Unscrambling device

Abstract

The utility model relates to the technical field of semiconductor processing relates to a kind of unzipping device.The material feeding subassembly of the utility model is discharged to the wafer above at the wafer of horizontal splitting subassembly and longitudinal splitting subassembly place and cover is set on the splitting surface of wafer, and the wafer splitting surface of material pressing mechanism protection film is pressed, horizontal splitting subassembly and longitudinal splitting subassembly respectively to wafer are carried out unzipping operation in horizontal and vertical two directions, and the wafer splitting surface of protection film is attached to wafer and split, not only achieve the purpose of wafer splitting, avoid hard contact with wafer directly, improve the integrity of the grain after splitting;Separation mechanism is again to the wafer and its protection film on wafer after completing unzipping operation and is lifted and separated, can effectively guarantee the separation of wafer and wafer, avoid the wafer grain on wafer from protection film sticking to cause separation, improve splitting effect.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing relates to a device. BACKGROUND

[0002] Wafer refers to the silicon wafer used for making silicon semiconductor integrated circuit, because its shape is round, so called wafer. In the process of making semiconductor chip, a plurality of chip units are formed on the wafer surface, which is called die. In the process of making, the wafer needs to be cut to divide the wafer into a plurality of dies.

[0003] The existing splitting device mainly uses the way of roller rolling or splitting knife extrusion to make the wafer complete splitting. The roller and the splitting knife directly contact with the wafer. Because the splitting is not carried out at the same time in different directions, the stress received by the die in different directions is different, which is easy to cause the die to crack and the corner to be missing in the splitting process, resulting in defective products. UTILITY MODEL CONTENT

[0004] The technical problem to be solved by the utility model is to provide a splitting device which avoids direct contact between hard objects and wafers, improves the integrity of the die after splitting, and improves the splitting effect.

[0005] In order to solve the above technical problem, the technical scheme adopted by the utility model to solve its technical problem is:

[0006] A splitting device, comprising:

[0007] A splitting mechanism, comprising a horizontal splitting assembly and a vertical splitting assembly, the horizontal splitting assembly and the vertical splitting assembly are oppositely arranged, and the horizontal splitting assembly and the vertical splitting assembly are used for respectively splitting the wafer in horizontal and vertical directions;

[0008] A protection mechanism, oppositely arranged with the splitting mechanism, the protection mechanism comprises two discharge assemblies, the two discharge assemblies are oppositely arranged with the horizontal splitting assembly and the vertical splitting assembly, and the discharge assembly is used for discharging the protective film thereon to above the wafer at the horizontal splitting assembly and the vertical splitting assembly and covering on the splitting surface of the wafer;

[0009] A pressing mechanism, arranged on the horizontal splitting assembly and the vertical splitting assembly, the pressing mechanism is used for pressing the protective film on the discharge assembly on the splitting surface of the wafer;

[0010] A separation mechanism, arranged on the horizontal splitting assembly and the vertical splitting assembly, the separation mechanism is used for lifting and separating the wafer and the protective film thereon after completing the splitting operation.

[0011] In one embodiment of the utility model, the separating mechanism includes two jacking air cylinders, the two jacking air cylinders are arranged on both sides of the wafer separating position respectively, the jacking air cylinder is drivenly connected with the jacking plate, the lateral splitting assembly or the longitudinal splitting assembly drives the jacking plate to jack up the protective film on both sides of the wafer after completing the separation of the wafer, so that the protective film is separated from the wafer.

[0012] In one embodiment of the utility model, the feeding assembly includes a feeding component, a feeding rack and a collecting rack, the feeding rack and the collecting rack are arranged on both sides of the lateral splitting assembly or the longitudinal splitting assembly respectively, the protective film roll is arranged on the feeding rack and the collecting rack, the guide rollers are arranged between the feeding rack and the wafer and between the collecting rack and the wafer, the feeding component is arranged between the guide roller at the collecting rack and the wafer, and the feeding rack is used for feeding the protective film to the wafer to assist in the separation of the wafer, and the waste protective film is collected by the collecting rack.

[0013] In one embodiment of the utility model, the feeding component includes a fixing frame, a sliding frame is slidably arranged on the fixing frame, a transmission roller is arranged on the sliding frame, and a counterweight is arranged on the sliding frame.

