Semiconductor photoresist efficient cleaning device

Abstract

The utility model discloses an efficient cleaning device for semiconductor photoresist, which relates to the technical field of photoresist cleaning, and comprises a heating furnace body, a sliding plate arranged on the inner bottom surface of the heating furnace body, a screw rod arranged inside the sliding plate, a first motor arranged at the end part of the screw rod, and a support column fixedly arranged at the edge of the upper end part of the sliding plate, a plurality of evenly-distributed first connecting plates are fixedly arranged on the outer side of the upper end of the supporting column in the circumferential direction, fixing rings are fixedly arranged at the ends of the first connecting plates, rotating rings are arranged in the fixing rings, a second motor is arranged in the upper end of the supporting column and drives the multiple rotating rings to rotate synchronously, lifting columns are arranged in the rotating rings, and the supporting column is sleeved with a driving ring. The driving ring rotates and lifts to drive the plurality of lifting columns to synchronously and vertically lift, and the inner side of the upper end of the rotating ring is used for clamping a wafer; according to the utility model, by rotating and heating batch wafers, the photoresist on the back surfaces of the wafers is uniformly heated and expanded to fall off, so that the cleaning efficiency and effect are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to photoresist cleaning technical field, concretely to a kind of semiconductor photoresist high-efficiency cleaning device. BACKGROUND

[0002] In the semiconductor manufacturing process, wafer is very key to remove glue. Wafer surface needs to be removed glue, that is, photoresist adhered on the surface is removed, so that the next process step is carried out.

[0003] The existing mode is all through artificial semiconductor wafer disassembly, then remove photoresist, so workload is large, and efficiency is low, and cleaning effect cannot be guaranteed.

[0004] For the above problems, the utility model provides a kind of semiconductor photoresist high-efficiency cleaning device. UTILITY MODEL CONTENT

[0005] The utility model aims at providing a kind of semiconductor photoresist high-efficiency cleaning device, by to batch wafer rotation heating, make its back photoresist uniform heat expansion and fall off, improve cleaning efficiency and effect, to solve the problem in background art.

[0006] To achieve the above object, the utility model provides the following technical scheme: a kind of semiconductor photoresist high-efficiency cleaning device, including heating furnace body, the bottom surface of heating furnace body is provided with sliding plate, sliding plate is provided with screw rod inside, screw rod end is provided with first motor, sliding plate upper end edge is fixed with support column, the outer side of the upper end of support column is fixed with a plurality of evenly distributed first connecting plate, first connecting plate end is fixed with fixed ring, fixed ring is provided with rotating ring inside, the inside of the upper end of support column is provided with second motor, second motor drives a plurality of rotating rings synchronous rotation, rotating ring is provided with lifting column inside, support column outer side is equipped with driving ring, driving ring rotation lifting movement drives a plurality of lifting columns synchronous vertical lifting movement, rotating ring upper end inner side is used for clamping wafer.

[0007] Further, the bottom end of sliding plate is slidably connected on the bottom surface in heating furnace body, screw rod is screw-connected with the inside of sliding plate, and first motor is fixedly installed on the back of heating furnace body and extends inward at the output end and is fixedly connected with the end of screw rod.

[0008] Further, rotating ring outer side is rotatably connected on the inner side of fixed ring through bearing, first ring gear is fixedly arranged on the outer side of the upper end of rotating ring, circular groove is arranged in the inside of the upper end of support column, second motor is fixedly installed on the bottom surface of circular groove and extends outward at the output end and is fixedly connected with U-shaped connecting rod, second ring gear is fixedly arranged on the bottom end of the both sides of U-shaped connecting rod, and second ring gear and first ring gear are engaged with each other.

[0009] Further, the lifting column outer side is slidably connected with the rotating ring inner side, the driving ring inner side is threadedly connected with the support column outer side, the driving ring outer side is rotatably connected with the lifting ring through a bearing, and the lifting column outer side lower end is fixedly connected with the driving ring outer side through a second connecting plate.

[0010] Further, the rotating ring inner side is clamped with the wafer outer side.

