Carrying table device and wafer detection equipment

Abstract

The utility model belongs to the technical field of semiconductors, and discloses a carrying table device and wafer detection equipment. The carrying table device comprises a mounting table, a chuck, a driving piece, a detection piece and a heat dissipation assembly. The chuck is slidably connected to the mounting table in the vertical direction, a mounting space is formed between the chuck and the mounting table, and the driving part is used for driving the transmission assembly to act so that the transmission assembly can drive the chuck to ascend and descend. The detection piece is arranged on the mounting table, is located in the mounting space and is used for detecting the chuck; the heat dissipation assembly is arranged on the side, facing the chuck, of the installation table and located in the installation space, and the heat dissipation assembly is used for dissipating heat of the detection piece. In the using process of the carrying table device, the heat dissipation assembly is used for dissipating heat of the detection piece, heat accumulation around the detection piece is effectively avoided, the temperature of the detection piece is reduced, the detection precision of the detection piece in the continuous operation process is effectively improved, the positioning precision of a wafer in the lifting process is high, and the detection efficiency is improved. Therefore, the precision of a wafer detection result can be effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, especially to platform device and wafer detection equipment. BACKGROUND

[0002] Wafer detection equipment is a kind of equipment using probe to detect wafer, and wafer detection is an indispensable step in the production link of wafer, which can detect defective products in time and mark.

[0003] In the prior art, wafer detection equipment includes bearing table and multiple sets of moving mechanism, and the multiple sets of moving mechanism can drive the bearing table to move in three-dimensional direction, so as to adjust the position of wafer carried on the bearing table.

[0004] However, in the prior art, during the driving of moving mechanism to drive the bearing table to move up and down, the driving part will generate a lot of heat due to continuous operation, which will continuously increase the temperature of the positioning detection part close to the driving part, and the high temperature will reduce the detection accuracy of the detection part, thereby reducing the accuracy of wafer detection result. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing platform device and wafer detection equipment, which solves the problem that the temperature of detection part continuously increases due to the continuous operation of driving part of wafer detection equipment in the prior art, which reduces the detection accuracy of detection part and further affects the accuracy of wafer detection result.

[0006] To achieve this purpose, the utility model adopts the following technical scheme:

[0007] In the first aspect, the platform device comprises:

[0008] Mounting table;

[0009] Chuck for carrying wafer, the chuck is slidingly connected to the mounting table along the vertical direction and forms mounting space with the mounting table;

[0010] Driving part, which is arranged on the mounting table and located in the mounting space, the driving part is used to drive the transmission assembly to act, so that the transmission assembly drives the chuck to lift;

[0011] Detection part, which is arranged on the mounting table and located in the mounting space, is used to detect the chuck;

[0012] Heat dissipation assembly, which is arranged on the side of the mounting table facing the chuck and located in the mounting space, is used to dissipate heat of the detection part.

[0013] Optionally, the heat dissipation assembly comprises:

[0014] A first fan is arranged on the mounting table and located in the mounting space, and an air outlet of the first fan is arranged towards the detection member and / or the driving member.

[0015] Optionally, the detection member is located on an axial extension line of the chuck, and the first fan is located on a side of the detection member away from the driving member, and the first fan is used for synchronously dissipating heat of the detection member and the driving member.

[0016] Optionally, the heat dissipation assembly further comprises:

[0017] A second fan is arranged on the chuck and located close to the detection member, and an air outlet of the second fan is arranged towards a space between the detection member and the driving member.

[0018] Optionally, the heat dissipation assembly further comprises:

[0019] A heat dissipation part is arranged on an end of the driving member facing the chuck.

[0020] Optionally, the heat dissipation part is a heat dissipation fin.

[0021] Optionally, the stage device further comprises:

[0022] A guide frame is fixed to the mounting table and extends in a vertical direction, and the chuck is arranged on the guide frame and is in sliding connection with the guide frame.

