Manipulator for grabbing wafer, wafer carrier box and wafer processing system

Abstract

The utility model provides a manipulator for grabbing a wafer, a wafer carrier box and a wafer processing system, and the manipulator for grabbing the wafer comprises a driving mechanism; the grabbing piece is connected with the driving mechanism, and the grabbing piece is used for grabbing a wafer; the wafer position acquirer is arranged at the bottom of the grabbing piece and electrically connected with the driving mechanism, and the wafer position acquirer is used for detecting a wafer position identification part in the wafer carrier box; and in a working state, the wafer position acquirer sends wafer position information in the wafer position identification part to the driving mechanism, so that the driving mechanism drives the grabbing piece to grab the corresponding wafer. According to the mechanical arm provided by the utility model, the wafer position acquirer is arranged at the bottom of the grabbing piece, so that when the wafer is grabbed, the position information of the wafer is accurately acquired through the wafer position acquirer, the reliability of grabbing the wafer is ensured, the small damage of the wafer in the taking and placing process is avoided, the production efficiency is improved, and the production cost is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor processing equipment technical field especially relates to a kind of mechanical hand for grabbing wafer, wafer carrier box and wafer processing system. BACKGROUND

[0002] In the semiconductor field wafer is usually accessed by wafer carrier box, to avoid wafer oxidation and pollution in the process of transmission in different process machine, the situation occurs.

[0003] Wafer is generally grabbed by mechanical arm, and the grabbing position is usually determined by positioning the coordinate position of each wafer, but due to the inaccuracy of mechanical arm movement when grabbing, and the difference of different kinds of carrier box will appear the problem of inaccurate grabbing position, resulting in wafer damage, thereby affecting production efficiency, increase production cost. UTILITY MODEL CONTENT

[0004] The utility model discloses a kind of mechanical hand for grabbing wafer, wafer carrier box and wafer processing system, improve the reliability of wafer grabbing, avoid wafer damage, improve production efficiency, reduce production cost.

[0005] To achieve the above object, first aspect, the utility model provides a kind of mechanical hand for grabbing wafer, comprising:

[0006] Drive mechanism;

[0007] Grabbing part, connected with the drive mechanism, the grabbing part is used to grab wafer;

[0008] Wafer position obtainer, be located at the bottom of the grabbing part, and with the drive mechanism electric connection, the wafer position obtainer is used to detect the wafer position mark portion in wafer carrier box, and the wafer position information in the wafer position mark portion is sent to the drive mechanism.

[0009] The utility model provides a kind of mechanical hand for grabbing wafer, beneficial effect is in that: through the bottom of grabbing part setting wafer position obtainer, when grabbing wafer, the position information of wafer is accurately obtained by wafer position obtainer, to ensure the reliability of wafer grabbing, avoid wafer damage in the process of taking and placing, improve production efficiency, reduce production cost.

[0010] In some embodiments, the wafer position obtainer is a laser code reader, the laser signal emitted by the laser code reader is parallel with the extension direction of the grabbing part, and the laser code reader is used to read the wafer position information in the wafer position mark portion;

[0011] The wafer position identifier comprises a plurality of position codes arranged at intervals.

[0012] In some embodiments, the driving mechanism comprises a base, a first telescopic device and a second telescopic device.

[0013] The fixed end of the first telescopic device is arranged on the base, and the telescopic end of the first telescopic device can be lifted and lowered along a direction perpendicular to the plane where the base is arranged.

[0014] The fixed end of the second telescopic device is arranged on the telescopic end of the first telescopic device, and the telescopic direction of the second telescopic device is perpendicular to the telescopic direction of the first telescopic device.

[0015] The gripping member is arranged on the telescopic end of the second telescopic device, and the extension direction of the gripping member is the same as the telescopic direction of the second telescopic device.

[0016] In some embodiments, the driving mechanism further comprises a controller.

[0017] The controller is electrically connected with the first telescopic device, the second telescopic device and the wafer position obtainer, and the controller is used to control the operation of the first telescopic device and the second telescopic device.

[0018] In the second aspect, the utility model embodiment provides a wafer carrier box, comprising:

[0019] A box body;

[0020] A plurality of bearing members arranged at intervals in the box body, the bearing members being used to bear wafers;

[0021] A wafer position identifier arranged on the inner wall of the box body, the wafer position identifier being used to mark the wafer position information on each bearing member.