[0011] Further, the driving ring outer side is processed with anti-skid lines.

[0012] Compared with the prior art, the semiconductor photoresist efficient cleaning device has the following beneficial effects:

[0013] The semiconductor photoresist efficient cleaning device provided by the utility model, a plurality of wafers are inverted, the photoresist is pasted on the back of the wafer, and the wafer is clamped in the corresponding rotating ring inner side, then the first motor drives the screw rod to rotate, drives the sliding plate to move to the heating furnace body, and then drives the structure on the upper end of the sliding plate to enter the heating furnace body, the door is closed, vacuum heating is carried out, the second motor drives a plurality of rotating rings to rotate synchronously in the heating process, the wafer on the inner side rotates synchronously, the photoresist pasted on the back is uniformly heated, the photoresist expands and deforms to form a bubble when heated to a certain temperature, and the bubble is separated from the surface of the silicon wafer, then the heating is stopped and the door is opened, then the screw rod reverses to drive the sliding plate to move out of the heating furnace body, drives the wafer to move to the outside of the heating furnace body, waits for cooling, and rotates the driving ring after cooling, the driving ring rotates and linearly rises, drives a plurality of lifting columns to vertically rise synchronously, and the corresponding wafer is pushed out of the rotating ring inner side, at this time, the photoresist on the back of the wafer is cleaned and cleaned. The purpose of the design is to rotate and heat the batch wafers, so that the photoresist on the back is uniformly heated and expanded to fall off, and the cleaning efficiency and effect are improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is the whole structure schematic diagram of the utility model;

[0015] Figure 2 It is the heating furnace body internal structure schematic diagram in the utility model;

[0016] Figure 3 It is the driving ring external structure schematic diagram in the utility model;

[0017] Figure 4 It is the second motor position schematic diagram in the utility model.

[0018] In the drawing: 1, heating furnace body; 2, sliding plate; 3, screw rod; 4, first motor; 5, support column; 6, first connecting plate; 7, fixed ring; 8, rotating ring; 9, first gear ring; 10, second gear ring; 11, U-shaped connecting rod; 12, circular groove; 13, second motor; 14, lifting column; 15, second connecting plate; 16, lifting ring; 17, driving ring. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the utility model will be apparently and completely described in the embodiments of the utility model combined with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skilled in the art without creative labor belong to the scope of protection of the utility model.

[0020] In order to solve the problem of how to clean photoresist efficiently, such as Figures 1-4 The following preferred technical solutions are provided:

[0021] A semiconductor photoresist efficient cleaning device, including heating furnace body 1, the bottom surface of heating furnace body 1 is provided with sliding plate 2, the inside of sliding plate 2 is provided with lead screw 3, the end of lead screw 3 is provided with first motor 4, the upper end edge of sliding plate 2 is fixedly provided with support column 5, the outer side of the upper end of support column 5 is fixedly provided with a plurality of evenly distributed first connecting plates 6, the end of first connecting plate 6 is fixedly provided with fixing ring 7, the inside of fixing ring 7 is provided with rotating ring 8, the inside of the upper end of support column 5 is provided with second motor 13, second motor 13 drives a plurality of rotating rings 8 to rotate synchronously, the inside of rotating ring 8 is provided with lifting column 14, the outside of support column 5 is provided with driving ring 17, driving ring 17 rotates and lifts to drive a plurality of lifting columns 14 to move vertically synchronously, and the inside of the upper end of rotating ring 8 is used for clamping wafers.

