Cooling runner mechanism and sorting machine

Abstract

The utility model relates to the technical field of chip testing, and discloses a cooling runner mechanism and a sorting machine. Wherein the cooling runner mechanism comprises a cover plate, a heat insulation plate and a runner plate, and the cover plate is provided with a first liquid inlet; the heat insulation plate is connected to one side of the cover plate, a liquid inlet flow channel is formed in the side, facing the cover plate, of the heat insulation plate, and the first end of the liquid inlet flow channel communicates with the first liquid inlet; a first heat insulation groove is formed in the side, away from the cover plate, of the heat insulation plate and right faces the liquid inlet flow channel. The runner plate is connected to the side, away from the cover plate, of the heat insulation plate, the runner plate is provided with a cooling runner, the liquid inlet end of the cooling runner is located in the center of the runner plate, the second end of the liquid inlet runner is located in the center of the heat insulation plate, and the liquid inlet end of the cooling runner communicates with the second end of the liquid inlet runner. By adding the first heat insulation groove, the heat exchange capacity of the flow channel can be slightly improved, and the temperature uniformity of the flow channel can be obviously improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip testing technical field especially relates to a cooling runner mechanism and sorting machine. BACKGROUND

[0002] ATC (Active Thermal Control, active thermal control) is an active temperature control mode, the core mode is to adopt the double temperature regulation of circulating refrigeration (chiller refrigerant) and thermal compensation (heating sheet), realizes closed loop feedback through temperature sensor and PID controller, and the fast, accurate stable control of target area (chip) temperature is completed.

[0003] At present, the cooling channel of the runner plate is in the shape of an Archimedes spiral line, the inlet of the cooling runner is located at the center of the cooling runner, the refrigerant flows through the cooling runner clockwise through the center of the cooling runner, and flows out of the cooling runner counterclockwise from the center, and absorbs heat through the spiral wall surface and the bottom surface. The existing runner plate needs to be provided with a guide plate because the liquid inlet is misaligned with the center of the cooling channel, the guide plate sets a guide runner, and the guide runner communicates the liquid inlet with the center of the cooling channel. However, because the temperature of the refrigerant in the guide runner is relatively low, the temperature of the refrigerant in the guide runner is directly transmitted to the runner plate, resulting in poor temperature uniformity of the runner plate.

[0004] Therefore, there is an urgent need for a cooling runner mechanism and a sorting machine to solve the above problems. UTILITY MODEL CONTENTS

[0005] Based on the above, the utility model aims to provide a cooling runner mechanism and a sorting machine, by increasing the first heat insulation groove, the refrigerant in the liquid inlet runner will not be heated before entering the cooling runner, which reduces the heat exchange capacity; the heat exchange capacity of the runner can be slightly improved, and the temperature uniformity of the runner can be significantly improved.

[0006] To achieve the above purpose, the utility model adopts the following technical scheme:

[0007] On the one hand, a cooling runner mechanism is provided, which comprises:

[0008] A cover plate is provided with a first liquid inlet;

[0009] A heat insulation plate is connected to one side of the cover plate, the heat insulation plate is provided with a liquid inlet runner on the side facing the cover plate, and the first end of the liquid inlet runner is communicated with the first liquid inlet; the side of the heat insulation plate away from the cover plate is provided with a first heat insulation groove, and the first heat insulation groove is opposite to the liquid inlet runner;

[0010] A flow channel plate is connected to the side of the heat insulation plate away from the cover plate, and the flow channel plate is provided with a cooling flow channel, the inlet end of the cooling flow channel is located at the center of the flow channel plate, the second end of the inlet flow channel is located at the center of the heat insulation plate, and the inlet end of the cooling flow channel is communicated with the second end of the inlet flow channel.

[0011] As a preferred technical solution of the cooling flow channel mechanism, the outer side of the flow channel rib of the inlet flow channel is provided with a second heat insulation groove, and the second heat insulation groove extends along the extension direction of the flow channel rib.

[0012] As a preferred technical solution of the cooling flow channel mechanism, the side of the heat insulation plate facing the cover plate is provided with a circular heat insulation groove, and the second end of the inlet flow channel is located at the center of the circular heat insulation groove.

[0013] As a preferred technical solution of the cooling flow channel mechanism, a plurality of support columns are uniformly arranged in the circular heat insulation groove.

[0014] As a preferred technical solution of the cooling flow channel mechanism, the cooling flow channel mechanism further comprises a center inlet plate, one side of the center inlet plate is connected to the side of the heat insulation plate away from the cover plate, the other side of the center inlet plate is connected to the flow channel plate, so that the cooling flow channel is formed between the flow channel plate and the center inlet plate, the center of the center inlet plate is provided with a second inlet, and the inlet flow channel is communicated with the inlet end of the cooling flow channel through the second inlet.