[0023] Optionally, the transmission assembly comprises:

[0024] A plurality of transmission shafts are arranged at equal intervals around the circumference of the mounting table, the transmission shafts are arranged in sliding connection with the mounting table and the chuck and are perpendicular to the mounting table and the chuck, one end of each transmission shaft is in transmission connection with the chuck, and the other end of each transmission shaft is in transmission connection with the driving member.

[0025] Optionally, a driving wheel is fixedly connected to an output end of the driving member, a driven wheel is threadedly connected to each end of each transmission shaft away from the chuck, and a transmission belt is arranged in sleeving connection between the driving wheel and the driven wheels.

[0026] In a second aspect, a wafer detection device comprises:

[0027] A detection platform;

[0028] A moving assembly arranged on the detection platform; and

[0029] The stage device according to any one of the first aspect, the stage device is arranged on the moving assembly, and the moving assembly is used for driving the stage device to move in a plane.

[0030] The stage device has the following beneficial effects:

[0031] In the first aspect, when the wafer is detected, the wafer is placed and adsorbed and fixed on the chuck, the chuck is driven and lifted on the mounting table by the driving part and the transmission assembly, so that the height position of the wafer is adjusted. During the lifting of the chuck, the detection part can detect the lifting height of the chuck in real time, so as to determine that the chuck is accurately slid to the specified height. During the simultaneous operation of the driving part and the detection part, the heat dissipation assembly can dissipate heat from the detection part, so as to avoid the heat generated by the driving part from spreading to the detection part, so as to ensure that the detection part is in a lower temperature environment, thereby ensuring that the detection part can accurately detect the lifting amplitude of the chuck, so as to improve the positioning accuracy of the wafer. In this way, during the use of the carrier device, the heat dissipation assembly dissipates heat from the detection part, effectively reduces the accumulation of heat around the detection part, thereby reducing the temperature of the detection part, effectively improves the detection accuracy of the detection part in the continuous operation process, so that the positioning accuracy of the wafer in the lifting process is higher, thereby effectively improving the accuracy of the wafer detection result.

[0032] In the second aspect, the wafer detection equipment can accurately move the carrier device to a specified position in the plane by using the moving assembly, accurately lift the wafer to a specified height by the carrier device, so as to ensure that the wafer is accurately positioned before detection, so as to accurately detect the wafer by using the detection platform, and effectively improve the detection accuracy of the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 FIG. 1 is a structural schematic view of a carrier device in an embodiment of the present application;

[0034] Figure 2 FIG. 3 is a structural sectional view of the carrier device in the embodiment of the present application;

[0035] Figure 3 FIG. 5 is a structural schematic view of the carrier device after the chuck is hidden in the embodiment of the present application;

[0036] Figure 4 FIG. 7 is a structural schematic view of a transmission assembly of the carrier device in the embodiment of the present application.

[0037] In the drawings:

[0038] 1, mounting table;

[0039] 2, chuck;

[0040] 3, driving part;

[0041] 4, transmission assembly; 41, transmission shaft; 42, driving wheel; 43, driven wheel; 44, transmission belt; 45, tension pulley; 46, protective cover;

[0042] 5, detection part;

[0043] 6, heat dissipation assembly; 61, first fan; 62, second fan; 63, heat dissipation part;

[0044] 7, guide frame; 71, vertical plate. DETAILED DESCRIPTION

[0045] The utility model will be described in further detail below in combination with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the utility model and are not limited to the utility model. In addition, it should be noted that only the parts related to the utility model are shown in the drawings for the convenience of description, not all the structures.

[0046] In the description of the utility model, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0047] In the utility model, unless otherwise explicitly specified and limited, the first feature "on" or "below" the second feature can include that the first and second features are in direct contact, or the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0048] In the description of the embodiment, the terms "up", "down", "left", "right" and other orientation or position relationship are based on the orientation or position relationship shown in the drawings, only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation of the utility model. In addition, the terms "first" and "second" are only used to distinguish in description and have no special meaning.

[0049] The utility model embodiment discloses a carrier device and wafer detection equipment.

