A chip package wire bonding apparatus

Abstract

The utility model discloses a chip package welding line device relates to chip package field. This kind of chip package welding line device, including workstation, stroke unit and welding line unit, the workstation is used when the placement platform of chip package welding, the stroke unit is used for the moving stroke of welding line unit, the welding line unit is used to chip welding line package, the workstation includes support leg and support plate, the support plate fixedly arranged in support leg inboard, the support plate top is provided with rotating motor, and the support leg top is provided with support frame, the welding line unit includes anvil and pressure ring, the pressure ring is arranged as " C " character shape, and the pressure ring is located anvil directly below. This kind of chip package welding line device. Be provided with anvil and pressure ring, when welding, use pressure ring to press the welding line, and anvil drives the welding line to move directly to the next welding point and weld, avoid the reverse curve journey and make the welding line journey arch shape.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip packaging technical field, concretely is a chip packaging wire bonding device. BACKGROUND

[0002] Chip is also called microcircuit, microchip, integrated circuit, refers to the silicon chip containing integrated circuit, volume is very small, often is the part of computer or other electronic equipment, chip horizontal welding wire is to utilize the solder and welding machine platform, respectively the bonding wire is welded on the chip electrode and support function area, interconnects between the two and forms a conductive path, and completes the connection of internal and external lead.

[0003] The chip packaging wire bonding in the prior art usually moves in the opposite direction for a period, and then returns to the welding direction, so that the welding metal wire forms an arch shape.

[0004] The movement in the opposite direction increases the welding movement stroke, causes the welding process to take more time, leads to increased time cost, and reduces production efficiency; the welding metal wire forms an arch shape, the arch shape protrudes upward, causes the chip to occupy more space, the probability of being touched increases, and the probability of welding damage increases. UTILITY MODEL CONTENT

[0005] In view of the defects of the prior art, the utility model provides a chip packaging wire bonding device, solves the problem that the welding movement stroke is large, causes the welding process to take more time, leads to increased time cost; solves the problem that the arch-shaped welding wire occupies a large space and is easily damaged by collision.

[0006] To achieve the above object, the utility model is realized by the following technical scheme: a chip packaging wire bonding device, including workbench, stroke unit and wire bonding unit, the workbench is the placement platform for chip packaging wire bonding, the stroke unit is used for the movement stroke of the wire bonding unit, the wire bonding unit is used for chip wire bonding packaging, the workbench includes support leg and support plate, the support plate is fixedly arranged on the inner side of the support leg, the support plate top is provided with rotating motor, the support leg top is provided with support frame;

[0007] The wire bonding unit includes a pressure head and a pressure ring, the pressure ring is arranged in the shape of "C", and the pressure ring is located directly below the pressure head.

[0008] Preferably, the rotating motor output end is inserted and fixed with a placement table, the placement table is placed with a circuit board, and the circuit board is placed with a chip.

[0009] Preferably, the stroke unit comprises a fixed frame and a fixed plate, the fixed plate is fixedly connected outside the fixed frame, the inside of the fixed frame is provided with a positioning guide rod and a stroke screw rod, the positioning guide rod is located directly below the stroke screw rod, one end of the stroke screw rod penetrates through the fixed frame to the outside, and the left end of the fixed frame is fixedly connected with the support frame.

[0010] Preferably, the stroke screw rod is connected with a stroke motor, and the stroke motor is fixedly arranged at the top of the fixed plate.

[0011] Preferably, the outside of the positioning guide rod and the stroke screw rod is sleeved with a support column, and the support column is threadedly connected with the stroke screw rod.

[0012] Preferably, the welding line unit comprises a cross beam and a first hydraulic lifting rod, the first hydraulic lifting rod is fixedly arranged at the bottom of the cross beam, the cross beam is fixedly connected at the top of the support column, the inside of the cross beam is provided with a displacement guide rod, the top of the cross beam is provided with a positioning piece and a pulley, a metal welding line shaft is inserted into the positioning piece, the output end of the first hydraulic lifting rod is provided with a first cross connecting rod, and the other end of the first cross connecting rod is connected to the outside of the pressure head.

[0013] Preferably, the bottom of the cross beam is provided with a wire sleeve and a second hydraulic lifting rod, the wire sleeve is located directly above the pressure head, the output end of the second hydraulic lifting rod is connected with a second cross connecting rod, the second cross connecting rod is connected to the outside of the pressure ring, the top of the second hydraulic lifting rod is provided with a displacement connecting piece, and the displacement connecting piece is sleeved outside the displacement guide rod.

[0014] Preferably, a displacement screw rod is inserted into the displacement connecting piece, the displacement screw rod is connected with a displacement motor penetrating through the cross beam, and the displacement motor is fixed at the left end of the cross beam.

