Wafer pick-and-place device
By designing a wafer loading and unloading device, and utilizing the cooperation of tray assembly, clamping assembly and lifting mechanism, the uniformity problem caused by the contact between the wafer and the edge of the growth tray was solved, thereby improving the quality of the wafer and the uniformity of the coating.
Patent Information
- Application Number
- CN202423081672.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-13
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-12-13
AI Technical Summary
In the prior art, the contact between the wafer and the edge of the growth tray leads to poor uniformity of parameters such as coating thickness and doping concentration, and the falling off of the coating material at the edge of the growth tray affects the quality of the wafer.
Design a wafer pick-and-place device, including a tray assembly, a clamping assembly, and a lifting mechanism. By cooperating with the clamping tray and the support plate, the lifting mechanism drives the support plate to rise and fall, ensuring that the wafer is stably placed and removed on the growth tray, avoiding contact with the edge.
This effectively reduces the risk of contact between the wafer and the edge of the growth tray, ensures the uniformity of coating thickness and doping concentration, avoids wafer contamination by particles from the growth tray, and improves wafer quality.
Smart Images
Figure CN223612408U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor wafer coating, and more particularly to a wafer taking and placing device. BACKGROUND
[0002] In the related art, the wafer is usually placed on or taken out of a growth tray by manual operation. However, when the wafer is placed manually, if the wafer is placed at an inappropriate position on the growth tray, part of the wafer will touch the edge of the growth tray, so that the temperature distribution and flow field of the part of the wafer touching the edge of the growth tray during the growth process are different from those of the other part of the wafer not touching the edge, which affects the uniformity of the wafer coating thickness, doping concentration and other parameters.
[0003] In addition, since the growth tray needs to be placed in the growth chamber together with the wafer for coating, a coating is grown on the edge of the growth tray at the same time as the wafer is coated. When the wafer is taken out of the growth tray by manual operation, it is inevitable to touch the edge of the growth tray, so that the coating grown on the edge will fall on the wafer, greatly affecting the quality of the wafer.
[0004] Therefore, how to reduce the risk of the wafer contacting the edge of the growth tray has become a technical problem to be solved by those skilled in the art. CONTENT OF THE INVENTION
[0005] Therefore, the purpose of the present application is to provide a wafer taking and placing device to reduce the risk of the wafer contacting the edge of the growth tray.
[0006] To achieve the above-mentioned purpose, the present application provides the following technical solutions:
[0007] A wafer taking and placing device, comprising:
[0008] A tray assembly comprising a growth tray and a support disc movably arranged on the growth tray, the support disc being used to move the wafer, and the growth tray limiting a first annular support surface for placing the wafer and a first support opening for placing the support disc;
[0009] A clamping assembly comprising two movably arranged clamping rings, the two clamping rings being spliced to form a clamping tray for accommodating the wafer, the clamping tray limiting a second annular support surface for placing the wafer and a second support opening for placing the support disc, and the outer diameter of the first annular support surface being greater than that of the second annular support surface;
[0010] A lifting mechanism for driving the support disc to lift and lower, so as to transport the wafer between the clamping tray and the growth tray.
[0011] Optionally, in the wafer pick-and-place device, the clamping assembly comprises two clamping ring connecting driving members, so as to drive the two clamping rings to move towards each other or away from each other.
[0012] Optionally, in the wafer pick-and-place device, the driving member comprises a rotating motor and a rotating arm, one end of the rotating arm is connected with the rotating motor, and the other end of the rotating arm is connected with the clamping ring, so that the rotating motor drives the clamping ring to rotate in the horizontal direction through the rotating arm.
[0013] Optionally, in the wafer pick-and-place device, a tray holder is further arranged below the clamping assembly, and the growth tray is placed on the tray holder.
[0014] Optionally, in the wafer pick-and-place device, the lifting mechanism is arranged below the tray holder, and the lifting mechanism comprises a lifting column for driving the support disc to lift, and the tray holder is provided with a through hole through which the lifting column passes.