[0050] Reference Figures 1 to 4The carrier device comprises a mounting table 1, a chuck 2, a driving member 3, a detecting member 5 and a heat dissipation assembly 6. The chuck 2 is used for carrying a wafer, and is slidably connected to the mounting table 1 in a vertical direction and forms a mounting space with the mounting table 1. The driving member 3 is arranged on the mounting table 1 and located in the mounting space, and is used for driving a transmission assembly 4 to act, so that the transmission assembly 4 can drive the chuck 2 to ascend and descend, thereby adjusting the height of the chuck 2. The detecting member 5 is arranged on the mounting table 1 and located in the mounting space, and is used for detecting the chuck 2. The detecting member 5 can monitor the height change of the chuck 2 in real time, thereby accurately controlling the displacement of the ascending and descending movement of the chuck 2. The heat dissipation assembly 6 is arranged on one side of the mounting table 1 facing the chuck 2 and located in the mounting space, and is used for dissipating heat for the detecting member 5.

[0051] Specifically, in the wafer detection process, the higher the position accuracy of the wafer is, the more accurate the image data obtained by detecting the wafer will be, that is, the higher the positioning accuracy is, and the higher the detection accuracy will be. The mounting table 1 can be arranged on other moving mechanisms, which can drive the mounting table 1 to move horizontally in two directions perpendicular to the horizontal plane. The moving mechanisms can be realized by a plurality of linear driving modules, so as to ensure that the mounting table 1 can move in the plane and can realize high-precision positioning. The utility model does not limit this.

[0052] A frame structure extending in a vertical direction can be arranged on the top wall of the mounting table 1, and the chuck 2 is slidably connected in the frame in the vertical direction, so that the chuck 2 can ascend and descend relative to the mounting table 1. The top wall of the chuck 2 can be used for carrying a wafer. Suction holes are also arranged on the chuck 2, which can be communicated with a vacuum pump, so as to adsorb and fix the wafer on the top wall of the chuck 2. The mounting space is formed between the bottom wall of the chuck 2 and the top wall of the mounting table 1. The driving member 3 and the detecting member 5 are arranged in the mounting space. The detecting member 5 can be a grating ruler, which is used for detecting the ascending and descending amplitude of the chuck 2. The driving member 3 can be a cylinder or a motor. In the embodiment, the driving member 3 is a servo motor, and drives the chuck 2 to ascend and descend through a screw transmission structure.

[0053] The heat dissipation assembly 6 is arranged in the mounting space. The heat dissipation assembly 6 can be completely arranged in the mounting space, or partially arranged in the mounting space and arranged on the chuck 2 or the mounting table 1. The heat dissipation assembly 6 can adopt air cooling and blow air in a specific direction to form a heat dissipation air duct. The heat dissipation air duct can cover only the driving member 3, or sequentially or simultaneously cover the driving member 3 and the detecting member 5, so that the heat dissipation assembly 6 can achieve the effect of dissipating heat for the driving member 3.

[0054] During wafer inspection, the wafer is placed and fixed onto the chuck 2. The drive unit 3 and transmission assembly 4 move the chuck 2 up and down on the mounting stage 1, adjusting the wafer height. During the chuck 2's movement, the detection unit 5 monitors the chuck 2's height in real time, ensuring it slides accurately to the designated height. While the drive unit 3 and detection unit 5 operate simultaneously, the heat dissipation assembly 6 cools the detection unit 5, preventing heat generated by the drive unit 3 from dissipating to it. This keeps the detection unit 5 in a lower temperature environment, ensuring accurate detection of the chuck 2's rise and improving wafer positioning accuracy. Thus, this stage device, by utilizing the heat dissipation assembly 6 to cool the detection unit 5, effectively reduces heat accumulation around it, keeping it in a cooler environment. This improves the detection accuracy during continuous operation, resulting in higher wafer positioning accuracy during the lifting process and ultimately enhancing the precision of the wafer inspection results.

[0055] Optionally, the heat dissipation assembly 6 includes a first fan 61. The first fan 61 is disposed on the mounting platform 1 and located within the mounting space, with the air outlet of the first fan 61 facing the detection element 5 and / or the drive element 3.

