Heat dissipation device and plasma equipment
By employing heat transfer plates and heat dissipation plates with high thermal conductivity in plasma equipment, combined with heat-conducting media and fans, the problem of uneven heat dissipation in plasma equipment is solved, achieving uniform temperature of the components to be cooled and rapid heat transfer, thereby improving equipment performance.
Patent Information
- Application Number
- CN202423173360.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-12-23
AI Technical Summary
Existing plasma equipment has poor heat dissipation performance, resulting in large temperature differences between different parts of the components to be cooled, which affects the performance of the equipment.
The heat transfer plate and heat dissipation plate structure with high thermal conductivity are adopted. The wall thickness of the heat transfer plate on the side closer to the heat dissipation component is greater than that on the side farther away from the heat dissipation plate. A heat-conducting medium and a fan are set to increase the heat dissipation area and accelerate heat transfer by utilizing the heat-conducting medium and the fan.
It effectively reduces the temperature difference between different parts of the heat-dissipating components, improves heat transfer efficiency, achieves uniform temperature distribution, and enhances equipment performance.
Smart Images
Figure CN223600230U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of plasma, specifically, a heat dissipation device and plasma equipment. BACKGROUND
[0002] Plasma equipment is a device for generating plasma, which is usually used for surface treatment, material modification, thin film deposition and other processes in a vacuum environment.
[0003] The heat dissipation performance of the prior art plasma equipment is not high, and the temperature difference between each part on the heat dissipation part is large (see Figure 1 ), which seriously restricts its performance. UTILITY MODEL CONTENT
[0004] The utility model aims at providing a heat dissipation device which can reduce the temperature difference between each part on the heat dissipation part while dissipating heat.
[0005] Another purpose of the utility model is to provide a plasma equipment comprising the heat dissipation device.
[0006] The purpose of the utility model is achieved by the following technical solutions:
[0007] A heat dissipation device comprises a heat dissipation plate and a heat transfer plate, the heat transfer plate is arranged between the heat dissipation plate and a heat dissipation part, the heat transfer plate is provided with a first accommodating cavity, and a heat conducting medium is arranged in the first accommodating cavity.
[0008] Further, the wall thickness of the side of the heat transfer plate close to the heat dissipation part is greater than that of the side close to the heat dissipation plate.
[0009] Further, the heat dissipation plate is provided with heat dissipation teeth, the heat dissipation teeth are provided with a second accommodating cavity, and a heat conducting medium is arranged in the second accommodating cavity.
[0010] Further, a fan is further included, and the air outlet of the fan faces the heat dissipation teeth.
[0011] Further, the heat dissipation plate is provided with a groove, a heat conducting pipe is arranged in the groove, the heat conducting pipe is in direct contact with the heat transfer plate, and a heat conducting medium is arranged in the heat conducting pipe.
[0012] Further, the heat dissipation plate is provided with a groove, a heat conducting medium is arranged in the groove, and the heat conducting medium is in direct contact with the heat transfer plate.
[0013] A plasma equipment comprises the heat dissipation device.
[0014] The utility model has the following advantages:
[0015] 1. The temperature of the high-temperature part of the heat-dissipating piece can be quickly transferred to the low-temperature part of the heat-dissipating piece through the heat transfer plate, thereby quickly reducing or even eliminating the temperature difference between different parts of the heat-dissipating piece.
[0016] 2. The heat of the heat-dissipating piece can be quickly and directly transferred to the heat-dissipating plate through the heat transfer plate and dissipated.
[0017] 3. When there is a temperature difference between different parts of the heat-dissipating piece, there is also a temperature difference on the heat transfer plate under the action of heat transfer, and the heat transfer medium in the heat transfer plate can quickly transfer the heat between different parts of the heat transfer plate.
[0018] 4. Under the action of the heat transfer medium in the heat transfer plate, the heat of the heat-dissipating piece can be more quickly transferred to the heat-dissipating plate through the heat transfer plate and dissipated. BRIEF DESCRIPTION OF DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.
