Highly heat-conductive wedge-shaped heat transfer mechanism
By connecting the sawtooth wedge block with a multi-sloped heat-conducting sliding mechanism, the heat transfer path is optimized, which solves the problems of insufficient contact surface and high thermal resistance of the locking strip, and improves the heat dissipation capacity and sealing effect of electronic equipment.
Patent Information
- Application Number
- CN202423047173.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-10
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-12-10
AI Technical Summary
In existing heat dissipation technologies for electronic devices, locking strips have limited contact surfaces, high thermal resistance, and poor heat transfer, making it difficult to meet the heat dissipation requirements of high heat flux densities. Furthermore, the sealing effect of high and low temperature test chambers is not good.
A multi-sloping heat-conducting sliding mechanism is adopted, including a first serrated wedge, a second serrated wedge, and a third serrated wedge, which are connected by serrated pins and serrated screws. The number of sloping surfaces and the slope are designed to be 1:4. Combined with serrated screws and washers, the heat transfer path is optimized.
It achieves high thermal conductivity interconnection in the vertical heat transfer path, improves heat dissipation capacity by 20%, enhances the reliability of module installation and heat dissipation, and improves sealing effect.
Smart Images
Figure CN223600208U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to electronic equipment mechanical structure technical field, and particularly provide a high thermal conductivity wedge heat transfer mechanism. BACKGROUND
[0002] With the rapid development of microelectronic technology, electronic system miniaturization, integration and high heat flux density become mainstream development direction, the volume is continuously reduced, and the power density is continuously increased, so that the heat flux density of electronic equipment is higher and higher. When the electronic equipment is running, a large amount of heat will be generated in the internal electronic components, which must be dissipated in time, otherwise the temperature of the components will be too high, and once the temperature exceeds the temperature limit of the components, the components will be damaged. At the same time, if the components are in a high temperature environment for a long time, the reliability will decrease rapidly. Therefore, the temperature of the electronic components must be controlled within a certain range by appropriate means.
[0003] At present, the heat dissipation technology of electronic equipment mainly includes natural heat dissipation, forced air cooling, liquid cooling, etc. Among them, the natural heat dissipation is the lowest in heat dissipation capacity through the natural convection of air; the forced air cooling has higher heat dissipation capacity by driving air flow with fan and forced convection heat exchange with electronic equipment; the liquid cooling has the highest heat dissipation capacity by transferring heat through the convective heat exchange between liquid and heat source.
[0004] No matter which heat dissipation technology is used, there is no obvious difference in the mechanical structure between the electronic module and the case, and the heat transfer path is not optimized. The commonly used 5J general locking strip has the problems of less contact surface, high thermal resistance and poor heat transfer, and has certain limitations in actual heat dissipation capacity improvement.
[0005] The sealing of the current high and low temperature test box is usually directly sealed by sponge body hole plug. When the test cable size is uneven, the gap between the plug and the cable after sealing is too large, and it is difficult to produce good sealing effect. SUMMARY
[0006] The purpose of the present application is to provide a multi-inclined surface heat conduction sliding mechanism, which realizes high-thermal-conductivity interconnection of vertical heat transfer path, not only improves the heat conduction capacity of the locking strip, but also optimizes the heat transfer path between the module and the case, to meet the heat dissipation demand of high heat flux density electronic equipment.
[0007] In order to achieve the above purpose, the utility model adopts the following technical scheme: a high thermal conductivity wedge heat transfer mechanism, the mechanism includes the first sawtooth wedge block, the second sawtooth wedge block and the third sawtooth wedge block which are connected with each other, one end of the first sawtooth wedge block is connected with one end of the third sawtooth wedge block through a sawtooth pin, one end of the second sawtooth wedge block, the other end of the first sawtooth wedge block and the other end of the third sawtooth wedge block are connected through a sawtooth screw,
[0008] The third sawtooth wedge is provided with a plurality of inclined surfaces for heat transfer.
