A heat dissipation structure and a ruggedized sealed computer comprising the same

Abstract

The utility model discloses a heat dissipation structure, the heat dissipation structure includes heat dissipation structure body (1) and sets up the heat dissipation fan (3) of heat dissipation structure body (1) tail part, the inlet of heat dissipation structure body (1) is provided with air inlet grid (11), air inlet grid (11) is opposite with heat dissipation fan (3) setting, be provided with the mesh channel in heat dissipation structure body (1), the upper end surface and lower end surface of heat dissipation structure body (1) form the mounting position respectively to the recess inward. Adopt this heat dissipation structure can realize reliable heat dissipation to the reinforced machine case.

Description

TECHNICAL FIELD

[0001] The utility model relates to a case field, concretely relates to a heat dissipation structure and contain its reinforced sealed computer. BACKGROUND

[0002] The reinforced computer refers to through a series of hardware and software means, improves the security, stability and attack resistance of computer system, ensures that it can still operate stably under the harsh environment or potential security threat. The reinforced computer has application in many high security requirement scenes, such as military, finance, government agency, industrial control system etc.

[0003] With the high-speed development of domestic chip and integrated circuit technology, the functional integration and whole machine power consumption of reinforced computer are gradually improved. At present, along with the increase of use demand, the reinforced computer needs to layout more circuit components in limited space, therefore, to guarantee the reliability of computer operation, higher requirements are put forward to the heat dissipation of reinforced computer.

[0004] The current case mainly dissipates heat through the heat dissipation fan, and the side, top, bottom and front and back panels of the case are designed with ventilation holes, and the positions of these ventilation holes are reasonably designed to ensure that the air circulation is not hindered. Even many modern case designs have large-area mesh structures to enhance air flow. Therefore, the reinforced computer requires reinforced sealing treatment of the case, which seriously affects the heat dissipation effect of the reinforced case. UTILITY MODEL CONTENTS

[0005] In order to overcome the existing technology that the reinforcement and sealing requirements of the reinforced case affect the heat dissipation effect of the case, the utility model provides a heat dissipation structure and a reinforced sealed computer containing the same, which can realize reliable heat dissipation of the reinforced case by using the heat dissipation structure.

[0006] In order to achieve the above purpose, the utility model provides a heat dissipation structure, which comprises a heat dissipation structure body and a heat dissipation fan arranged at the tail of the heat dissipation structure body, an air inlet grille is arranged at the inlet of the heat dissipation structure body, the air inlet grille is arranged opposite to the heat dissipation fan, and a mesh channel is arranged in the heat dissipation structure body.

[0007] The upper end surface and the lower end surface of the heat dissipation structure body are respectively inwardly recessed to form mounting positions.

[0008] Preferably, the heat dissipation fan is provided with multiple heat dissipation fans, and the multiple heat dissipation fans are uniformly distributed at the tail of the heat dissipation structure body.

[0009] The application further provides a ruggedized sealed computer, which comprises the heat dissipation structure, the circuit board, the upper cover plate and the lower cover plate.

[0010] Preferably, the mounting position of the heat dissipation structure body is provided with a heat-conducting copper pipe, two ends of the heat-conducting copper pipe extending into the net-shaped channel.

[0011] Preferably, the mounting position of the heat dissipation structure body is provided with a heat-conducting copper column, one end of the heat-conducting copper column extending into the net-shaped channel and the other end being in contact with the circuit board.

[0012] Preferably, the surface of the heat dissipation fan facing the upper cover plate and the lower cover plate is provided with a mounting surface, and the upper cover plate and the lower cover plate are detachably connected with the heat dissipation structure through the mounting surface.

[0013] Preferably, the side walls of the mounting position are enclosed by the heat dissipation structure body and the heat dissipation fan, and the connecting positions between adjacent side walls are sealed.

[0014] Preferably, the connecting position between the heat dissipation structure and the upper cover plate is provided with a sealing ring.

[0015] Preferably, the connecting position between the heat dissipation structure and the lower cover plate is provided with a sealing ring.

[0016] According to the above technical solution, the channel for cooling air flow is formed in the heat dissipation structure body, under the action of the heat dissipation fan, the cold air enters from the inlet, passes through the entire heat dissipation structure body and is discharged from the heat dissipation fan, thereby realizing the heat dissipation effect of the entire heat dissipation structure body.

