Wafer product double-sided chuck

By designing a double-sided suction cup for wafer products and using an air path assembly with upper and lower aluminum plates and separating aluminum plates, efficient and low-cost handling of glass wafers for automated inspection is achieved, avoiding scratches and contamination of the wafer surface by the suction cup.

CN223612402UActive Publication Date: 2025-11-28JIAXING BAISHENG PHOTOELECTRIC
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Patent Information

Application Number
CN202423126410.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-18
Publication Date
2025-11-28
Estimated Expiration
2034-12-18

AI Technical Summary

Technical Problem

In the existing technology, the suction cup design is costly and easily scratched or contaminated during the automated inspection of glass wafers, which cannot meet the automation requirements of glass wafers.

Method used

Design a double-sided suction cup for wafer products. It uses an upper aluminum plate, a lower aluminum plate, and a partition aluminum plate in conjunction with an air passage groove to form a suction cup air passage assembly. It is connected to a vacuum pipeline through an air pipe connector to enable the suction of wafer products on both the upper and lower surfaces. A PEEK suction cup pad is used to avoid contamination.

Benefits of technology

It improves the efficiency of automated glass wafer handling, reduces costs, and ensures that the wafer surface is not easily contaminated, making it more convenient to use.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223612402U_ABST
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Abstract

The utility model discloses a kind of wafer product double-sided suction cups, including flange joint, the aluminium plate fixed groove is opened in the middle of one end of flange joint away from flange face, flange joint is opened with air pipe groove in the center of one end close to flange face, the inside of two air pipe grooves is all provided with air pipe joint, the inside upper portion of aluminium plate fixed groove is provided with upper aluminium plate, the inside lower portion of aluminium plate fixed groove is provided with lower aluminium plate, the separation aluminium plate is arranged between the upper aluminium plate and lower aluminium plate.The utility model is provided with upper aluminium plate, lower aluminium plate and separation aluminium plate, cooperate air path groove can be fixed under bolt, by opening air path on two aluminium plates, and using middle aluminium plate separates upper and lower air path to form suction cup air path combination, after being mounted to robot arm, can be connected vacuum pipeline by air pipe joint, two surfaces each connect a pipeline, and then can be set up PEEK suction cup on two pipelines, so that two surfaces can be adsorbed wafer product.
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Description

TECHNICAL FIELD

[0001] The utility model relates to glass wafer detection technical field, especially relate to a wafer product double -sided sucking disc. BACKGROUND

[0002] Wafer refers to the silicon wafer used for making silicon semiconductor circuit, and its raw material is silicon. High-purity polysilicon is dissolved and added into silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. After grinding and polishing, the silicon crystal rod is cut into slices to form a silicon wafer, which is a wafer. Domestic wafer production line mainly uses 8-inch and 12-inch wafers.

[0003] In the field of automatic detection of glass wafer products, the wafer products need to be automatically transmitted. The wafer chuck used in the semiconductor field has high design cost, which is not practical for glass wafers. However, the wafer chuck required for glass wafers cannot have scratches, dirt, and residues. Therefore, a wafer chuck suitable for the automatic process of glass wafers needs to be designed. To improve the overall automation effect, the wafer chuck needs to be designed in a double-sided usable form. SUMMARY

[0004] The utility model discloses a wafer product double-sided sucking disc, which can improve efficiency, reduce cost, make debugging and use more convenient, and solve the above problems.

[0005] To achieve the above-mentioned purpose, a wafer product double-sided sucking disc is provided, which includes a flange joint mounted on a robot flange mounting. An aluminum plate fixing groove is formed in the middle of the end of the flange joint away from the flange face. Gas pipe grooves are formed above and below the center of the end of the flange joint close to the flange face. Gas pipe joints are arranged inside the two gas pipe grooves. An upper aluminum plate is arranged above the inside of the aluminum plate fixing groove. A lower aluminum plate is arranged below the inside of the aluminum plate fixing groove. A separation aluminum plate is arranged between the upper aluminum plate and the lower aluminum plate. Gas channel grooves are formed on the side of the upper aluminum plate and the lower aluminum plate close to the separation aluminum plate. Suction holes are formed in the positions of the gas channel grooves corresponding to the gas pipe joints. Three sucking disc holes are formed in the end of the gas channel groove away from the gas pipe joint. PEEK sucking discs are arranged on the side of the upper aluminum plate and the lower aluminum plate away from the separation aluminum plate corresponding to the sucking disc holes.

[0006] According to the wafer product double-sided sucking disc, the PEEK sucking disc includes a sucking disc pipe, an elastic sleeve, and a sucking disc pad. The end of the sucking disc pipe close to the separation aluminum plate is fixedly connected to the corresponding sucking disc hole. The outside of the sucking disc pipe is fixedly sleeved with an elastic sleeve. The end of the elastic sleeve away from the separation aluminum plate is sealingly connected with a sucking disc pad. The sucking disc pad is a hard plastic pad made of PEEK material.

