Glue injection sealing device of LED (light-emitting diode)
By combining the electric lifting guide rail and the clamping docking mechanism, the problems of LED pin wobbling and glue waste are solved, achieving stable glue injection and convenient mold cleaning. It is suitable for glue injection and sealing devices for LED LEDs.
Patent Information
- Application Number
- CN202422233447.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-12
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-09-12
AI Technical Summary
In existing diode encapsulation equipment, the leads of the LEDs are prone to shaking during batch encapsulation operations, making it difficult to guarantee quality. At the same time, the adhesive is easily wasted and the mold is inconvenient to clean.
The system employs an electric lifting guide rail and conveying mechanism in conjunction with a clamping and docking mechanism. Precise glue injection is achieved through an extrusion glue dispensing mechanism, with glue dispensing only during clamping and docking to reduce glue waste. The side rolling bracket and conveyor chain facilitate mold movement and cleaning.
It achieves stable clamping of LED pins, reduces adhesive waste, improves dispensing quality and mold cleaning efficiency, and is suitable for small-batch processing.
Smart Images

Figure CN223602748U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of LED glue injection sealing device, specifically relates to a kind of glue injection sealing device of LED light emitting diode. BACKGROUND
[0002] Light emitting diode is a kind of commonly used light emitting device, and it emits light by releasing energy through electron and hole recombination, which is widely used in lighting field. Light emitting diode can efficiently convert electrical energy into light energy, and has wide application in modern society, such as lighting, flat panel display, medical device, etc. LED light emitting diode packaging refers to the packaging of light emitting chip.
[0003] In order to ensure production efficiency, the existing diode glue injection sealing equipment often carries out batch glue injection operation during glue injection operation. The pins of light emitting diode are prone to shake during glue injection operation, which causes quality difficult to guarantee. At the same time, the filling of glue directly opens and closes by controlling the switch of glue injection gun. The glue liquid will be directly emptied for the position of missing mold, which wastes glue liquid and is not convenient for later cleaning of mold. Therefore, the utility model provides a kind of glue injection sealing device of LED light emitting diode. UTILITY MODEL CONTENTS
[0004] The utility model aims at: in order to solve the problem that the existing diode glue injection sealing equipment often carries out batch glue injection operation during glue injection operation in order to ensure production efficiency, the pins of light emitting diode are prone to shake during glue injection operation, which causes quality difficult to guarantee. At the same time, the filling of glue directly opens and closes by controlling the switch of glue injection gun. The glue liquid will be directly emptied for the position of missing mold, which wastes glue liquid and is not convenient for later cleaning of mold. The utility model provides a kind of glue injection sealing device of LED light emitting diode.
[0005] The utility model realizes the above-mentioned purpose by adopting the following technical scheme:
[0006] A kind of glue injection sealing device of LED light emitting diode, including processing base, the rear side of processing base is provided with electric lift rail, and multiple glue injection barrels are fixedly connected to the moving end of electric lift rail, multiple glue injection barrels are arranged equidistantly side by side, multiple mold bases are installed on the upper end of processing base by conveying mechanism, and multiple side edge rolling brackets are set on the upper end of each mold base, multiple mold bases are placed on the processing base, and multiple rows of glue injection grooves are set on each mold base, each row of multiple glue injection grooves corresponds to the vertical position of multiple glue injection barrels one by one, extrusion glue mechanism is arranged at the bottom of glue injection barrel, and clamping docking mechanism is fixedly connected to the upper end of each glue injection groove.
[0007] Further, the conveying mechanism comprises two side rolling brackets, which are fixedly connected to the upper end of the processing base symmetrically, and conveying chains are installed on the inner wall of the processing base corresponding to the positions of the side rolling brackets, a plurality of rollers are installed on the inner wall of the side rolling bracket at equal intervals, and the bottom of the mold base is respectively abutted with the upper side of the rollers of the front and rear side rolling brackets, linkage inserting rods are fixedly connected to the bottom of the mold base corresponding to the positions of the conveying chains, and the connecting upper end of the conveying chain is fixedly provided with a chain plate with holes at equal intervals.