[0015] As a preferred technical solution of the cooling flow channel mechanism, the cooling flow channel mechanism is provided with an outlet, and the outlet penetrates the cover plate, the heat insulation plate and the center inlet plate and is communicated with the outlet end of the cooling flow channel.

[0016] As a preferred technical solution of the cooling flow channel mechanism, the cooling flow channel comprises a first sub-flow channel and a second sub-flow channel, the inlet end of the first sub-flow channel and the inlet end of the second sub-flow channel are located at the center of the flow channel plate, the first sub-flow channel and the second sub-flow channel are arranged in an Archimedean double spiral, and the outlet end of the first sub-flow channel and the outlet end of the second sub-flow channel are merged.

[0017] As a preferred technical solution of the cooling flow channel mechanism, the center of the flow channel plate is provided with a conical column.

[0018] As a preferred technical solution of the cooling flow channel mechanism, the cooling flow channel mechanism further comprises an adapter plate, the adapter plate is connected to the side of the flow channel plate away from the heat insulation plate, and the adapter plate is used for fixing a component to be heat exchanged.

[0019] In another aspect, a handler is provided, comprising a temperature-controlled pressure head for providing pressure to a chip, and the cooling channel mechanism of any of the preceding aspects, the temperature-controlled pressure head being connected to the cooling channel mechanism, the cooling channel mechanism being configured to regulate the temperature of the temperature-controlled pressure head.

[0020] The utility model discloses the beneficial effects are:

[0021] The utility model provides a cooling channel mechanism and handler, refrigerant passes through the first liquid inlet of cover plate and the liquid inlet channel of heat insulation board in proper order and enters the liquid inlet end of cooling channel, and refrigerant flows in cooling channel, carries out heat exchange through cooling channel, adjusts the temperature of the component of waiting heat exchange, wherein, because the first heat insulation groove is set to the side of heat insulation board away from cover plate, and the first heat insulation groove is opposite liquid inlet channel, the first heat insulation groove can prevent the heat transfer of refrigerant in liquid inlet channel to channel plate, guarantees that the temperature of channel plate is only influenced by the temperature of refrigerant in cooling channel, and then guarantees the temperature uniformity of channel plate, increases the heat insulation structure in the limited space, strengthens temperature uniformity, satisfies temperature control demand, the utility model discloses through increasing the first heat insulation groove, makes the refrigerant in liquid inlet channel not be heated and lead to heat exchange capacity reduction before entering cooling channel, can slightly improve the heat exchange capacity of channel plate, and the temperature uniformity of channel plate is improved significantly. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical scheme in the embodiment of the utility model, the following will be briefly introduced the drawing needed to be used in the embodiment of the utility model, and obviously, the drawing in the following description is only some embodiments of the utility model, and for the ordinary skilled person in the art, under the premise of not paying the creative labor, other drawings can also be obtained according to the content of the embodiment of the utility model and these drawings.

[0023] Figure 1 It is the structure schematic diagram of the cooling channel mechanism provided by the embodiment of the utility model;

[0024] Figure 2 It is the structure explosion drawing of the cooling channel mechanism provided by the embodiment of the utility model;

[0025] Figure 3 It is the structure schematic diagram of the heat insulation board provided by the embodiment of the utility model;

[0026] Figure 4 It is the structure schematic diagram of the channel plate provided by the embodiment of the utility model.

[0027] The marks in the drawing are as follows:

[0028] 1, cover plate;11, first liquid inlet;12, liquid outlet;

[0029] 2, heat insulation plate; 21, inlet flow channel; 22, first heat insulation groove; 23, second heat insulation groove; 24, circular heat insulation groove; 25, supporting column;

[0030] 3, flow channel plate; 31, cooling flow channel; 311, inlet end; 312, outlet end; 313, first sub-flow channel; 314, second sub-flow channel; 32, conical column;

[0031] 4, center inlet plate; 41, second inlet;

[0032] 5, adapter plate. DETAILED DESCRIPTION

[0033] The utility model will be described in further detail below in combination with the drawings and examples. It can be understood that the specific examples described herein are only used to explain the utility model and are not limited to the utility model. In addition, it should be noted that only the parts related to the utility model are shown in the drawings for ease of description, not all the structures.

