Gas supply system

Abstract

The embodiment of the utility model provides a gas supply system (100). The gas supply system (100) is used for a fluid tank (200) in the manufacturing process of a component bearing piece. The gas supply system (100) comprises: at least one gas input main line (110); at least two gas output branch lines (120), each of the gas output branch lines (120) extending at least partially into the fluid tank (200), each of the gas output branch lines (120) having one or more gas output ports (124), the gas output branch pipeline (120) is configured to supply gas received from the gas input main pipeline (110) into the fluid tank (200) through the gas output port (124); the gas buffering device (130) is constructed to enable the gas flow from the gas input main pipeline (110) to be conveyed towards the at least two gas output branch pipelines (120).

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor device manufacturing, and in particular to a gas supply system. BACKGROUND

[0002] This section provides background information to the present application which is not necessarily prior art.

[0003] In the background of increasing functionality of products equipped with one or more component carriers such as printed circuit boards and the ever-increasing miniaturization of such electronic components and the rising number of electronic components to be mounted on the component carriers, ever more powerful array-like components or packages with several electronic components are being employed. Such array-like components or packages have a plurality of contacts or connections between which the spacing is becoming ever smaller. Such component carriers should have mechanical robustness and electrical reliability in order to be able to operate even under harsh conditions.

[0004] In the process of manufacturing component carriers, plating processes are one of the important manufacturing processes. It has always been challenging to form a plating layer on a component carrier with higher uniformity and thinner thickness. In the plating process, how to effectively control the gas required in the plating process is crucial. SUMMARY

[0005] This section provides a general summary of the application, and not a comprehensive disclosure of its full scope or all of its features.

[0006] According to embodiments of the present application, a gas supply system is provided. The gas supply system is used in a fluid tank in a manufacturing process of a component carrier. The gas supply system comprises: at least one gas input main pipe; at least two gas output branch pipes, each of the gas output branch pipes extending at least partially into the fluid tank, each of the gas output branch pipes having one or more gas output ports, the gas output branch pipes being configured to supply gas received from the gas input main pipe into the fluid tank through the gas output ports; and a gas buffer device configured to deliver a gas flow from the gas input main pipe towards the at least two gas output branch pipes.

[0007] In the context of the present application, the term "fluid tank" can particularly denote a tank structure configured to allow the containment of chemical solutions and perform plating operations. In other words, a fluid tank is a tank structure configured to allow the containment of chemical solutions and perform plating operations. A fluid tank can also allow the management of temperature, pressure and fluid flow required for chemical reactions to facilitate the uniformity and effectiveness of the plating process. Fluids used in a fluid tank can be gases and / or liquids to accommodate different process requirements and operating conditions.

[0008] It is noted that in some exemplary descriptions of the present application, the technical solutions of the present application will be described with reference to metal plating processes, particularly chemical copper plating processes. In such descriptions, a fluid tank can particularly denote a liquid tank allowing chemical reduction reactions to take place therein to achieve copper deposition. However, it can be appreciated that the technical solutions of the present application can also be applicable to non-metal plating processes or electroplating metal processes.

[0009] In the context of the present application, the term "gas buffer device" can particularly denote a device having an internal volume disposed in a gas supply system in association with a gas input main line and gas output branch lines. A gas buffer device can particularly have the ability to stabilize and / or regulate gas flow. In use, the internal volume of a gas buffer device will preferably be filled with gas at all times. In particular, the internal volume of a gas buffer device is pre-filled with gas from a gas input main line prior to the delivery of gas to a gas output branch line. This enables a gas buffer device to provide a continuous, greater gas flow pressure to reduce or clear potential gas output port blockages, particularly to reduce or clear crystal or other particulate matter that can form in and / or around a gas output port during a deposition process, and to enable gas to be supplied to each gas output branch line to some extent under equal gas pressure and equal gas flow conditions, particularly when each gas output branch line is provided with gas output ports of the same conditions (e.g. number, diameter, spacing), each gas output port can thus release gas to a fluid tank evenly.

[0010] In the context of the present application, the term "gas input main line" can particularly denote a primary line for delivering gas from a gas source to other lines and equipment in a gas supply system. A gas input main line can enable other lines and equipment in the system to be provided with a substantially constant supply of gas.

[0011] In the context of the present application, the term "gas output branch line" can particularly mean a plurality of secondary lines fluidically connected to the gas buffer device for delivering the buffered gas to an end application point, such as a fluid tank. The term "fluidically connected" can particularly mean that the components are connected to each other in the direction of the fluid flow, or in other words, that the components are connected to each other with internal fluid as a connection means. The gas output branch line can be designed to extend partially or entirely to a specific reaction zone. Each gas output branch line can be equipped with one or more gas output ports in order to provide a balanced and precise gas flow to the target zone during operation. The gas output branch line can take various lengths and diameters to adapt to specific operating conditions.

[0012] In the context of the present application, the term "component carrier structure" can particularly mean any support structure capable of receiving one or more components thereon and / or therein to provide mechanical support and / or electrical connection and / or optical connection and / or thermal connection. In other words, the component carrier can be configured as a mechanical carrier and / or an electronic carrier for the components.

