White light LED device
By setting up a enclosure structure in the white LED device and encapsulating it with phosphor adhesive, the problems of difficult dispensing operation and poor device consistency were solved, thus achieving stability of the target color temperature and improved luminous efficacy.
Patent Information
- Application Number
- CN202423031402.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-09
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-12-09
AI Technical Summary
Precise control of existing white LED devices during the dispensing process is difficult to achieve, resulting in poor device consistency, high operational difficulty, and difficulty in achieving the target color temperature.
A baffle structure is set in the middle area of the support bowl to surround the first light-emitting chip assembly, and fluorescent adhesive is encapsulated inside the baffle structure to ensure that the fluorescent adhesive completely covers the top and outer surfaces of the chip, while using transparent materials to avoid light loss.
It reduces the difficulty of dispensing operations, ensures device consistency and the achievement of target color temperature, and improves light efficiency.
Smart Images
Figure CN223600272U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED display technology, and in particular to a white LED device. Background Technology
[0002] White LEDs are a widely used lighting technology based on the principle of light-emitting diodes (LEDs). Through the interaction between the light-emitting chip and a specific fluorescent material, they emit bright and highly energy-efficient white light. White LEDs have adjustable color temperature, allowing them to flexibly switch between warm light (low color temperature) and cool light (high color temperature). To achieve different color temperatures within a support bowl, existing white LEDs divide the bowl's cavity into a central region and an outer region surrounding the central region. Light-emitting chips are installed in both regions, and different phosphors are encapsulated in each chip. The light-emitting chip excites the corresponding phosphor, converting electrical energy into light energy, thus producing light of different color temperatures.
[0003] However, this arrangement requires precise control of the dispensing position and amount when applying adhesive to the central area: if the dispensing position is off, the adhesive cannot spread evenly, resulting in poor device consistency; if too much adhesive is applied, it is easy for the adhesive to overflow into the outer area, lowering the color temperature of the outer area and causing poor device consistency; if too little adhesive is applied, the adhesive cannot completely cover the top surface and outer periphery of the light-emitting chip in the central area, causing the blue light from the light-emitting chip to leak out, raising the color temperature of the central area. This makes the operation extremely difficult and makes it hard to achieve the target color temperature. Utility Model Content
[0004] Based on this, the purpose of this utility model is to overcome the defects or deficiencies of the prior art and provide a white LED device that can reduce the difficulty of dispensing operations, achieve the target color temperature, and ensure the consistency of the device.
[0005] A white LED device includes a support bowl with an open receiving cavity, a first light-emitting chip assembly disposed in the middle of the receiving cavity, and a second light-emitting chip assembly disposed around the outer periphery of the first light-emitting chip. A surrounding structure is provided in the middle of the receiving cavity, surrounding the outer periphery of the first light-emitting chip assembly to form a receiving space. The receiving space can be filled with phosphor adhesive. The second light-emitting chip assembly is located outside the receiving space. The surrounding structure and the first light-emitting chip assembly do not contact each other, and the height of the top surface of the surrounding structure is greater than the height of the highest point of the first light-emitting chip assembly.
[0006] Compared to existing technologies, the white LED device of this invention features a surrounding structure on the outer periphery of a first light-emitting chip assembly located in the middle region of the support cup cavity. This surrounds the first light-emitting chip assembly, separating it from the second light-emitting chip assembly surrounding it. By encapsulating the first phosphor within the surrounding structure, the first phosphor completely covers the top and outer surfaces of the first light-emitting chip assembly, preventing the first light-emitting chip assembly from emitting blue light and lowering the color temperature. Simultaneously, it prevents the adhesive from overflowing and contacting the light-emitting chips in the outer region during dispensing in the middle region, thus avoiding raising the color temperature. This significantly reduces the dispensing difficulty when encapsulating the first phosphor, ensuring that the device achieves the target color temperature and guarantees device consistency.
[0007] In one embodiment, the material of the enclosure structure is a transparent material with a thixotropic index of 3-4.
[0008] In one embodiment, the refractive index of the transparent material is 1-2.
[0009] In one embodiment, the transparent material is silicone resin or silicone gel.