[0009] The high-thermal-conductivity wedge-shaped heat transfer mechanism has the technical features that the inclination of the inclined surface is 1:4.
[0010] The high-thermal-conductivity wedge-shaped heat transfer mechanism has the technical features that the number of the inclined surfaces is 12.
[0011] The high-thermal-conductivity wedge-shaped heat transfer mechanism has the technical features that the first end of the first sawtooth wedge is provided with a first groove matched with the third sawtooth wedge, and the first end of the third sawtooth wedge is provided with a second groove matched with the first sawtooth wedge, and the first groove and the second groove are matched to form an empty space for locking.
[0012] The high-thermal-conductivity wedge-shaped heat transfer mechanism has the technical features that the second sawtooth wedge is provided with a gasket and a spring washer between the second sawtooth wedge and the sawtooth screw.
[0013] The high-thermal-conductivity wedge-shaped heat transfer mechanism has the technical features that the sawtooth screw is an internal hexagonal screw.
[0014] The high-thermal-conductivity wedge-shaped heat transfer mechanism has the technical features that the first end of the first sawtooth wedge and the first end of the third sawtooth wedge are provided with concentric sawtooth pin holes, and the sawtooth pin holes are matched with the sawtooth pin.
[0015] Advantages
[0016] The high-thermal-conductivity wedge-shaped heat transfer mechanism realizes high-thermal-conductivity interconnection of a vertical heat transfer path, solves the problems of a small contact surface, high thermal resistance and poor heat transfer of the existing 5J locking strip, and can improve the heat dissipation capacity by 20% compared with the previous 5J general locking strip, and greatly improves the reliability of module installation and heat dissipation. BRIEF DESCRIPTION OF DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor.
[0018] Fig. 1 It is a structural schematic view of the high-thermal-conductivity wedge-shaped heat transfer mechanism of the utility model;
[0019] Fig. 2The utility model discloses a high thermal conductivity wedge heat transfer mechanism in the internal hexagonal non -screw profile view of unscrewing,
[0020] Fig. 3 The utility model discloses a high thermal conductivity wedge heat transfer mechanism in the knurled pin half -sectional view,
[0021] 1: sawtooth screw, 2: first sawtooth wedge, 3: sawtooth pin, 4: second sawtooth wedge, 5: third sawtooth wedge, 6: spring washer, 7: washer, 8: sawtooth pin hole. DETAILED DESCRIPTION
[0022] The application will be described in further detail below in connection with the drawings and embodiments, but it should be noted that these embodiments are not limiting to the application, and equivalent transformations or substitutions of function, method or structure made by those skilled in the art based on these embodiments are within the protection scope of the application.
[0023] In the description of the embodiments of the application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation to the application.
[0024] In addition, the terms "first", "second", "third" and the like are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by "first", "second" and the like can explicitly or implicitly include one or more of the features. In the description of the application, unless otherwise stated, the meaning of "multiple" is two or more.
[0025] The terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection, it can be mechanical connection, or electrical connection, it can be direct connection, or indirect connection through intermediate medium, it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood through specific circumstances.
[0026] As Figs. 1-3As shown, the embodiment of the present application provides a high-thermal-conductivity wedge-shaped heat transfer mechanism, which comprises a first sawtooth wedge block 2, a second sawtooth wedge block 4 and a third sawtooth wedge block 5 connected with each other, one end of the first sawtooth wedge block 2 is connected with one end of the third sawtooth wedge block 5 through a sawtooth pin 3, one end of the second sawtooth wedge block 4, the other end of the first sawtooth wedge block 2 and the other end of the third sawtooth wedge block 5 are connected through a sawtooth screw 1,
[0027] A plurality of inclined surfaces for heat transfer are arranged on the third sawtooth wedge block 5.
[0028] In some embodiments, the inclination of the inclined surface is 1:4, and the number of the inclined surfaces is 12.