[0013] Exemplary embodiments provide a gas supply system for a fluid tank that can be applied in a manufacturing process of a component carrier. The gas supply system comprises at least one gas input main line, at least two gas output branch lines, and a gas buffer device. The gas input main line receives a gas to be delivered from a gas source and delivers the received gas in the form of a gas flow to the gas buffer device. The gas buffer device delivers the gas flow from the gas input main line towards the gas output branch lines. Each gas output branch line extends at least partially into the fluid tank to supply the received gas into the fluid tank through gas output ports thereon.

[0014] Providing a gas buffer device between the gas input main line and the gas output branch lines in the direction of gas flow can promote a continuous and stable gas flow. Without the gas buffer device, the gas input main line is directly connected to each gas output branch line in a fluidic and non-equidistant manner, thus each gas output branch line is provided with an unbalanced (e.g., different flow rate and / or different pressure) gas flow. The flow rate and pressure of the gas in each gas output branch line decrease as the distance from the gas input main line increases. Taking the electroless copper plating process as an example (in which the gas is oxygen), part of the oxygen gas in the gas output branch line can be released to the fluid tank through some gas output ports that are relatively far from the gas input main line, and the flow rate and pressure of the oxygen gas near these gas output ports decrease due to the increase in the distance from the gas input main line, resulting in insufficient dissolved oxygen, which in turn causes the intermediate by-products of the reaction to be unable to be lifted to an electron level to dissolve into the solution, forming unwanted crystal residues (e.g., copper nodules, oxides, and other residual particles) at the gas output ports, thereby causing the obstruction of the gas output ports. Partial or complete obstruction of one or more of the gas output ports on the gas output branch line can cause the gas flow rate and pressure in the gas output branch line to fluctuate, thereby degrading the deposition effect. The gas in the internal volume of the gas buffer device is always filled to provide a positive pressure environment to prevent the accumulation of crystal residues in and / or around the gas output ports. The positive pressure can effectively "push" the deposits that are not expected to appear in and / or around the gas output ports away or prevent their formation. In addition, the gas buffer device can accumulate gas to quickly release the accumulated gas when needed, thereby providing an additional gas impact to clear possible obstructions.

[0015] The gas buffer device improves the stability and reliability of the deposition process by improving the responsiveness and adaptability of the entire gas supply system. This allows the formed plated layer (e.g., copper plated layer) to have improved uniformity and reduced layer thickness. The improved uniformity and reduced layer thickness of the plated layer will support the development of lower line / space ratios, such as line / space ratios of 8 microns / 8 microns, or even 5 microns / 5 microns. This is particularly important for the miniaturization and high-density wiring of modern electronic devices. In addition, since the improved technology provides better layer thickness uniformity, the occurrence of open circuit (incomplete connection) and short circuit (excessive connection) defects in the lines can be reduced or prevented.

[0016] In the following, further exemplary embodiments of the gas supply system will be explained.

[0017] In some optional embodiments, the gas buffer device is configured to regulate the gas flow delivered from the gas input main line towards the at least two gas output branch lines.

[0018] By regulating the gas flow delivered between the gas input main line and the gas output branch lines with the gas buffer device, possible gas pressure fluctuations or gas flow fluctuations from the input main line or the output branch lines will be effectively absorbed, thereby maintaining the stability of the gas output. Such stability helps to avoid deposition inhomogeneity or process condition changes caused by gas flow fluctuations. The gas buffer device can also adjust the gas species and flow rate under different working conditions according to process needs, thereby improving the flexibility and compatibility of the system when facing various materials or reaction conditions. In summary, the gas buffer device effectively optimizes the performance of the gas supply system and the stability of the process operation by regulating the gas flow delivered from the gas input main line towards the gas output branch lines, giving more controllability and flexibility to the complex manufacturing process. The regulated gas can be, for example, non-chemically reactive carrier gases used for other gas delivery or removal, precursor gases participating in chemical reactions, reactive gases, or stable functional gases in the process of component carrier manufacturing.

[0019] In some alternative embodiments, the gas supply system can include the same number of gas output ports in at least two of the gas output branch lines. Having the same number of gas output ports on different gas output branch lines can facilitate uniform distribution of gas among the multiple branch lines, which is advantageous for process environments requiring the same conditions.

[0020] In some alternative embodiments, the gas supply system can include different numbers of gas output ports in at least two of the gas output branch lines. Having different numbers of gas output ports on different gas output branch lines allows for customized settings to accommodate the characteristics of different regions or stages requiring different gas flow rates.

[0021] In some alternative embodiments, the gas supply system can include the same distribution of gas output ports along the length of the gas output branch lines in at least two of the gas output branch lines. In addition, the size, shape, and / or gas release form of the gas output ports on at least two of the gas output branch lines can also be set in the same form. This can facilitate uniform distribution of gas among the multiple branch lines.

[0022] In some alternative embodiments, the gas supply system can include different gas outlet port distributions along the length of the gas output branch lines in at least two of the gas output branch lines. Different gas outlet port distributions along the length of the branch lines allow customization of gas supply according to specific process requirements, such that certain zones can receive more or less gas. In addition, the size, shape, and / or gas release form of the gas outlet ports on at least two of the gas output branch lines can also be arranged in different forms to meet the production process requirements of different zones.

[0023] In some alternative embodiments, the gas buffer device can include a box-shaped body fluidly connected between the gas input main line and the gas output branch lines. The box-shaped body has an interior space defining an internal volume. The interior space of the box-shaped body is in fluid communication with the gas input main line and the gas output branch lines, respectively. It can be appreciated that in further embodiments, the gas buffer device can have a body of different shape having an internal volume, such as a circular or irregularly shaped body.