[0010] In one embodiment, the shortest distance between the enclosure structure and the first light-emitting chip assembly is greater than or equal to 50 μm.
[0011] In one embodiment, the height of the enclosure structure does not exceed 50 μm from the surface of the support bowl.
[0012] In one embodiment, the accommodating space of the enclosure structure is filled with a first fluorescent adhesive, and the remaining space in the accommodating cavity is filled with a second fluorescent adhesive.
[0013] In one embodiment, the first light-emitting chip assembly includes at least three first light-emitting chips, each of which is connected end to end to form a regular polygon.
[0014] In one embodiment, the enclosure structure is a regular polygon identical to the first light-emitting chip assembly.
[0015] In one embodiment, the second light-emitting chip assembly includes at least three second light-emitting chips, each of which is connected end to end to form a regular polygon identical to the first light-emitting chip assembly.
[0016] To better understand and implement this invention, the following detailed description is provided in conjunction with the accompanying drawings. Attached Figure Description
[0017] Figure 1 This is a top view of one embodiment of the white LED device of the present invention;
[0018] Figure 2This is a cross-sectional view of an embodiment of the white LED device of the present invention;
[0019] Figure label:
[0020] 10. Support bowl / cup; 100. Receiving cavity of the support bowl / cup;
[0021] 200. First light-emitting chip;
[0022] 300. Second light-emitting chip;
[0023] 40. Enclosure structure; 400. Accommodation space of the enclosure structure;
[0024] 50. Pad assembly;
[0025] 60. Solder wire. Detailed Implementation
[0026] Existing white LEDs divide the cavity of the support cup into a central region and an outer region from the inside out. Light-emitting chips are placed in the central and outer regions respectively, and different phosphor layers are then encapsulated in each region. Different color temperatures are generated through the interaction between the light-emitting chips and the different phosphor layers. However, this arrangement requires precise control of the dispensing position and amount: if the dispensing position is off, the adhesive cannot spread evenly, resulting in poor device consistency; if too much adhesive is dispensed, it may overflow and contact the light-emitting chips in the outer region, lowering the color temperature of the outer region; conversely, if too little adhesive is dispensed, it cannot completely cover the top and outer sides of the chip in the central region, causing the chip to leak blue light and raising the color temperature of the central region.
[0027] Based on this, the present invention provides a surrounding structure on the outer periphery of the first light-emitting chip assembly located in the middle region of the cup-shaped support cavity, thereby separating it from the second light-emitting chip assembly surrounding the first light-emitting chip assembly. By encapsulating the first fluorescent adhesive within the surrounding structure, the first fluorescent adhesive completely covers the top surface and outer side surface (the side facing the sidewall of the cup-shaped support cavity) of the first light-emitting chip assembly, preventing the first light-emitting chip assembly from emitting blue light and lowering the color temperature. At the same time, it prevents the adhesive from overflowing and contacting the light-emitting chips in the outer region when applying adhesive to the middle region, thus preventing the color temperature from rising. This ensures that the device can achieve the target color temperature and ensures the consistency of the device, while greatly reducing the operational difficulty of encapsulating the first fluorescent adhesive. Furthermore, by using a transparent material to make the surrounding structure, the setting of the surrounding structure is prevented from affecting the light emission of the first light-emitting chip assembly, thereby avoiding light loss and helping to improve light efficiency.
[0028] The present invention will now be described in detail with reference to the accompanying drawings.
[0029] like Figure 1-2As shown, one embodiment of the present invention provides a white LED device, which includes a support bowl 10 with an open receiving cavity 100, a first light-emitting chip assembly disposed in the middle of the receiving cavity 100, and a second light-emitting chip assembly disposed around the outer periphery of the first light-emitting chip assembly.
[0030] Specifically, the first light-emitting component includes four first light-emitting chips 200, which are connected end to end to form a regular quadrilateral. The second light-emitting chip component includes four second light-emitting chips 300, which are arranged in the same quadrilateral as the first light-emitting chip component.