[0014] In one embodiment of the utility model, the lateral splitting assembly and the longitudinal splitting assembly have the same structure, the lateral splitting assembly includes a moving frame, the moving frame is slidably arranged on the rack, the moving frame is drivenly connected with the horizontal movement linear module on the rack, a lifting driving module is arranged on the moving frame, the lifting driving module is drivenly connected with a lifting frame, a separating roller group is arranged on the lifting frame, the pressing mechanism is arranged on the separating roller group, and the separating roller group is driven by the lifting driving module to abut against the wafer, so that the separating roller group performs horizontal roller pressing separation on the wafer under the driving of the horizontal movement linear module.

[0015] In one embodiment of the utility model, the separating roller group includes a fixed plate and a separating roller, the two ends of the separating roller are connected with the bearing seat on the fixed plate, a guide rod is arranged on the fixed plate, the guide rod is arranged in the guide sleeve of the lifting frame, a fixed block is arranged at the free end of the guide rod, so that the guide rod cannot be separated from the guide sleeve, a limiting block is arranged on the fixed plate, and the limiting block is arranged opposite to the lifting frame.

[0016] In one embodiment of the utility model, a guide rod is arranged on the lifting frame, the guide rod is arranged in the guide sleeve on the moving frame, a pressure sensor is arranged on the lifting frame, and the lifting driving module is drivenly connected with the pressure sensor.

[0017] In an embodiment of the utility model, the material pressing mechanism includes two material pressing plates, the two material pressing plates are arranged on the two sides of the separating roller respectively, the material pressing plate is provided with the avoiding groove matched with the separating roller, the material pressing plate is provided with the material pressing surface, the material pressing plate is connected with the fixed plate floatingly.

[0018] In an embodiment of the utility model, the material pressing plate is provided with the sliding shaft, the sliding shaft is slidably arranged on the sliding sleeve of the fixed plate, the free end of the sliding shaft is provided with the limiting block, so that the sliding shaft cannot be separated from the sliding sleeve, the floating spring is arranged between the fixed plate and the material pressing plate.

[0019] In an embodiment of the utility model, further include conveying track, the conveying track includes track frame, the track frame is provided with the belt conveying line, the separating mechanism is arranged on the track frame, and the belt conveying line is used for transferring the wafer between the horizontal splitting assembly and the longitudinal splitting assembly.

[0020] The utility model discloses the beneficial effects:

[0021] The material discharging assembly discharges the protective film on the wafer above the horizontal splitting assembly and the longitudinal splitting assembly and covers the wafer splitting surface, the material pressing mechanism protects the wafer splitting surface, the horizontal splitting assembly and the longitudinal splitting assembly carry out the separating operation to the wafer in horizontal and longitudinal directions respectively, and the protective film is attached to the wafer and split, which not only achieves the wafer splitting purpose, avoids the direct contact between the hard object and the wafer, improves the wafer grain integrity after splitting, and separates the wafer and the protective film after the separating operation, effectively guarantees the separation of the protective film and the wafer, avoids the wafer grain separation caused by the protective film adhesion, and improves the splitting effect. DRAWINGS

[0022] Figure 1 It is a separating device schematic view of the utility model.

[0023] Figure 2 It is a horizontal splitting assembly schematic view of the utility model.

[0024] Figure 3 It is a separating roller group schematic view of the utility model.

[0025] Figure 4 It is a material pressing mechanism schematic view of the utility model.

[0026] Figure 5 It is a material discharging assembly schematic view of the utility model.

[0027] Explanation of reference signs in the figure: 1, conveying track; 11, track frame; 12, belt conveying line; 13, split film; 14, wafer; 15, protective film; 2, frame; 21, transverse splitting assembly; 22, longitudinal splitting assembly; 23, moving frame; 24, transverse moving linear module; 25, lifting driving module; 26, lifting frame; 27, guide rod; 28, pressure sensor; 3, discharging assembly; 31, discharging frame; 32, receiving frame; 33, guide roller; 34, discharging component; 35, fixing frame; 36, sliding frame; 37, counterweight; 38, conveying roller; 4, splitting roller set; 41, fixing plate; 42, bearing seat; 43, splitting roller; 44, guide rod; 45, guide sleeve; 5, pressing mechanism; 51, pressing plate; 52, sliding shaft; 53, sliding sleeve; 54, floating spring; 55, avoiding groove; 56, pressing surface; 6, separating mechanism; 61, lifting cylinder; 62, lifting plate. DETAILED DESCRIPTION

[0028] The utility model will be further explained in connection with the drawings and specific embodiments, so that the person skilled in the art can better understand the utility model and can be implemented, but the embodiment is not as the limitation of the utility model.