[0007] According to the double-sided chuck for wafer products, a plurality of bolt holes are symmetrically formed on the plate body of the upper aluminum plate.

[0008] According to the double-sided chuck for wafer products, a plurality of stepped holes are formed on the plate body of the lower aluminum plate at positions corresponding to the plurality of bolt holes.

[0009] According to the double-sided chuck for wafer products, a plurality of through holes are formed on the plate body of the partition aluminum plate at positions corresponding to the plurality of bolt holes.

[0010] According to the double-sided chuck for wafer products, the slot width of the aluminum plate fixing slot corresponds to the sum of the thicknesses of the upper aluminum plate, the lower aluminum plate and the partition aluminum plate.

[0011] According to the double-sided chuck for wafer products, the flange joint is fixedly connected with the upper aluminum plate, the lower aluminum plate and the partition aluminum plate through bolts.

[0012] The above scheme has at least one of the following beneficial effects:

[0013] The double-sided chuck for wafer products is provided with an upper aluminum plate, a lower aluminum plate and a partition aluminum plate, and cooperates with an air channel groove to form a chuck air channel assembly by opening air channels on the upper and lower aluminum plates and separating the upper and lower air channels by the middle aluminum plate under the fixation of bolts.

[0014] Additional aspects and advantages of the present application will be described in part below, will become apparent from the following description, or will be learned by practicing the present application. BRIEF DESCRIPTION OF DRAWINGS

[0015] The present application will be further described below in combination with the drawings and embodiments.

[0016] Figure 1 FIG. 1 is a left side perspective view of a double-sided chuck for wafer products according to the present application;

[0017] Figure 2 FIG. 2 is a right side perspective view of a double-sided chuck for wafer products according to the present application;

[0018] Figure 3 FIG. 3 is a structural view of a lower aluminum plate according to the present application;

[0019] Figure 4 FIG. 4 is an exploded structural view of a PEEK chuck according to the present application;

[0020] Figure 5 The utility model discloses a wafer product double -sided sucking disc's wafer adsorption schematic view.

[0021] Legend:

[0022] 1, flange joint;2, aluminum plate fixed groove;3, air pipe groove;4, air pipe joint;5, upper aluminum plate;6, partition aluminum plate;7, lower aluminum plate;8, gas path groove;9, PEEK sucking disc;10, bolt hole;11, stepped hole;12, air extraction hole;13, sucking disc hole;91, sucking disc pipe;92, elastic sleeve;93, sucking disc pad. Specific implementation

[0023] This part will describe the specific embodiments of the utility model in detail, and the preferred embodiments of the utility model are shown in the drawings, and the drawings are used to supplement the description of the text part, so that people can intuitively and visually understand each technical feature and the overall technical scheme of the utility model, but it cannot be understood as the limitation of the protection scope of the utility model.

[0024] Reference Figures 1-5 The utility model embodiment provides a wafer product double -sided sucking disc, including the flange joint 1 of installation to the robot flange mounting spare, its characterized in that: the aluminum plate fixed groove 2 is set up in the middle part of the one end of flange joint 1 away from the flange face, the air pipe groove 3 is set up in the center of the one end of flange joint 1 close to the flange face, and the inside of two air pipe grooves 3 is provided with air pipe joint 4, the inside upper of aluminum plate fixed groove 2 is provided with upper aluminum plate 5, the plate body of upper aluminum plate 5 is provided with multiple bolt holes 10 in symmetry, the inside lower of aluminum plate fixed groove 2 is provided with lower aluminum plate 7, and the plate body of lower aluminum plate 7 is provided with stepped hole 11 at the position corresponding to multiple bolt holes 10, and the nut of bolt is accommodated, and the partition aluminum plate 6 is set up between upper aluminum plate 5 and lower aluminum plate 7, and the plate body of partition aluminum plate 6 is provided with through hole at the position corresponding to multiple bolt holes 10, can be sealed fastening and fitted by multiple bolts to aluminum plate 5, lower aluminum plate 7 and partition aluminum plate 6, and the groove width of aluminum plate fixed groove 2 corresponds with the sum of the thickness of upper aluminum plate 5, lower aluminum plate 7 and partition aluminum plate 6, and flange joint 1 is fixedly connected with upper aluminum plate 5, lower aluminum plate 7 and partition aluminum plate 6 by bolt;

[0025] Air passage grooves 8 are provided on the side of the upper aluminum plate 5 and the lower aluminum plate 7 near the separating aluminum plate 6. Air extraction holes 12 are provided on the upper aluminum plate 5 and the lower aluminum plate 7 at the positions corresponding to the air passage grooves 8 and the air pipe connectors 4. Three suction cup holes 13 are provided on the side of the upper aluminum plate 5 and the lower aluminum plate 7 away from the air pipe connectors 4. PEEK suction cups 9 are provided on the side of the upper aluminum plate 5 and the lower aluminum plate 7 away from the separating aluminum plate 6 at the positions corresponding to the suction cup holes 13. This utility model forms a suction cup air passage assembly by opening air passages on the upper and lower aluminum plates and using the middle aluminum plate to separate the upper and lower air passages. After being installed on the robot arm, it can be connected to the vacuum pipeline through the air pipe connectors 4, forming a situation where each of the upper and lower surfaces is connected to a pipeline. Then, the PEEK suction cups 9 provided on the two pipelines can be used to adsorb wafer products on both the upper and lower surfaces.