[0015] Optionally, in the wafer pick-and-place device, the outer diameter of the lifting column is not greater than the outer diameter of the support disc, and the inner diameters of the first support port and the second support port are both greater than the outer diameter of the lifting column.
[0016] Optionally, in the wafer pick-and-place device, the through hole, the first support port and the second support port are coaxially arranged at the center.
[0017] Optionally, in the wafer pick-and-place device, the tray holder is provided with an annular accommodating groove for placing the growth tray, and the through hole is arranged on the bottom wall of the annular accommodating groove.
[0018] Optionally, in the wafer pick-and-place device, at least one step portion is arranged in the radial direction of the through hole in the annular accommodating groove, the step portion comprises at least two step surfaces, and the bottom surface of the growth tray defines a contact surface abutting against each step surface.
[0019] Optionally, in the wafer pick-and-place device, the support disc is a circular truncated cone structure, and the first support port and the second support port are both circular truncated cone holes matched with the support disc.
[0020] The wafer taking and placing device provided in the application places the wafer on the second annular supporting surface of the clamping tray, then drives the supporting disc placed in the second supporting port to lift up by the lifting mechanism, so that the supporting disc props up the wafer. At this time, the two clamping rings of the clamping tray can move away from each other, then the supporting disc is driven to move downward by the lifting mechanism until the supporting disc is placed at the position of the first supporting port of the growth tray, so that the wafer can be placed on the growth tray. Since the outer diameter of the second annular supporting surface is smaller than the outer diameter of the first annular supporting surface, when the wafer is placed on the first annular supporting surface of the growth tray, the risk of the wafer contacting the edge of the growth tray can be effectively reduced. As can be seen from the above example, the wafer taking and placing device provided in the application drives the supporting disc to lift up or down by the lifting mechanism, so as to transport the wafer between the clamping tray and the growth tray. Since the outer diameter of the second annular supporting surface of the clamping tray is smaller than the outer diameter of the first annular supporting surface of the growth tray, when the wafer is placed on the first annular supporting surface of the growth tray, the risk of the wafer contacting the edge of the growth tray can be effectively reduced, so as to avoid the growth environment such as the temperature field and the airflow field of the contact edge and the non-contact edge of the wafer and the growth tray being different, thereby ensuring the uniformity of the film thickness, the doping concentration and other parameters of the wafer. At the same time, the particles on the growth tray can be effectively prevented from being brought to the wafer surface when the wafer is taken out from the growth tray, the risk of the wafer being contaminated can be reduced, and the quality of the wafer can be improved.
[0021] The technical features mentioned above, the technical features to be mentioned below, and the technical features shown in the drawings alone can be combined with each other arbitrarily, as long as the combined technical features are not contradictory to each other. All feasible combinations of features are explicitly described herein. Any one of the multiple sub-features included in the same sentence can be applied independently, and does not have to be applied together with other sub-features. BRIEF DESCRIPTION OF DRAWINGS
[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are only embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative effort on the basis of the provided drawings.
[0023] Figure 1 A structural schematic diagram of the wafer taking and placing device provided in the embodiments of the present application;
[0024] Figure 2 A schematic diagram of wafer taking and placing provided in the embodiments of the present application;
[0025] Figure 3 A side view of the first clamping ring provided in the embodiments of the present application;
[0026] Figure 4 A front view of the first clamping ring provided for the embodiment of the present application;
[0027] Figure 5 A front view of the second clamping ring provided for the embodiment of the present application;
[0028] Figure 6 A side view of the support disc provided for the embodiment of the present application;
[0029] Figure 7 A structural schematic of the growth tray provided for the embodiment of the present application Figure 1 ;
[0030] Figure 8 A structural schematic of the growth tray provided for the embodiment of the present application Figure 2 ;
[0031] Figure 9 A positioning schematic of the growth tray, the support disc and the clamping tray provided for the embodiment of the present application.