[0029] Reference Figures 1-5 The splitting device comprises:

[0030] The splitting mechanism comprises a transverse splitting assembly 21 and a longitudinal splitting assembly 22, wherein the transverse splitting assembly 21 and the longitudinal splitting assembly 22 are oppositely arranged, and the transverse splitting assembly 21 and the longitudinal splitting assembly 22 are used for respectively performing splitting operations on the wafer 14 in the transverse direction and the longitudinal direction.

[0031] The protective mechanism is oppositely arranged with the splitting mechanism, and the protective mechanism comprises two discharging assemblies 3, wherein the two discharging assemblies 3 are oppositely arranged with the transverse splitting assembly 21 and the longitudinal splitting assembly 22 respectively, and the discharging assembly 3 is used for discharging the protective film 15 thereon to above the wafer 14 at the transverse splitting assembly 21 and the longitudinal splitting assembly 22 and covering the splitting surface of the wafer 14.

[0032] The pressing mechanism 5 is arranged on the transverse splitting assembly 21 and the longitudinal splitting assembly 22, and the pressing mechanism 5 is used for pressing the protective film 15 on the discharging assembly 3 on the splitting surface of the wafer 14.

[0033] The separating mechanism 6 is arranged on the transverse splitting assembly 21 and the longitudinal splitting assembly 22, and the separating mechanism 6 is used for lifting and separating the wafer 14 and the protective film 15 thereon after the splitting operation is completed.

[0034] The material discharging assembly 3 discharges the protective film 15 above the wafer 14 at the horizontal splitting assembly 21 and the longitudinal splitting assembly 22 and covers the splitting surface of the wafer 14, the material pressing mechanism 5 presses the protective film 15 on the splitting surface of the wafer 14, the horizontal splitting assembly 21 and the longitudinal splitting assembly 22 respectively perform splitting operation on the wafer 14 in horizontal and vertical directions, the protective film 15 is attached on the wafer 14 for splitting, the wafer 14 splitting purpose is achieved, direct contact of the wafer 14 with a hard object is avoided, and the integrity of the crystal grain after splitting is improved; the separating mechanism 6 further separates the wafer 14 after the splitting operation and the protective film 15 thereon, the separation of the protective film 15 and the wafer 14 can be effectively ensured, the protective film 15 is prevented from being adhered to cause the crystal grain on the wafer 14 to be separated, and the splitting effect is improved.

[0035] In an embodiment of the utility model, separating mechanism 6 includes two lift cylinders 61, two lift cylinders 61 are arranged at wafer 14 splitting position both sides respectively, lift cylinder 61 is driven with lift plate 62 connection, horizontal splitting assembly 21 or longitudinal splitting assembly 22 is driven to lift plate 62 after wafer 14 complete splitting two lift cylinders 61, wafer 14 both sides protective film 15 is lifted, so that protective film 15 and wafer 14 are separated.

[0036] Specifically, after the lifting and driving module 25 drives the splitting roller group 4 and the material pressing plate 51 to return to the initial position, the two lift cylinders 61 drive the lift plate 62 to lift the protective film 15 on both sides of the wafer 14, so that the protective film 15 is separated from the wafer 14 after splitting, the separation of the protective film 15 and the wafer 14 can be effectively ensured, the protective film 15 is prevented from being adhered to cause the crystal grain on the wafer 14 to be separated, and the splitting effect is improved.

[0037] In an embodiment of the utility model, the material discharging assembly 3 includes a material discharging part 34, a material discharging rack 31 and a material collecting rack 32, the material discharging rack 31 and the material collecting rack 32 are respectively arranged on both sides of the horizontal splitting assembly 21 or the longitudinal splitting assembly 22, the material discharging rack 31 and the material collecting rack 32 are provided with a protective film 15 roll, guide rollers 33 are arranged between the material discharging rack 31 and the wafer 14 and between the material collecting rack 32 and the wafer 14, the material discharging part 34 is arranged between the guide roller 33 at the material collecting rack 32 and the wafer 14, the material discharging rack 31 is used for discharging the protective film 15 to the wafer 14 for assisting in splitting, and the material collecting rack 32 is used for collecting the waste protective film 15.

[0038] Specific, the feeding rack 31 is used for feeding the protective film 15 to the wafer 14 to assist in the post-dicing, and the waste collecting rack 32 is used for collecting the waste protective film 15, the protective film 15 is covered on the wafer 14, so that the wafer 14 is subjected to stress in each direction more uniformly, and problems such as the wafer being lifted from the protective film 15 can be avoided, compared with the existing single-direction dicing blade dicing mode, the dicing efficiency can be improved, and the production capacity can be improved.