[0034] In the description of the utility model, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements or the interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0035] In the utility model, unless otherwise explicitly specified and limited, the "upper" or "lower" of the first feature to the second feature can include the direct contact of the first and second features, or it can include the contact of the first and second features through another feature between them. Moreover, the "upper", "upper" and "upper" of the first feature to the second feature include the vertical and inclined upward of the first feature above the second feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature to the second feature include the vertical and inclined downward of the first feature below the second feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0036] In the description of the embodiment, the terms "upper", "lower", "left", "right" and other orientation or position relationship are based on the orientation or position relationship shown in the drawings, only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, therefore it cannot be understood as a limitation of the utility model. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0037] As Figures 1-3 shown, the embodiment provides a cooling flow channel mechanism, which comprises a cover plate 1, a heat insulation plate 2 and a flow channel plate 3. The cover plate 1 is provided with a first liquid inlet 11. The heat insulation plate 2 is connected to one side of the cover plate 1. The heat insulation plate 2 is provided with a liquid inlet flow channel 21 on the side facing the cover plate 1. The first end of the liquid inlet flow channel 21 is communicated with the first liquid inlet 11. The heat insulation plate 2 is provided with a first heat insulation groove 22 on the side away from the cover plate 1. The first heat insulation groove 22 is opposite to the liquid inlet flow channel 21. The flow channel plate 3 is connected to the side of the heat insulation plate 2 away from the cover plate 1. The flow channel plate 3 is provided with a cooling flow channel 31. The liquid inlet end 311 of the cooling flow channel 31 is located at the center of the flow channel plate 3. The second end of the liquid inlet flow channel 21 is located at the center of the heat insulation plate 2. The liquid inlet end 311 of the cooling flow channel 31 is communicated with the second end of the liquid inlet flow channel 21.

[0038] In operation, the refrigerant enters the liquid inlet end 311 of the cooling flow channel 31 through the first liquid inlet 11 of the cover plate 1 and the liquid inlet flow channel 21 of the heat insulation plate 2 in sequence. The refrigerant flows in the cooling flow channel 31 and exchanges heat through the cooling flow channel 31 to adjust the temperature of the component to be exchanged. Since the heat insulation plate 2 is provided with the first heat insulation groove 22 on the side away from the cover plate 1, the shape of the first heat insulation groove 22 is preferably matched with that of the liquid inlet flow channel 21, but is not limited to this embodiment. The projection area of the liquid inlet flow channel 21 can fall within the projection area of the first heat insulation groove 22. The shape of the first heat insulation groove 22 is not limited as long as the liquid inlet flow channel 21 can be separated by the first heat insulation groove 22. The first heat insulation groove 22 is opposite to the liquid inlet flow channel 21. The first heat insulation groove 22 can prevent the heat of the refrigerant in the liquid inlet flow channel 21 from being transferred to the flow channel plate 3, so that the temperature of the flow channel plate 3 is only affected by the temperature of the refrigerant in the cooling flow channel 31, thereby ensuring the temperature uniformity of the flow channel plate 3. In a limited space, the heat insulation structure is increased to strengthen the temperature uniformity and meet the temperature control requirements. Moreover, the first heat insulation groove 22 is added to prevent the refrigerant in the liquid inlet flow channel 21 from being heated before entering the cooling flow channel 31, thereby reducing the heat exchange capacity. The heat exchange capacity of the flow channel plate 3 can be slightly improved, and the temperature uniformity of the flow channel plate 3 can be significantly improved.

[0039] The cooling flow channel mechanism is optimized and improved in terms of fluid heat insulation under the condition that the overall shape frame size is unchanged. Therefore, the cooling flow channel mechanism can directly replace the existing spiral flow channel to improve the ATC temperature control performance.

[0040] Preferably, the outer side of the flow channel rib of the liquid inlet channel 21 is provided with a second heat insulation groove 23 extending along the extension direction of the flow channel rib. By providing the second heat insulation groove 23, the heat of the refrigerant in the liquid inlet channel 21 can be prevented from being transferred to other parts of the heat insulation plate 2 in the horizontal direction; at the same time, the first heat insulation groove 22 of the liquid inlet channel 21 can effectively prevent the heat of the refrigerant in the liquid inlet channel 21 from being transferred to the center liquid inlet plate 4 in the vertical direction; thereby preventing other parts of the heat insulation plate 2 and the center liquid inlet plate 4 from affecting the temperature uniformity of the flow channel plate 3.