[0020] Figure 1 A heat simulation diagram of the prior art heat-dissipating piece;
[0021] Figure 2 A structural schematic diagram of the heat-dissipating device embodiment one of the present application;
[0022] Figure 3 A structural schematic diagram of the heat-dissipating device embodiment two of the present application;
[0023] Figure 4 A heat simulation diagram of the heat-dissipating piece provided with the heat-dissipating device of the present application;
[0024] In the figure: 1 - heat-dissipating plate; 2 - heat transfer plate; 3 - heat-dissipating piece; 4 - heat pipe; 5 - heat-dissipating tooth; 6 - fan; 7 - equipment shell; 8 - gas passage; 9 - first containing cavity; 10 - second containing cavity. DETAILED DESCRIPTION
[0025] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in conjunction with the drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0026] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product of the present application is used, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" and the like are only used to distinguish the description and cannot be understood as indicating or implying relative importance.
[0027] In addition, the terms "horizontal", "vertical", "overhang" and the like do not mean that the components must be absolutely horizontal or overhanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.
[0028] In the present application, unless otherwise explicitly specified and limited, the first feature above or below the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature therebetween. Moreover, the first feature above, above and above the second feature includes that the first feature is directly above and obliquely above the second feature, or only means that the horizontal height of the first feature is higher than that of the second feature. The first feature below, below and below the second feature includes that the first feature is directly below and obliquely below the second feature, or only means that the horizontal height of the first feature is less than that of the second feature.
[0029] See Figure 2As shown in the drawings, a heat dissipation device comprises a heat dissipation plate 1, and further comprises a heat transfer plate 2 which is arranged between the heat dissipation plate 1 and a heat dissipation object 3, and the two sides of the heat transfer plate 2 are tightly attached to the heat dissipation plate 1 and the heat dissipation object 3 respectively, and since different modules with different power consumptions are arranged on the heat dissipation object 3, there must be temperature difference between different parts of the heat dissipation object 3; however, the heat transfer efficiency of the heat dissipation object 3 is often very low, in order to improve the heat transfer efficiency, so as to quickly reduce the temperature difference between different parts of the heat dissipation object 3, the heat transfer plate 2 is made of materials with high heat conductivity, such as gold, silver and copper; since the heat transfer plate 2 has high heat conductivity, on the one hand, the temperature of the high-temperature part of the heat dissipation object 3 can be quickly transferred to the low-temperature part of the heat dissipation object 3 through the heat transfer plate 2, so as to quickly reduce or even eliminate the temperature difference between different parts of the heat dissipation object 3, on the other hand, the heat of the heat dissipation object 3 can also be quickly and directly transferred to the heat dissipation plate 1 through the heat transfer plate 2 and then dissipated, that is, the heat transfer plate 2 of the utility model can quickly reduce the temperature difference between different parts of the heat dissipation object 3, and can also quickly and directly transfer the heat of the heat dissipation object 3 to the heat dissipation plate 1; the heat transfer plate 2 is provided with a first accommodating cavity 9, and a heat-conducting medium is arranged in the first accommodating cavity 9, when there is temperature difference between different parts of the heat dissipation object 3, there is also temperature difference on the heat transfer plate 2 under the action of heat transfer, and the heat-conducting medium can realize the quick heat transfer between different parts of the heat transfer plate 2; at the same time, under the action of the heat-conducting medium, the heat of the heat dissipation object 3 can be more quickly transferred to the heat dissipation plate 1 through the heat transfer plate 2 and then dissipated; in some embodiments, in order to realize the tight attachment of the heat transfer plate 2 to the heat dissipation plate 1 and the heat dissipation object 3, so as to be more conducive to heat dissipation, heat-conducting silicone grease can be applied between the heat transfer plate 2 and the heat dissipation plate 1 and between the heat transfer plate 2 and the heat dissipation object 3.
[0030] Further, see Figure 2 As shown in the drawings, in order to further reduce the temperature difference between different parts of the heat dissipation object 3, the wall thickness of the side of the heat transfer plate 2 close to the heat dissipation object 3 is greater than the wall thickness of the side close to the heat dissipation plate 1, that is, the first accommodating cavity 9 is not arranged in the middle of the heat transfer plate 2, but close to the bottom of the heat transfer plate 2; since the wall thickness of the side of the heat transfer plate 2 close to the heat dissipation object 3 is thicker, the heat-conducting medium can uniformly transfer heat to the whole heat transfer plate 2, so that the temperature of the whole heat transfer plate 2 changes uniformly, and the heat transfer plate 2 after the overall temperature uniform change in turn affects the temperature of the heat dissipation object 3, so that the temperature difference between different parts of the heat dissipation object 3 becomes smaller or even completely eliminated, that is, the heat transfer plate 2 after the overall temperature uniform change can make the temperature of different parts of the heat dissipation object 3 more uniform; in addition, the wall thickness of the side of the heat transfer plate 2 close to the heat dissipation object 3 is greater than the wall thickness of the side close to the heat dissipation plate 1, that is, the wall thickness of the side of the heat transfer plate 2 close to the heat dissipation plate 1 is thinner, so that the heat-conducting medium is closer to the heat dissipation plate 1, thereby shortening the heat transfer distance between the heat-conducting medium and the heat dissipation plate 1, and being more conducive to the heat transfer of the heat transfer plate 2 to the heat dissipation plate 1 through the heat-conducting medium.