[0056] Specifically, the arrangement of the first fan 61 includes at least the following three scenarios: 1. The first fan 61 is located on the annular side of the detection element 5, and the air outlet of the first fan 61 faces the detection element 5, so that the first fan 61 only blows air onto the detection element 5 for heat dissipation, thereby achieving the purpose of keeping the detection element 5 in a low-temperature environment; 2. The first fan 61 is located on the annular side of the driving element 3, so that the first fan 61 only blows air onto the driving element 3 for heat dissipation, thereby reducing heat dissipation while lowering the temperature of the driving element 3, thereby preventing the detection element 5 from overheating; 3. ... Figure 2 As shown, the detection element 5 is located on the axial extension line of the chuck 2. The first fan 61 is located on the side of the detection element 5 away from the drive element 3, and the air outlet of the first fan 61 faces both the detection element 5 and the drive element 3. This allows the first fan 61 to blow cool air to the detection element 5 and the drive element 3 when it is running, thereby preventing the heat generated by the drive element 3 from spreading to the detection element 5 and reducing the temperature of the drive element 3, thus achieving a better heat dissipation effect.

[0057] Understandably, the first fan 61 is erected in the installation space. It can be fixed to the surface of the mounting platform 1 facing the chuck 2 using bolts or other fasteners, or it can be fixed to other structures in the installation space using bolts or other fasteners, or it can be integrally formed with the mounting platform 1. This arrangement can prevent the first fan 61 from shaking during operation.

[0058] It can be understood that the chuck 2 is in a plate structure, the edge of the chuck 2 is in a sliding fit with the frame structure on the mounting table 1, when the detection piece 5 is on the axial extension line of the chuck 2, the detection of the detection piece 5 on the lifting of the chuck 2 can be more accurate. The driving piece 3 is arranged close to the detection piece 5, so that the driving piece 3 can be arranged close to the axial extension line of the chuck 2, so that the unbalanced load during operation is reduced, so as to reduce the energy consumption during driving the chuck 2 to lift. It can be understood that the first fan 61 is arranged on the side of the detection piece 5 away from the driving piece 3, so that the wind blown by the first fan 61 passes through the detection piece 5 and the heat dissipation piece in turn, so as to change the heat radiation direction of the driving piece 3 by using the flow of the wind, so as to effectively reduce the influence of the heat radiation on the detection piece 5, so as to further reduce the possibility of continuous temperature rise of the detection piece 5.

[0059] Optionally, the heat dissipation assembly 6 further comprises a second fan 62. The second fan 62 is arranged on the chuck 2 and close to the detection piece 5, and the air outlet of the second fan 62 faces the space between the detection piece 5 and the driving piece 3.

[0060] Specifically, a notch is formed on the chuck 2, and the second fan 62 is fixedly installed in the notch, so that the second fan 62 is located above the detection piece 5 and the driving piece 3, and the air outlet of the second fan 62 faces the space between the detection piece 5 and the driving piece 3, so that the second fan 62 can blow wind downward to form radiation insulation between the driving piece 3 and the detection piece 5, thereby further reducing the efficiency of heat diffusion from the driving piece 3 to the detection piece 5.

[0061] Optionally, the heat dissipation assembly 6 further comprises a heat dissipation part 63. The heat dissipation part 63 is arranged on the end of the driving piece 3 facing the chuck 2.

[0062] Specifically, the heat dissipation part 63 is made of a material with good thermal conductivity, such as copper and aluminum. The heat dissipation part 63 arranged on the end of the driving piece 3 can better absorb the heat generated by the driving piece 3. The heat dissipation part 63 can be arranged on the side close to the second fan 62, so that after absorbing heat, the heat dissipation part 63 can be in full contact with the wind to quickly take away the heat of the heat dissipation part 63, which can reduce the possibility of heat accumulation on the heat dissipation part 63, and can improve the heat transfer efficiency between the heat dissipation part 63 and the driving piece 3, thereby further reducing the intensity of heat radiation from the driving piece 3 to the detection piece 5.