[0031] A ring-shaped enclosure structure 40 is provided in the middle of the cavity 100 of the support cup 10. This enclosure structure 40 surrounds the outer periphery of the four first light-emitting chips 200, forming a receiving space 400. The four second light-emitting chips 300 are located outside this receiving space 400. The inner wall of the enclosure structure 40 does not contact any of the first light-emitting chips 200, and the height of the top surface of the enclosure structure 40 is greater than the height of the top surface of each of the first light-emitting chips 200. When encapsulating the first light-emitting chips 200, first fluorescent adhesive can be filled into the receiving space 400 of the enclosure structure 40 until it is full. Thus, the enclosure structure 40 prevents the filled first fluorescent adhesive from overflowing and contacting the second light-emitting chips 300. Simultaneously, once the first fluorescent adhesive fills the receiving space 400 of the enclosure structure 40, the height of the enclosure structure 40 and the spacing between it and any of the first light-emitting chips 200 ensure that the first fluorescent adhesive completely covers the top and outer periphery of each first light-emitting chip 200. Thus, when encapsulating the first light-emitting chip component, it is only necessary to ensure that the dispensing head is aligned with the receiving space 400 of the enclosure structure 40 and that the first phosphor fills the receiving space 400. Excessive precision in controlling the dispensing position and amount is unnecessary, greatly reducing operational difficulty. The first phosphor, filling the receiving space 400 of the enclosure structure 40, is heated and cured. The surface of the cured first phosphor is flat or slightly convex. Then, the remaining space of the receiving cavity 100 of the bracket cup 10 is filled with a second phosphor, covering the top of the first phosphor. The second phosphor is then cured by heating, resulting in a white LED device with a double layer of phosphor, thereby achieving two color temperatures.
[0032] Here, the enclosure structure 40 can be shaped as follows: Figure 1 Besides the regular quadrilateral shown, it can also be a triangle, pentagon, or even a circle, but preferably it is the same as the outer perimeter outline of the first light-emitting chip 200 after being enclosed. In this way, it can ensure that the enclosure structure 40 can surround the first light-emitting chip assembly, while saving space.
[0033] The height of the enclosure structure 40 is greater than 200 μm and less than 300 μm. Within this height range, the height of the top surface of the enclosure structure 40 is greater than the height of the top surface of the first light-emitting chip 200, and the top surface of the enclosure structure 40 does not exceed a position within the accommodating cavity 100 that is 50 μm away from the surface of the support cup 10. This ensures that after encapsulating the first fluorescent adhesive, the first fluorescent adhesive can cover the top surface of the first light-emitting chip 200, but will not protrude from or be flush with the surface of the support cup 10. The shortest distance between the enclosure structure 40 and any of the first light-emitting chips 200 is greater than or equal to 50 μm. This ensures that the outer side (the side facing the enclosure structure 40) of each first light-emitting chip 200 is covered with a sufficiently thick layer of the first fluorescent adhesive.
[0034] The accommodating cavity 100 of the support cup 10 is further provided with two sets of pad assemblies 50, each consisting of a power supply pad and a grounding pad. The first light-emitting chip assembly and the second light-emitting chip assembly are respectively connected to the pad assemblies 50 via bonding wires 60, forming two electrical control channels. In this embodiment, both sets of pad assemblies 50 are located on the outside of the enclosure structure 40. To allow sufficient space for the bonding wires 60 connecting the first light-emitting chip 200 and the pad assemblies 50, and between the second light-emitting chip 300, the top surface of the enclosure structure 40 does not exceed a position within the accommodating cavity 100 50 μm from the cup surface of the support cup 10. This ensures that the second fluorescent adhesive can completely cover the bonding wires 60 arranged above the enclosure structure 40, while also ensuring the thickness of the second layer of fluorescent adhesive in the area above the enclosure structure 40, preventing the second layer of fluorescent adhesive from being too thin and unsuitable for color dot mixing.