[0039] In an embodiment of the utility model, the feeding component 34 includes a fixed frame 35, a sliding frame 36 is slidably arranged on the fixed frame 35, a transmission roller 38 is arranged on the sliding frame 36, and a counterweight 37 is arranged on the sliding frame 36.

[0040] Specific, the feeding rack 31 is used for feeding the protective film 15 to the wafer 14, in the driving of the counterweight 37, the transmission roller 38 on the sliding frame 36 always stretches the protective film 15 downward, when the pressing plate 51 and the dicing roller 43 complete the dicing of the wafer 14 and move away from the protective film 15, the material roll on the feeding rack 31 is pulled and fed under the gravity of the counterweight, and the waste protective film 15 is collected by the waste collecting rack 32, because the movement stroke of the sliding frame 36 on the fixed frame 35 is limited, the protective film 15 above the wafer 14 can be quickly replaced, and the structure is simple and reasonable.

[0041] In an embodiment of the utility model, the transverse dicing assembly 21 and the longitudinal dicing assembly 22 are the same in structure, the transverse dicing assembly 21 includes a moving frame 23, the moving frame 23 is slidably arranged on the rack 2, the moving frame 23 is drivingly connected with a horizontal movement linear module 24 on the rack 2, a lifting driving module 25 is arranged on the moving frame 23, the lifting driving module 25 is drivingly connected with a lifting frame 26, a dicing roller group 4 is arranged on the lifting frame 26, a pressing mechanism 5 is arranged on the dicing roller group 4, the lifting driving module 25 drives the dicing roller group 4 to abut against the wafer 14, and the dicing roller group 4 performs transverse roller pressing and dicing on the wafer 14 under the driving of the horizontal movement linear module 24.

[0042] Specific, the horizontal movement linear module 24 and the lifting driving module 25 are both reciprocating driving devices, the two form a two-axis movement module, the lifting driving module 25 drives the dicing roller group 4 on the lifting frame 26 to move towards the wafer 14, the dicing roller 43 presses the protective film 15 on the wafer 14, the lifting driving module 25 continues to drive the dicing roller 43 to press the wafer 14, and the horizontal movement linear module 24 drives the dicing roller 43 to perform roller pressing and dicing on the wafer 14 along the transverse direction, so that the dicing is completed, hard objects are prevented from directly contacting the wafer 14, and the integrity of the wafer after dicing is improved.

[0043] In an embodiment of the utility model, the unloading roller group 4 includes fixed plate 41 and unloading roller 43, both ends of unloading roller 43 are connected with bearing seat 42 on fixed plate 41, guiding rod 44 is arranged on fixed plate 41, guiding rod 44 is arranged on the guide sleeve 45 of lifting frame 26, the free end of guiding rod 44 is provided with fixed block, so that guiding rod 44 cannot be separated from guide sleeve 45, limiting block is arranged on fixed plate 41, and limiting block is arranged opposite lifting frame 26.

[0044] Specifically, guiding rod 44 is arranged on fixed plate 41, guiding rod 44 is arranged on the guide sleeve 45 of lifting frame 26, can make fixed plate 41 float up and down along guiding rod 44, guarantee the lifting allowance of wafer 14 cracking, limiting block is arranged on fixed plate 41, and limiting block is arranged opposite lifting frame 26, limiting block can limit the stroke between fixed plate 41 and lifting frame 26, guarantee normal cracking processing, lifting drive module 25 drives unloading roller group 4 on lifting frame 26 to move towards wafer 14 direction, unloading roller 43 is pressed on wafer 14, lifting drive module 25 continues to drive unloading roller 43 to press wafer 14, and horizontal moving linear module 24 drives unloading roller 43 to roll and press wafer 14 along the transverse direction, improve the integrity of the grain after cracking, the length of unloading roller 43 is greater than wafer 14, so that it can adapt to wafer 14 cracking of different diameters, and has stronger practicality.

[0045] In an embodiment of the utility model, guide rod 27 is arranged on lifting frame 26, guide rod 27 is arranged on the guide sleeve of moving frame 23, pressure sensor 28 is arranged on lifting frame 26, and lifting drive module 25 is drivenly connected with pressure sensor 28.