[0063] Optionally, the heat dissipation part 63 is a heat dissipation fin. Specifically, a plurality of heat dissipation fins can be arranged at intervals, so that the wind generated by the heat dissipation assembly 6 can be in full contact with the plurality of heat dissipation fins, thereby improving the heat dissipation effect of the heat dissipation fins.

[0064] Optionally, the stage device further comprises a guide frame 7. The guide frame 7 is fixed to the mounting table 1 and extends in the vertical direction, and the chuck 2 is arranged on the guide frame 7 and is in sliding connection with the guide frame 7.

[0065] Specifically, the guide frame 7 includes two opposite vertical plates 71, two sliding rails are arranged on opposite sides of the two vertical plates 71, and sliding blocks that are in sliding fit with the sliding rails are arranged on the side surface of the chuck 2. The vertical plates 71 can also be provided with lightening holes and adaptive notches to reduce the overall weight and improve the adaptability of the guide frame 7 to various chucks 2. It should be understood that the guide frame 7 can also be in the form of a ring-shaped surrounding plate structure, which can be designed according to actual lifting requirements, and the utility model does not limit this.

[0066] It can be understood that the guide frame 7 can guide the lifting of the chuck 2, and the two vertical plates 71 included in the guide frame 7 can limit the chuck 2 from multiple positions to ensure that the chuck 2 lifts as a whole and avoids tilting.

[0067] Optionally, the transmission assembly 4 includes a plurality of transmission shafts 41. The plurality of transmission shafts 41 are equally spaced around the circumference of the mounting table 1; the transmission shafts 41 are slidably arranged through the mounting table 1 and are perpendicular to the mounting table 1 and the chuck 2, and the mounting table 1 and the chuck 2 are arranged in parallel and spaced apart, one end of the transmission shaft 41 close to the chuck 2 is in transmission connection with the chuck 2, and the other end is in transmission connection with the driving member 3.

[0068] Specifically, one end of the transmission shaft 41 is arranged through the chuck 2, and the transmission shaft 41 is threadedly connected with the chuck 2. In this way, during the rotation of the transmission shaft 41 around its own axis direction, the rotational motion is converted into linear motion of the chuck 2 along the axis direction of the transmission shaft 41, so that the transmission shaft 41 and the chuck 2 are in transmission connection to realize the lifting of the chuck 2. According to the shape and size of the chuck 2, a plurality of transmission shafts 41 are equally angularly spaced along the circumference of the chuck 2, the plurality of transmission shafts 41 are arranged through the mounting table 1 and are in sliding connection with the mounting table 1, and at least one transmission shaft 41 is in transmission connection with the driving member 3 among the plurality of transmission shafts 41, or a plurality of transmission shafts 41 are in transmission connection with the driving member 3. In this embodiment, the transmission shaft 41 is equally angularly spaced by three.

[0069] It can be understood that by arranging a plurality of transmission shafts 41, stable sliding connection can be formed between the chuck 2 and the mounting table 1, so as to further ensure that the chuck 2 can slide smoothly during lifting.

[0070] Optionally, the output end of the driving member 3 is fixedly connected with a driving wheel 42, one end of each transmission shaft 41 away from the chuck 2 is threadedly connected with a driven wheel 43, and a transmission belt 44 is sleeved between the driving wheel 42 and the plurality of driven wheels 43.

[0071] Specifically, the driven wheel 43 can rotate and be arranged on the bottom surface of the mounting table 1 away from the chuck 2, and the transmission shaft 41 penetrates through the driven wheel 43 and is in threaded connection with the driven wheel 43, and a snap ring is fixedly connected at one end of the transmission shaft penetrating through the driven wheel 43, so as to avoid the transmission shaft 41 from being separated from the driven wheel 43. A tension wheel 45 can also be arranged at a position close to the middle of the mounting table 1, and the transmission belt 44 is sleeved on the tension wheel 45, so that the transmission belt 44 can be in abutting contact with the plurality of driven wheels 43. In the embodiment, the driving wheel 42 and the driven wheel 43 can both be synchronous wheels, and the transmission belt 44 is a synchronous belt. A protective cover 46 is also arranged on the bottom wall of the mounting table 1 away from the chuck 2, so as to cover the driving wheel 42, the driven wheel 43 and the transmission shaft 41 inside the protective cover 46.

