Integrated circuit mold moving device
By designing an integrated circuit mold moving device, utilizing a stop structure and a track to protect the positioning pin, the problem of easy damage to the positioning pin during transportation was solved, thus achieving safe and efficient mold transportation.
Patent Information
- Application Number
- CN202423173130.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-12-23
AI Technical Summary
When transporting integrated circuit molds, locating pins are easily damaged due to improper stacking.
An integrated circuit mold moving device was designed, comprising multiple stop structures and placement tracks, with locating pin receiving space formed between the stop structures, tilting at an angle of 20°-35°, and equipped with buffer pads and spring-loaded structures to protect the locating pins.
This effectively avoids damage to the locating pins during transportation, improving the safety and transportation efficiency of integrated circuit molds.
Smart Images
Figure CN223612393U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of semiconductor, and particularly relates to an integrated circuit mold moving device. BACKGROUND
[0002] When transporting integrated circuit molds between workstations, the common practice is to stack multiple integrated circuit molds on a cart for moving. However, the integrated circuit molds usually include positioning pins, and improper stacking of the integrated circuit molds can easily cause damage to the positioning pins. SUMMARY
[0003] Therefore, one of the purposes of the present application is to provide an integrated circuit mold moving device to solve the above problems.
[0004] According to an embodiment of the present application, an integrated circuit mold moving device is provided. The integrated circuit mold moving device includes a plurality of block structures. The plurality of block structures are arranged in parallel. A mold placement space for placing the integrated circuit mold is formed between two adjacent block structures. The block structure includes an upper block and a lower block. A positioning pin accommodation space is formed between the upper block and the lower block. The positioning pin accommodation space is used to accommodate the positioning pin on the integrated circuit mold.
[0005] According to an embodiment of the present application, an angle is formed between the plurality of block structures and a horizontal line.
[0006] According to an embodiment of the present application, the angle is in the range of 20°-35°.
[0007] According to an embodiment of the present application, the mold placement space includes a placement track for accessing the integrated circuit mold.
[0008] According to an embodiment of the present application, one end of the placement track is provided with a buffer pad.
[0009] According to an embodiment of the present application, the mold placement space includes a rebound structure for pushing out the placement track.
[0010] According to an embodiment of the present application, the plurality of block structures are arranged in parallel along a first direction, and the integrated circuit mold moving device further includes a blocking strip. The blocking strip is arranged on one side of the plurality of block structures and extends along the first direction.
[0011] According to an embodiment of the present application, the integrated circuit mold moving device further includes a storage area. The storage area is arranged below the plurality of block structures.
[0012] The integrated circuit mold moving device provided by the present application can avoid damage to the positioning pins on the integrated circuit mold during transportation of the integrated circuit mold. BRIEF DESCRIPTION OF DRAWINGS
[0013] The accompanying drawings are included to provide a further understanding of the present application, and are incorporated in and constitute a part of this specification, illustrate embodiments of the present application and serve to explain the principles of the present application. In the drawings:
[0014] Figure 1 A schematic view of an integrated circuit mold moving device according to an embodiment of the present application is shown.
[0015] Figure 2 A schematic view of a stop block structure according to an embodiment of the present application is shown. DETAILED DESCRIPTION
[0016] The following disclosure provides various embodiments or examples, which can be used to implement different features of the present disclosure. The specific examples of components and configurations described below are used to simplify the present disclosure. As can be appreciated, these descriptions are merely examples, and are not intended to limit the present disclosure. For example, in the following description, a first feature is formed on or over a second feature, which can include certain embodiments in which the first and second features are directly in contact with each other; and can also include certain embodiments in which additional components are formed between the first and second features such that the first and second features can not be directly in contact with each other. In addition, the present disclosure can repeatedly use component symbols and / or reference numerals in multiple embodiments. Such repeated use is based on the purpose of simplicity and clarity, and does not represent a relationship between different embodiments and / or configurations.
[0017] Furthermore, spatially relative terms, such as "beneath", "below", "lower", "above", "upper", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The devices can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
[0018] Notwithstanding that the numerical ranges and parameters setting forth the broadest scope of the application are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements. Moreover, all ranges disclosed herein are to be understood to be
[0019] Figure 1 A schematic diagram of an integrated circuit mold moving device 10 according to an embodiment of the present application is shown. In some embodiments, the integrated circuit mold moving device 10 includes a plurality of block structures 101. In some embodiments, the plurality of block structures 101 are arranged in parallel along a first direction (e.g., the X-axis direction). It is noted that the present application does not limit the number of block structures 101 included in the integrated circuit mold moving device 10.
