Wafer front and back face washing, centering and spin-drying mechanism

Abstract

The utility model discloses a wafer front and back face washing, centering and spin-drying mechanism which comprises a fixed disc and a shell arranged at the top of the fixed disc. A water tank is concentrically arranged in the shell, and at least two groups of nozzles are arranged on the inner wall of the water tank; a rotatable jig is arranged in the center of the inner side of the water tank, and a plurality of micropore suction cups are arranged above the jig; two centering clamping jaws are symmetrically arranged at the two ends of the jig, clamping jaw opening and closing air cylinders are arranged at the bottoms of the centering clamping jaws, clamping jaw lifting assemblies are connected to the bottoms of the clamping jaw opening and closing air cylinders in a matched mode, and the clamping jaw lifting assemblies are fixedly installed at the bottom of the fixing disc; by arranging the profiling centering clamping jaw, the wafer can be firmly attached to the outer edge of the wafer, firm fixation of the wafer is guaranteed, the wafer is prevented from flying out during rotary spin-drying, the wafer spin-drying safety is improved, in addition, the water tank is flexibly controlled to ascend and descend in the wafer cleaning and spin-drying process, and the wafer can be cleaned and spin-dried in the wafer cleaning and spin-drying process. The water tank ascends to prevent water from splashing when the wafer rotates, and the water tank descends after spin-drying is completed to prevent liquid from dripping into the water tank.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer spin-drying technical field more specifically, relate to wafer front and back washing centering spin-drying mechanism. BACKGROUND

[0002] Wafer needs to be spin-drying operation after cleaning, and the existing wafer spin-drying mechanism cannot firmly clamp and fix the wafer, and cannot realize rapid spin-drying when the wafer rotates, which can easily cause the wafer to fly out or damage the wafer, in addition, the existing wafer spin-drying mechanism cannot flexibly control the water tank lifting during spin-drying, and it is difficult to block the water splashed from the wafer by the water tank. SUMMARY

[0003] In order to solve the above at least one technical problem, the utility model provides a wafer front and back washing centering spin-drying mechanism.

[0004] The utility model discloses a wafer front and back washing centering spin-drying mechanism, which comprises a fixed disc and a shell arranged on the top of the fixed disc.

[0005] The water tank is arranged inside the shell with the same center, and at least two groups of spray heads are arranged on the inner wall of the water tank.

[0006] A rotatable jig is arranged at the center position of the inner side of the water tank, and a plurality of microporous suction cups are arranged above the jig.

[0007] Two centering clamping jaws are symmetrically arranged at both ends of the jig, and a clamping jaw opening and closing air cylinder is arranged at the bottom of the centering clamping jaw.

[0008] The bottom of the clamping jaw opening and closing air cylinder is connected with a clamping jaw lifting assembly, and the clamping jaw lifting assembly is fixedly installed at the bottom of the fixed disc.

[0009] In a preferred embodiment of the utility model, the clamping jaw lifting assembly is two, and the two clamping jaw lifting assemblies are symmetrically arranged at both sides of the bottom of the fixed disc.

[0010] In a preferred embodiment of the utility model, the clamping jaw lifting assembly comprises a clamping jaw lifting air cylinder fixedly installed at the bottom of the fixed disc, a connecting rod is connected to the bottom of the clamping jaw lifting air cylinder, a guide column is connected to the top of both ends of the connecting rod, a clamping jaw telescopic column is arranged at the top of the guide column, and the clamping jaw telescopic column is connected to the bottom of the clamping jaw opening and closing air cylinder.

[0011] In a preferred embodiment of the utility model, a rotating shaft is arranged at the center position of the bottom of the jig, and the rotating shaft penetrates through the fixed disc at the bottom.

[0012] In a preferred embodiment of this utility model, a coupling is connected to the bottom of the rotating shaft, and a central servo motor is connected to the bottom of the coupling. The central servo motor drives the wafer on the fixture to rotate.