[0035] However, the enclosure structure 40 may block the light emitted by the first light-emitting chip 200, causing light loss and reducing luminous efficiency. Therefore, in some embodiments, the enclosure structure 40 is made of a transparent material with a refractive index of 1-2. This allows the light emitted by the first light-emitting chip 200 to pass through the enclosure structure 40. The transparent material is preferably a material with a high thixotropic index, preferably 3-4. This prevents the enclosure structure 40 from easily deforming during the heat curing process of the first fluorescent adhesive after dispensing; silicone resin or silicone can be selected as the specific material. By using a transparent material to prepare the enclosure structure 40, light emitted by the first light-emitting chip 200 can pass through, avoiding light loss and improving luminous efficiency.
[0036] Compared to existing technologies, the white LED device of the present invention separates the first light-emitting chip assembly from the second light-emitting chip assembly surrounding the first light-emitting chip assembly located in the middle region of the support cup cavity by setting a barrier structure around the first light-emitting chip assembly. By encapsulating the first phosphor within the barrier structure, the first phosphor completely covers the top and outer surfaces of the first light-emitting chip assembly, preventing the first light-emitting chip assembly from emitting blue light and lowering the color temperature. At the same time, it prevents the adhesive from overflowing and contacting the light-emitting chips in the outer region during dispensing in the middle region, thus preventing the color temperature from rising. This ensures that the device can achieve the target color temperature and guarantees the consistency of the device, and greatly reduces the operational difficulty of encapsulating the first phosphor. Furthermore, by using a transparent material to make the barrier structure, the setting of the barrier structure is prevented from affecting the light emission of the first light-emitting chip assembly, thereby avoiding light loss and helping to improve luminous efficiency.
[0037] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of this application. The singular forms “a,” “the,” and “the” used in the embodiments and claims of this application are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that, unless otherwise stated, “a plurality” means two or more; the terms “first,” “second,” “third,” etc., are used only to distinguish and not to describe a particular order or sequence, nor should they be construed as indicating or implying relative importance. The term “and / or” as used herein refers to and includes any or all possible combinations of one or more associated listed items. When the above description relates to drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. In the description of this application, those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0038] The embodiments described above are merely examples of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model.
Claims
1. A white LED device, comprising a support bowl (10) having an open receiving cavity, a first light-emitting chip assembly disposed in the middle of the receiving cavity (100) of the support bowl (10), and a second light-emitting chip assembly disposed around the outer periphery of the first light-emitting chip (200), characterized in that: A baffle structure (40) is provided in the middle of the cavity (100) of the bracket cup (10). The baffle structure (40) surrounds the outer periphery of the first light-emitting chip assembly to form a receiving space (400). The receiving space (400) can be filled with fluorescent glue. The second light-emitting chip assembly is located outside the receiving space (400). The baffle structure (40) does not contact the first light-emitting chip assembly. The height of the top surface of the baffle structure (40) is greater than the height of the highest point of the first light-emitting chip assembly.
2. The white LED device according to claim 1, characterized in that: The material of the enclosure structure (40) is a transparent material with a thixotropic index of 3-4.
3. The white LED device according to claim 2, characterized in that: The refractive index of the transparent material is 1-2.
4. The white LED device according to claim 2, characterized in that: The transparent material is silicone resin or silicone.
5. The white LED device according to claim 1, characterized in that: The shortest distance between the enclosure structure (40) and the first light-emitting chip assembly is greater than or equal to 50 μm.
6. The white LED device according to claim 1, characterized in that: The height of the enclosure structure (40) does not exceed the position within the accommodating cavity that is 50 μm away from the surface of the support cup (10).
7. The white LED device according to claim 1, characterized in that: The enclosure structure (40) is filled with a first fluorescent adhesive in its accommodating space (400), and the remaining space in the accommodating cavity (100) is filled with a second fluorescent adhesive.
8. The white LED device according to claim 1, characterized in that: The first light-emitting chip assembly includes at least three first light-emitting chips (200), each first light-emitting chip (200) being connected end to end to form a regular polygon.
9. The white LED device according to claim 8, characterized in that: The enclosure structure (40) is a regular polygon, the same as the first light-emitting chip assembly.
10. The white LED device according to claim 8, characterized in that: The second light-emitting chip assembly includes at least three second light-emitting chips (300), each second light-emitting chip (300) being connected end to end to form a regular polygon identical to the first light-emitting chip assembly.