[0024] In some alternative embodiments, the gas supply system can be configured such that gas flow from the gas input main line flows through the gas buffer device and the gas output branch lines, thereby entering the fluid tank through the gas outlet ports on the gas output branch lines. Via the gas buffer device, gas can be better distributed optimized before entering the gas output branch lines, ensuring that each gas outlet port can receive gas flow evenly, thereby achieving uniform deposition effect in the fluid tank. As the gas buffer device allows temporary storage and redistribution of flow, more flexible operation structure can be introduced in the system to adapt to changes in different process conditions without the need to change the mechanical structure.

[0025] In some alternative embodiments, the gas buffer device can be configured to have a closed space isolated from the external environment, in which gas from the gas input main line can be buffered. The closed space can help to absorb pressure fluctuations from the gas input main line to provide a more stable pressure output. The closed space can act as a temporary storage device, allowing gas to be properly adjusted before reaching the output branch lines. This adjustment capability allows more precise management of gas flow at different stages and operating conditions. Such a closed space also allows gas to be quickly stored and released, thereby improving the system's ability to provide gas quickly when needed. This design can be particularly useful when dealing with sudden demand or adjusting process parameters.

[0026] In some alternative embodiments, at least one of the at least two gas output branch lines can include a gas release section, the gas output ports can be distributed on the gas release section, and the gas release section can extend at least partially into the fluid tank such that gas is released into the fluid tank via the gas output ports. By precisely positioning and controlling the release point of gas, the loss of gas during transportation is reduced, and the possible adverse effects on the environment are reduced, thereby optimizing the use of gas resources.

[0027] In some alternative embodiments, the gas release section included in at least one of the at least two gas output branch lines can be an end section of the respective gas output branch line. Using the end of the line as the release point in the fluid tank facilitates direct delivery of gas to the target area, thereby increasing the contact area of the gas with the fluid medium.

[0028] In some alternative embodiments, the gas release sections of the at least two gas output branch lines are uniformly spaced apart in the fluid tank. This facilitates the uniform distribution of gas in the fluid tank. In some embodiments, the gas release sections of the at least two output branch lines are arranged to extend parallel to each other in the fluid tank. In some embodiments, the gas release sections of the at least two gas output branch lines are arranged to extend non-parallel to each other in the fluid tank.

[0029] In some alternative embodiments, the gas buffer device can include at least two buffer chambers. Each buffer chamber can be in fluid communication with all or part of the gas output branch lines in the gas supply system, according to the requirements of the manufacturing process. In some implementations, the at least two buffer chambers can be in fluid communication with each other. In some implementations, the at least two buffer chambers can be fluidically isolated from each other. In some implementations, some of the buffer chambers of the gas buffer device are in fluid communication with each other, while the remaining buffer chambers are fluidically isolated from each other. The diversified design of buffer chambers can allow further refined adjustment of the gas flow into the gas output branch lines.

[0030] In some alternative embodiments, one or more gas flow guides can be provided in each of the buffer chambers. In the gas flow path, the flow guides can effectively guide the gas flow, reduce vortex and turbulence in the buffer chamber, and make the gas flow more stable. Stable gas flow helps to improve the overall efficiency and reliability of the system.

[0031] In some alternative embodiments, the gas supply system can include at least one regulating valve. The at least one regulating valve can be disposed in association with the gas output branch line to regulate the flow of gas in the gas output branch line. The regulating valve allows for precise regulation of the flow of gas to or through the corresponding branch line, for example, by a regulating valve regulating the flow of gas in the at least two gas output branch lines as a whole to control the total amount of gas output, or preferably, by a plurality of regulating valves regulating the flow of gas in the at least two gas output branch lines respectively. The number, position, and the like of the regulating valves can vary to meet specific process conditions or operational requirements.

[0032] In some alternative embodiments, the gas supply system can include at least two regulating valves, each of which is disposed in association with a corresponding gas output branch line to regulate the flow of gas in the corresponding gas output branch line. In some implementations, each regulating valve can be disposed at an upstream end of a corresponding one of the gas output branch lines in the direction of gas flow. In some implementations, each regulating valve can be disposed between the gas buffer device and a corresponding one of the gas output branch lines in the direction of gas flow to regulate the flow of gas from the gas buffer device into the corresponding gas output branch line. In other implementations, the regulating valves can be disposed on the gas buffer device, in particular, each regulating valve can be disposed on the gas buffer device in association with a corresponding gas output branch line.

[0033] Each regulating valve is associated with a specific gas output branch line to allow for individual regulation of the flow of gas to or through each gas output branch line. Independent control of the flow of gas corresponding to each gas output branch line enables the system to make adjustments more quickly when process conditions or requirements change, thereby improving the responsiveness and adaptability of the production line.

[0034] In some alternative embodiments, the gas supply system further includes at least one detection device associated with the gas output branch lines, the at least one detection device being configured to detect data related to the flow of gas into at least one of the gas output branch lines. In some implementations, the data related to the flow of gas can be the flow rate or the pressure of the gas. Accordingly, the detection device can be a flow meter or a pressure sensor. Upon detection of abnormal data by the detection device, the regulating valve can be operated in response to adaptively regulate the flow of gas.