[0041] Further preferably, the side of the heat insulation plate 2 facing the cover plate 1 is provided with a circular heat insulation groove 24, and the second end of the liquid inlet channel 21 is located at the center of the circular heat insulation groove 24. Since the temperature of the part where the end of the liquid inlet channel 21 communicates with the liquid inlet end 311 of the cooling flow channel 31 is low, by providing the circular heat insulation groove 24, the heat of the refrigerant at the part where the end of the liquid inlet channel 21 communicates with the liquid inlet end 311 of the cooling flow channel 31 can be prevented from being transferred to other parts of the heat insulation plate 2, providing better heat insulation effect, and preventing other parts of the heat insulation plate 2 from affecting the temperature uniformity of the flow channel plate 3.

[0042] Preferably, a plurality of support columns 25 are uniformly arranged in the circular heat insulation groove 24, which can improve the structural strength after the heat insulation plate 2 is connected to the cover plate 1.

[0043] By providing the first heat insulation groove 22, the second heat insulation groove 23 and the circular heat insulation groove 24 on the heat insulation plate 2, the low-temperature refrigerant in the liquid inlet channel 21 can be prevented from exchanging heat with the refrigerant in the cooling flow channel 31 before flowing into the cooling flow channel 31, thereby reducing the heat exchange capacity. In the present embodiment, the refrigerant in the liquid inlet channel 21 is a cold fluid, and the refrigerant in the cooling flow channel 31 is a superheated gaseous refrigerant.

[0044] Further, the cooling flow channel mechanism further comprises a center liquid inlet plate 4, one side of the center liquid inlet plate 4 being connected to the side of the heat insulation plate 2 away from the cover plate 1, and the other side being connected to the flow channel plate 3, so that the cooling flow channel 31 is formed between the flow channel plate 3 and the center liquid inlet plate 4, and the center of the center liquid inlet plate 4 is provided with a second liquid inlet 41, and the liquid inlet channel 21 is communicated to the liquid inlet end 311 of the cooling flow channel 31 through the second liquid inlet 41. When the center liquid inlet plate 4 is not provided, the cooling flow channels 31 will be communicated with each other through the first heat insulation groove 22. By providing the center liquid inlet plate 4, the cooling flow channel 31 is formed between the flow channel plate 3 and the center liquid inlet plate 4, thereby ensuring the sealing of the cooling flow channel 31. Moreover, by providing the center liquid inlet plate 4, the thermal resistance between the heat insulation plate 2 and the flow channel plate 3 is improved, thereby further reducing the influence of the refrigerant in the liquid inlet channel 21 on the temperature uniformity of the flow channel plate 3.

[0045] It should be noted that the cooling flow channel mechanism is provided with a liquid outlet 12, the liquid outlet 12 penetrates the cover plate 1, the heat insulation plate 2, the center liquid inlet plate 4 and is communicated with the liquid outlet end 312 of the cooling flow channel 31, the refrigerant in the cooling flow channel 31 is discharged through the liquid outlet end 312 of the cooling flow channel 31 and the liquid outlet 12, so as to realize the circulating flow of the refrigerant.

[0046] In the embodiment, as shown in Figure 2 and Figure 4 , the cooling flow channel 31 comprises a first sub-flow channel 313 and a second sub-flow channel 314, the liquid inlet end 311 of the first sub-flow channel 313 and the liquid inlet end 311 of the second sub-flow channel 314 are located at the center of the flow channel plate 3, and the first sub-flow channel 313 and the second sub-flow channel 314 are in Archimedean double spiral distribution, and the liquid outlet end 312 of the first sub-flow channel 313 and the liquid outlet end 312 of the second sub-flow channel 314 are converged. The refrigerant entering the cooling flow channel 31 is transported through the first sub-flow channel 313 and the second sub-flow channel 314, so as to improve the temperature uniformity and improve the heat exchange efficiency of the flow channel plate 3. The refrigerant in the cooling flow channel 31 converges at the liquid outlet end 312 of the first sub-flow channel 313 and the liquid outlet end 312 of the second sub-flow channel 314, and the converged refrigerant is discharged through the liquid outlet 12.

[0047] Preferably, a tapered column 32 is arranged at the center of the flow channel plate 3, when the refrigerant enters the liquid inlet end 311 of the cooling flow channel 31, it first contacts the tapered column 32 and then uniformly distributes to both sides, and then flows through the first sub-flow channel 313 and the second sub-flow channel 314 to take away heat, and the tapered column 32 realizes good flow distribution effect.

[0048] Further, the cooling flow channel mechanism further comprises an adapter plate 5, the adapter plate 5 is connected to the side of the flow channel plate 3 away from the heat insulation plate 2, and the adapter plate 5 is used for fixing the component to be heat exchanged. In the embodiment, the component to be heat exchanged is a temperature control pressure head, the temperature control pressure head can be connected to the adapter plate 5 through screws, and the refrigerant in the cooling flow channel mechanism can be heat exchanged with the temperature control pressure head through the flow channel plate 3 and the adapter plate 5, so as to adjust the temperature of the temperature control pressure head. When the temperature control pressure head can adsorb the chip, an air path communicating with the temperature control pressure head can be arranged on the adapter plate 5.