[0013] In a preferred embodiment of this utility model, a lifting motor is further included. A speed reducer is provided above the lifting motor. The speed reducer is fixedly installed below the fixed plate. A linkage rod is connected above the speed reducer. Connecting columns are provided at both ends of the linkage rod. The connecting columns are connected to the bottom of the water tank. The lifting motor drives the linkage rod to lift and lower, controlling the synchronous lifting and lowering of the water tank.

[0014] In a preferred embodiment of this utility model, the water tank, the centering gripper, the fixture, and the fixing plate are all made of non-metallic materials, including PVC and PEEK materials.

[0015] In a preferred embodiment of this invention, the inner wall of the centering gripper has an arc-shaped structure.

[0016] In a preferred embodiment of this invention, two sets of nozzles are respectively disposed on both sides of the fixture, each set of nozzles includes at least three spray nozzles, the two sets of nozzles are staggered in height, and the two sets of nozzles spray cleaning fluid onto the top and bottom of the wafer respectively.

[0017] In a preferred embodiment of this invention, the cleaning solution includes one of hydrofluoric acid, ammonia, or pure water.

[0018] The above-mentioned technical solution of this utility model has the following advantages compared with the prior art:

[0019] This application employs a design where the wafer is first lifted by grippers, then sprayed with liquid for cleaning of its upper and lower surfaces. A microporous suction cup then holds the wafer in place for spin-drying, ensuring secure fixation and preventing the wafer from flying out during the spin-drying process, thus improving spin-drying safety. Furthermore, the water tank's height can be flexibly controlled during both cleaning and spin-drying processes. During cleaning and spin-drying, the water tank rises to prevent water splashing from the rotating wafer, and descends after spin-drying to prevent dripping. Finally, the grippers can be used to adjust the wafer's concentricity and position it. Attached Figure Description

[0020] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, some of the drawings in the following description are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1It is the embodiment wafer front and back washing centering spin-drying mechanism perspective structure schematic view of the utility model;

[0022] Figure 2 It is the embodiment wafer front and back washing centering spin-drying mechanism side view of the utility model;

[0023] Figure 3 It is the embodiment wafer front and back washing centering spin-drying mechanism plan view of the utility model;

[0024] Figure 4 It is the embodiment wafer front and back washing centering spin-drying mechanism front view of the utility model;

[0025] Figure 5 It is the embodiment A-A section view of the utility model.

[0026] In the drawing: 1, centering clamp jaw, 2, clamp jaw opening and closing cylinder, 3, clamp jaw telescopic column, 4, water tank, 5, center servo motor, 6, speed reducer, 7, lifting motor, 8, guide column, 9, connecting rod, 10, clamp jaw lifting cylinder, 11, shell, 12, fixed disc, 13, spray head, 14, microporous suction disc, 15, jig, 16, rotating shaft, 17, linkage rod, 18, coupling. DETAILED DESCRIPTION

[0027] In order to more clearly understand the above purpose, features and advantages of the utility model, the utility model is further described in detail below in conjunction with specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0028] In the following description, a lot of specific details are set forth in order to fully understand the utility model, however, the utility model can also be implemented in other ways different from the description herein, therefore, the protection scope of the utility model is not limited by the specific embodiments disclosed below.

[0029] Embodiment one

[0030] Referring to Figures 1-5 The utility model discloses a kind of wafer front and back washing centering spin-drying mechanism, comprising: fixed disc 12 and the shell 11 being set in the top of fixed disc 12;

[0031] Water tank 4 is provided in the concentricity of shell 11 interior, and at least two groups of spray head 13 are provided on the inner wall of water tank 4;

[0032] Rotatable jig 15 is provided in the center position of the inside of water tank 4, and multiple microporous suction disc 14 are provided above jig 15;

[0033] Two centering clamp jaws 1 are symmetrically provided at the two ends of jig 15, and clamp jaw opening and closing cylinder 2 is provided at the bottom of centering clamp jaw 1.

[0034] The clamping jaw opening and closing cylinder 2 is connected with a clamping jaw lifting assembly at the bottom, and the clamping jaw lifting assembly is fixedly installed at the bottom of the fixed disc 12.

