Semiconductor display with good heat dissipation performance

Abstract

The utility model discloses a semiconductor display with good heat dissipation performance, which relates to the technical field of displays and comprises a display mechanism, heat dissipation mechanisms are arranged on two sides of an inner cavity of the display mechanism, a heat dissipation reinforcing mechanism is arranged in the display mechanism and comprises a heat conduction block in contact with a display screen chip, and the heat conduction block is arranged in the inner cavity of the display mechanism. And a heat conduction copper pipe is arranged in the heat conduction block. Through the arrangement of the heat dissipation reinforcing mechanism, when the heat dissipation mechanism carries out uniform heat dissipation, heat generated by the chip is absorbed through the heat conduction block, then the heat is conducted into the heat dissipation tower through the heat conduction copper pipe, the contact area between a heat dissipation device and air is increased, and under the action of the second fan, flowing air passes through a gap in the heat dissipation tower, so that the heat dissipation effect is improved. Compared with the prior art, the heat dissipation effect of the semiconductor display screen chip can be improved in a targeted mode, the chip is prevented from being overheated, and the semiconductor display screen chip is more convenient to use.

Description

TECHNICAL FIELD

[0001] The utility model relates to display technology field, concretely relates to a semiconductor display that good heat dissipation. BACKGROUND

[0002] Semiconductor display is a kind of equipment using the photoelectric characteristic of semiconductor material to realize image display, and semiconductor display is mainly based on the electroluminescence phenomenon of semiconductor material.When voltage is applied to both ends of semiconductor material, electron and hole recombine under the action of electric field, release energy and emit light in the form of photon.Different semiconductor materials and structures can emit light of different colors and wavelengths, and by accurately controlling semiconductor light emitting unit, it makes it emit light or not according to certain rule, thereby forming image.These light emitting units are usually arranged in matrix form, and the light emitting state of each unit is controlled by row and column driving circuit, and then the display of image is realized.

[0003] The existing semiconductor display in the process of using, the light emitting diode and other semiconductor elements in semiconductor display when working, current through can produce certain heat, especially in the case of high brightness display or long time use, current is larger, and the heat generated will also increase accordingly, and the conventional processing mode is to pass through the heat dissipation mode of air cooling, makes flowing air to pass through the surface of semiconductor display, and the heat generated by semiconductor display is discharged, but this kind of heat dissipation mode, the heat dissipation effect is more balanced, and the display driving chip and control chip and other devices in semiconductor display are compared with the light emitting diode in display screen, and the power is higher, so the heat generation is also larger, and the heat dissipation balanced heat dissipation mode is easy to lead to the overheating of display driving chip and control chip and other devices, and the display effect is influenced, and there is certain inconvenience. UTILITY MODEL CONTENTS

[0004] The utility model provides a semiconductor display that good heat dissipation to solve the problem in above -mentioned background art.

[0005] To solve the above technical problems, the technical scheme adopted by the utility model is:

[0006] A kind of semiconductor display that good heat dissipation, including display mechanism, the two sides of the display mechanism inner chamber are provided with heat dissipation mechanism, the inside of the display mechanism is provided with heat dissipation strengthening mechanism, the heat dissipation strengthening mechanism includes the heat conduction block that contact with display screen chip, the inside of the heat conduction block is provided with heat conduction copper pipe, the surface of the heat conduction copper pipe is provided with heat dissipation tower, the top of the heat dissipation tower is fixedly connected with installation frame, the inner wall of the installation frame is fixedly connected with second mounting plate, the inside of the second mounting plate is provided with second fan.

[0007] The further improvement in the technical scheme of the utility model lies in that the surface of the mounting shell is fixedly connected with a containing shell, and the two sides of the inner cavity of the containing shell are provided with second heat dissipation openings.

[0008] The further improvement in the technical scheme of the utility model lies in that the surface of the mounting shell is fixedly connected with a containing shell, and the two sides of the inner cavity of the containing shell are provided with second heat dissipation openings.

[0009] The further improvement in the technical scheme of the utility model lies in that one side of the inner cavity of the mounting shell is provided with a semiconductor display screen, and the semiconductor chip of the semiconductor display screen is surface-lapped with the heat-conducting block.

[0010] The further improvement in the technical scheme of the utility model lies in that the heat-dissipation mechanism comprises a heat-conducting copper plate, and one side of the heat-conducting copper plate is provided with heat-dissipation fins.

[0011] The further improvement in the technical scheme of the utility model lies in that one side of the heat-conducting copper plate is indirectly contacted with one side of the semiconductor display screen through heat-dissipation silicone grease, and the bottom of the heat-conducting block is bolt-connected with the surface of the heat-conducting copper plate.

[0012] The further improvement in the technical scheme of the utility model lies in that the surfaces of the two ends of the heat-conducting copper plate are fixedly connected with mounting frames, and the interiors of the mounting frames are provided with dustproof nets.

[0013] The further improvement in the technical scheme of the utility model lies in that the inner walls of the mounting frames are fixedly connected with first mounting plates, and the surfaces of the first mounting plates are fixedly connected with first fans.