[0049] In the embodiment, the cover plate 1, the heat insulation plate 2, the center liquid inlet plate 4, the flow channel plate 3 and the adapter plate 5 are sequentially brazed and connected, so as to ensure the sealing of the liquid inlet flow channel 21 and the cooling flow channel 31.

[0050] The embodiment also provides a sorting machine, which comprises a temperature control pressure head and the above cooling flow channel mechanism, the temperature control pressure head is used for providing pressure to the chip, the temperature control pressure head is connected to the cooling flow channel mechanism, and the cooling flow channel mechanism is used for adjusting the temperature of the temperature control pressure head.

[0051] It should be noted that the above only the preferred embodiments of the present application and the use of technical principles. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, those skilled in the art can make various obvious changes, re-adjustment and replacement without departing from the scope of the present application. Therefore, although the above embodiments of the present application has been described in more detail, but the present application is not limited to the above examples, without departing from the concept of the present application, but also can include more other equivalent embodiments, and the scope of the present application is determined by the appended claims.

Claims

1. A cooling runner mechanism characterized by, The application relates to a cooling flow channel mechanism. The cooling flow channel mechanism comprises a cover plate (1) provided with a first liquid inlet (11); a heat insulation plate (2) connected to one side of the cover plate (1), wherein one side of the heat insulation plate (2) is provided with a liquid inlet flow channel (21) which is communicated with the first liquid inlet (11); and a flow channel plate (3) connected to the side of the heat insulation plate (2) away from the cover plate (1), wherein the flow channel plate (3) is provided with a cooling flow channel (31) with an inlet end (311) located at the center of the flow channel plate (3). The outer side of the flow channel rib of the liquid inlet flow channel (21) is provided with a second heat insulation groove (23) extending along the extension direction of the flow channel rib. The side of the heat insulation plate (2) facing the cover plate (1) is provided with a circular heat insulation groove (24), and the second end of the liquid inlet flow channel (21) is located at the center of the circular heat insulation groove (24).

2. The cooling runner mechanism according to claim 1, characterized by The circular heat insulation groove (24) is uniformly provided with a plurality of support columns (25).

3. The cooling runner mechanism of claim 1, wherein The cooling flow channel mechanism further comprises a center liquid inlet plate (4) connected to the side of the heat insulation plate (2) away from the cover plate (1) and connected to the flow channel plate (3), so that the cooling flow channel (31) is formed between the flow channel plate (3) and the center liquid inlet plate (4), and the center of the center liquid inlet plate (4) is provided with a second liquid inlet (41), and the liquid inlet flow channel (21) is communicated with the inlet end (311) of the cooling flow channel (31) through the second liquid inlet (41).

4. The cooling runner mechanism according to claim 3, characterized by The cooling flow channel mechanism is provided with a liquid outlet (12) penetrating through the cover plate (1), the heat insulation plate (2) and the center liquid inlet plate (4) and communicated with the outlet end (312) of the cooling flow channel (31).

5. The cooling runner mechanism according to any one of claims 1 to 4, characterized in that, The cooling flow channel (31) comprises a first sub-flow channel (313) and a second sub-flow channel (314), the inlet ends (311) of the first sub-flow channel (313) and the second sub-flow channel (314) are located at the center of the flow channel plate (3), the first sub-flow channel (313) and the second sub-flow channel (314) are arranged in an Archimedes double spiral manner, and the outlet ends (312) of the first sub-flow channel (313) and the second sub-flow channel (314) are merged.

6. The cooling runner mechanism of claim 5, wherein The center of the flow channel plate (3) is provided with a conical column (32).

7. The cooling runner mechanism according to any one of claims 1 to 4, characterized in that, The cooling flow channel mechanism further comprises an adapter plate (5) connected to the side of the flow channel plate (3) away from the heat insulation plate (2), and the adapter plate (5) is used for fixing a component to be heat exchanged.

8. The cooling runner mechanism of claim 7, wherein ​ 9. The cooling runner mechanism according to any one of claims 1 to 4, characterized in that, ​ 10. A sorter characterized by A temperature-controlled presser head for providing pressure to a chip, the temperature-controlled presser head being connected to a cooling channel mechanism for regulating the temperature of the temperature-controlled presser head, the cooling channel mechanism being as claimed in any one of claims 1-9.

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