[0008] Further, the extrusion glue discharging mechanism comprises a movable inner cylinder, which is movably inserted into the inner cavity of the glue injection cylinder, a ejection spring is arranged between the upper end of the movable inner cylinder and the top of the inner cavity of the glue injection cylinder, a glue injection nozzle is fixedly connected to the bottom of the movable inner cylinder, and the glue injection nozzle penetrates through the bottom of the glue injection cylinder, a glue injection vertical pipe is fixedly inserted into the center of the upper end of the glue injection cylinder, the bottom of the glue injection vertical pipe is movably inserted into the upper end of the movable inner cylinder, a glue liquid conveying pump is connected to the upper end of the glue injection vertical pipe through a hose, a plurality of glue discharging holes are arranged at equal intervals on the side wall of the glue injection vertical pipe close to the bottom, a glue injection cavity is arranged in the inner part of the movable inner cylinder corresponding to the lower end of the glue injection vertical pipe, and the size of the glue injection cavity is larger than that of the glue injection vertical pipe.
[0009] Further, a plurality of high-temperature-resistant sliding sealing rings are fixedly connected to the outer wall of the glue injection vertical pipe close to the upper end of the movable inner cylinder.
[0010] Further, the glue injection groove is a cylindrical structure provided with a spherical recess at the bottom, and a glue injection clamping seat is inserted into the upper end of the glue injection groove, the center of the glue injection clamping seat is provided with a glue injection channel, and the upper end of the glue injection clamping seat is fixedly connected with a butt joint seat.
[0011] Further, the glue injection clamping seat and the butt joint seat are both cylindrical structures formed by butt joint of two half-cylinders, and a limiting step is arranged on the upper side of the glue injection groove corresponding to the bottom of the glue injection clamping seat, and a reverse tapered butt joint groove is arranged in the center of the butt joint seat.
[0012] Further, lead clamping grooves are arranged on both sides of the clamping surface of the glue injection clamping seat corresponding to the glue injection channel, and the lead clamping grooves are fixedly clamped with the pins of light emitting diodes.
[0013] The beneficial effects of the utility model are as follows:
[0014] 1. The utility model discloses a conveying mechanism is set, and the conveying mechanism can drive the mould base to translate on the upside of conveying chain belt, makes the multiple row glue injection groove pass the below of glue injection cylinder in turn, the electric lifting rail is set, and the electric lifting rail drives the glue injection cylinder to descend when the glue injection groove passes, and the glue injection is completed through the cooperation of extruding glue mechanism and clamping butt joint mechanism, and the clamping butt joint mechanism can clamp the fixed light emitting diode pin and form the stable glue injection channel simultaneously, through the extruding glue mechanism that sets up, the extruding glue mechanism only can glue when the butt joint with clamping butt joint mechanism, make the glue liquid that does not place the pin glue injection groove will not be injected, reduces the waste of glue liquid, is convenient for the cleaning of subsequent mould base, and for the glue injection sealing processing of small batch light emitting diode only needs to put the pin of corresponding quantity as needed and can carry out the glue injection processing, and the scope of application is wider.
[0015] 2. The utility model discloses two side edge rolling bracket are set up, and two side edge rolling bracket can prop up the front and rear bottom of mould base, is convenient for the left and right movement of mould base on side edge rolling bracket, through the setting of conveying chain belt, and the cooperation of the through -hole on the chain plate and the linkage insertion rod can drive the mould base movement, and it is convenient for the taking of mould base, thereby it is convenient for the feeding of production.
[0016] 3. The utility model discloses the movable inner tube and glue feeding vertical pipe are set up, and the glue feeding vertical pipe continuously transports glue liquid movable inner tube can keep the glue injection nozzle and eject under the action of eject spring, and when the glue injection nozzle ejects, the multiple glue outlet holes of glue feeding vertical pipe bottom are shielded by movable inner tube side wall, and cannot glue, when the glue injection nozzle is butt -joined with clamping butt joint mechanism, movable inner tube is relatively movable inner tube and moves down when being extruded the glue feeding vertical pipe that moves up, and is inserted in the glue injection cavity of movable inner tube, at this moment, the glue outlet hole position can smoothly glue, and the glue liquid is extruded through the glue injection nozzle, can realize when not clamping butt joint mechanism will not glue. ACCURACY OF DRAWINGS
[0017] Figure 1 It is the perspective drawing of the utility model;
[0018] Figure 2 It is the side sectional view of the utility model;
[0019] Figure 3 It is the enlarged view of A place in the utility model Figure 2 ;
[0020] Figure 4 It is the enlarged view of B place in the utility model Figure 2 ;
[0021] Figure 5 It is the front sectional view of the utility model;
[0022] Figure 6 It is the downward sectional view of glue injection clamping seat in the utility model.