[0014] Thanks to the above technical scheme, the utility model has the following technical progress compared with the prior art:

[0015] The utility model provides a semiconductor display good in heat dissipation, through the setting of the heat-dissipation strengthening mechanism, when the heat-dissipation mechanism uniformly dissipates heat, the heat generated by the chip is absorbed through the heat-conducting block, then the heat is conducted to the heat-dissipation tower through the heat-conducting copper pipe, the contact area of the heat-dissipation device and air is increased, under the action of the second fan, the flowing air passes through the gap in the heat-dissipation tower, so that the heat is taken away, thereby improving the heat dissipation effect of the semiconductor display screen chip, compared with the conventional technology, the heat dissipation effect of the display screen chip can be targetedly improved, the chip is prevented from overheating, and the utility model is more convenient to use. ACCOUT OF DRAWINGS

[0016] Fig. 1 It is a front view structural schematic diagram of the utility model;

[0017] Fig. 2 It is a back view structural schematic diagram of the utility model;

[0018] Fig. 3It is internal structure schematic view of the utility model;

[0019] Fig. 4 It is heat radiation mechanism structure schematic view of the utility model;

[0020] Fig. 5 It is heat radiation reinforcing mechanism structure schematic view of the utility model;

[0021] Fig. 6 It is heat radiation reinforcing mechanism side structure schematic view of the utility model.

[0022] In the drawing: 11, bottom plate;12, installation shell;13, first heat dissipation port;14, containing shell;15, second heat dissipation port;16, semiconductor display screen;21, heat conduction copper plate;22, heat dissipation fin;23, installation frame;24, dust screen;25, first installation plate;26, first fan;31, heat conduction block;32, heat conduction copper pipe;33, heat dissipation tower;34, installation frame;35, second installation plate;36, second fan. DETAILED DESCRIPTION

[0023] The utility model will be further explained in detail in connection with example:

[0024] Example 1

[0025] As Figs. 1-6 shown, the utility model provides a semiconductor display with good heat dissipation, including display mechanism, and the both sides of the inner chamber of display mechanism are provided with heat radiation mechanism, and the inside of display mechanism is provided with heat radiation reinforcing mechanism, and heat radiation reinforcing mechanism includes heat conduction block 31 in contact with display screen chip, the inside of heat conduction block 31 is provided with heat conduction copper pipe 32, the surface of heat conduction copper pipe 32 is provided with heat dissipation tower 33, the top of heat dissipation tower 33 is fixedly connected with installation frame 34, the inner wall of installation frame 34 is fixedly connected with second installation plate 35, and the inside of second installation plate 35 is provided with second fan 36.

[0026] In this embodiment, in the process of heat dissipation, the heat generated in the chip is adsorbed by the heat conduction block 31, and under the action of the heat conduction copper pipe 32, the heat is conducted to the heat dissipation tower 33, the heat dissipation tower 33 is composed of a plurality of heat dissipation plates, the contact area of the heat dissipation member and the air can be increased, so that when the second fan 36 sucks the air from the second heat dissipation port 15 into the installation shell 12 and blows to the heat dissipation tower 33, the contact area with the flowing air is increased, the heat dissipation effect of the chip is improved, the chip is prevented from overheating due to the large heat generated by the chip, and the utility model is more convenient to use, and the dust screen is arranged in the second heat dissipation port 15, which can prevent the dust in the external air from accumulating on the heat dissipation tower 33, and the utility model is more convenient to use.

[0027] Example 2

[0028] AsFigs. 1-6 As shown in the embodiment 1, the utility model provides a technical scheme based on the embodiment 1: preferably, display mechanism includes the bottom plate 11, the top fixed connection of bottom plate 11 has installation shell 12, the both sides of installation shell 12 inner chamber are provided with first heat dissipation port 13, the surface fixed connection of installation shell 12 has containing shell 14, the both sides of containing shell 14 inner chamber are provided with second heat dissipation port 15, one side of installation shell 12 inner chamber is provided with semiconductor display screen 16, and the surface of semiconductor chip of semiconductor display screen 16 and heat conduction block 31 are overlapped.

[0029] In this embodiment, by in the process of using, by display control chip control light emitting diode in semiconductor display screen 16 light emitting, realize display function, in the process of display, first fan 26 rotates, make outside air from installation shell 12 one side's first heat dissipation port 13 into installation frame 23, after filtering through dust screen 24, enter installation shell 12, and the surface contact of heat dissipation fin 22 and heat conduction copper plate 21, carry out heat dissipation.

[0030] Embodiment 3

[0031] As Figs. 1-6 As shown in the embodiment 1, the utility model provides a technical scheme based on the embodiment 1: preferably, the heat dissipation mechanism includes heat conduction copper plate 21, one side of heat conduction copper plate 21 is provided with heat dissipation fin 22, one side of heat conduction copper plate 21 is indirectly contacted with one side of semiconductor display screen 16 through heat dissipation silicone grease, the bottom of heat conduction block 31 is bolted to the surface of heat conduction copper plate 21, the surface fixed connection of both ends of heat conduction copper plate 21 has installation frame 23, the inside of installation frame 23 is provided with dust screen 24, the inner wall fixed connection of installation frame 23 has first mounting plate 25, the surface fixed connection of first mounting plate 25 has first fan 26.