[0032] Wherein, 1 is the growth tray, 101 is the first annular support surface, 102 is the first support port, 103 is the contact surface, 2 is the support disc, 3 is the clamping ring, 301 is the clamping tray, 302 is the second annular support surface, 303 is the second support port, 304 is the driving member, 3041 is the rotating motor, 3042 is the rotating arm, 4 is the lifting mechanism, 401 is the lifting column, 5 is the tray rack, 501 is the perforation, 502 is the annular accommodating groove, 503 is the stepped portion, 5031 is the stepped surface, and 6 is the wafer. DETAILED DESCRIPTION
[0033] The core of the present application is to provide a wafer taking and placing device to reduce the risk of wafer contacting the edge of the growth tray.
[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0035] In the related technical field, the wafer is usually placed on the growth tray or taken out from the growth tray by manual operation. However, when the wafer is placed manually, if the placement position of the wafer on the growth tray is not appropriate, part of the wafer will contact the edge of the growth tray, so that the temperature distribution and flow field of the part of the wafer contacting the edge of the growth tray during the growth process are different from those of the other part of the wafer not contacting the edge, which affects the uniformity of the parameters such as the film thickness and the doping concentration of the wafer.
[0036] In addition, since the growth tray needs to be placed in the growth chamber at the same time as the wafer for coating, the edge of the growth tray grows a coating at the same time as the wafer is coated, and when the wafer is taken out of the growth tray by manual operation, the edge of the growth tray will inevitably be touched, and the coating grown thereon will fall on the wafer, greatly affecting the quality of the wafer.
[0037] To this end, as shown in Figure 1 The wafer taking and placing device disclosed by the embodiments of the present application comprises a tray assembly, a clamping assembly and a lifting mechanism 4. The support disc 2 is driven to ascend and descend by the lifting mechanism 4 to drive the wafer 6 to transport between the clamping tray 301 and the growth tray 1. Since the outer diameter of the second annular support surface 302 of the clamping tray 301 is smaller than the outer diameter of the first annular support surface 101 of the growth tray 1, when the wafer 6 is placed on the first annular support surface 101 of the growth tray 1, the risk of the wafer contacting the edge of the growth tray 1 can be effectively reduced, and the temperature field, airflow field and other growth environments of the contacted edge and the non-contact edge of the wafer and the growth tray 1 can be prevented from being different, so that the uniformity of the coating thickness, doping concentration and other parameters of the wafer can be ensured. At the same time, the particulate matter on the growth tray 1 can be effectively prevented from being brought to the wafer surface when the wafer 6 is taken out of the growth tray 1, the risk of wafer contamination can be reduced, and the quality of the wafer can be improved.
[0038] The wafer taking and placing device disclosed by the embodiments of the present application will be specifically explained and described below. Figures 1 to 9 The wafer taking and placing device disclosed by the embodiments of the present application will be specifically explained and described below.
[0039] As shown in Figure 1 and Figure 2 The tray assembly can comprise the growth tray 1 and the support disc 2, and the support disc 2 is movably arranged on the growth tray 1, so that the support disc 2 can be separated from the growth tray 1 and drive the wafer 6 to move. As shown in Figure 7 The growth tray 1 has the first annular support surface 101 on which the wafer 6 can be placed and the first support opening 102 on which the support disc 2 can be placed, so that when the support disc 2 is located in the first support opening 102, the upper surface of the support disc 2 and the first annular support surface 101 are located in the same plane, and can jointly form a growth working surface on which the wafer 6 is placed.
[0040] As shown in Figure 1 and Figure 2As shown, the clamping assembly can include two clamping rings 3, and the two clamping rings 3 are movably arranged so that the two clamping rings 3 can be close to each other, so that the two clamping rings 3 splice to form a clamping tray 301 accommodating the wafer 6, and the clamping tray 301 has a second annular support surface 302 for placing the wafer 6 and a second support opening 303 for placing the support disc 2, so that when the support disc 2 is located in the second support opening 303, the upper surface of the support disc 2 and the second annular support surface 302 are located in the same plane, and can jointly form a temporary work surface for placing the wafer 6, and the outer diameter of the first annular support surface 101 is greater than the outer diameter of the second annular support surface 302.