[0023] Reference signs: 1, processing base; 2, side rolling bracket; 3, conveying chain belt; 4, electric lifting guide rail; 5, glue injection cylinder; 6, movable inner cylinder; 7, ejection spring; 8, glue conveying vertical pipe; 9, glue outlet hole; 10, glue injection nozzle; 11, mold base; 12, glue injection groove; 13, glue injection clamping seat; 14, butt joint seat; 15, pin clamping groove. DETAILED DESCRIPTION
[0024] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in combination with the drawings in the embodiments of the utility model.
[0025] Please refer to Figure 1 - Figure 6 The utility model provides a kind of glue injection sealing device of LED light emitting diode, including processing base 1, the rear side of processing base 1 is provided with electric lifting guide rail 4, and electric lifting guide rail 4 mobile end is fixedly connected with multiple glue injection cylinders 5, multiple glue injection cylinders 5 are equidistantly and side by side arranged, and the upper end of processing base 1 is equipped with multiple mold bases 11 by conveying mechanism, and multiple side rolling brackets 2 are set on the upper end of each mold base 11, multiple mold bases 11 are placed on the processing base 1, and multiple rows of glue injection grooves 12 are set on each mold base 11, each row of multiple glue injection grooves 12 and the vertical position of multiple glue injection cylinders 5 one-to-one correspond, the bottom of glue injection cylinder 5 is provided with extrusion glue outlet mechanism, and the upper end of each glue injection groove 12 is fixedly connected with clamping butt joint mechanism.
[0026] In the embodiment, preferably, the conveying mechanism includes two side rolling brackets 2, the two side rolling brackets 2 are fixedly connected to the upper end of the processing base 1 on the front and rear sides in mirror symmetry, and the inner walls of the processing base 1 are equipped with conveying chain belts 3 on the positions corresponding to the side rolling brackets 2 on the two sides, the inner walls of the side rolling brackets 2 are equipped with multiple rollers at equal intervals, the bottoms of the mold bases 11 are respectively abutted on the upper sides of the rollers of the front and rear side rolling brackets 2, the bottoms of the mold bases 11 are fixedly connected with linkage insertion rods at positions corresponding to the conveying chain belts 3 on the two sides, and the conveying chain belts 3 are fixed with hole chain plates at equal intervals on the connections, and the linkage insertion rods on the bottoms of the mold bases 11 are inserted into the hole chain plates at the corresponding positions of the conveying chain belts 3; the two side rolling brackets 2 can hold up the front and rear bottoms of the mold bases 11, the mold bases 11 can be moved left and right on the side rolling brackets 2, the conveying chain belts 3 can drive the mold bases 11 to move by the cooperation of the through holes on the hole chain plates and the linkage insertion rods, the mold bases 11 can be taken and placed, and thus the feeding and discharging during production is facilitated.
[0027] In this embodiment, preferably, the extrusion dispensing mechanism includes a movable inner cylinder 6, which is movably inserted into the bottom of the inner cavity of the dispensing cylinder 5. A push-out spring 7 is provided between the upper end of the movable inner cylinder 6 and the top of the inner cavity of the dispensing cylinder 5. A dispensing nozzle 10 is fixedly connected to the bottom of the movable inner cylinder 6, and the dispensing nozzle 10 penetrates the bottom of the dispensing cylinder 5. A dispensing riser 8 is fixedly inserted into the center of the upper end of the dispensing cylinder 5, and the bottom of the dispensing riser 8 is movably inserted into the upper end of the movable inner cylinder 6. A glue delivery pump is connected to the upper end of the dispensing riser 8 via a flexible hose. Multiple dispensing holes 9 are evenly spaced on the side wall of the dispensing riser 8 near the bottom. The interior of the movable inner cylinder 6 is corresponding to the lower end of the dispensing riser 8. The device is equipped with a glue injection chamber, the size of which is larger than that of the glue delivery riser 8. Through the movable inner cylinder 6 and the glue delivery riser 8, the glue delivery riser 8 continuously delivers glue. The movable inner cylinder 6 can keep the glue injection nozzle 10 pushed out under the action of the ejector spring 7. When the glue injection nozzle 10 is pushed out, the multiple glue outlet holes 9 at the bottom of the glue delivery riser 8 are blocked by the side wall of the movable inner cylinder 6 and cannot dispense glue. When the glue injection nozzle 10 is docked with the clamping docking mechanism, the glue delivery riser 8, which is pushed up by the movable inner cylinder 6, moves down relative to the movable inner cylinder 6 and is inserted into the glue injection chamber of the movable inner cylinder 6. At this time, the glue outlet holes 9 can dispense glue smoothly, squeezing the glue through the glue injection nozzle 10. This ensures that no glue will be dispensed when there is no clamping docking mechanism.