[0022] The wafer carrier box has the beneficial effects that the wafer position identifier is arranged in the box body, and the wafer position obtainer obtains the position information of each wafer, so that the gripping member can accurately and reliably grip the wafer.

[0023] In some embodiments, the wafer position identification part comprises a plurality of position codes, which are arranged on the inner wall of the box body at intervals, and each position code corresponds to one of the carriers.

[0024] In some embodiments, the carrier comprises a support part and a top part arranged oppositely, and the support part and the top part are arranged at intervals to form a carrying space for carrying wafers.

[0025] In some embodiments, the surfaces of the support part and the top part arranged oppositely are arc surfaces, so that the carrying space gradually increases in the direction from the inner wall of the box body to the center of the box body. Its beneficial effect is that by arranging the surfaces of the support part and the top part oppositely as arc surfaces, the carrying space gradually increases in the direction from the inner wall of the box body to the center of the box body, so as to facilitate the taking and placing of wafers and avoid interference between the wafers and the carrier during the taking and placing of the wafers.

[0026] In some embodiments, the wafer position identification part further comprises a plurality of mounting plates, and the size of each mounting plate is the same as that of the position code.

[0027] The mounting plates are arranged on the inner wall of the box body at intervals, and each mounting plate corresponds to one of the carriers.

[0028] The position code is attached to the mounting plate. Its beneficial effect is that by arranging the mounting plates on the inner wall of the box body at intervals and attaching the position code to the mounting plate, the replacement of the position code is facilitated, and the later replacement and maintenance are facilitated.

[0029] In a third aspect, the utility model provides a wafer processing system, including processing cavity, the mechanical hand and the wafer carrier box of the utility model;

[0030] The mechanical hand is used for grabbing wafers from the wafer carrier box and transferring the wafers to the processing cavity for processing

[0031] The wafer processing system provided by the utility model has the beneficial effects that the mechanical hand is used in cooperation with the wafer carrier box to ensure the reliability of wafer grabbing, thereby improving the reliability of wafer processing, improving production efficiency and reducing production cost. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 The structure diagram of the mechanical hand for grabbing wafers provided by the utility model is shown in the embodiment of the utility model;

[0033] Figure 2The utility model provides an embodiment wafer carrier box structure schematic view provided by the utility model,

[0034] Figure 3 Another embodiment wafer carrier box structure schematic view provided by the utility model.

[0035] Reference signs:

[0036] Driving mechanism 1, base 11, first telescopic ware 12, second telescopic ware 13, controller 14, grabbing piece 2,

[0037] Wafer position obtainer 3, wafer carrier box 4, box body 41, wafer position mark part 42, position code 421, bearing 43, support part 431, top 432, arc surface 433, temperature regulator 44, temperature sensor 45, heater 46, cooler 47, wafer 5. Specific implementation

[0038] In order to make the purpose, technical scheme and advantage of the utility model more clear, the technical scheme in the embodiment of the utility model will be clearly and completely described below in combination with the drawings of the utility model. Based on the embodiment in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the protection scope of the utility model. Unless otherwise defined, the technical terms or scientific terms used here should be the usual meaning understood by the person skilled in the art in the field of the utility model. The similar words such as "include" used in this paper mean that the elements or objects before the word cover the elements or objects listed after the word and its equivalent, and other elements or objects are not excluded. In this paper, "connection" can be direct connection or indirect connection, that is, connection through intermediate objects, unless otherwise specified.

[0039] In view of the problems existing in the prior art, the embodiment of the utility model provides a kind of mechanical hand for grabbing wafer, refer to Figure 1 And Figure 2 As shown in the figure, the mechanical hand includes driving mechanism 1, grabbing piece 2 and wafer position obtainer 3. Wherein, the grabbing piece 2 is connected with the driving mechanism 1, and the grabbing piece 2 is used to grab wafer 5. The wafer position obtainer 3 is arranged at the bottom of the grabbing piece 2, and is electrically connected with the driving mechanism 1, and the wafer position obtainer 3 is used to detect the wafer position mark part 42 in wafer carrier box 4.

[0040] In working condition, the wafer position obtainer 3 sends the wafer position information in the wafer position mark part 42 to the driving mechanism 1, so that the driving mechanism 1 drives the grabbing piece 2 to grab corresponding wafer 5.