[0035] In some alternative embodiments, each of the at least one detection device is arranged on a respective one of the gas output branch lines. In particular, each gas output branch line is equipped with a detection device for real-time detection of the gas flow in this line. Generally, the detection devices can be arranged on the gas output branch lines after the regulating valves in the direction of travel of the gas flow.

[0036] In some alternative embodiments, the gas input main line has a larger diameter than the gas output branch lines.

[0037] In embodiments, the component carrier comprises a stack of at least one insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier can be a laminate of the mentioned insulating layer structures and electrically conductive layer structures, in particular a laminate formed by applying mechanical pressure and / or thermal energy. The mentioned stack can provide a plate-like component carrier which can provide a large mounting surface for further components and still be very thin and compact.

[0038] In embodiments, the component carrier or a preform thereof is configured as one of a printed circuit board, a substrate, in particular an IC substrate, and an interposer.

[0039] In the context of the present application, the term "printed circuit board" (PCB) can in particular denote a plate-like component carrier formed by laminating a plurality of electrically conductive layer structures with a plurality of insulating layer structures, for example by applying pressure and / or providing thermal energy. The various electrically conductive layer structures can be connected to each other in a desired manner by forming holes through the laminate, for example by laser drilling or mechanical drilling, and by partially or completely filling the holes with an electrically conductive material, in particular copper, thereby forming vias such as through-hole connections. In addition to one or more components which can be embedded in the printed circuit board, the printed circuit board is generally configured to accommodate one or more components on one or both opposite surfaces of the plate-like printed circuit board. They can be connected to the respective main surface by soldering. The dielectric part of the PCB can consist of a resin with reinforcing fibers such as glass fibers.

[0040] In the context of the present application, the term "substrate" can in particular denote a submount. The substrate can be a relatively small submount related to a PCB, on which one or more components can be mounted and which can act as a connection medium between one or more chips and another PCB. For example, the substrate can have substantially the same size as the components, in particular electronic components, to be mounted thereon, for example in case of a chip scale package (CSP). More particularly, the substrate can be understood as a carrier for electrical connections or electrical networks and as a submount comparable to a printed circuit board (PCB), but with a comparably high density of laterally and / or vertically arranged connections. The lateral connections are for example electrically conductive paths, while the vertical connections can be for example vias. These lateral and / or vertical connections are arranged within the substrate and can be used to provide electrical, thermal and / or mechanical connections of the components, in particular of the IC chips, with or without housing, such as bare dies, to a printed circuit board or an intermediate printed circuit board. Thus, the term "substrate" also includes "IC substrates". The dielectric part of the substrate can consist of a resin with reinforcing particles, such as reinforcing spheres, in particular glass spheres.

[0041] The substrate or interposer can comprise or consist of at least a layer of glass; silicon and / or a photosensitive or dry-etchable organic material, such as an epoxy-based build-up material (e.g. an epoxy-based build-up film); or a polymeric compound (which can or can not include light- and / or heat-sensitive molecules).

[0042] In embodiments, the at least one insulating layer structure comprises at least one of a resin (e.g. a reinforced or non-reinforced resin, e.g. an epoxy resin or a bismaleimide-triazine resin), a cyanate ester resin, a polyphenylene derivative, a glass (in particular glass fibers, multi-layer glass, glass-like materials), a prepreg material (e.g. FR-4 or FR-5), a polyimide, a polyamide, a liquid crystal polymer (LCP), an epoxy resin-based build-up film, polytetrafluoroethylene (PTFE, Teflon), a ceramic and a metal oxide. Reinforcing structures made of glass (multi-layer glass), for example meshes, fibers or spheres, can also be used. While for rigid PCBs, a prepreg, in particular FR4, is generally preferred, other materials, in particular epoxy resin-based build-up films or photoimageable dielectric materials, can also be used. For high frequency applications, high frequency materials such as polytetrafluoroethylene, liquid crystal polymers and / or cyanate ester resins, low temperature co-fired ceramics (LTCC) or other low, very low or ultra-low DK materials can be applied in the submount as electrically insulating layer structure.

[0043] In embodiments, the at least one electrically conductive layer structure comprises at least one of: copper, aluminum, nickel, silver, gold, palladium, tungsten, magnesium, carbon, (in particular doped) silicon, titanium, and platinum. Although copper is generally preferred, other materials or coated variants thereof, in particular coated with a superconductive material or a conductive polymer, such as graphene or polyacetylene, respectively, are also possible.