[0026] The PEEK suction cup 9 includes a suction cup tube 91, an elastic sleeve 92, and a suction cup pad 93. The end of the suction cup tube 91 closest to the separating aluminum plate 6 is fixedly connected to the corresponding suction cup hole 13. The elastic sleeve 92 is fixedly sleeved on the outside of the suction cup tube 91. The end of the elastic sleeve 92 furthest from the separating aluminum plate 6 is sealed with the suction cup pad 93. The suction cup pad 93 is a hard plastic pad made of PEEK material. While ensuring the elasticity of the suction cup, the suction cup pad 93 set on the PEEK suction cup 9 can make the surface of the wafer product less susceptible to contamination due to the cleanliness of the PEEK material.

[0027] Working principle: In use, the upper aluminum plate 5, lower aluminum plate 7, and dividing aluminum plate 6, together with the corresponding air passage groove 8, can form a suction cup air passage assembly by opening air passages on the upper and lower aluminum plates and using the middle aluminum plate to separate the upper and lower air passages under the fixation of bolts. After being installed on the robot arm, it can be connected to the vacuum line through the air pipe connector 4, forming a situation where one line is connected to each of the upper and lower surfaces. Then, the PEEK suction cups 9 set on the two lines can be used to adsorb wafer products on both the upper and lower surfaces. Moreover, the suction cup pads 93 set on the PEEK suction cups 9 can make the surface of the wafer products less susceptible to contamination due to the cleanliness of the PEEK material.

[0028] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A wafer product dual side chuck comprising a flange joint (1) mounted to a robot flange mount characterized in that: The flange joint (1) is provided with an aluminum plate fixing groove (2) in the middle of the end away from the flange face, air pipe grooves (3) are opened up and down in the center of the end close to the flange face, air pipe joints (4) are arranged in the air pipe grooves (3), an upper aluminum plate (5) is arranged above the aluminum plate fixing groove (2), a lower aluminum plate (7) is arranged below the aluminum plate fixing groove (2), a separation aluminum plate (6) is arranged between the upper aluminum plate (5) and the lower aluminum plate (7), air path grooves (8) are opened in the side of the upper aluminum plate (5) and the lower aluminum plate (7) close to the separation aluminum plate (6), air extraction holes (12) are opened in the upper aluminum plate (5) and the lower aluminum plate (7) at positions corresponding to the air pipe joints (4), three sucker holes (13) are opened in the upper aluminum plate (5) and the lower aluminum plate (7) at the end away from the air pipe joints (4), and PEEK suckers (9) are arranged on the side of the upper aluminum plate (5) and the lower aluminum plate (7) away from the separation aluminum plate (6) at positions corresponding to the sucker holes (13).

2. The dual-sided wafer chuck of claim 1, wherein, The PEEK sucker (9) comprises a sucker pipe (91), an elastic sleeve (92) and a sucker pad (93), one end of the sucker pipe (91) close to the separation aluminum plate (6) is fixedly communicated with the corresponding sucker hole (13), the elastic sleeve (92) is fixedly sleeved on the outer side of the sucker pipe (91), and the sucker pad (93) is sealingly connected to the end of the elastic sleeve (92) away from the separation aluminum plate (6), and the sucker pad (93) is a hard plastic pad made of PEEK.

3. The dual-sided wafer chuck of claim 1, wherein, A plurality of bolt holes (10) are symmetrically opened in the plate body of the upper aluminum plate (5).

4. The dual-sided wafer chuck of claim 3, wherein, Step holes (11) are opened in the plate body of the lower aluminum plate (7) at positions corresponding to the plurality of bolt holes (10).

5. The dual-sided wafer chuck of claim 4, wherein, Through holes are opened in the plate body of the separation aluminum plate (6) at positions corresponding to the plurality of bolt holes (10).

6. The dual-sided wafer chuck of claim 1, wherein, The groove width of the aluminum plate fixing groove (2) corresponds to the sum of the thicknesses of the upper aluminum plate (5), the lower aluminum plate (7) and the separation aluminum plate (6).

7. The dual-sided wafer chuck of claim 1, wherein, The flange joint (1) is fixedly connected with the upper aluminum plate (5), the lower aluminum plate (7) and the separation aluminum plate (6) through bolts.