[0022] Specifically, a plurality of wafers are inverted, photoresist is pasted on the back of the wafer, and the wafer is clamped inside the corresponding rotating ring 8, then the first motor 4 drives the lead screw 3 to rotate, drives the sliding plate 2 to move into the heating furnace body 1, and then drives the structure on the upper end of the sliding plate 2 to enter the inside of the heating furnace body 1 synchronously, closes the door, and then heats in vacuum. In the heating process, the second motor 13 drives a plurality of rotating rings 8 to rotate synchronously, so that the wafers inside rotate synchronously, and the photoresist pasted on the back is heated uniformly. The photoresist expands and deforms to form a bubble when heated to a certain temperature, and then the photoresist is separated from the surface of the silicon wafer. Then stop heating and open the door. Then the lead screw 3 is reversed to drive the sliding plate 2 to move out of the heating furnace body 1, and then the wafer is moved to the outside of the heating furnace body 1. Wait for cooling, and then rotate the driving ring 17. The driving ring 17 rotates and rises linearly, drives a plurality of lifting columns 14 to rise vertically synchronously, and the corresponding wafer is pushed out of the inside of the rotating ring 8. At this time, the photoresist on the back of the wafer is clean and clean. The purpose of this design is to rotate and heat the batch of wafers, so that the photoresist on the back is uniformly heated and expanded to fall off, thereby improving the cleaning efficiency and effect.

[0023] Further, as shown in Figure 1 And Figure 2 The following preferred technical solutions are provided:

[0024] The bottom end of the sliding plate 2 is slidingly connected to the bottom surface of the heating furnace body 1, the lead screw 3 is threadedly connected to the inside of the sliding plate 2, and the first motor 4 is fixedly installed on the back surface of the heating furnace body 1 and has an output end extending inward and fixedly connected to the end of the lead screw 3. The purpose of this design is that the first motor 4 drives the lead screw 3 to rotate, thereby driving the sliding plate 2 to move horizontally and reciprocally in a straight line.

[0025] Further, as shown in Figure 2 and Figure 4 , the following preferred technical solutions are provided:

[0026] The outer side of the rotating ring 8 is rotatably connected to the inner side of the fixed ring 7 through a bearing, the first gear ring 9 is fixedly arranged on the outer side of the upper end of the rotating ring 8, the circular groove 12 is arranged in the inner side of the upper end of the support column 5, the second motor 13 is fixedly installed on the inner bottom surface of the circular groove 12 and has an output end extending outward and fixedly connected to the U-shaped connecting rod 11, the second gear ring 10 is fixedly arranged on the bottom end of the two sides of the U-shaped connecting rod 11, and the second gear ring 10 is meshed with the first gear ring 9. The purpose of this design is that the second motor 13 drives the U-shaped connecting rod 11 to rotate, thereby driving the second gear ring 10 to rotate, and through meshing with the plurality of first gear rings 9, the plurality of rotating rings 8 are driven to rotate synchronously relative to the corresponding fixed rings 7.

[0027] Further, as shown in Figures 1-4 , the following preferred technical solutions are provided:

[0028] The outer side of the lifting column 14 is slidingly connected to the inner side of the rotating ring 8, the inner side of the driving ring 17 is threadedly connected to the outer side of the support column 5, the lifting ring 16 is rotatably connected to the outer side of the driving ring 17 through a bearing, and the second connecting plate 15 is fixedly connected between the outer side of the lower end of the lifting column 14 and the outer side of the driving ring 17. The purpose of this design is that the driving ring 17 is manually rotated and moved up and down, thereby driving the lifting column 14 to move up and down synchronously, the wafer in the rotating ring 8 is pushed out, and the residual and fallen photoresist in the rotating ring 8 can also be cleaned.

[0029] Further, as shown in Figure 4 , the following preferred technical solutions are provided:

[0030] The inner side of the rotating ring 8 is clamped with the outer side of the wafer. The purpose of this design is to fix the wafer, facilitate the rotation of the rotating ring 8 to drive the wafer to rotate, and make the photoresist on the back surface of the wafer evenly heated.

[0031] Further, as shown in Figure 3 , the following preferred technical solutions are provided:

[0032] The outer side of the driving ring 17 is processed with anti-skid lines. The purpose of this design is to facilitate the rotation of the driving ring 17.