[0044] In embodiments, at least one component can be embedded in the stack. Such a component can be selected from at least one of the following: a non-conductive inlay, a conductive inlay, such as a metallic inlay, preferably comprising copper or aluminum, a heat transfer unit, e.g. a heat pipe, a light guiding element, e.g. a light waveguide or a light conductor connection, an electronic component or a combination thereof. The inlay can be, for example, a metal block (IMS-inlay) with or without a coating of an insulating material, which can be embedded or surface mounted for the purpose of facilitating heat dissipation. Suitable materials are defined in terms of the thermal conductivity of the material, which should be at least 2 W / mK. Such materials are typically based on, but not limited to, metals, metal oxides and / or ceramics, e.g. copper, aluminum oxide (AI2O3) or aluminum nitride (AIN). In order to increase the heat exchange capacity, other geometrical shapes with increased surface area are also frequently used. Furthermore, the component can be an active electronic component (with at least one implemented p-n junction), a passive electronic component such as a resistor, an inductor or a capacitor, an electronic chip, a storage device (e.g. a DRAM or other data memory), a filter, an integrated circuit (such as a field-programmable gate array (FPGA), programmable array logic (PAL), generic array logic (GAL), and complex programmable logic device (CPLD)), a signal processing component, a power management component (such as a field-effect transistor (FET), a metal-oxide-semiconductor field-effect transistor (MOSFET), a complementary metal-oxide-semiconductor (CMOS), a junction field-effect transistor (JFET), or an insulated-gate field-effect transistor (IGFET), all of which are based on a semiconductor material such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga2O3), indium gallium arsenide (InGaAs), indium phosphide (InP) and / or any other suitable inorganic compound), an optoelectronic interface element, a light-emitting diode, a light coupler, a voltage converter (e.g. a DC / DC converter or an AC / DC converter), a cryptographic component, a transmitter and / or receiver, an electromechanical transducer, a sensor, an actuator, a microelectromechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductor, a battery, a switch, a video camera, an antenna, a logic chip and an energy harvesting unit. However, other components can also be embedded in the component carrier. For example, a magnetic element can be used as a component. Such a magnetic element can be a permanent magnetic element (such as a ferromagnetic element, an antiferromagnetic element, a multiferroic element or a ferrimagnetic element, e.g. a ferrite core) or can be a paramagnetic element. However, the component can also be an IC substrate, an interposer or other component carrier, e.g. in a board-in-board configuration. The component can be surface mounted on the component carrier and / or can be embedded in the interior of the component carrier. Furthermore, other components, in particular components that generate and emit electromagnetic radiation and / or are sensitive to electromagnetic radiation propagating from the environment, can also be used as components.

[0045] The above-defined aspects and further aspects of the present application become apparent from the examples of embodiments described below and with reference to these examples of embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0046] The features and advantages of the embodiments of the present application will become more apparent from the following description of the embodiments with reference to the accompanying drawings, on which:

[0047] Figure 1 A structural schematic of a gas supply system according to an exemplary embodiment of the present application is provided.

[0048] Figure 2 A gas output branch line portion in a gas supply system according to an exemplary embodiment of the present application is schematically shown as extending partially into a fluid tank.

[0049] Figure 3 A schematic cross-sectional view of a gas buffer device in a gas supply system according to an exemplary embodiment of the present application is provided, in which a buffer chamber and a flow guide plate are shown.

[0050] Figure 4 A comparison chart of a standard deviation of a copper plating layer thickness in the related art and a standard deviation of a copper plating layer thickness obtained by applying the technology of the present application is shown. DETAILED DESCRIPTION

[0051] The present application will now be described in detail with reference to the accompanying drawings, by way of example of embodiments of the present application. It should be noted that the following detailed description of the present application is merely provided for the purpose of illustration, rather than to limit the present application. In addition, the same reference numerals are used throughout the drawings to designate the same components.

[0052] It should also be noted that, in the specification and drawings, all the features of the actual specific embodiments are not described and shown for the sake of clarity, and in addition, in order to avoid obscuring the technical solutions of the present application with unnecessary details, only the arrangements closely related to the technical content of the present application are described and shown in the specification and drawings, and other details which are not closely related to the technical content of the present application and which are known to those skilled in the art are omitted.

[0053] In order to make the purposes, technical solutions, and advantages of the embodiments of the present application clearer, the embodiments of the present application will be described in detail below with the accompanying drawings. However, those skilled in the art can understand that, in the embodiments of the present application, many technical details are presented in order to make the readers better understand the present application. However, the technical solutions claimed by the present application can be implemented even without these technical details and based on various changes and modifications of the following embodiments. The division of the following embodiments is for the convenience of description, and should not constitute any limitation on the specific embodiments of the present application, and the embodiments can be combined with each other and cited to each other without contradiction.

[0054] It should be noted that the terms "first", "second", and the like in the description, claims, and drawings of the present application are used to distinguish like objects, and do not necessarily indicate a particular order or sequence, and should not be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. It should be understood that the terms used in this way can be interchanged as appropriate, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device including a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0055] In the present document, terms such as "upper", "lower", "outer", and "inner" used to describe the orientation are only for the purpose of convenience of description, and should not be considered as limiting. In addition, although the present application has been described with reference to the exemplary embodiments, it should be understood that the present application is not limited to the specific embodiments described and illustrated in detail. Those skilled in the art can make various changes to the exemplary embodiments without departing from the scope defined by the claims of the present application.

[0056] Referring to Figure 1 and Figure 2 The gas supply system 100 according to the exemplary embodiments of the present application can be applied to the fluid tank 200 in the manufacturing process of the component carrier. As shown in Figure 1 , the gas supply system 100 can include at least one gas input main pipe 110, a gas buffer device 130, and at least two gas output branch pipes 120.

[0057] The gas input main line 110 can receive gas from a gas source and deliver the received gas to other devices and lines in the system. Each gas output branch line 120 can be provided with one or more gas output ports 124. Each gas output branch line 120 can extend at least partially into the fluid tank 200 to supply gas received from the gas input main line 110 into the fluid tank 200 through the gas output ports 124 (see Fig. 1). The gas buffer device 130 can be configured to deliver a gas flow from the gas input main line 110 towards the gas output branch line 120. In particular, the gas flow can flow from the gas input main line 110 through the gas buffer device 130 and the gas output branch line 120, thereby entering the fluid tank 200 through the gas output ports 124 on the gas output branch line 120. Figure 2 The gas buffer device 130 can be configured to deliver a gas flow from the gas input main line 110 towards the gas output branch line 120. In particular, the gas flow can flow from the gas input main line 110 through the gas buffer device 130 and the gas output branch line 120, thereby entering the fluid tank 200 through the gas output ports 124 on the gas output branch line 120.