[0035] According to the embodiment of the utility model, the clamping jaw lifting assembly is two, and the two clamping jaw lifting assemblies are symmetrically arranged at the two sides of the bottom of the fixed disc 12.

[0036] According to the embodiment of the utility model, the clamping jaw lifting assembly comprises a clamping jaw lifting cylinder 10 fixedly installed at the bottom of the fixed disc 12, a connecting rod 9 connected at the bottom of the clamping jaw lifting cylinder 10, a guide column 8 connected at the top of the two ends of the connecting rod 9, a clamping jaw telescopic column 3 arranged at the top of the guide column 8, and the clamping jaw telescopic column 3 is connected to the bottom of the clamping jaw opening and closing cylinder 2.

[0037] According to the embodiment of the utility model, a rotating shaft 16 is arranged at the center position of the bottom of the jig 15, and the bottom of the rotating shaft 16 penetrates through the fixed disc 12.

[0038] According to the embodiment of the utility model, the bottom of the rotating shaft 16 is connected with a shaft coupling 18, the bottom of the shaft coupling 18 is connected with a center servo motor 5, and the center servo motor 5 drives the wafer on the jig 15 to rotate.

[0039] According to the embodiment of the utility model, a lifting motor 7 is further arranged, a speed reducer 6 is arranged above the lifting motor 7, the speed reducer 6 is fixedly installed below the fixed disc 12, a linkage rod 17 is connected above the speed reducer 6, connecting columns are arranged at the two ends of the linkage rod 17, the connecting columns are connected to the bottom of the sink 4, and the lifting motor 7 drives the linkage rod 17 to lift and control the sink 4 to synchronously lift.

[0040] According to the embodiment of the utility model, the sink 4, the centering clamping jaw 1, the jig 15 and the fixed disc 12 are all made of non-metallic materials, and the non-metallic materials include PVC and PEEK materials.

[0041] In addition, in order to ensure the use safety of the spin-drying mechanism and adapt to the corrosiveness of the cleaning liquid, the spray head 13, the shell 11 and the parts in contact with the cleaning liquid are all made of non-metallic materials.

[0042] According to the embodiment of the utility model, the inner wall of the centering clamping jaw 1 is in an arc structure, and it can be understood that the centering clamping jaw 1 is made in a shape corresponding to the edge of the wafer, so that the outer edge of the wafer can be perfectly attached to the inner wall of the centering clamping jaw 1, and the firmness of the centering clamping jaw 1 in clamping the wafer is improved.

[0043] According to the embodiment of the utility model, the two groups of spray heads 13 are arranged at the two sides of the jig 15 respectively, each group of spray heads 13 comprises at least three water spraying openings, the two groups of spray heads 13 are distributed in a height staggered manner, and the two groups of spray heads 13 respectively spray the cleaning liquid to the top and the bottom of the wafer.

[0044] According to the embodiment of the utility model, the cleaning liquid comprises one of hydrofluoric acid, ammonia water or pure water.

[0045] Working principle:

[0046] Firstly, the centering clamp 1 is lifted and opened by the clamping jaw lifting cylinder 10 and the clamping jaw opening and closing cylinder 2, the wafer is caught after the centering clamp 1 is lifted, and the centering clamp 1 is closed to clamp the wafer,

[0047] The water tank 4 is lifted, and the lower water nozzle sprays water on the back of the wafer for cleaning;

[0048] The centering clamp 1 is lowered, the wafer is placed on the middle rotating microporous suction disc 14, the microporous suction disc 14 is opened and sucks the wafer by negative pressure, the water tank 4 is lifted to prevent splashing, the jig 15 is slowly rotated by the center servo motor 5, the water nozzle is opened to clean the upper and lower surfaces of the wafer,

[0049] After cleaning, the wafer is rotated and quickly spun dry by the center servo motor 5, the centering clamp 1 is lifted and positioned and connected to the mechanical hand, and the water tank 4 is lowered to prevent dripping.