[0028] In this embodiment, preferably, multiple high-temperature resistant sliding sealing rings are fixedly connected to the outer wall of the glue conveying riser 8 near the upper end of the movable inner cylinder 6; the high-temperature resistant sliding sealing rings ensure the sealing between the glue conveying riser 8 and the upper end of the movable inner cylinder 6.
[0029] In this embodiment, preferably, the glue injection groove 12 is a cylindrical structure with a spherical recess at the bottom, and a glue injection clamping seat 13 is inserted into the upper end of the glue injection groove 12. The center of the glue injection clamping seat 13 is provided with a glue injection channel, and a docking seat 14 is fixedly connected to the upper end of the glue injection clamping seat 13. Through the glue injection clamping seat 13, the bottom of the glue injection clamping seat 13 and the inner cavity of the glue injection groove 12 form a complete glue injection cavity. The glue extruded from the glue injection nozzle 10 can be injected into the glue injection cavity through the glue injection channel for injection molding. Through the docking seat 14, the docking seat 14 facilitates the docking of the glue injection channel of the glue injection clamping seat 13 with the glue injection nozzle 10.
[0030] In this embodiment, preferably, the glue injection clamp 13 and the docking seat 14 are both cylindrical structures formed by the docking of two semi-cylinders, and the upper side of the glue injection groove 12 is provided with a limiting step corresponding to the bottom of the glue injection clamp 13, and the center of the docking seat 14 is provided with an inverted conical docking groove; the limiting step facilitates the assembly and disassembly of the glue injection clamp 13, and the docking groove facilitates docking contact with the glue injection nozzle 10.
[0031] In the embodiment, preferably, the clamping surface of the glue injection clamping seat 13 is provided with a pin clamping groove 15 on both sides of the glue injection channel, and the pin clamping groove 15 clamps and fixes the pin of the light emitting diode; the pin clamping groove 15 can clamp and fix the pin of the light emitting diode, so that the position of the pin is fixed during glue injection processing, and the quality of the finished product is improved.
[0032] The working principle and use process of the utility model are as follows: when the device is used, the conveying mechanism can drive the mold base 11 to translate on the upper side of the conveying chain belt 3, so that the multiple rows of glue injection grooves 12 pass the lower side of the glue injection cylinder 5 in turn; the electric lifting guide rail 4 drives the glue injection cylinder 5 to descend when the glue injection groove 12 passes; glue injection is completed through the cooperation of the extrusion glue discharge mechanism and the clamping butt joint mechanism; the clamping butt joint mechanism can clamp and fix the pin of the light emitting diode and form a stable glue injection channel at the same time; the extrusion glue discharge mechanism only discharges glue when it is connected with the clamping butt joint mechanism, so that the glue injection groove 12 without the pin will not inject glue, reducing the waste of glue, facilitating the cleaning of the mold base 11, and the glue injection sealing processing of small batches of light emitting diodes only needs to put the corresponding number of pins as needed to carry out glue injection processing, so that the application range is wider.