[0058] The gas buffer 130, disposed between the gas input main line 110 and the gas output branch lines 120 in the direction of gas flow, can cause the pressure in the system to be equalized or nearly equalized, i.e., pi = p2 = p3 =... = pn and pi = pi', p2 = p2', p3 = p3', and pn = pn' (pi, p2, p3,..., pn are the pressure values at the top of the gas output branch lines 120, and pi', p2', p3',..., pn' are the pressure values at the end of the gas output branch lines 120), thereby facilitating continuous and stable gas flow in the system. Without the gas buffer 130, the gas input main line 110 and the gas output branch lines 120 are directly connected in a fluidic and non-equidistant manner, so the gas output branch lines 120 are provided with an unbalanced (e.g., different flow rates and / or different pressures) gas flow. The flow rate and pressure of the gas in the gas output branch lines 120 decrease as the distance from the gas input main line 110 increases. Taking the electroless copper plating process as an example (in which the gas is oxygen), part of the oxygen in the gas output branch lines 120 will be released to the fluid tank 200 through some gas output ports 124 that are relatively far from the gas input main line 110. The flow rate and pressure of the oxygen near these gas output ports decrease due to the increase in distance from the gas input main line 110, resulting in insufficient dissolved oxygen, which in turn causes the intermediate byproducts of the reaction to be unable to be dissolved into the solution, forming unwanted crystal residues (e.g., copper nodules, oxides, and other residual particles) at the gas output ports 124, thereby blocking the gas output ports 124. Partial or complete blocking of any gas output port 124 on the gas output branch lines 120 can cause the gas flow rate and gas pressure in that gas output branch line 120 to fluctuate more severely, thereby degrading the deposition effect. The gas that always fills the internal volume of the gas buffer 130 can provide a positive pressure environment to prevent the accumulation of crystals and the like in and / or around the gas output ports 124. The positive pressure can effectively "push" away or prevent the formation of deposits that are not desired to appear in and / or around the gas output ports 124.

[0059] The gas buffer 130 improves the stability and reliability of the deposition process by improving the responsiveness and adaptability of the entire gas supply system 100. This allows the formed plating layer (e.g., copper plating layer) to have improved uniformity and reduced layer thickness. The improved uniformity and reduced layer thickness of the plating layer will support the development of lines with lower line / space ratios (e.g., support the development of 8 micron / 8 micron, or even 5 micron / 5 micron, line / space ratio lines). In addition, better layer thickness uniformity can also reduce or prevent the occurrence of open circuit (incomplete connection) or short circuit (excessive connection) defects in the lines.

[0060] The number of gas outlets 124 provided on the different gas output branch lines 120 can be uniform or varied. For example, at least two of the gas output branch lines 120 of the gas supply system 100 can comprise the same number of gas outlets 124. For example, at least two of the gas output branch lines 120 of the gas supply system 100 can comprise different numbers of gas outlets 124.

[0061] The distribution of gas outlets 124 on the different gas output branch lines 120 can be uniform or varied. For example, at least two of the gas output branch lines 120 of the gas supply system 100 can comprise the same distribution of gas outlets 124 along the length (longitudinal extension) of the gas output branch line 120. For example, at least two of the gas output branch lines 120 of the gas supply system 100 can comprise different distributions of gas outlets 124 along the length (longitudinal extension) of the gas output branch line 120. Furthermore, the size, shape and / or gas release form of the gas outlets on at least two of the gas output branch lines 120 can also be provided in the same form.

[0062] Generally, the diameter of the gas input main line 110 is larger than the diameter of the gas output branch lines 120.

[0063] The gas buffer device 130 can also be configured to regulate the flow of gas being transported from the gas input main line 110 towards the gas output branch lines 120. In particular, the gas buffer device 130 can regulate the flow rate and / or pressure of the gas flowing to the gas output branch lines 120. Also in particular, the gas buffer device 130 can selectively regulate the flow of gas being transported towards the different gas output branch lines 120 individually or in association. With the regulating capabilities of the gas buffer device 130, possible fluctuations in gas pressure or gas flow rate from the transport line will likely be effectively absorbed.

[0064] As shown in Fig. 1, the gas supply system 100 can comprise a gas buffer device 130. The gas buffer device 130 can be configured to regulate the flow of gas being transported from the gas input main line 110 towards the gas output branch lines 120. In particular, the gas buffer device 130 can regulate the flow rate and / or pressure of the gas flowing to the gas output branch lines 120. Also in particular, the gas buffer device 130 can selectively regulate the flow of gas being transported towards the different gas output branch lines 120 individually or in association. With the regulating capabilities of the gas buffer device 130, possible fluctuations in gas pressure or gas flow rate from the transport line will likely be effectively absorbed. Figure 1 As shown in Fig. 1, the gas supply system 100 can comprise a gas buffer device 130. The gas buffer device 130 can be configured to regulate the flow of gas being transported from the gas input main line 110 towards the gas output branch lines 120. In particular, the gas buffer device 130 can regulate the flow rate and / or pressure of the gas flowing to the gas output branch lines 120. Also in particular, the gas buffer device 130 can selectively regulate the flow of gas being transported towards the different gas output branch lines 120 individually or in association. With the regulating capabilities of the gas buffer device 130, possible fluctuations in gas pressure or gas flow rate from the transport line will likely be effectively absorbed.