[0032] In this embodiment, by in the process of using, by display control chip control light emitting diode in semiconductor display screen 16 light emitting, realize display function, in the process of display, first fan 26 rotates, make outside air from installation shell 12 one side's first heat dissipation port 13 into installation frame 23, after filtering through dust screen 24, enter installation shell 12, and the surface contact of heat dissipation fin 22 and heat conduction copper plate 21, carry out heat dissipation.

[0033] The working principle of the semiconductor display with good heat dissipation will be described in detail below.

[0034] As Figs. 1-6As shown, in the process of using, the display function is realized by controlling the light-emitting diode in the semiconductor display screen 16 to emit light through the display control chip, in the process of display, the first fan 26 rotates, the outside air enters the installation frame 23 from the first heat dissipation port 13 on the side of the installation shell 12, and then enters the installation shell 12 after being filtered by the dust screen 24, and contacts the surface of the heat dissipation fin 22 and the heat conduction copper plate 21, under the action of heat conduction, the heat generated in the semiconductor display screen 16 conducted by the heat dissipation silicone grease in the heat dissipation fin 22 and the heat conduction copper plate 21 enters the flowing air, and then the flowing air carrying heat is discharged from the first heat dissipation port 13 on the other side, and the heat dissipation is carried out uniformly, and at the same time, the two groups of heat dissipation mechanisms are arranged on the two sides of the inner cavity of the installation shell 12, one group makes the outside air enter the installation shell, and the other group exhausts the hot air in the installation shell 12, so that the air circulation speed is improved, and the heat dissipation effect is improved, and at the same time, in the process of heat dissipation, the heat generated in the chip is adsorbed by the heat conduction block 31, and under the action of the heat conduction copper pipe 32, the heat is conducted to the heat dissipation tower 33, the heat dissipation tower 33 is composed of a plurality of heat dissipation plates, the contact area of the heat dissipation member and the air can be increased, so that when the outside air is sucked into the installation shell 12 from the second heat dissipation port 15 by the second fan 36 and blown to the heat dissipation tower 33, the contact area with the flowing air is increased, the heat dissipation effect of the chip is improved, the chip is prevented from overheating due to large heat generation of the chip, and the chip is more convenient to use, and at the same time, the dust screen is arranged in the second heat dissipation port 15, so that the dust in the outside air is prevented from accumulating on the heat dissipation tower 33, and the use is more convenient.

[0035] The above is a detailed description of the present application, but some modifications or improvements can be made on the basis of the present application, which is obvious to those skilled in the art. Therefore, the modifications or improvements without departing from the spirit of the present application are within the protection scope of the present application.

Claims

1. A semiconductor display having a high heat dissipation, comprising a display mechanism, characterized by: Both sides of the display mechanism inner cavity are provided with heat dissipation mechanism, the inside of the display mechanism is provided with heat dissipation reinforcing mechanism, the heat dissipation reinforcing mechanism includes the heat conduction block (31) that contacts display screen chip, the inside of the heat conduction block (31) is provided with heat conduction copper pipe (32), the surface of the heat conduction copper pipe (32) is provided with heat dissipation tower (33), the top of the heat dissipation tower (33) is fixedly connected with installation frame (34), the inner wall of the installation frame (34) is fixedly connected with second mounting plate (35), the inside of the second mounting plate (35) is provided with second fan (36).

2. The semiconductor display of claim 1, wherein: The display mechanism includes the bottom plate (11), and the top of the bottom plate (11) is fixedly connected with the mounting shell (12).

3. The semiconductor display of claim 2, wherein: The surface of the mounting shell (12) is fixedly connected with the containing shell (14), and both sides of the inner cavity of the containing shell (14) are provided with the second heat dissipation port (15).

4. The semiconductor display of claim 3, wherein: One side of the inner cavity of the mounting shell (12) is provided with the semiconductor display screen (16), and the semiconductor chip of the semiconductor display screen (16) is overlapped with the surface of the heat conduction block (31).

5. The semiconductor display of claim 1, wherein: the semiconductor display is a liquid crystal display. The heat dissipation mechanism includes the heat conduction copper plate (21), and one side of the heat conduction copper plate (21) is provided with the heat dissipation fin (22).

6. The semiconductor display with good heat dissipation according to claim 5, characterized in that: One side of the heat conduction copper plate (21) is indirectly contacted with one side of the semiconductor display screen (16) through the heat dissipation silicone grease, and the bottom of the heat conduction block (31) is bolted with the surface of the heat conduction copper plate (21).

7. The semiconductor display with good heat dissipation according to claim 6, characterized in that: The surfaces of both ends of the heat conduction copper plate (21) are fixedly connected with the installation frame (23), and the inside of the installation frame (23) is provided with the dustproof net (24).

8. The semiconductor display with good heat dissipation according to claim 7, characterized in that: The inner wall of the installation frame (23) is fixedly connected with the first mounting plate (25), and the surface of the first mounting plate (25) is fixedly connected with the first fan (26). The surface of the first mounting plate (25) is fixedly connected with the first fan (26).

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