[0033] The above description of the disclosed embodiments enables a person skilled in the art to implement or use the utility model. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the utility model. Therefore, the utility model will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. An encapsulation apparatus for an LED light emitting diode, characterized by: The utility model provides a kind of injection molding machine, including processing base (1), the rear side of processing base (1) is provided with electric lift rail (4), and electric lift rail (4) moving end is fixedly connected with multiple glue injection cylinders (5), multiple glue injection cylinders (5) are equidistantly and side by side arranged, the upper end of processing base (1) is equipped with multiple mould bases (11) by conveying mechanism, and the upper end of each mould base (11) is equipped with multiple side edge rolling bracket (2), multiple mould bases (11) are placed on the processing base (1), and multiple rows of glue injection grooves (12) are opened on each mould base (11), each row multiple glue injection grooves (12) and the vertical position of multiple glue injection cylinders (5) one-to-one correspond, the bottom of glue injection cylinder (5) is provided with extrusion glue mechanism, and the upper end of each glue injection groove (12) is fixedly connected with clamping docking mechanism.
2. The LED encapsulation device according to claim 1, wherein: The conveying mechanism includes two side edge rolling brackets (2), two side edge rolling brackets (2) are fixedly connected to the upper end of the processing base (1) on the front and rear sides in mirror symmetry, and the inner wall of the processing base (1) is provided with a conveying chain belt (3) on both sides corresponding to the side edge rolling bracket (2), a plurality of rollers are equidistantly installed on the inner wall of the side edge rolling bracket (2), and the bottom of the mould base (11) is respectively abutted with the upper side of the rollers of the front and rear side edge rolling brackets (2), the bottom of the mould base (11) is fixedly connected with a linkage inserting rod corresponding to the position of the conveying chain belt (3), and a perforated chain plate is equidistantly fixed on the connection of the conveying chain belt (3), and the linkage inserting rod of the bottom of the mould base (11) is inserted into the perforated chain plate at the corresponding position of the conveying chain belt (3).
3. The LED encapsulation device according to claim 1, wherein: the encapsulation material is a silicone encapsulation material. The extrusion glue mechanism includes a movable inner cylinder (6), the movable inner cylinder (6) is movably inserted into the inner cavity of the glue injection cylinder (5), and a ejection spring (7) is arranged between the upper end of the movable inner cylinder (6) and the inner cavity of the glue injection cylinder (5). The bottom of the movable inner cylinder (6) is fixedly connected with a glue injection nozzle (10), and the glue injection nozzle (10) penetrates the bottom of the glue injection cylinder (5). A glue feeding vertical pipe (8) is fixedly inserted into the upper end of the movable inner cylinder (6). The upper end of the glue feeding vertical pipe (8) is connected with a glue liquid conveying pump through a hose. A plurality of glue outlet holes (9) are equidistantly arranged on the side wall of the glue feeding vertical pipe (8) near the bottom. A glue injection cavity is formed in the inner part of the movable inner cylinder (6) corresponding to the lower end of the glue feeding vertical pipe (8), and the size of the glue injection cavity is larger than the size of the glue feeding vertical pipe (8).
4. The LED encapsulation device according to claim 3, wherein the encapsulation material is a silicone resin. A plurality of high-temperature-resistant sliding sealing rings are fixedly connected to the outer wall of the glue feeding vertical pipe (8) near the upper end of the movable inner cylinder (6).
5. The LED encapsulation device of claim 1, wherein: the encapsulation material is a silicone encapsulation material; and the encapsulation material is applied to the LED chip in a liquid form and then cured to form a solid encapsulation material. 5 The glue injection groove (12) is a cylindrical structure with a spherical recess at the bottom, and a glue injection clamping seat (13) is inserted into the upper end of the glue injection groove (12). The center of the glue injection clamping seat (13) is provided with a glue injection channel, and the upper end of the glue injection clamping seat (13) is fixedly connected with a docking seat (14).
6. The LED encapsulation device according to claim 5, wherein: The glue injection clamping seat (13) and the butt joint seat (14) are both cylindrical structures formed by butt joint of two half cylinders, and the upper side of the glue injection groove (12) is provided with a limiting step corresponding to the bottom of the glue injection clamping seat (13), and the center of the butt joint seat (14) is provided with a reverse tapered butt joint groove.
7. The LED encapsulation device according to claim 5, wherein the encapsulation material is a silicone resin. The clamping surface of the glue injection clamping seat (13) is provided with a pin clamping groove (15) on both sides of the glue injection channel, and the pin clamping groove (15) clamps and fixes the pin of the light emitting diode.