[0017] The net-shaped channel is arranged in the heat dissipation structure body, so that the air can stay in the heat dissipation structure body for a longer time, so that the cooling air can be fully cooled with the upper end surface and the lower end surface of the heat dissipation structure body.

[0018] By arranging the air inlet grid at the inlet of the heat dissipation structure body, the air entering the net-shaped channel in the heat dissipation structure body can be preliminarily filtered, avoiding that impurities in the air block the net-shaped channel, thereby improving the use effect and service life of the heat dissipation structure.

[0019] The upper end surface and the lower end surface of the heat dissipation structure body are provided with inwardly recessed mounting positions, and the circuit board can be installed in the mounting positions. When the circuit board works, the heat generated by the circuit board is discharged into the mounting positions and is exchanged with the cooling air in the heat dissipation structure body through heat transfer, so that the cooling air carries away the heat, realizing the cooling effect of the circuit board.

[0020] Therefore, by setting the heat dissipation structure, the purpose of dissipating heat to the circuit board above and below the heat dissipation structure body can be achieved, the heat dissipation efficiency is high, and by setting the mesh channel and the heat dissipation fan in cooperation, the heat dissipation structure has more excellent heat dissipation effect, and the rapid cooling and heat dissipation effect of the circuit board can be achieved. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a schematic view of a heat dissipation structure.

[0022] Figure 2 It is a structural schematic view of a reinforced sealed computer.

[0023] REFERENCE SIGNS

[0024] DETAILED DESCRIPTION

[0025] In the present application, unless otherwise stated, the orientation words such as "away, up, down, side, two ends" generally refer to the orientation of the term in the conventional use state, or the common name understood by those skilled in the art, and should not be regarded as a limitation on the term.

[0026] Referring to Figure 1 The heat dissipation structure comprises a heat dissipation structure body 1 and a heat dissipation fan 3 arranged at the tail of the heat dissipation structure body 1, an air inlet grille 11 is arranged at the inlet of the heat dissipation structure body 1, the air inlet grille 11 is arranged opposite to the heat dissipation fan 3, and a mesh channel is arranged in the heat dissipation structure body 1.

[0027] The upper end face and the lower end face of the heat dissipation structure body 1 are respectively inwardly recessed to form mounting positions.

[0028] Through the implementation of the above technical scheme, the channel for cooling air circulation is formed in the heat dissipation structure body 1, under the action of the heat dissipation fan 3, the cold air enters from the inlet, passes through the entire heat dissipation structure body 1, and is discharged from the heat dissipation fan 3, thereby realizing the heat dissipation effect of the entire heat dissipation structure body 1.

[0029] The mesh channel is arranged in the heat dissipation structure body 1, so that the air can stay in the heat dissipation structure body 1 for a longer time, so that the cooling air can be fully cooled with the upper end face and the lower end face of the heat dissipation structure body 1.

[0030] By arranging the air inlet grille 11 at the inlet of the heat dissipation structure body 1, the air entering the mesh channel in the heat dissipation structure body 1 can be preliminarily filtered, so as to avoid that the impurities in the air block the mesh channel, thereby improving the use effect and service life of the heat dissipation structure.

[0031] The upper end face and the lower end face of the heat dissipation structure body 1 are provided with mounting positions recessed inward, and the circuit board 4 can be mounted in the mounting positions. When the circuit board 4 works, the heat generated by the circuit board 4 is discharged into the mounting positions, and is exchanged with the cooling air in the heat dissipation structure body 1 through heat transfer, so that the cooling air carries away the heat, and the cooling effect on the circuit board 4 is achieved.

[0032] Therefore, by arranging the heat dissipation structure, the purpose of dissipating heat for the circuit board 4 above and below the heat dissipation structure body 1 is achieved, the heat dissipation efficiency is high, and by arranging the mesh channel and cooperating with the heat dissipation fan 3, the heat dissipation structure has more excellent heat dissipation effect, and the rapid cooling and heat dissipation effect on the circuit board 4 is achieved.

[0033] In this embodiment, preferably, a plurality of heat dissipation fans 3 are arranged, and the plurality of heat dissipation fans 3 are uniformly distributed at the tail of the heat dissipation structure body 1.