[0041] As shown in Figure 1 and Figure 2 The lifting mechanism 4 can drive the support disc 2 to lift, so as to drive the wafer 6 to transport between the clamping tray 301 and the growth tray 1.
[0042] When placing the wafer 6 before growth, first use the wafer suction pen to place the wafer 6 on the temporary work surface composed of the second annular support surface 302 of the clamping tray 301 and the upper surface of the support disc 2, and then drive the support disc 2 placed in the second support opening 303 to lift by the lifting mechanism 4, so that the support disc 2 supports the wafer 6. At this time, the two clamping rings 3 of the clamping tray 301 can be away from each other to avoid interference of the clamping ring 3 to the movement of the wafer 6 on the support disc 2, and then the support disc 2 is driven to move downward by the lifting mechanism 4 until the support disc 2 is placed at the position of the first support opening 102 of the growth tray 1, and at the same time, the wafer 6 can be placed on the growth work surface composed of the upper surface of the support disc 2 and the first annular support surface 101 of the growth tray 1, at this time, the growth tray 1, the support disc 2 and the wafer 6 located on the growth work surface can be sent into the growth chamber for growth. Since the outer diameter of the first annular support surface 101 is greater than the outer diameter of the second annular support surface 302, the risk of the wafer 6 contacting the edge of the growth tray 1 can be effectively reduced, and the growth environment such as temperature field and airflow field of the contact edge and the non-contact edge of the wafer and the growth tray 1 is different, so that the uniformity of the film thickness, doping concentration and other parameters of the wafer can be ensured.
[0043] When the wafer 6 is taken out after growth, the support plate 2 placed in the first support port 102 of the growth tray 1 can be driven by the lifting mechanism 4, so that the support plate 2 props up the wafer 6 and is lifted to a position higher than the clamping ring 3, at this time, the two clamping rings 3 can be close to each other to splice to form the clamping tray 301, then the lifting mechanism 4 drives the support plate 2 to move downward until the support plate 2 falls in the position of the second support port 303 of the clamping tray 301, at the same time, the wafer 6 can be placed on the temporary work surface composed of the second annular support surface 302 of the clamping tray 301 and the upper surface of the support plate 2, then the wafer 6 is picked up by the wafer suction pen. Since the wafer 6 does not contact the edge of the growth tray 1, it can effectively avoid that the protruding loose particles grown on the growth tray 1 are brought to the wafer surface when the wafer 6 is taken out from the growth tray 1, which can reduce the risk of wafer contamination, thereby improving the quality of the wafer.
[0044] As shown in Figure 1 and Figure 2 , the clamping assembly can include two driving members 304 respectively connected with the two clamping rings 3, so as to drive the two clamping rings 3 to move towards each other or away from each other.
[0045] In some embodiments, as shown in Figure 1 and Figure 2 , the driving member 304 can include a rotating motor 3041 and a rotating arm 3042. One end of the rotating arm 3042 can be connected with the rotating motor 3041, and the other end of the rotating arm 3042 can be connected with the clamping ring 3, so that the rotating motor 3041 drives the clamping ring 3 to rotate in the horizontal direction through the rotating arm 3042. When the wafer 6 needs to be placed on the temporary work surface composed of the second annular support surface 302 of the clamping tray 301 and the upper surface of the support plate 2, the two rotating motors 3041 can simultaneously rotate forward, for example, clockwise, until the two clamping rings 3 contact and splice to form the clamping tray 301, and at the same time, the support plate 2 can be located in the position of the second support port 303 of the clamping tray 301, so that the temporary work surface composed of the second annular support surface 302 of the clamping tray 301 and the upper surface of the support plate 2 ensures effective support for the wafer 6. When the wafer 6 needs to be moved to the growth work surface composed of the first annular support surface 101 of the growth tray 1 and the upper surface of the support plate 2, the two rotating motors 3041 can simultaneously rotate reversely, for example, counterclockwise, as shown in Figure 2 , until the two clamping rings 3 are separated and do not interfere with the movement of the wafer 6 on the support plate 2, at this time, the support plate 2 can be driven downward by the lifting mechanism 4 until the support plate 2 falls in the position of the first support port 102 of the growth tray 1, and at the same time, the wafer 6 can be placed on the growth work surface composed of the first annular support surface 101 of the growth tray 1 and the upper surface of the support plate 2.