[0020] In some embodiments, the plurality of block structures 101 are inclined at an angle In some embodiments, the angle to facilitate user access to the integrated circuit molds (e.g., an integrated circuit mold 40 as shown). In some embodiments, the angle Figure 2 is in the range of 20°-35°.
[0021] In some embodiments, a mold placement space 70 is formed between two adjacent block structures 101. The mold placement space 70 is used to place an integrated circuit mold 40. In some embodiments, the mold placement space 70 includes a placement track for accessing the integrated circuit mold 40. When a user wants to access the integrated circuit mold 40, the user only needs to push or pull the integrated circuit mold 40 into or out of the placement track. In some embodiments, a bumper pad can be provided at one end of the placement track. The bumper pad can provide a cushioning effect when the user pushes the integrated circuit mold 40, thereby avoiding collision of the integrated circuit mold 40.
[0022] In some embodiments, the mold placement space 70 can further comprise a resilient structure. The resilient structure can push the placement rail out when a user applies pressure, so that the user can place the integrated circuit mold 40. After the user places the integrated circuit mold 40, the user can press the placement rail to access the integrated circuit mold 40.
[0023] In some embodiments, the integrated circuit mold moving device 10 can further comprise a blocking bar 80. In some embodiments, the blocking bar 80 is disposed on one side of the plurality of blocking structures 101 and extends in a first direction (e.g., the X-axis direction). After the user places the integrated circuit mold 40 into the mold placement space 70, the user can use the blocking bar 80 to block the integrated circuit mold 40 from escaping from the mold placement space 70, thereby reducing the risk of the integrated circuit mold 40 falling off the integrated circuit mold moving device 10 during transportation. In some embodiments, the blocking bar 80 can be fixed at one end to the vehicle body of the integrated circuit mold moving device 10 and detachably connected to the vehicle body of the integrated circuit mold moving device 10 at the other end by means of latching, magnetic attraction, adhesion, or the like.
[0024] Referring to FIGS. 1 and 2, Figure 1 and Figure 2 , Figure 2 A schematic view of a blocking structure 101 according to an embodiment of the present application is shown. In some embodiments, the blocking structure 101 comprises an upper blocking block 201 and a lower blocking block 202. The upper blocking block 201 and the lower blocking block 202 extend in a second direction (e.g., the Y-axis direction). In some embodiments, the upper blocking block 201 and the lower blocking block 202 form a positioning pin receiving space 30 therebetween. In some embodiments, the positioning pin receiving space 30 is configured to receive a positioning pin 41 on the integrated circuit mold 40. The positioning pin receiving space 30 can prevent the positioning pin 41 from being damaged by collision. In some embodiments, the upper blocking block 201 and the lower blocking block 202 each comprise a hollow space to reduce the weight of the integrated circuit mold moving device 10.
[0025] In some embodiments, the height L10 of the integrated circuit mold moving device 10 is in the range of 1.5 m to 1.8 m, which facilitates the user to access the integrated circuit mold 40. In some embodiments, the integrated circuit mold moving device 10 further comprises a universal wheel 90 to facilitate movement of the integrated circuit mold moving device 10. In some embodiments, the integrated circuit mold moving device 10 can further comprise a handle (not shown) to facilitate the user to move the integrated circuit mold moving device 10. In some embodiments, the integrated circuit mold moving device 10 can further comprise a motor (not shown) to achieve autonomous movement of the integrated circuit mold moving device 10.
[0026] In some embodiments, the integrated circuit mold moving device 10 can further include a storage area 50. The storage area 50 is disposed below the block structure 101. The storage area 50 can be used to store other items.
[0027] The integrated circuit mold moving device 10 presented herein can avoid breakage of the positioning pins 41 on the integrated circuit mold 40 during transportation of the integrated circuit mold 40.
[0028] As used herein, the terms "approximately," "essentially," "substantially," and "about" are used to describe and account for small variations. When used in connection with a quantity, the terms can indicate that the quantity is exact or nearly exact. As used herein in reference to a given value or range, the term "about" generally means within ±10%, ±5%, ±1%, or ±0.5% of the given value or range. Ranges can be expressed herein as from one endpoint to another endpoint or between two endpoints. Unless otherwise specified, all ranges disclosed herein include the endpoints. The term "substantially co-planar" can refer to two surfaces that are positioned along the same plane to within a few micrometers (pm), e.g., to within 10 pm, 5 pm, 1 pm, or 0.5 pm. When referring to values or characteristics that are "substantially the same," the term can refer to values that are within ±10%, ±5%, ±1%, or ±0.5% of the average of the values.