[0034] In order to better improve the heat dissipation effect, more fans can be provided for the heat dissipation structure to increase the ventilation amount of the heat dissipation structure per unit time. Preferably, the heat dissipation efficiency of the heat dissipation structure can also be improved by increasing the rotating speed of the heat dissipation fan 3.

[0035] In addition, due to the influence of the size of the heat dissipation structure itself, the diameter of the heat dissipation fan 3 cannot be too large, and therefore the effective area of the heat dissipation fan 3 is limited. By arranging a plurality of fans to cover the tail of the heat dissipation structure body 1, the effective area of the tail of the heat dissipation structure body 1 is effectively utilized, as many heat dissipation fans 3 as possible are arranged, and the mesh channel cross section in the heat dissipation structure body 1 is effectively covered. Not only the heat dissipation effect of the heat dissipation structure is improved, but also the heat dissipation structure can uniformly dissipate heat for the circuit board 4, and the local temperature rise of the circuit board 4 is avoided.

[0036] Referring to Figure 2 The reinforced sealed computer comprises a heat dissipation structure, a circuit board 4, an upper cover plate 5 and a lower cover plate 6. The circuit board 4 is detachably connected with the heat dissipation structure through the mounting position, and the upper cover plate 5 and the lower cover plate 6 are sealingly connected with the upper end face and the lower end face of the heat dissipation structure respectively.

[0037] The circuit board 4 is fixedly connected with the heat dissipation structure through the mounting position, so that the heat generated by the circuit board 4 during work is discharged through the cooling air channel in the heat dissipation structure.

[0038] The upper cover plate 5 and the lower cover plate 6 seal the mounting positions above and below the heat dissipation mechanism respectively, so that the circuit board 4 can be enclosed in the recessed space of the mounting position, which can not only obtain good waterproof sealing effect, but also can be effectively supported through the mounting position, thereby improving the strength of the reinforced and sealed computer.

[0039] In this embodiment, preferably, the mounting position of the heat dissipation structure body 1 is provided with a heat-conducting copper pipe 12, and both ends of the heat-conducting copper pipe 12 extend into the mesh channel.

[0040] The heat-conducting copper pipe 12 is arranged below the circuit board 4 and is in contact with the heat generating elements on the circuit board 4, so that the heat generated on the circuit board 4 can be quickly conducted to the heat dissipation structure through the heat-conducting copper pipe 12 and discharged through heat exchange by the cooling air flowing in the heat dissipation structure.

[0041] In the case of vibration and the like, the circuit board 4 can not only obtain a relatively stable positional relationship with the heat dissipation structure through fixed mounting, but also can be supported by the heat-conducting copper pipe 12 to a certain extent, thereby avoiding the influence of vibration and the like on the stability of the circuit board 4.

[0042] In this embodiment, preferably, the upper end face and the lower end face of the heat dissipation structure body 1 are respectively provided with a heat-conducting copper column 13, one end of the heat-conducting copper column 13 extends into the mesh channel, and the other end is in contact with the circuit board 4.

[0043] The heat-conducting copper column 13 is arranged below the circuit board 4 and is in contact with the heat generating elements on the circuit board 4, so that the heat generated on the circuit board 4 can be quickly conducted to the heat dissipation structure through the heat-conducting copper pipe 12 and discharged through heat exchange by the cooling air flowing in the heat dissipation structure.

[0044] The heat-conducting copper column 13 is used for the heat generating elements with small surface area and small heat generation, while the heat-conducting copper pipe 12 can be used for the heat generating elements with large surface area and large heat generation, so that the heat generated on the circuit board 4 can be quickly transferred to the heat dissipation structure through the cooperation of the heat-conducting copper pipe 12 and the heat-conducting copper column 13, thereby achieving high-efficiency heat dissipation of the circuit board 4.

[0045] In this embodiment, preferably, the face of the heat dissipation fan 3 facing the upper cover plate 5 and the lower cover plate 6 is provided with a mounting face, and the upper cover plate 5 and the lower cover plate 6 are detachably connected with the heat dissipation structure through the mounting face.

[0046] The upper cover plate 5 and the lower cover plate 6 are detachably connected with the heat dissipation structure through the mounting face, so that the heat dissipation fan 3 is also sealed in the reinforced and sealed computer, which is conducive to improving the reliability of the heat dissipation fan 3.