[0046] In some embodiments, as shown in Figures 1 to 5 For ease of understanding, the left clamping ring 3 is defined as the first clamping ring, and the right clamping ring 3 is defined as the second clamping ring. As shown in Figure 4 and Figure 5 The splicing surface of the first clamping ring and the second clamping ring can adopt an oblique cutting surface, and the included angle β of the oblique cutting surface can be 45°. At the same time, the included angle between the splicing surface of the first clamping ring and the rotating arm 3042 can be 135°, and the included angle between the splicing surface of the second clamping ring and the rotating arm 3042 can be 135°, so that the two rotating motors 3041 can drive the two clamping rings 3 to quickly separate and splice, thereby improving the transportation efficiency of the wafer 6. Of course, the included angle β of the oblique cutting surface can also be 30°, 60°, etc., and the included angle between the splicing surface of the two clamping rings 3 and the rotating arm 3042 can be 90°, 120°, 150°, etc. This will not be limited herein.
[0047] In some embodiments, the driving member 304 can also include a telescopic cylinder and a telescopic rod. One end of the telescopic rod can be connected with the telescopic cylinder, and the other end of the telescopic rod can be connected with the clamping ring 3, so that the telescopic cylinder drives the clamping ring 3 to move in the horizontal direction through the telescopic rod. When the wafer 6 needs to be placed on the temporary work surface composed of the second annular support surface 302 of the clamping tray 301 and the upper surface of the support disc 2, the two telescopic cylinders can simultaneously drive the telescopic rods to extend until the two clamping rings 3 contact and splice to form the clamping tray 301, and at the same time, the support disc 2 can be located at the position of the second support port 303 of the clamping tray 301, so that the temporary work surface composed of the second annular support surface 302 of the clamping tray 301 and the upper surface of the support disc 2 ensures effective support for the wafer 6. When the wafer 6 needs to be moved to the growth work surface composed of the first annular support surface 101 of the growth tray 1 and the upper surface of the support disc 2, the two telescopic cylinders can simultaneously drive the telescopic rods to retract until the two clamping rings 3 separate and do not interfere with the movement of the wafer 6 on the support disc 2. At this time, the support disc 2 can be driven downward by the lifting mechanism 4 until the support disc 2 falls at the position of the first support port 102 of the growth tray 1, and at the same time, the wafer 6 can be placed on the growth work surface composed of the first annular support surface 101 of the growth tray 1 and the upper surface of the support disc 2.
[0048] Of course, the driving member 304 can also adopt a turnover cylinder, so as to drive the two clamping rings 3 to turn in the vertical plane through the turnover cylinder, thereby realizing that the two clamping rings 3 contact and splice to form the clamping tray 301 or the two clamping rings 3 move away from each other, avoiding interference with the movement of the wafer 6 on the support disc 2. This will not be repeated herein.