[0065] In some embodiments, the gas buffer device 130 can be configured to have a closed space isolated from the external environment, in which gas from the gas input main line 110 can be temporarily stored. For example, the inner space of the box-shaped body 132 can be a closed space isolated from the external environment. The gas always filled in the closed space can provide a positive pressure environment during the gas delivery to effectively clean or prevent the formation of accumulations that are not desired to appear in and / or around the gas output port 124.

[0066] As shown in Figure 3 , the inner space of the gas buffer device 130 can also be divided into two or more buffer chambers 134. The different buffer chambers 134 can be selectively fluidly connected or fluidly isolated. Each buffer chamber 134 can be selectively fluidly connected with part or all of the gas output branch lines 120 of the gas supply system 100.

[0067] Still referring to Figure 3 , one or more gas baffles 136 can be provided in each buffer chamber 134 for effectively guiding the gas flow, reducing the vortex and turbulence in the buffer chamber. The vertical height of the gas baffle 136 is preferably not more than one third of the vertical height of the buffer chamber 134 to avoid hindering the delivery of the gas flow.

[0068] Referring to Figure 2 , at least one of the gas output branch lines 120 of the gas supply system 100 can include a gas release section 122. In particular, all of the gas output branch lines 120 of the gas supply system 100 include a gas release section 122. In particular, the gas release sections 122 of the respective gas output branch lines 120 are uniformly spaced apart in the fluid tank 200. More particularly, the gas release sections 122 of the respective gas output branch lines 120 are uniformly spaced apart and extend parallel to each other in the fluid tank 200.

[0069] The gas output ports 124 can be distributed on the gas release sections 122. Preferably, the gas release sections 122 are end sections of the respective gas output branch lines 120, such that the gas output ports 124 are distributed at positions close to the end of the respective gas output branch lines 120. The gas release sections 122 can at least partially extend into the fluid tank 200, such that the gas is released into the fluid tank 200 via the gas output ports 124.

[0070] Referring back to Figure 1The gas supply system 100 can further include at least one regulating valve 140. The at least one regulating valve 140 can be disposed in association with the gas output branch line 120 to regulate the flow of gas in the gas output branch line 120. It can be appreciated that the number, location, disposition, etc. of the regulating valves are not limited to the illustrated implementation, but are subject to the particular process conditions or operational requirements.

[0071] In some implementations, the gas supply system 100 can include a regulating valve 140 corresponding to the number of gas output branch lines 120. Each regulating valve 140 is disposed in association with a respective gas output branch line 120 to regulate the flow of gas in the respective gas output branch line 120.

[0072] The location of the regulating valves 140 can vary depending on the requirements. In some implementations, each regulating valve 140 can be disposed upstream (closer to the gas buffer device 130 in the direction of gas flow) of an upstream end of a respective one of the gas output branch lines 120 in the direction of gas flow. In particular, in such implementations, the regulating valve 140 can also be positioned adjacent to the gas buffer device 130. In some implementations, each regulating valve 140 can be disposed between the gas buffer device 130 and a respective one of the gas output branch lines 120 in the direction of gas flow (rather than physically located above the gas buffer device 130 or above the gas output branch line 120) to regulate the flow of gas from the gas buffer device 130 into the respective gas output branch line 120. In some implementations, the regulating valve 140 can be physically disposed on the gas buffer device 130, in particular, each regulating valve 140 can be disposed on the gas buffer device 130 in association with a respective gas output branch line 120.

[0073] Still referring to Figure 1 The gas supply system 100 can further include a detection device 150 associated with the gas output branch line 120. Each detection device 150 can be disposed on the gas output branch line 120 (to be detected by the detection device 150) associated therewith. The detection device 150 can be configured to detect data (such as gas flow rate and / or gas pressure) related to the flow of gas into the gas output branch line 120.

[0074] In some implementations, the detection device 150 can be disposed downstream of the regulating valve 140 in the direction of gas flow.

[0075] The gas supply system 100 can further comprise a control device 160. The control device 160 can be configured to receive data related to the gas flow in the gas output branch line 120 from the detection device 150 in real time, and issue a warning when the data is determined to be abnormal. For example, when the control device 160 determines that the detected data value deviates from the normal value by a predetermined percentage (such as 3%, 5%, 10%), it is determined that the data is abnormal and a warning is issued.

[0076] The control device 160 can be further configured to automatically control the regulating valve 140 for regulating the gas flow in the gas output branch line 120 when it is determined that the data related to the gas flow received from the detection device 150 is abnormal, until the data related to the gas flow received from the detection device 150 is not abnormal.

[0077] Figure 4 A comparison chart of the standard deviation of the copper plating layer thickness in the related art (ordinate) and the standard deviation of the copper plating layer thickness obtained by applying the technology of the present application is shown. It can be seen from the chart that applying the gas supply system 100 provided by the embodiments of the present application to participate in the copper deposition process in the manufacturing process of the component carrier can effectively improve the uniformity of the copper plating layer.

