High-frequency film capacitor
By using encapsulant to fill gaps and positioning block structure in high-frequency film capacitors, the sealing problem at the connection between pins and base is solved, achieving better sealing performance and physical stability, and improving the overall performance of the capacitor.
Patent Information
- Application Number
- CN202422974129.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-12-04
AI Technical Summary
Existing high-frequency film capacitors have sealing problems at the connection between the pins and the base, which allows external moisture and contaminants to easily penetrate, affecting the capacitor's performance and lifespan.
The design employs an encapsulant to fill the gaps between the pins and the sleeve, combined with a positioning component and a spring clip structure, to achieve internal encapsulation of the pins, enhancing sealing performance. The outer shell is then secured by the interlocking strips and clips, improving physical stability.
It effectively prevents moisture and contaminants from entering, improves the sealing performance and physical stability of the capacitor, enhances electrical performance, reduces leakage current, and extends the capacitor's lifespan.
Smart Images
Figure CN223612245U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to capacitor technical field, specifically to a high frequency film capacitor. BACKGROUND
[0002] With the rapid development of electronic equipment technology, especially in the field of communication, computer and consumer electronics, the demand for high performance capacitor is growing. As an important electronic component, high frequency film capacitor is gradually becoming an indispensable part of modern electronic circuit with its superior electrical performance and good stability. In the process of installing the pin of the existing capacitor, the pin is usually fixed from the outside. Although this design realizes the basic fixing function, it indeed has some significant defects, especially in the aspect of sealing. Since the pin of the capacitor is inserted into the outside of the base, this structure is easy to leave a certain gap at the connection. Especially with temperature fluctuations or material aging, the friction and movement between the pin and the base may cause the gap to increase. SUMMARY
[0003] In view of the defects of the prior art, the utility model provides a high frequency film capacitor, which has the advantages of improving the sealing between the pin and the base, and solving the problem of sealing between the pin and the base.
[0004] To solve the above technical problems, the utility model provides the following technical scheme:
[0005] A high frequency film capacitor, comprising a base and a core body installed on the base, the core body bottom is connected with a pin, the core body outside is equipped with a shell, the base is equipped with a positioning piece for core body packaging, the base is equipped with a positioning hole corresponding to the pin, the positioning hole is fixedly connected with a sleeve, the sleeve is fixedly connected with a plurality of packaging films filled with packaging agent, and the pin is inserted through the packaging film to lead out the packaging agent.
[0006] Preferably, the positioning piece comprises two insertion strips fixedly connected to the bottom of the shell, the base is provided with an insertion slot corresponding to the insertion strip, the insertion strip is provided with a clamping groove, the base is fixedly connected with a spring, the end of the spring is fixedly connected with a clamping block corresponding to the clamping groove, the end of the insertion strip close to the clamping block is arc-shaped, and one side of the clamping block and the insertion strip is also arc-shaped.
[0007] Preferably, the shape of the insertion strip is L-shaped horizontally, and the long end of the insertion strip is inserted into the insertion slot.
[0008] Preferably, the packaging agent is made of epoxy resin material.
[0009] Preferably, the base is provided with a bolt corresponding to the pin, and the bolt is sleeved on the outer circle of the pin.
[0010] Preferably, the cutting surfaces of the outer side and the inner side of the insert are both arc surfaces, and the arc surfaces have the center point of the base as the center.
[0011] By means of the technical scheme, the high-frequency film capacitor has at least the following beneficial effects:
[0012] 1. The high-frequency film capacitor has the positioning member arranged, so that the shell can be fixed on the base, thereby enhancing the physical stability of the capacitor and preventing the capacitor components from loosening or falling off due to vibration or external force.
[0013] 2. The high-frequency film capacitor has the encapsulating agent introduced from the inner side to the gap between the pin and the sleeve, so as to encapsulate the pin, promote the encapsulating agent to be introduced from the inner side to the gap between the pin and the sleeve, improve the encapsulation performance, ensure that the encapsulating agent can better fill the gap, effectively prevent air and moisture from entering, and improve the sealing performance of the capacitor. BRIEF DESCRIPTION OF DRAWINGS
[0014] The accompanying drawings, which are included to provide a further understanding of the present application and constitute a part of this application, illustrate embodiments of the present application and serve to explain the principles of the present application:
[0015] Figure 1 is a split structure schematic view of the present application;
[0016] Figure 2 is a connection structure schematic view of the shell and the base of the present application;
[0017] Figure 3 is a split structure schematic view of the present application Figure 2 is an enlarged view of A of the present application;
[0018] Figure 4 is an external connection structure schematic view of the sleeve of the present application;
[0019] Figure 5 is a front view direction three-dimensional structure schematic view of the present application.