[0072] The wafer detection device comprises a detection platform, a moving assembly and a stage device as in the above embodiment. The stage device is arranged on the moving assembly; the moving assembly is arranged on the detection platform and can drive the stage device to move on the plane of the detection platform.

[0073] In use, the wafer detection device can accurately move the stage device to a specified position on the plane by the moving assembly, and the stage device can accurately lift the wafer to a specified height, so as to ensure accurate positioning of the wafer before detection, thereby accurately detecting the wafer by the detection platform and effectively improving the detection accuracy of the wafer.

[0074] Obviously, the above embodiments of the present application are only examples for clearly illustrating the present application, and are not intended to limit the embodiments of the present application. For those skilled in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present application. Here, it is not necessary and impossible to exhaust all the embodiments. Any modification, equivalent substitution and improvement within the spirit and principle of the present application shall be included in the protection scope of the claims of the present application.

Claims

1. A stage device, characterized in that, include: Mounting station (1); A chuck (2) is used to carry a wafer. The chuck (2) is slidably connected to the mounting stage (1) in the vertical direction and forms a mounting space with the mounting stage (1). A drive unit (3) is disposed on the mounting platform (1) and located in the mounting space. The drive unit (3) is used to drive the transmission assembly (4) to move so that the transmission assembly (4) drives the chuck (2) to rise and fall. The testing component (5) is set on the mounting platform (1) and located in the mounting space, and is used to test the chuck (2); A heat dissipation component (6) is provided on the side of the mounting platform (1) facing the chuck (2) and located in the mounting space. The heat dissipation component (6) is used to dissipate heat from the detection component (5).

2. The platform device according to claim 1, characterized in that, The heat dissipation assembly (6) includes: A first fan (61) is disposed on the mounting platform (1) and located within the mounting space, with the air outlet of the first fan (61) facing the detection element (5) and / or the drive element (3).

3. The platform device according to claim 2, characterized in that, The detection element (5) is located on the axial extension line of the chuck (2), and the first fan (61) is located on the side of the detection element (5) away from the drive element (3). The first fan (61) is used to simultaneously dissipate heat from the detection element (5) and the drive element (3).

4. The platform device according to claim 1, characterized in that, The heat dissipation assembly (6) also includes: A second fan (62) is disposed on the chuck (2) and close to the detection element (5), with the air outlet of the second fan (62) facing the space between the detection element (5) and the drive element (3).

5. The platform device according to claim 1, characterized in that, The heat dissipation assembly (6) also includes: A heat dissipation part (63) is provided at the end of the drive member (3) facing the chuck (2).

6. The platform device according to claim 5, characterized in that, The heat dissipation part (63) is a heat dissipation fin.

7. The platform device according to claim 1, characterized in that, The platform device further includes: The guide frame (7) is fixed to the mounting platform (1) and extends in the vertical direction. The chuck (2) is provided on the guide frame (7) and is slidably connected to the guide frame (7).

8. The platform device according to claim 1, characterized in that, The transmission assembly (4) includes: Multiple drive shafts (41) are distributed at equal intervals around the circumference of the mounting platform (1). The drive shafts (41) slide through the mounting platform (1) and are perpendicular to both the mounting platform (1) and the chuck (2). One end of the drive shaft (41) is connected to the chuck (2) and the other end is connected to the drive component (3).

9. The platform device according to claim 8, characterized in that, The output end of the drive unit (3) is fixedly connected to a drive wheel (42), and the end of each drive shaft (41) away from the chuck (2) is threadedly connected to a driven wheel (43). A drive belt (44) is sleeved between the drive wheel (42) and the multiple driven wheels (43).

10. A wafer inspection equipment, characterized in that, include: Testing platform; A mobile component is disposed on the detection platform; and The platform device as described in any one of claims 1 to 9, wherein the platform device is disposed on the moving component, and the moving component is used to drive the platform device to move in a plane.

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