[0029] In the above embodiment, 12 inclined surfaces with an inclination of 1:4 are used for cooperation to realize a front and back displacement of 4 mm and a locking effect of expanding the locking strip by 1 mm.
[0030] In some embodiments, one end of the first sawtooth wedge block 2 is provided with a first groove matched with the third sawtooth wedge block 5, and one end of the third sawtooth wedge block 5 is provided with a second groove matched with the first sawtooth wedge block 2, and the first groove and the second groove cooperate to form an empty space for realizing locking.
[0031] In some embodiments, a gasket 7 and a spring washer 6 are arranged between the second sawtooth wedge block 4 and the sawtooth screw 1.
[0032] In some embodiments, the sawtooth screw 1 is an internal hexagonal screw. The high-thermal-conductivity wedge-shaped heat transfer mechanism is fastened and loosened through the internal hexagonal screw, and is designed with a non-unscrewing thread mechanism and an empty space to ensure that it can idle after being loosened to the right position and that the first sawtooth wedge block 2, the second sawtooth wedge block 4 and the third sawtooth wedge block 5 are connected with each other and cannot be loosened.
[0033] In some embodiments, one end of the first sawtooth wedge block 2 and one end of the third sawtooth wedge block 5 are provided with concentric sawtooth pin holes 8, and the sawtooth pin holes 8 are matched with the sawtooth pin 3.
[0034] The high-thermal-conductivity wedge-shaped heat transfer mechanism provided by the foregoing embodiment realizes high-thermal-conductivity interconnection of the vertical heat transfer path, solves the problems of the existing 5J locking strip, such as small contact surface, high thermal resistance and poor heat transfer, and can improve the heat dissipation capacity by 20% compared with the previous 5J general locking strip, thereby greatly improving the reliability of module installation and heat dissipation.
[0035] The above merely describes preferred embodiments of the present application, and is not used to limit the present application, any modification, equivalent replacement and improvement made within the spirit and principle of the present application should be included in the protection scope of the present application. The above merely describes preferred embodiments of the present application, and it should be pointed out that, for ordinary skilled in the art, without departing from the technical principles of the present application, a number of improvements and variations can be made, and these improvements and variations should be considered as the protection scope of the present application.
Claims
1. A high thermal conductivity wedge-shaped heat transfer mechanism, characterized in that, The mechanism includes a first serrated wedge, a second serrated wedge, and a third serrated wedge connected to each other. One end of the first serrated wedge is connected to one end of the third serrated wedge by a serrated pin, and one end of the second serrated wedge, the other end of the first serrated wedge, and the other end of the third serrated wedge are connected by serrated screws. The third sawtooth wedge has multiple inclined surfaces for heat transfer.
2. The high thermal conductivity wedge-shaped heat transfer mechanism according to claim 1, characterized in that, The slope of the inclined plane is 1:
4.
3. The high thermal conductivity wedge-shaped heat transfer mechanism according to claim 1, characterized in that, The number of inclined planes is 12.
4. The high thermal conductivity wedge-shaped heat transfer mechanism according to claim 1, characterized in that, The first sawtooth wedge has a first groove at one end that mates with the third sawtooth wedge, and the third sawtooth wedge has a second groove at one end that mates with the first sawtooth wedge. The first groove and the second groove mate to form an empty space for locking.
5. The high thermal conductivity wedge-shaped heat transfer mechanism according to claim 1, characterized in that, A washer and a spring washer are provided between the second sawtooth wedge and the sawtooth screw.
6. The high thermal conductivity wedge-shaped heat transfer mechanism according to claim 1, characterized in that, The serrated screw is an internal hexagonal screw.
7. The high thermal conductivity wedge-shaped heat transfer mechanism according to claim 1, characterized in that, One end of the first sawtooth wedge and one end of the third sawtooth wedge are provided with concentric sawtooth pin holes, and the sawtooth pin holes cooperate with the sawtooth pins.