[0078] Although the present application has been described with reference to the example embodiments, it is to be understood that the present application is not limited to the particular details described and it is understood that various changes can be made to the embodiments described without departing from the scope of the present application as defined by the claims.

[0079] The features mentioned and / or shown in the above description of the example embodiments of the present application can be combined in one or more other embodiments, both in the same combination and in other combinations, or replaced by other features. The technology obtained by combining the features mentioned and / or shown in the above description is also included within the scope of the present application.

Claims

1. A gas supply system (100) for a fluid slot (200) in a manufacturing process of a component carrier, characterized in that, The gas supply system (100) comprises: at least one gas input main line (110); at least two gas output branch lines (120), each of the gas output branch lines (120) extending at least partially into the fluid tank (200), each of the gas output branch lines (120) having one or more gas output ports (124), the gas output branch lines (120) being configured to supply gas received from the gas input main line (110) into the fluid tank (200) through the gas output ports (124); a gas buffer device (130) configured to transport a flow of gas from the gas input main line (110) towards the at least two gas output branch lines (120).

2. The gas supply system (100) according to claim 1, characterized in that The gas buffer device (130) is configured to regulate the flow of gas transported from the gas input main line (110) towards the at least two gas output branch lines (120).

3. The gas supply system (100) according to claim 1 or 2, wherein the gas supply system (100) comprises the same number of gas output ports (124) in at least two of the gas output branch lines (120); or the gas supply system (100) comprises a different number of gas output ports (124) in at least two of the gas output branch lines (120).

4. The gas supply system (100) according to claim 1 or 2, wherein the gas supply system (100) comprises the same distribution of gas output ports (124) along the length of the gas output branch lines (120) in at least two of the gas output branch lines (120); or the gas supply system (100) comprises a different distribution of gas output ports (124) along the length of the gas output branch lines (120) in at least two of the gas output branch lines (120).

5. The gas supply system (100) according to claim 1 or 2, characterized in that The gas buffer device (130) comprises a box-shaped body (132) fluidically connected between the gas input main line (110) and the gas output branch lines (120).

6. The gas supply system (100) according to claim 1 or 2, characterized in that The gas supply system (100) is configured such that a flow of gas flows from the gas input main line (110) through the gas buffer device (130) and the gas output branch lines (120) to enter the fluid tank (200) through the gas output ports (124) on the gas output branch lines (120).

7. The gas supply system (100) according to claim 1 or 2, characterized in that The gas buffer device (130) is configured to have a closed space isolated from an external environment, in which gas from the gas input main line (110) is buffered.

8. The gas supply system (100) according to claim 1 or 2, characterized in that At least one of the at least two gas output branch pipes (120) comprises a gas release section (122), and the gas outlets (124) are distributed on the gas release section (122), and the gas release section (122) at least partially extends into the fluid tank (200), so that gas is released into the fluid tank (200) through the gas outlets (124).

9. The gas supply system (100) according to claim 8, characterized in that The gas release section (122) comprised by at least one of the at least two gas output branch pipes (120) is an end section of the corresponding gas output branch pipe (120).

10. The gas supply system (100) according to claim 8, characterized in that The gas release sections (122) of the at least two gas output branch pipes (120) are uniformly spaced apart in the fluid tank (200).

11. The gas supply system (100) according to claim 1 or 2, characterized in that The gas buffer device (130) comprises at least two buffer chambers (134).

12. The gas supply system (100) according to claim 11, characterized in that One or more gas baffles (136) are arranged in each of the buffer chambers (134).

13. The gas supply system (100) according to claim 1, characterized in that The gas supply system (100) further comprises at least one regulating valve (140), and at least one of the regulating valves (140) is arranged in association with the gas output branch pipes (120) to regulate the flow of gas in the gas output branch pipes (120).

14. The gas supply system (100) according to claim 13, characterized in that The gas supply system (100) comprises at least two regulating valves (140), and each of the regulating valves (140) is arranged in association with a corresponding gas output branch pipe (120) to regulate the flow of gas in the corresponding gas output branch pipe (120).

15. The gas supply system (100) according to claim 13 or 14, characterized in that Each of the regulating valves (140) is arranged at an upstream end of a corresponding one of the gas output branch pipes (120) in the direction of the gas flow.

16. The gas supply system (100) according to claim 13 or 14, characterized in that Each of the regulating valves (140) is arranged between the gas buffer device (130) and the gas output branch pipes (120) in the direction of the gas flow to regulate the flow of gas flowing from the gas buffer device (130) into the gas output branch pipes (120).

17. The gas supply system (100) according to claim 16, characterized in that Each of the regulating valves (140) is arranged on the gas buffer device (130) in association with a corresponding gas output branch pipe (120).

18. The gas supply system (100) according to claim 1, characterized in that The gas supply system (100) further comprises at least one detection device (150) associated with the gas output branch pipes (120), and at least one of the detection devices (150) is configured to detect data related to the flow of gas into at least one of the gas output branch pipes (120).

19. The gas supply system (100) according to claim 18, characterized in that Each of the at least one detection devices (150) is arranged on a corresponding one of the gas output branch pipes (120).

20. The gas supply system (100) according to claim 1, characterized in that The diameter of the gas input main pipe (110) is greater than the diameter of the gas output branch pipes (120).

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