[0020] REFERENCE NUMERALS:
[0021] 1. base; 2. core; 3. pin; 4. shell; 5. positioning member; 51. insert; 52. insert slot; 53. clamping groove; 54. spring; 55. clamping block; 6. positioning hole; 7. sleeve; 8. encapsulating film; 9. bolt. DETAILED DESCRIPTION
[0022] Clearly and completely describe the technical scheme in the embodiments of the utility model with reference to the drawings in the embodiments of the utility model, obviously, the described embodiment is only a part of the embodiment of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skill in the art without creative labor belong to the scope of the utility model protection.
[0023] With the rapid development of electronic equipment technology, especially in the field of communication, computer and consumer electronics, the demand for high-performance capacitors is growing. As an important electronic component, high-frequency film capacitor is gradually becoming an indispensable part of modern electronic circuits with its superior electrical performance and good stability. Due to the existence of gap, the moisture, dust and other pollutants in the outside world are more likely to penetrate into the capacitor. This may cause the capacitor to be damp, short circuit, insulation failure, thereby affecting the performance and life of the capacitor.
[0024] Embodiment one:
[0025] The traditional capacitor assembly often uses screws or other tools for fixing, this method has several obvious problems, time cost is high: using screws and other tools need additional time for manual installation, reduces the overall production efficiency, in order to solve the above problems, combined Figure 2 、 Figure 4 and 5 , the utility model provides a high-frequency film capacitor, which comprises a base 1 and a core 2 mounted on the base 1, the core 2 is connected with a pin 3 at the bottom, the outer side of the core 2 is provided with a shell 4, and the base 1 is provided with a positioning piece 5 for fixing the shell 4, which can effectively fix the shell 4 on the base 1, thereby enhancing the physical stability of the whole capacitor and preventing the capacitor assembly from loosening or falling off due to vibration or external force.
[0026] Due to the existence of gap, the moisture, dust and other pollutants in the outside world are more likely to penetrate into the capacitor, which may cause the capacitor to be damp, short circuit, insulation failure, thereby affecting the performance and life of the capacitor. In order to solve the above problems, a positioning hole 6 corresponding to the pin 3 is formed on the base 1, a sleeve 7 is fixedly connected in the positioning hole 6, a plurality of packaging films 8 filled with encapsulants are fixedly connected in the sleeve 7, the pin 3 is inserted through the packaging film 8 to lead out the encapsulant, and the encapsulant can be introduced from the inside to the gap between the pin 3 and the sleeve 7, so as to realize the packaging of the pin 3. The encapsulant can be introduced from the inside to the gap between the pin 3 and the sleeve 7, which improves the packaging performance and ensures that the encapsulant can better fill the gap, effectively prevents the entry of air and moisture, and thus improves the sealing performance of the capacitor.
[0027] Specifically, the encapsulant is specifically made of an epoxy resin material, which has excellent adhesion and chemical resistance, can effectively protect the pin 3, and prevent the intrusion of moisture and other contaminants.
[0028] According to the embodiment, through the structure design, not only the reliability of the encapsulation is improved, but also the electrical performance of the capacitor is improved, such as reducing the leakage current and enhancing the anti-breakdown capability, thereby improving the overall performance of the capacitor.
[0029] Embodiment two:
[0030] Since the capacitor assembly requires high-precision alignment, a slight displacement or error during the assembly process can affect the electrical performance and reliability. To solve the above problems, in combination with Figures 1-5 As shown in the embodiment one, the positioning member 5 includes two insertion strips 51 fixed to the bottom of the shell 4, the base 1 is provided with an insertion slot 52 corresponding to the insertion strip 51, the insertion strip 51 is provided with a clamping groove 53, the base 1 is fixed with a spring 54, the end of the spring 54 is fixed with a clamping block 55 corresponding to the clamping groove 53, the end of the insertion strip 51 close to the clamping block 55 is arc-shaped, and one side of the clamping block 55 and the insertion strip 51 is also arc-shaped. First, the insertion strip 51 is inserted into the insertion slot 52, then the shell 4 is rotated to make the insertion strip 51 rotate with it, then the insertion strip 51 contacts the clamping block 55 to move inward, then the insertion strip 51 continues to move, when the clamping block 55 and the insertion slot 52 are in the same plane, the spring 54 pushes the clamping block 55 to insert into the insertion slot 52 to limit the insertion strip 51, then the shell 4 can be fixed on the base 1 to realize the encapsulation of the core 2, and the simple and efficient assembly steps are realized, the tools and complex operations required for assembly are reduced, and the production efficiency is improved.