[0041] In the embodiment, the wafer position detector 3 is arranged at the bottom of the grabbing member 2. When the robot grabs the wafer 5, the driving mechanism 1 drives the grabbing member 2 to move into the wafer carrier box 4 in advance, and then the wafer position detector 3 accurately acquires the position information of the wafer 5. Then, the driving mechanism 1 grabs the corresponding wafer 5 according to the acquired wafer position information, so as to ensure the reliability of wafer grabbing, avoid wafer damage during taking and placing, improve production efficiency, and reduce production cost.

[0042] In some embodiments, the wafer position detector 3 is a laser code reader, which is arranged below the grabbing member 2 and fixedly connected with the grabbing member 2. The laser signal emitted by the laser code reader is parallel to the extending direction of the grabbing member 2. The laser code reader is used to read the wafer position information in the wafer position identification part 42. The wafer position identification part 42 includes a plurality of position codes 421 arranged at intervals. Each position code 421 corresponds to a wafer position. The position of each wafer 5 is accurately acquired by reading each position code 421 by the laser code reader.

[0043] In the embodiment, the laser code reader and the position code 421 are used in cooperation, so as to accurately determine the position of the corresponding wafer 5, and ensure the reliability of wafer grabbing.

[0044] Continuing to refer to Figure 1 and Figure 2 In some embodiments, the driving mechanism 1 includes a base 11, a first telescopic device 12, and a second telescopic device 13. The fixed end of the first telescopic device 12 is arranged vertically on the base 11, so that the telescopic end of the first telescopic device 12 can be lifted and lowered along a direction perpendicular to the plane on which the base 11 is arranged. The fixed end of the second telescopic device 13 is arranged vertically on the telescopic end of the first telescopic device 12, so that the telescopic direction of the second telescopic device 13 is perpendicular to the telescopic direction of the first telescopic device 12. The grabbing member 2 is arranged at the telescopic end of the second telescopic device 13, and the extending direction of the grabbing member 2 is the same as the telescopic direction of the second telescopic device 13.

[0045] In the embodiment, the first telescopic device 12 and the second telescopic device 13 are used in cooperation to drive the grabbing member 2 to move, and the scanning of the wafer position detector 3 is combined to accurately grab the wafer 5.

[0046] Further, the driving mechanism 1 further comprises a controller 14, the controller 14 is electrically connected with the first telescopic device 12, the second telescopic device 13 and the wafer position detector 3, the controller 14 is used for controlling the first telescopic device 12 and the second telescopic device 13 to run, when the controller 14 receives the wafer position information, the controller 14 controls the grabbing piece 2 to grab the corresponding wafer 5.

[0047] In the embodiment, it can be understood that when the mechanical arm needs to grab the wafer 5 from the wafer carrier box 4, the controller 14 will control the first telescopic device 12 and the second telescopic device 13 to run in advance, so that the wafer position detector 3 enters the wafer carrier box 4, the wafer position detector 3 scans and obtains the wafer position information in the wafer carrier box 4, and feeds back the wafer position information to the controller 14, so that the controller 14 controls the grabbing piece 2 to grab the corresponding wafer 5.

[0048] In another embodiment of the utility model, a wafer carrier box 4 is provided, as shown in Figure 1 and Figure 3 The wafer carrier box 4 comprises a box body 41 and a wafer position marking part 42, wherein a plurality of bearing pieces 43 are arranged in the box body 41 at intervals, the distance between each adjacent bearing piece 43 is equal, and the bearing piece 43 is used for bearing the wafer 5, and the wafer position marking part 42 is arranged on the inner wall of the box body 41, and the wafer position marking part 42 is used for marking the wafer position information on each bearing piece 43, so as to obtain the information by the wafer position detector 3.

[0049] In the embodiment, the wafer position marking part 42 is arranged in the box body 41, so as to cooperate with the wafer position detector 3 to obtain the position information of each wafer 5, so that the grabbing piece 2 can accurately and reliably grab the wafer 5.

[0050] In some embodiments, the wafer position marking part 42 comprises a plurality of position codes 421, and the plurality of position codes 421 are arranged on the inner wall of the box body 41 at intervals, each position code 421 corresponds to one bearing piece 43, and each position code 421 is located below the corresponding bearing piece 43.

