is circular, so called wafer. Wafer is the basic raw material for manufacturing integrated circuits (IC). Various circuit element structures can be processed and manufactured on the silicon wafer, thereby forming IC products with specific electrical functions. The raw material of wafer is silicon, and there is abundant silicon dioxide resource on the earth's surface. These silicon dioxide ores can be refined and processed to produce high-purity polysilicon, which is used to manufacture wafers.

[0036] The manufacturing process of wafer needs to be carried out in a dust-free environment, and the wafer also needs to be transferred without contact during the transfer process of each manufacturing process, so as to reduce the pollution probability of the wafer and improve the yield of the wafer. Based on the purpose, the present application provides a wafer automatic transposition device in the wafer manufacturing process.

[0037] Referring to Figures 1-8 A wafer automatic transposition device, comprising a workbench 200, and a transposition device 1 and a tray fixing device 2 arranged thereon.

[0038] The transposition device comprises a lifting device and a suction cup 4, the sliding part of the lifting device is connected with the suction cup through a cantilever 15, the suction cup sucks the wafer below under the action of negative pressure, and the wafer is suspended at the bottom of the suction cup.

[0039] The tray fixing device 2 comprises a base 21, a tray groove 22 and a positioning device;

[0040] The tray groove 22 is arranged on the top of the base, and the structure of the tray groove is matched with the structure of the graphite tray. The positioning device is arranged on the base and is used for positioning the graphite tray in the tray groove.

[0041] In some embodiments, during the wafer processing, the function of the transposition device 1 is to move the wafer sucked by the mechanical arm to the tray. The transposition device 1 comprises a base and a lifting device arranged on the base. The lifting device is connected with a cantilever. The suction disc 4 is arranged at the end of the cantilever. When the mechanical arm moves the wafer to below the suction disc, the lifting device drives the suction disc to move downward, and the wafer on the mechanical arm is sucked under the action of negative pressure.

[0042] The lifting device comprises a linear module 24 and a sliding block 23. The linear module is vertically arranged on the fixed base. The cantilever is horizontally arranged. One end of the cantilever is connected with the sliding block of the linear module. The suction disc is arranged at the bottom of the other end of the cantilever. The sliding block drives the suction disc to move through the support arm.

[0043] In some embodiments, the lifting device comprises a support base 11, a linear module 13 and a stroke limiting device.

[0044] The support base is suspended on the top of the workbench through a plurality of support legs. The linear module is vertically fixed on the support base 11. The non-working side of the linear module is connected with the support base through a support plate 12 to ensure the stability of the linear module. The sliding block of the linear module is close to the tray fixing device 2. The cantilever is in L-shaped structure. The vertical plate of the cantilever 15 is fixedly connected with the sliding block 14. The suction disc is fixed at the bottom of the end of the horizontal plate of the cantilever.

[0045] The stroke limiting device comprises a photoelectric switch 18 and a limiting plate 17. The limiting plate 17 is arranged on one side of the sliding block. Two photoelectric switches 18 are arranged on the side wall of the linear module and are arranged in an upper and lower interval. The photoelectric switch 18 is located on the moving path of the limiting plate. When the limiting plate 17 triggers the photoelectric switch, the sliding block stops moving, thereby limiting the moving stroke of the sliding block.

[0046] In some embodiments, the suction disc comprises a base disc, airflow holes 41 and an airflow cavity. A plurality of airflow holes are arranged in an array on the surface of the base disc. The airflow cavity is arranged in the base disc. The air inlet of the airflow cavity is connected with the air source through the air nozzle 16. The outlets of the airflow cavity are respectively communicated with the airflow holes. The airflow rotation directions of the adjacent two airflow holes are opposite, and the vacuum cavities are formed in the centers of the airflow holes. The top of the base disc is connected with the end of the cantilever through the connecting structure. In this state, the airflow cavity is located at the bottom of the base disc.

[0047] The air inlet of the air flow hole is arranged at the top edge of the air flow hole, the air inlet is communicated with the air flow cavity 44, and an included angle is formed between the air inlet and the center of the air flow hole 41, so that the air flow entering the air flow hole 41 flows in a circumferential direction in the air flow hole 41, and a vacuum area is formed at the center of the air flow hole 41. The side wall of the air flow hole 41 forms a horn structure, the circumferentially flowing air flow escapes along the side wall of the air cavity, so that an air film is formed between the surface of the air flow hole 41 and the wafer, the wafer is isolated from the air flow hole 41, and the wafer is suspended at the bottom of the chuck under the action of the vacuum, so that the wafer is non-contact sucked.

[0048] The number of air flow cavities is 4-8, a plurality of air flow holes 41 are arranged in a rectangular array, the side wall of the air flow hole 41 is a rough surface, the roughness is controlled by using a borax process, the diffusion rate of the gas is controlled through the roughness, and the adsorption force of the air flow hole 41 is improved.

[0049] The base disc is provided with a positioning angle 42 for positioning the wafer, a plurality of positioning angles are arranged along the centers of a plurality of air cavities, the positioning angle is a convex structure formed on the base disc, the contact side of the positioning angle with the wafer is an arc surface, so that the positioning angle and the side wall of the wafer form point contact, so as to reduce the contact area with the wafer and reduce the damage probability of the wafer.

[0050] In the embodiment, when the mechanical arm uses the chuck A to suck the wafer, the chuck on the cantilever sucks the wafer on the chuck A, in order to ensure the accuracy of the wafer position conversion of the two chucks, a positioning structure is arranged between the two chucks, and the positioning structure positions the two chucks when the two chucks are in contact.