[0029] As used herein, the terms“approximately,”“substantially,”“essentially,” and“about” are used to describe and account for small variations. When utilized in connection with an event or circumstance, the terms can refer to instances in which the event or circumstance occurs exactly, as well as instances in which the event or circumstance occurs with a small variation. For example, when utilized in connection with a numerical value, the terms can refer to a range of variation that is less than or equal to ±10% of the numerical value, e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, two numerical values can be considered“substantially” or“about” the same if the difference between the two values is less than or equal to ±10% of the average of the values (e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%). For example,“substantially” parallel can refer to a range of angular variation that is less than or equal to ±10° from 0°, e.g., less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. For example,“substantially” perpendicular can refer to a range of angular variation that is less than or equal to ±10° from 90°, e.g., less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.
[0030] For example, two surfaces can be considered coplanar or substantially coplanar if the displacement between the two surfaces is equal to or less than 5 pm, equal to or less than 2 pm, equal to or less than 1 pm, or equal to or less than 0.5 pm. A surface can be considered planar or substantially planar if the displacement of the surface relative to a plane between any two points on the surface is equal to or less than 5 pm, equal to or less than 2 pm, equal to or less than 1 pm, or equal to or less than 0.5 pm.
[0031] As used herein, the terms "conductive," "electrically conductive," and "electrical conductivity" refer to the ability to transfer electrical current. Electrically conductive materials generally indicate those materials that are little or zero resistant to the flow of electrical current. One measure of electrical conductivity is Siemens per meter (S / m). Generally, an electrically conductive material is one that has an electrical conductivity greater than approximately 104S / m (e.g., at least 105S / m or at least 106S / m). The electrical conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the electrical conductivity of a material is measured at room temperature.
[0032] As used herein, the singular terms "a," "an," and "the" can encompass the plural unless the context clearly dictates otherwise. In describing embodiments, the use of "or" means "and / or" unless the context clearly dictates otherwise. In describing a component or feature as being "on" or "above" another component or feature, it is intended that the component or feature can be directly on the other component or feature or intervening components or features can be present.
[0033] As used herein, spatially relative terms, such as "beneath," "below," "lower," "above," "upper," "bottom," "left," "right," and the like, can be used for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms can be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. It will be understood that when an element is referred to as being "connected to" or "coupled to" another element, it can be directly connected or coupled to the other element or intervening elements can be present.
[0034] The foregoing outlines features of several embodiments and details of the present disclosure. Embodiments described in the present disclosure can be readily used as bases for the design of other processes and as structures for the implementation of same, and / or to obtain the same or similar results as the embodiments introduced herein. These equivalent constructions do not depart from the spirit and scope of the present disclosure and can be made by different changes, substitutions, and alterations of detail.
Claims
1. An integrated circuit mold moving device characterized by comprising: Comprising: a plurality of block structures arranged in parallel, wherein a mold placement space for placing the integrated circuit mold is formed between two adjacent block structures, the block structure comprising: an upper block and a lower block forming a positioning pin receiving space therebetween for receiving a positioning pin on the integrated circuit mold.
2. The integrated circuit mold moving apparatus according to claim 1, wherein The plurality of block structures and the horizontal line form an inclined angle.
3. The integrated circuit mold moving apparatus according to claim 2, wherein The inclined angle is in the range of 20°-35°.
4. The integrated circuit mold moving apparatus according to claim 1, wherein The mold placement space comprises a placement track for accessing the integrated circuit mold.
5. The integrated circuit mold moving apparatus according to claim 4, wherein One end of the placement track is provided with a buffer pad.
6. The integrated circuit die moving device of claim 4, wherein, The mold placement space comprises a rebound structure for pushing out the placement track.
7. The integrated circuit mold moving apparatus according to claim 1, wherein The plurality of block structures are arranged in parallel along a first direction, and the integrated circuit mold moving device further comprises: a blocking strip arranged on one side of the plurality of block structures and extending along the first direction.
8. The integrated circuit mold moving apparatus according to claim 1, wherein Further comprising: a storage area arranged below the plurality of block structures.