[0031] Further, see Figure 2 As shown in the figure, in order to increase the heat dissipation area and improve the heat dissipation efficiency, the heat dissipation plate 1 is provided with heat dissipation teeth 5 away from the heat transfer plate 2, the heat dissipation teeth 5 are provided with a second containing cavity 10, and the second containing cavity 10 is provided with a heat conducting medium.
[0032] Further, see Figure 2 As shown in the figure, in order to accelerate air flow and thus accelerate heat dissipation, a fan 6 is further included, and an air outlet of the fan 6 faces the heat dissipation teeth 5.
[0033] Further, as an embodiment, see Figure 2 As shown in the figure, in order to facilitate heat dissipation, the heat dissipation plate 1 is provided with a recess, the recess is provided with a heat conducting pipe 4, in order to improve the heat dissipation efficiency, the heat conducting pipe 4 is in direct contact with the heat dissipation plate 1 and the heat transfer plate 2, the heat conducting pipe 4 is provided with a heat conducting medium, and the heat conducting medium is in direct contact with the heat conducting pipe 4.
[0034] Further, as another embodiment, the heat dissipation device of the embodiment is basically similar to that of the first embodiment, and the difference lies in that the heat dissipation device of the embodiment is not provided with the heat conducting pipe 4, and see Figure 3 As shown in the figure, in order to facilitate heat dissipation, the heat dissipation plate 1 is provided with a recess, the recess is provided with a heat conducting medium, and in order to improve the heat dissipation efficiency, the heat conducting medium is in direct contact with the heat dissipation plate 1 and the heat transfer plate 2.
[0035] A plasma device, the plasma device comprising the heat dissipation device.
[0036] It should be noted that the heat conducting medium of the utility model is a working fluid used for transferring heat energy and generating freezing effect in a heat dissipation system, such as trifluoro propylene, freon, alkane, ammonia or carbon dioxide, etc.
[0037] Compared with the heat dissipation part in the prior art, the heat dissipation part provided with the heat dissipation device has smaller temperature difference between parts and more uniform temperature distribution, see Figure 4 .
[0038] The above only describes preferred embodiments of the utility model and is not used for limiting the utility model, and for those skilled in the art, the utility model can have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
Claims
1. A heat dissipation device, comprising a heat dissipation plate (1), characterized in that: It also includes a heat transfer plate (2), which is disposed between the heat dissipation plate (1) and the heat dissipation component (3). The heat transfer plate (2) is provided with a first receiving cavity (9), and a heat-conducting medium is disposed in the first receiving cavity (9).
2. The heat dissipation device according to claim 1, characterized in that: The wall thickness of the heat transfer plate (2) on the side closer to the heat-dissipating component (3) is greater than the wall thickness on the side closer to the heat dissipation plate (1).
3. The heat dissipation device according to any one of claims 1 or 2, characterized in that: The heat sink (1) is provided with heat dissipation teeth (5), and the heat dissipation teeth (5) are provided with a second receiving cavity (10), and the second receiving cavity (10) is provided with a heat-conducting medium.
4. The heat dissipation device according to claim 3, characterized in that: It also includes a fan (6) whose air outlet faces the heat dissipation teeth (5).
5. The heat dissipation device according to claim 3, characterized in that: The heat sink (1) is provided with a groove, and a heat pipe (4) is provided in the groove. The heat pipe (4) is in direct contact with the heat transfer plate (2), and a heat-conducting medium is provided in the heat pipe (4).
6. The heat dissipation device according to claim 3, characterized in that: The heat sink (1) is provided with a groove, and a heat-conducting medium is provided in the groove. The heat-conducting medium is in direct contact with the heat transfer plate (2).
7. A plasma device, characterized in that: The plasma device includes the heat dissipation device as described in any one of claims 1 to 6.