[0051] The positioning structure includes a positioning groove and a positioning column 43 matched with the positioning groove, and the positioning groove and the positioning column 43 are arranged on the positioning angles of the two chucks respectively. In the embodiment, the positioning groove 12 is arranged on the positioning angle of the chuck connected with the mechanical arm, and the positioning column 43 is arranged on the positioning angle of the chuck 4. The positioning column can be inserted into the positioning groove, so as to realize the positioning of the two chucks.

[0052] In some embodiments, the base 21 of the tray fixing device 2 is fixed on the top of the workbench through the supporting leg, the tray groove 22 is a circular groove formed on the surface of the base, the diameter of the tray groove 22 is greater than the diameter of the graphite tray, and the graphite tray is placed in the tray groove during the wafer processing.

[0053] The base 21 is provided with an emptying groove 23, the emptying groove 23 is located in the middle of the tray groove, the emptying groove 23 is a U-shaped groove structure and is communicated with the side wall of the base, and when the graphite tray is transported by the mechanical arm, the mechanical arm places the graphite tray in the tray groove by entering the emptying groove.

[0054] The positioning device is a pneumatic positioning device, and the piston of the pneumatic positioning device abuts against the side wall of the graphite tray to realize positioning.

[0055] The pneumatic positioning device comprises a positioning cylinder 24, a positioning block 25 and a positioning groove 26.

[0056] The positioning groove 26 is a groove arranged at the edge of the surface of the base, the positioning cylinder 24 is fixed on the side wall of the base, the positioning block 25 is connected with the piston of the positioning cylinder, and the positioning hole is located in the positioning groove, the positioning cylinder can drive the positioning block to move along the positioning groove to the tray direction, and the positioning of the graphite tray is completed when the positioning block 25 abuts against the side wall of the graphite tray.

[0057] A plurality of positioning convex points are arranged on the side of the positioning block in contact with the graphite tray, so that the positioning block and the graphite tray form point contact.

[0058] In the working process, the mechanical arm transports the wafer to the bottom of the suction cup, the tray fixing device converts the position of the wafer, so that the wafer is adsorbed on the bottom of the suction cup, and the tray is transported into the tray groove, the lifting device is lowered and the air pressure is cancelled, the wafer is placed on the tray under the action of gravity, and finally the tray with the wafer is moved to the tray bin, after the tray bin is full, the whole tray bin is moved to the electroplating device, and the wafer is electroplated; the wafer automatic position changing device transfers the wafer to the tray in a non-contact state, improves the production efficiency of the wafer, and improves the electroplating yield of the wafer.

[0059] Referring to Figure 1 The application also provides a non-contact wafer transfer system comprising the wafer automatic position changing device.

[0060] The above content only illustrates the technical idea of the utility model, and cannot limit the protection scope of the utility model, and any modification made on the basis of the technical scheme according to the technical idea of the utility model falls within the protection scope of the utility model claim.

Claims

1. An automatic wafer repositioning device, characterized in that, Includes a transposition device and a pallet fixing device; The transposition device includes a lifting device and a suction cup. The sliding component of the lifting device is connected to the suction cup via a cantilever. The suction cup can pick up the wafer below it under negative pressure and suspend the wafer at the bottom of the suction cup. The pallet fixing device includes a base, a pallet groove, and a positioning device; The tray groove is located on the top of the base, and the structure of the tray groove matches the structure of the graphite tray. The positioning device is located on the base and is used to position the graphite tray in the tray groove.

2. The automatic wafer repositioning device according to claim 1, characterized in that, The lifting device includes a linear module, which is vertically mounted on a support base. The cantilever is horizontally mounted, with one end of the cantilever connected to the slider of the linear module, and a suction cup mounted at the bottom of the other end of the support arm.

3. The automatic wafer repositioning device according to claim 2, characterized in that, One side of the linear module is connected to the support base via a support plate. The cantilever has an L-shaped structure, with the vertical plate of the cantilever fixed to the slider and the suction cup fixed to the bottom of the horizontal plate end of the cantilever.

4. The automatic wafer repositioning device according to claim 2, characterized in that, The linear module is also equipped with a travel limit device to limit the movement of the slider.

5. The automatic wafer repositioning device according to claim 1, characterized in that, The suction cup includes a base plate, airflow holes, and an airflow chamber; Multiple airflow holes are arrayed on the bottom surface of the base plate. The airflow cavity is set inside the base plate. The air inlet of the airflow cavity is connected to the air source, and the outlet of the airflow cavity is connected to each airflow hole. The airflow of two adjacent airflow holes rotates in opposite directions and forms a vacuum cavity at the center of the airflow hole.

6. The automatic wafer repositioning device according to claim 5, characterized in that, The base plate is provided with positioning angles, and multiple positioning angles are distributed circumferentially for positioning the wafer.

7. The automatic wafer repositioning device according to claim 6, characterized in that, A positioning groove is provided on the positioning angle.

8. The automatic wafer repositioning device according to claim 1, characterized in that, The tray groove is a circular groove formed on the surface of the base.

9. The automatic wafer repositioning device according to claim 1, characterized in that, The base is provided with a clearance groove, which is located in the middle of the tray groove and is connected to the side wall of the base.

10. The automatic wafer repositioning device according to claim 1, characterized in that, The positioning device includes a positioning cylinder, a positioning block, and a positioning groove; The positioning groove is set in the groove on the edge of the base surface. The positioning cylinder is fixed on the side wall of the base. The positioning block is connected to the piston of the positioning cylinder, and the positioning hole is located in the positioning groove. The positioning cylinder can drive the positioning block to move along the positioning groove towards the tray.

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