[0049] In some embodiments, as shown in Figure 1 and Figure 2As shown, the wafer pick-and-place device can further include a tray holder 5, and the tray holder 5 is located below the clamping assembly, and the growth tray 1 can be placed on the tray holder 5, so that the growth tray 1 can be supported by the tray holder 5 to ensure the stability of the wafer 6 placed on the growth tray 1. Wherein, the two ends of the tray holder 5 can be fixed on the two driving members 304 of the clamping assembly respectively, and the lifting mechanism 4 can be located below the tray holder 5. Specifically, as shown in Figure 1 and Figure 9 As shown, the lifting mechanism 4 can include a lifting column 401 for driving the support disc 2 to lift, and the tray holder 5 is provided with a through hole 501, so that the lifting column 401 of the lifting mechanism 4 can pass through the through hole 501 of the tray holder 5 to drive the support disc 2 to lift. It should be noted that the lifting mechanism 4 can drive the support disc 2 to lift through the lifting cylinder driving the lifting column 401, of course, the lifting column 401 can also be a telescopic rod, and the telescopic rod can also be driven by a telescopic cylinder to drive the support disc 2 to lift, which is not limited herein.
[0050] In some embodiments, as shown in Figure 1 and Figure 2 In order to ensure the stability of the lifting column 401 driving the support disc 2 to lift, the lifting column 401 and the support disc 2 can both adopt a circular cross section, and the outer diameter of the lifting column 401 is not greater than the outer diameter of the support disc 2, and optionally, the outer diameter of the lifting column 401 is equal to the outer diameter of the support disc 2, so as to ensure the larger contact area of the lifting column 401 and the support disc 2 as much as possible, and improve the stability of the lifting column 401 driving the support disc 2 to lift. As shown in Figure 9 The centers of the through hole 501 of the tray holder 5, the first support port 102 of the growth tray 1 and the second support port 303 of the clamping tray 301 are coaxially arranged, and the through hole 501, the first support port 102 and the second support port 303 can adopt a circular hole matched with the lifting column 401 and the support disc 2, and the inner diameters of the through hole 501, the first support port 102 and the second support port 303 are all greater than the outer diameter of the lifting column 401, so that the lifting column 401 can pass through the through hole 501, the first support port 102 and the second support port 303 respectively.
[0051] In some embodiments, as shown in Figure 9 In order to improve the stability of the growth tray 1 installed on the tray holder 5, an annular accommodating groove 502 for placing the growth tray 1 can be arranged on the tray holder 5, wherein the through hole 501 is located on the bottom wall of the annular accommodating groove 502 and is arranged in alignment with the first support port 102 and the second support port 303, so that the growth tray 1 can be limited by the side wall of the annular accommodating groove 502 to ensure that the growth tray 1 will not shake or fall off due to external factors such as vibration, thereby improving the stability of the growth tray 1 installed on the tray holder 5.
[0052] In some embodiments, in order to facilitate the installation between the growth tray 1 and the tray rack 5, as shown in Figure 8 and Figure 9 , at least one step part 503 is arranged in the annular accommodating groove 502 along the radial direction of the through hole 501, that is, the step part 503 can be one, or two or more, and the step part 503 includes at least two step faces 5031, that is, each step part 503 can have two step faces 5031, or three step faces 5031 or more. At the same time, as shown in Figure 8 , the bottom surface of the growth tray 1 has a contact surface 103 abutting each step face 5031, and the adjacent two contact surfaces 103 can be connected by an inclined slope, and the included angle of the inclined slope can be 135°, so that the contact surface 103 of the bottom surface of the growth tray 1 abuts each step face 5031, thereby realizing the installation and positioning of the growth tray 1, and further improving the convenience of the installation between the growth tray 1 and the tray rack 5. Alternatively, two step parts 503 are arranged in the annular accommodating groove 502 along the radial direction of the through hole 501, and each step part 503 has two step faces 5031, and the two step parts 503 are symmetrically arranged in the annular accommodating groove 502 along the center of the through hole 501, so that the growth tray 1 can be limited and the installation position of the growth tray 1 can be positioned, thereby improving the convenience of the installation between the growth tray 1 and the tray rack 5, and ensuring the stability of the growth tray 1 installed on the tray rack 5.