[0033] In summary: several wafers are inverted, photoresist is pasted on the back of the wafer, and the wafer is clamped inside the corresponding rotating ring 8, then the first motor 4 drives the screw rod 3 to rotate, drives the sliding plate 2 to move into the heating furnace body 1, and then the structure at the upper end of the sliding plate 2 is driven to enter the heating furnace body 1, the door is closed, and then vacuum heating is carried out. In the heating process, the second motor 13 drives the rotating ring 8 to rotate synchronously, so that the wafer inside rotates synchronously, and the photoresist pasted on the back is uniformly heated. The photoresist expands and deforms to form a bubble and separates from the surface of the silicon wafer when heated to a certain temperature. Then stop heating and open the door, then reverse the screw rod 3 to drive the sliding plate 2 to move out of the heating furnace body 1, drive the wafer to move to the outside of the heating furnace body 1, and wait for cooling. After cooling, the driving ring 17 is rotated, the driving ring 17 is rotated and linearly raised, the lifting column 14 is driven to vertically rise synchronously, and the corresponding wafer is pushed out of the inside of the rotating ring 8. At this time, the photoresist on the back of the wafer falls off and is clean. The purpose of this design is to uniformly heat the photoresist on the back of the wafer by rotating and heating the batch of wafers, so that the photoresist expands and falls off, thereby improving the cleaning efficiency and effect.

[0034] It should be noted that the relational terms herein such as first and second and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0035] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made thereto without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A high-efficiency cleaning device for semiconductor photoresist, comprising a heating furnace body (1), characterized in that: The inner bottom surface of the heating furnace body (1) is provided with a sliding plate (2), the sliding plate (2) is internally provided with a lead screw (3), the lead screw (3) is provided with a first motor (4) at the end, the sliding plate (2) is provided with a support column (5) at the upper end edge, a plurality of first connecting plates (6) are circumferentially arranged on the outer side of the upper end of the support column (5), the first connecting plates (6) are fixedly provided with a fixing ring (7) at the end, the fixing ring (7) is internally provided with a rotating ring (8), the upper end of the support column (5) is internally provided with a second motor (13), the second motor (13) drives a plurality of rotating rings (8) to rotate synchronously, the rotating ring (8) is internally provided with a lifting column (14), the outer side of the support column (5) is sleeved with a driving ring (17), the driving ring (17) rotates and lifts to drive a plurality of lifting columns (14) to move vertically and synchronously, and the upper end of the rotating ring (8) is used for clamping a wafer.

2. The high-efficiency cleaning device for semiconductor photoresist according to claim 1, characterized in that: The sliding plate (2) is slidably connected to the inner bottom surface of the heating furnace body (1), the lead screw (3) is threadedly connected to the inside of the sliding plate (2), and the first motor (4) is fixedly installed on the back of the heating furnace body (1) and has an output end extending inwardly and fixedly connected to the end of the lead screw (3).

3. The device according to claim 1, wherein the device is characterized by: The outer side of the rotating ring (8) is rotatably connected to the inner side of the fixing ring (7) through a bearing, the upper end of the rotating ring (8) is fixedly provided with a first gear ring (9), the upper end of the support column (5) is internally provided with a circular groove (12), the second motor (13) is fixedly installed on the inner bottom surface of the circular groove (12) and has an output end extending outwardly and fixedly connected with a U-shaped connecting rod (11), the U-shaped connecting rod (11) is fixedly provided with a second gear ring (10) at the bottom end on both sides, and the second gear ring (10) is meshed with the first gear ring (9).

4. The high-efficiency cleaning device for semiconductor photoresist according to claim 1, characterized in that: The outer side of the lifting column (14) is slidably connected to the inner side of the rotating ring (8), the inner side of the driving ring (17) is threadedly connected to the outer side of the support column (5), the outer side of the driving ring (17) is rotatably connected with a lifting ring (16) through a bearing, and the outer side of the lifting column (14) is fixedly connected with a second connecting plate (15) between the outer side of the driving ring (17).

5. The semiconductor photoresist high-efficiency cleaning device according to claim 1, wherein: The inner side of the rotating ring (8) is clamped with the outer side of the wafer.

6. The semiconductor photoresist high-efficiency cleaning device according to claim 1, wherein: The outer side of the driving ring (17) is processed with anti-skid lines.

Images