[0047] Moreover, the upper cover plate 5 and the lower cover plate 6 have better strength through the support of the installation surface of the heat dissipation fan 3, so that the thickness of the upper cover plate 5 and the lower cover plate 6 can be reduced, the cost is saved, and the portability of the ruggedized sealed computer is improved.

[0048] In the embodiment, preferably, the side walls of the mounting position are enclosed by the heat dissipation structure body 1 and the heat dissipation fan 3, and the connecting parts between the adjacent side walls are sealed.

[0049] In order to realize reliable sealing of the circuit board 4, the connecting gaps between the side walls of the mounting position are sealed, and the sealing between the cover plate and the mounting position is performed, so that the circuit board 4 is in a completely sealed state, and the waterproof performance of the ruggedized sealed computer is greatly improved.

[0050] In the embodiment, preferably, a sealing ring is arranged at the connecting part between the heat dissipation structure and the upper cover plate 5.

[0051] In the embodiment, preferably, a sealing ring is arranged at the connecting part between the heat dissipation structure and the lower cover plate 6.

[0052] The preferred embodiments of the utility model are described in detail above in combination with the drawings, but the utility model is not limited to the specific details in the above embodiments, and various simple modifications can be made to the technical solutions of the utility model within the technical concept of the utility model, and these simple modifications all belong to the protection scope of the utility model.

[0053] In addition, it should be noted that the various specific technical features described in the above specific embodiments can be combined in any appropriate manner without contradiction, and in order to avoid unnecessary repetition, the utility model will not further describe various possible combination manners.

[0054] In addition, the various different embodiments of the utility model can also be combined in any manner, as long as it does not deviate from the technical concept of the utility model, and it should be considered as the disclosed content of the utility model.

Claims

1. A heat dissipating structure, characterized by comprising: The heat dissipation structure comprises a heat dissipation structure body (1) and a heat dissipation fan (3) arranged at the tail of the heat dissipation structure body (1), an air inlet grille (11) is arranged at the inlet of the heat dissipation structure body (1), the air inlet grille (11) is arranged opposite to the heat dissipation fan (3), and a mesh channel is arranged in the heat dissipation structure body (1). The upper end face and the lower end face of the heat dissipation structure body (1) are respectively inwardly recessed to form mounting positions.

2. The heat dissipating structure according to claim 1, wherein The heat dissipation fan (3) is arranged in multiple, and the multiple heat dissipation fans (3) are uniformly arranged at the tail of the heat dissipation structure body (1).

3. A hardened sealed computer, comprising: The reinforced sealed computer comprises the heat dissipation structure, a circuit board (4), an upper cover plate (5) and a lower cover plate (6) according to any one of claims 1-2, the circuit board (4) is detachably connected with the heat dissipation structure through the mounting position, and the upper cover plate (5) and the lower cover plate (6) are respectively sealingly connected with the upper end face and the lower end face of the heat dissipation structure.

4. The ruggedized sealed computer of claim 3, wherein, The mounting position of the heat dissipation structure body (1) is provided with a heat-conducting copper pipe (12), and both ends of the heat-conducting copper pipe (12) extend into the mesh channel.

5. The ruggedized sealed computer of claim 3, wherein, The mounting position of the heat dissipation structure body (1) is provided with a heat-conducting copper column (13), one end of the heat-conducting copper column (13) extends into the mesh channel, and the other end is in contact with the circuit board (4).

6. The ruggedized sealed computer of claim 3, wherein, The surface of the heat dissipation fan (3) facing the upper cover plate (5) and the lower cover plate (6) is provided with a mounting surface, and the upper cover plate (5) and the lower cover plate (6) are detachably connected with the heat dissipation structure through the mounting surface.

7. The ruggedized sealed computer of claim 3, wherein, The side walls of the mounting position are formed by the heat dissipation structure body (1) and the heat dissipation fan (3), and the connecting portions between the adjacent side walls are sealingly treated.

8. The ruggedized sealed computer of claim 6, wherein, The connecting portion between the heat dissipation structure and the upper cover plate (5) is provided with a sealing ring.

9. The ruggedized sealed computer of claim 6, wherein, The connecting portion between the heat dissipation structure and the lower cover plate (6) is provided with a sealing ring.

Images