[0051] In the embodiment, one position code 421 is arranged corresponding to each bearing piece 43, so as to mark each stored wafer 5 in the box body 41.

[0052] In some embodiments, the wafer position identification part 42 further comprises a plurality of mounting plates, the mounting plates are of the same size as the position code 421, the mounting plates are detachably arranged on the inner wall of the box body 41, and each mounting plate corresponds to one of the carriers 43, and the position code 421 is attached to the mounting plate.

[0053] In the embodiment, each mounting plate is detachably arranged below the carrier 43, by detachably arranging the mounting plate on the inner wall of the box body 41 and attaching the position code 421 to the mounting plate, the replacement of the position code 421 is facilitated, and the replacement and maintenance of the wafer position identification part 42 in later stage is facilitated.

[0054] In some embodiments, the carrier 43 comprises a support part 431 and a top part 432 arranged oppositely, and the support part 431 and the top part 432 are arranged at intervals to form a carrying space for carrying the wafer 5 to ensure the stability of the wafer 5 during storage.

[0055] Further, the opposite surfaces of the support part 431 and the top part 432 are arc surfaces 433, so that the carrying space gradually increases from the inner wall of the box body 41 to the center of the box body 41.

[0056] In the embodiment, by arranging the opposite surfaces of the support part 431 and the top part 432 as arc surfaces 433, the carrying space gradually increases from the inner wall of the box body 41 to the center of the box body 41, so as to facilitate the taking and placing of the wafer 5 and avoid interference between the wafer 5 and the carrier 43 during the taking and placing of the wafer 5.

[0057] In some embodiments, the wafer carrier box 4 further comprises a temperature regulator 44, a temperature sensor 45, a heater 46 and a cooler 47. The temperature sensor 45, the heater 46 and the cooler 47 are arranged in the box body 41, the temperature sensor 45 is used to detect the temperature in the box body 41, the heater 46 is used to heat the box body 41, the cooler 47 is used to cool the box body 41, the temperature regulator 44 is arranged in the box body 41 and electrically connected with the temperature sensor 45, the heater 46 and the cooler 47, and the temperature regulator 44 is used to control the operation of the heater 46 and the cooler 47 to make the actual temperature in the box body 41 reach the target temperature.

[0058] In the embodiment, the temperature sensor 45, the heater 46 and the cooler 47 are arranged in the box body 41 to adjust the temperature in the box body 41, so that the actual temperature in the box body 41 reaches the target temperature, thereby ensuring the reliability of the wafer 5 stored in the box body 41.

[0059] In another embodiment of the utility model, a wafer processing system is provided, comprising a processing cavity, the mechanical hand and the wafer carrier box 4. Wherein, the mechanical hand is used to grab wafer 5 from the wafer carrier box 4, and the wafer 5 is transferred to the processing cavity for processing.

[0060] In this embodiment, the mechanical hand provided in the above embodiment is used in cooperation with the wafer carrier box 4 to ensure the reliability of wafer 5 grabbing, thereby improving the reliability of wafer 5 being transferred to the processing cavity for processing, improving the production efficiency and reducing the production cost.

[0061] The above is only a specific implementation of the embodiment of the application, but the protection scope of the embodiment of the application is not limited to this, any change or replacement within the technical scope disclosed in the embodiment of the application should be covered in the protection scope of the embodiment of the application. Therefore, the protection scope of the embodiment of the application should be subject to the protection scope of the claims.

Claims

1. A robot for gripping a wafer, characterized by, The utility model relates to a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box.

2. The robot for gripping a wafer according to claim 1, wherein The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box.

3. The robot for gripping a wafer according to claim 2, wherein The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box.

4. The robot for gripping a wafer according to claim 3, wherein The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box.

5. A wafer carrier cassette characterized by, The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box.

6. The wafer carrier cassette of claim 5, wherein, The utility model discloses a wafer position acquisition device and a wafer carrier box.

7. The wafer carrier cassette of claim 5, wherein, The utility model discloses a wafer position acquisition device and a wafer carrier box.

8. The wafer carrier cassette of claim 7, wherein, The utility model discloses a wafer position acquisition device and a wafer carrier box.

9. The wafer carrier cassette of claim 6, wherein, The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box.

10. A wafer processing system, characterized by, The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box. The utility model discloses a wafer position acquisition device and a wafer carrier box. 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