[0050] In summary, the wafer is lifted by the clamping jaw first, the upper and lower surfaces of the wafer are sprayed and cleaned, and then the microporous suction disc is used to spin dry the wafer, which ensures the firm fixation of the wafer, prevents the wafer from flying out during spinning, and improves the safety of wafer spinning. In addition, the water tank can be flexibly controlled to rise and fall during the cleaning and spinning of the wafer, so that the water tank can block the water splashing when the wafer is cleaned and spun, and the water tank can be lowered after spinning to prevent dripping. Finally, the wafer can be positioned and adjusted for concentricity by the clamping jaw.

[0051] The technical features of the above embodiments can be combined arbitrarily, and in order to make the description concise, not all possible combinations of the technical features in the above embodiments are described, however, as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.

[0052] The above description of the disclosed embodiments enables a person skilled in the art to implement or use the utility model. Various modifications of the above embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the utility model. Therefore, the utility model will not be limited to the above embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

[0053] The above merely describes a specific implementation of the present application, but the protection scope of the present application is not limited thereto, any skilled person in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A wafer front and backside rinse centering spin-dry mechanism comprising: A fixed disc and a shell arranged on the top of the fixed disc; characterized in that, A water tank is arranged inside the shell and shares the same center with the shell, A rotatable jig is arranged at the center of the inner side of the water tank, and a plurality of microporous suction cups are arranged above the jig, Two centering clamping jaws are symmetrically arranged at the two ends of the jig, and a clamping jaw opening and closing air cylinder is arranged at the bottom of the centering clamping jaw, A clamping jaw lifting assembly is connected to the bottom of the clamping jaw opening and closing air cylinder, and the clamping jaw lifting assembly is fixedly installed at the bottom of the fixed disc.

2. The wafer front and back side rinsing and centering spin-dry mechanism according to claim 1, characterized in that, The clamping jaw lifting assembly is two, and the two clamping jaw lifting assemblies are symmetrically arranged at the two sides of the bottom of the fixed disc.

3. The wafer front and back side rinsing and centering spin-dry mechanism of claim 2, wherein, The clamping jaw lifting assembly includes a clamping jaw lifting air cylinder fixedly installed at the bottom of the fixed disc, a connecting rod connected to the bottom of the clamping jaw lifting air cylinder, a guide column connected to the top of the two ends of the connecting rod, and a clamping jaw telescopic column arranged at the top of the guide column and connected to the bottom of the clamping jaw opening and closing air cylinder.

4. The wafer front and back side rinsing and centering spin-dry mechanism of claim 1 wherein, A rotating shaft is arranged at the center of the bottom of the jig, and the rotating shaft penetrates the fixed disc.

5. The wafer front and backside rinsing and centering spin-dry mechanism of claim 4, wherein, A shaft coupling is connected to the bottom of the rotating shaft, a center servo motor is connected to the bottom of the shaft coupling, and the center servo motor drives the wafer on the jig to rotate.

6. The wafer front and back side rinsing and centering spin-dry mechanism of claim 1 wherein, Further comprising a lifting motor, a speed reducer is arranged above the lifting motor, the speed reducer is fixedly installed below the fixed disc, a linkage rod is connected above the speed reducer, a connecting column is arranged at the two ends of the linkage rod, the connecting column is connected to the bottom of the water tank, and the lifting motor drives the linkage rod to lift and control the water tank to synchronously lift.

7. The wafer front and back side rinsing and centering spin-dry mechanism of claim 1 wherein, The water tank, the centering clamping jaw, the jig and the fixed disc are all made of non-metallic materials, and the non-metallic materials include PVC and PEEK materials.

8. The wafer front and back side rinsing and centering spin-dry mechanism of claim 1 wherein, The inner wall of the centering clamping jaw is in an arc structure.

9. The wafer front and back side rinsing and centering spin-dry mechanism of claim 1 wherein, Two groups of spray heads are arranged at the two sides of the jig, each group of spray heads includes at least three water spray openings, the two groups of spray heads are distributed in height staggered, and the two groups of spray heads respectively spray cleaning liquid to the top and bottom of the wafer.

10. The wafer front and backside rinsing and centering spin-dry mechanism of claim 9, wherein, The cleaning liquid includes one of hydrofluoric acid, ammonia water or pure water.

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