[0015] The utility model discloses a chip packaging welding line device, which has the following beneficial effects: the pressure head and the pressure ring are provided, the pressure ring is used to press the welding line during welding, the pressure head drives the welding line to directly move to the next welding point for welding, the reverse curve stroke is avoided to make the welding line stroke arch shape, the stroke and material use in the welding line process are reduced, and the time cost and material cost are saved; the pressure ring is designed as a "C" shape to avoid being stuck by the welding line; the placement table is designed, the placement table has a rotating motor to provide power and can change the welding direction of the circuit board and the chip, cooperates with the stroke unit, and facilitates the operation of the welding line packaging. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0017] Figure 1 It is a structural schematic diagram of the present application.

[0018] Figure 2 It is a structural schematic diagram of the workbench of the present application.

[0019] Figure 3 It is a structural schematic diagram of the forming unit of the present application.

[0020] Figure 4 It is a structural schematic diagram of the wire welding unit of the present application.

[0021] Figure 5 It is a structural schematic diagram of the bottom of the wire welding unit of the present application.

[0022] In the figure: 1, workbench; 11, support leg; 12, support plate; 13, rotating motor; 14, support frame; 15, placement table; 16, circuit board; 17, chip; 2, stroke unit; 21, fixed frame; 211, positioning guide rod; 212, stroke screw; 213, standing leg; 22, fixed plate; 221, stroke motor; 23, support column; 3, wire welding unit; 31, cross beam; 311, displacement guide rod; 312, positioning piece; 313, pulley; 32, first hydraulic lifting rod; 321, first cross connecting rod; 322, pressure head; 33, wire sleeve; 34, second hydraulic lifting rod; 341, second cross connecting rod; 342, pressure ring; 343, displacement connecting piece; 35, displacement motor; 351, displacement screw; 36, metal wire shaft. DETAILED DESCRIPTION

[0023] In order to better understand the above technical solutions, the above technical solutions will be described in detail in combination with the drawings of the specification and specific embodiments.

[0024] The embodiment of the present application discloses a chip packaging wire welding device.

[0025] According to the drawings Figures 1-5As shown, including workbench 1, stroke unit 2 and wire bonding unit 3, workbench 1 is used for chip packaging wire placement platform, stroke unit 2 is used for the movement of wire bonding unit 3, wire bonding unit 3 is used for chip wire packaging, workbench 1 includes support leg 11 and support plate 12, support plate 12 is fixedly arranged inside support leg 11, support plate 12 top is provided with rotating motor 13, support leg 11 top is provided with support frame 14; Wire bonding unit 3 includes pressure head 322 and pressure ring 342, pressure ring 342 is arranged as "C" shape, pressure ring 342 is located directly below the pressure head 322.

[0026] Provided with pressure head 322 and pressure ring 342, the pressure ring 342 is pressed during welding, the pressure head 322 drives the wire to move directly to the next welding point for welding, avoiding the reverse curve stroke to make the wire stroke arch shape, reducing the stroke and material use in the process of wire, saving time cost and material cost; The pressure ring 342 is designed as "C" shape, avoiding the pressure ring 342 being stuck by the wire; Design has a placement table 15, the placement table 15 has rotating motor 13 to provide power to change the welding direction of the circuit board 16 and the chip 17, and cooperate with the stroke unit 2, facilitate the operation of wire packaging.

[0027] Further, the output end of the rotating motor 13 is inserted and fixed with the placement table 15, the placement table 15 is placed on the circuit board 16, and the circuit board 16 is placed on the chip 17.

[0028] Further, the stroke unit 2 includes a fixed frame 21 and a fixed plate 22, the fixed plate 22 is fixedly connected to the outside of the fixed frame 21, the fixed frame 21 is provided with a positioning guide rod 211 and a stroke screw 212 inside, the positioning guide rod 211 is located directly below the stroke screw 212, one end of the stroke screw 212 penetrates through the fixed frame 21 to the outside, and the left end of the fixed frame 21 is fixedly connected with the support frame 14.

[0029] In particular, the stroke screw 212 is connected with a stroke motor 221, the stroke motor 221 is fixedly arranged on the top of the fixed plate 22, and the fixed plate 22 is connected with a stand leg 213 at the bottom.

[0030] In particular, the positioning guide rod 211 and the stroke screw 212 are sleeved with a support column 23 outside, and the support column 23 is threadedly connected with the stroke screw 212.

[0031] It should be emphasized that the wire welding unit 3 includes a crossbeam 31 and a first hydraulic lifting rod 32. The first hydraulic lifting rod 32 is fixedly installed at the bottom of the crossbeam 31. The crossbeam 31 is fixedly connected to the top of the support column 23. A displacement guide rod 311 is provided on the inner side of the crossbeam 31. A positioning component 312 and a pulley 313 are provided on the top of the crossbeam 31. A metal wire welding shaft 36 is inserted into the positioning component 312. A first horizontal connecting rod 321 is provided at the output end of the first hydraulic lifting rod 32. The other end of the first horizontal connecting rod 321 is connected to the outside of the pressure head 322.