[0031] Specifically, the shape of the insertion strip 51 is horizontally placed L-shaped, the long end of the insertion strip 51 is inserted into the insertion slot 52, the protruding part is seen on the outside, the sealing effect is better, and the appearance of the capacitor can be improved.
[0032] Further, the base 1 is provided with a bolt 9 corresponding to the pin 3, and the bolt 9 is sleeved on the outer circle of the pin 3.
[0033] The cutting surfaces of the outer side and the inner side of the insertion strip 51 are arc surfaces, and the arc surfaces have the center point of the base 1 as the center, so that the insertion strip 51 can rotate in a ring shape and realize cooperation with the insertion slot 52.
[0034] The contact between the insertion strip 51 and the clamping block 55 can be promoted, the close combination between the encapsulation components is ensured, the environmental factors (such as moisture, dust, etc.) are effectively isolated, and the sealing performance of the encapsulation is improved.
[0035] Through the above embodiment, first, the core 2 is placed on the base 1, and the pin 3 of the core 2 is inserted through the packaging film 8, so that the packaging agent can be guided out, and the packaging agent can be guided from the inside to the gap between the pin 3 and the sleeve 7, so as to realize the packaging of the pin 3, then the insertion strip 51 on the shell 4 is inserted into the insertion slot 52, and then the shell 4 is rotated to make the insertion strip 51 rotate with it, then the insertion strip 51 contacts the clamping block 55 to move inward, then the insertion strip 51 continues to move, when the clamping block 55 and the insertion slot 52 are located in the same plane, the spring 54 pushes the clamping block 55 to insert into the insertion slot 52 to complete the limiting of the insertion strip 51, then the shell 4 can be fixed on the base 1, and the packaging of the core 2 is realized.
[0036] It should be noted that the terms "comprising", "including", or any other variation thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements, but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus.
[0037] Although the embodiments of the present application have been shown and described, it should be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A high-frequency thin-film capacitor comprising a base (1) and a core (2) mounted on the base (1), the core (2) having a pin (3) connected to the bottom of the core (2), and the core (2) having a shell (4) on the outside, characterized in that: The base (1) is provided with a positioning member (5) for the core package; The base (1) is provided with a positioning hole (6) corresponding to the needle pin (3), the positioning hole (6) is fixedly connected with a sleeve (7), the sleeve (7) is fixedly connected with a multi-layer packaging film (8) filled with a packaging agent, and the needle pin (3) is inserted through the packaging film (8) to lead out the packaging agent.
2. The high frequency thin film capacitor of claim 1, wherein: The positioning member (5) comprises two insertion strips (51) fixedly connected to the bottom of the shell (4), the base (1) is provided with an insertion slot (52) corresponding to the insertion strip (51), the insertion strip (51) is provided with a clamping groove (53), the base (1) is fixedly connected with a spring (54), the end of the spring (54) is fixedly connected with a clamping block (55) corresponding to the clamping groove (53), one end of the insertion strip (51) close to the clamping block (55) is arc-shaped, and one side of the clamping block (55) and the insertion strip (51) is also arc-shaped.
3. The high frequency thin film capacitor of claim 2, wherein: The shape of the insertion strip (51) is horizontally placed L-shaped, and the long end of the insertion strip (51) is inserted into the insertion slot (52).
4. The high frequency thin film capacitor of claim 1, wherein: The packaging agent is specifically made of epoxy resin material.
5. The high frequency thin film capacitor of claim 1, wherein: The base (1) is provided with a bolt (9) corresponding to the needle pin (3), and the bolt (9) is sleeved on the outer circle of the needle pin (3).
6. The high frequency thin film capacitor of claim 2, wherein: The cross sections of the outer side and the inner side of the insertion strip (51) are arc surfaces, and the arc surfaces take the center point of the base (1) as the center.