[0053] In some embodiments, as shown in Figure 6 , the support disc 2 can adopt a circular truncated cone structure, and the peripheral surface of the support disc 2 and the bottom surface of the support disc 2 have an included angle α, and as shown in Figure 3 and Figure 6 , the first support port 102 and the second support port 303 can both adopt a circular truncated cone hole matched with the support disc 2, and the peripheral wall of the circular truncated cone hole and the lower eave of the circular truncated cone hole have an included angle γ equal to the included angle α of the peripheral surface of the support disc 2 and the bottom surface of the support disc 2, so that the support disc 2 can be supported on the first support port 102 or the second support port 303, respectively, and the upper surface of the support disc 2 can be flush with the first annular support surface 101 or the second annular support surface 302, respectively, thereby realizing the stable placement of the wafer 6. Wherein, the included angle α of the peripheral surface of the support disc 2 and the bottom surface of the support disc 2 can be 135°, 120°, etc., which is not limited herein.
[0054] In some embodiments, the driving member 304 can adopt a rotating motor 3041 with a height of 320 mm and a radius of 100 mm, and the rotating arm 3042 can adopt a metal plate with a length of 250 mm, a width of 80 mm, and a thickness of 5 mm. The lifting mechanism 4 can adopt a lifting driving motor with a height of 150 mm and a radius of 80 mm, and the lifting column 401 connected with the lifting driving motor can adopt a height of 170 mm and a radius of 2 mm. The support disc 2 can adopt graphite material, and the height of the support disc 2 can adopt 3.8 mm and the radius can adopt 30 mm. The angle α between the peripheral surface of the support disc 2 and the bottom surface of the support disc 2 can adopt 135°. The growth tray 1 can adopt graphite material, and the outer edge radius of the growth tray 1 can adopt 165 mm. The outer diameter of the first annular support surface 101 of the growth tray 1 can adopt 160 mm, the edge height of the growth tray 1 is 16 mm, and the outer side edge of the first annular support surface 101 of the growth tray 1 adopts 135° chamfer. The radius of the first support port 102 can adopt 30 mm, the first support port 102 adopts 45° chamfer, the depth of the first support port 102 can adopt 8.8 mm, the height difference of the two contact surfaces 103 of the growth tray 1 can adopt 5 mm, the connecting inclined surface angle of the two contact surfaces 103 can adopt 45°, and the radius of the contact surface 103 close to the first support port 102 can adopt 150 mm. The tray holder 5 can adopt a metal plate with a length of 210 mm, a width of 120 mm, and a thickness of 50 mm. The inner diameter of the annular accommodating groove 502 can adopt 170 mm, the height of the stepped portion 503 can adopt 5 mm, and the radius of the stepped surface 5031 close to the perforation 501 can adopt 150 mm. The clamping ring 3 can adopt quartz material, the inner ring chamfer of the first clamping ring adopts 135°, the inner ring chamfer of the second clamping ring adopts 45°, the outer diameter of the second annular support surface 302 of the clamping tray 301 formed by splicing the first clamping ring and the second clamping ring can adopt 155 mm, the edge chamfer of the second annular support surface 302 adopts 135°, the radius of the outermost edge of the clamping tray 301 can adopt 160 mm, the edge height is 16 mm, the depth of the second support port 303 can adopt 5 mm, and the bottom of the clamping tray 301 can adopt a smooth round surface.The two rotating arms 3042 are connected with the rotating motor 3041 on the corresponding side and clamped with the ring 3, so that the two clamping rings 3 rotate clockwise or counterclockwise under the action of the rotating motor 3041 rotating horizontally, realizing the splicing and separation of the two clamping rings 3. Meanwhile, the lifting mechanism 4 can drive the support disc 2 to lift, so as to drive the wafer 6 to transport between the clamping tray 301 and the growth tray 1. Since the outer diameter of the second annular support surface 302 of the clamping tray 301 is smaller than that of the first annular support surface 101 of the growth tray 1, when the wafer 6 is placed on the first annular support surface 101 of the growth tray 1, the risk of the wafer contacting the edge of the growth tray 1 can be effectively reduced, avoiding the growth environment such as temperature field and airflow field of the contact edge and non-contact edge of the wafer and the growth tray 1 being different, so as to ensure the uniformity of the film thickness, doping concentration and other parameters of the wafer. At the same time, when the wafer 6 is taken out from the growth tray 1, the particles on the growth tray 1 can be effectively prevented from being brought to the wafer surface, the risk of wafer contamination can be reduced, and the quality of the wafer can be improved.