[0032] It should be emphasized that the bottom of the crossbeam 31 is provided with a wire sleeve 33 and a second hydraulic lifting rod 34. The wire sleeve 33 is located directly above the pressure head 322. The output end of the second hydraulic lifting rod 34 is connected to a second horizontal connecting rod 341. The second horizontal connecting rod 341 is connected to the outside of the pressure ring 342. The top of the second hydraulic lifting rod 34 is provided with a displacement connector 343, which is sleeved on the outside of the displacement guide rod 311.

[0033] It should be emphasized that a displacement screw 351 is inserted into the displacement connector 343, the displacement screw 351 passes through the crossbeam 31 and is connected to the displacement motor 35, and the displacement motor 35 is fixed to the left end of the crossbeam 31.

[0034] Working principle: First, start the workbench unit 1, rotate the motor 13 to drive the placement stage 15 to rotate, so that the circuit board 16 and the chip 17 are rotated to the side that needs to be soldered.

[0035] Then, the wire bonding unit 3 is started. The second hydraulic lifting rod 34 drives the pressure ring 342 to move down. The pressure ring 342 drives the wire bonding to be bonded to the chip 17. At this time, the wire bonding unit 3 is driven to move to the right by the stroke unit 2, while the second hydraulic lifting rod 34 is driven to move to the left by the displacement screw 351, so that the pressure ring 342 is fixed on the chip 17 to prevent the wire bonding from falling off.

[0036] Finally, when the wire bonding unit 3 moves to the designated position, the first hydraulic lifting rod 32 drives the pressure head 322 to move downward, so that the wire bonding is welded to the circuit board 16, completing the welding.

[0037] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A chip package wire bonding apparatus comprising a table (1), a stroke unit (2) and a wire bonding unit (3), characterized in that, The workbench (1) is a placement platform for chip packaging wire welding, the stroke unit (2) is used for the movement stroke of the wire welding unit (3), the wire welding unit (3) is used for chip wire packaging, the workbench (1) comprises support legs (11) and a support plate (12), the support plate (12) is fixedly arranged on the inner side of the support leg (11), the top of the support plate (12) is provided with a rotating motor (13), and the top of the support leg (11) is provided with a support frame (14). The wire welding unit (3) comprises a pressure head (322) and a pressure ring (342), the pressure ring (342) is arranged in a "C" shape, and the pressure ring (342) is located directly below the pressure head (322).

2. The wire bonding apparatus of claim 1, wherein the wire bonding apparatus is a chip package wire bonding apparatus. The output end of the rotating motor (13) is inserted and fixed with a placement table (15), the placement table (15) is placed with a circuit board (16), and the circuit board (16) is placed with a chip (17).

3. The wire bonding apparatus of claim 1, wherein the wire bonding apparatus is a chip package wire bonding apparatus. The stroke unit (2) comprises a fixed frame (21) and a fixed plate (22), the fixed plate (22) is fixedly connected to the outer side of the fixed frame (21), the inner side of the fixed frame (21) is provided with a positioning guide rod (211) and a stroke screw (212), the positioning guide rod (211) is located directly below the stroke screw (212), one end of the stroke screw (212) penetrates through the fixed frame (21) to the outer side, and the left end of the fixed frame (21) is fixedly connected with the support frame (14).

4. The chip package wire bonding apparatus of claim 3, wherein, The stroke screw (212) is connected with a stroke motor (221), and the stroke motor (221) is fixedly arranged on the top of the fixed plate (22).

5. The chip package wire bonding apparatus of claim 3, wherein, The outer sides of the positioning guide rod (211) and the stroke screw (212) are sleeved with a support column (23), and the support column (23) is threadedly connected with the stroke screw (212).

6. The chip package wire bonding apparatus of claim 1, wherein, The wire welding unit (3) comprises a cross beam (31) and a first hydraulic lifting rod (32), the first hydraulic lifting rod (32) is fixedly arranged on the bottom of the cross beam (31), the cross beam (31) is fixedly connected to the top of the support column (23), the inner side of the cross beam (31) is provided with a displacement guide rod (311), the top of the cross beam (31) is provided with a positioning piece (312) and a pulley (313), the metal wire shaft (36) is inserted into the positioning piece (312), and the output end of the first hydraulic lifting rod (32) is provided with a first cross connecting rod (321).

7. The chip package wire bonding apparatus of claim 6, wherein, The bottom of the cross beam (31) is provided with a wire sleeve (33) and a second hydraulic lifting rod (34), the wire sleeve (33) is located directly above the pressure head (322), the output end of the second hydraulic lifting rod (34) is connected with a second cross connecting rod (341), the second cross connecting rod (341) is connected to the outer side of the pressure ring (342), and the top of the second hydraulic lifting rod (34) is provided with a displacement connecting piece (343).

8. The chip package wire bonding apparatus of claim 7, wherein, The shift connecting piece (343) is inserted with a shift screw (351), the shift screw (351) is connected with a shift motor (35) penetrating the crossbeam (31), and the shift motor (35) is fixed at the left end of the crossbeam (31).

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