[0055] The terms "first" and "second" and the like in the description and in the claims of the present application and above-described drawings are used for distinguishing between similar objects, not necessarily described in a specific order. The terms "including" and "having" and any variations thereof are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or apparatus that comprises a list of steps or units are not necessarily limited to the listed steps or units, but can include other steps or units not expressly listed.
[0056] The above description of disclosed embodiments enables a person skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A wafer pick-and-place device, characterized in that, The utility model relates to a tray assembly, clamping assembly and lifting mechanism for wafer growth. The tray assembly comprises a growth tray (1) and a support disc (2) movably arranged on the growth tray (1), the support disc (2) is used to drive a wafer (6) to move, the growth tray (1) limits a first annular support surface (101) for placing the wafer (6) and a first support opening (102) for placing the support disc (2); The clamping assembly comprises two clamping rings (3) movably arranged, the two clamping rings (3) are spliced to form a clamping tray (301) for accommodating the wafer (6), the clamping tray (301) limits a second annular support surface (302) for placing the wafer (6) and a second support opening (303) for placing the support disc (2), and the outer diameter of the first annular support surface (101) is greater than the outer diameter of the second annular support surface (302); The lifting mechanism (4) is used to drive the support disc (2) to lift, so as to drive the wafer (6) to transport between the clamping tray (301) and the growth tray (1).
2. The wafer pick-and-place apparatus of claim 1, wherein The clamping assembly comprises driving members (304) connected with the two clamping rings (3) respectively, so that the two clamping rings (3) are driven to move towards each other or away from each other by the two driving members (304).
3. The wafer pick-and-place apparatus of claim 2, wherein, The driving member (304) comprises a rotating motor (3041) and a rotating arm (3042), one end of the rotating arm (3042) is connected with the rotating motor (3041), and the other end of the rotating arm (3042) is connected with the clamping ring (3), so that the rotating motor (3041) drives the clamping ring (3) to rotate in the horizontal direction through the rotating arm (3042).
4. The wafer pick-and-place apparatus of claim 1, wherein, The tray rack (5) is located below the clamping assembly, and the growth tray (1) is placed on the tray rack (5).
5. The wafer pick-and-place apparatus of claim 4, wherein, The lifting mechanism (4) is located below the tray rack (5), and the lifting mechanism (4) comprises a lifting column (401) used to drive the support disc (2) to lift, and the tray rack (5) is provided with a through hole (501) through which the lifting column (401) passes.
6. The wafer pick-and-place apparatus of claim 5, wherein, The outer diameter of the lifting column (401) is not greater than the outer diameter of the support disc (2), and the inner diameters of the first support opening (102) and the second support opening (303) are both greater than the outer diameter of the lifting column (401).
7. The wafer pick-and-place apparatus of claim 5, wherein The centers of the through hole (501), the first support opening (102) and the second support opening (303) are coaxially arranged.
8. The wafer pick-and-place apparatus of claim 7, wherein, The tray rack (5) is provided with an annular accommodating groove (502) used to place the growth tray (1), and the through hole (501) is located on the bottom wall of the annular accommodating groove (502).
9. The wafer pick-and-place apparatus of claim 8, wherein, The annular accommodating groove (502) is provided with at least one stepped portion (503) along the radial direction of the through hole (501), the stepped portion (503) comprises at least two step surfaces (5031), and the bottom surface of the growth tray (1) limits a contact surface (103) abutting each step surface (5031).
10. The wafer pick-and-place apparatus according to any one of claims 1 to 9, characterized by The support disc (2) is a circular truncated cone structure, and the first support opening (102) and the second support opening (303) are both circular truncated cone holes matched with the support disc (2).