[0046] Specifically, guide rod 27 is arranged on lifting frame 26, can make lifting frame 26 move up and down along guide rod 27, effectively guarantee the lifting precision of lifting frame 26, guarantee the alignment precision of unloading roller 43 and wafer 14, lifting drive module 25 is drivenly connected with pressure sensor 28, can detect the pressure condition of unloading roller 43 to wafer 14 in real time, avoid the phenomenon of not cracking, improve the defects of edge collapse and cracking, and improve the yield of product.

[0047] In an embodiment of the utility model, the pressure mechanism 5 includes two pressure plates 51, and the two pressure plates 51 are arranged on the two sides of the unloading roller 43, the pressure plate 51 is provided with the avoiding groove 55 matched with the unloading roller 43, the pressure plate 51 is provided with the pressure surface 56, and the pressure plate 51 is floatingly connected with the fixed plate 41.

[0048] Specific, lifting drive module 25 drive lifting frame 26 on the unloading roll group 4 towards the wafer 14 direction movement, so that the material pressing plate 51 and the protective film 15 contact, and under the drive of lifting drive module 25, both sides of the material pressing plate 51 will be protective film 15 pressed to the two sides of the belt conveying line 12 on the wafer 14, protective film 15 attached to the wafer 14 for splitting, not only to the wafer 14 splitting purpose, to avoid hard contact with the wafer 14, thus preventing the grain crack and the angle of the missing, improve the integrity of the grain after splitting.

[0049] In an embodiment of the utility model, the material pressing plate 51 is provided with the sliding shaft 52, the sliding shaft 52 is slid on the sliding sleeve 53 of the fixed plate 41, the free end of the sliding shaft 52 is provided with the limiting block, so that the sliding shaft 52 cannot be separated from the sliding sleeve 53, and the floating spring 54 is arranged between the fixed plate 41 and the material pressing plate 51.

[0050] Specific, the material pressing plate 51 is provided with the sliding shaft 52, can make the material pressing plate 51 move up and down along the sliding shaft 52, form the floating connection with the fixed plate 41, under the elastic force of the floating spring 54, the material pressing plate 51 is always away from the fixed plate 41, so that the material plate is under the elastic force of the spring and is flexibly pressed to the protective film 15, avoids the relative displacement of protective film 15 and wafer 14, guarantees the splitting stability.

[0051] In an embodiment of the utility model, further include conveying track 1, the conveying track 1 includes track frame 11, the track frame 11 is provided with the belt conveying line 12, the separating mechanism 6 is arranged on the track frame 11, and the belt conveying line 12 is used to transfer wafer 14 between the horizontal splitting assembly 21 and the longitudinal splitting assembly 22.

[0052] Specific, place wafer 14 on the splitting membrane 13 on the belt conveying line 12, the belt conveying line 12 transports wafer 14 and splitting membrane to the horizontal splitting assembly 21 or longitudinal splitting assembly 22 position, and the belt conveying line 12 can not only support and position wafer 14, but also can transfer wafer 14 between the horizontal splitting assembly 21 and the longitudinal splitting assembly 22, greatly improves transmission efficiency.

[0053] Use process

[0054] Place the wafer 14 on the split film 13 on the belt conveying line 12, the belt conveying line 12 conveys the wafer 14 and the split film to the transverse splitting assembly 21 or the longitudinal splitting assembly 22, when the wafer 14 is at the transverse splitting assembly 21, the protective film 15 is between the wafer 14 and the splitting roller 43, the lifting drive module 25 drives the splitting roller group 4 on the lifting frame 26 to move towards the wafer 14, so that the pressing plate 51 and the splitting roller 43 contact the protective film 15, and under the driving of the lifting drive module 25, the two pressing plates 51 press the protective film 15 to the two sides of the wafer 14, the splitting roller 43 presses the protective film 15 on the wafer 14, the lifting drive module 25 continues to drive the splitting roller 43 to press the wafer 14, while the horizontal movement linear module 24 drives the splitting roller 43 to roll and split the wafer 14 in the transverse direction, after the transverse splitting of the wafer 14 is completed, the lifting drive module 25 drives the splitting roller group 4 and the pressing plate 51 to return to the initial position, then the two lifting cylinders 61 drive the lifting plate 62 to lift the protective film 15 on the two sides of the wafer 14, so that the protective film 15 is separated from the split wafer 14, the belt conveying line 12 conveys the wafer 14 to the longitudinal splitting assembly 22, the splitting roller 43 on the longitudinal splitting assembly 22 rolls and splits the wafer 14 in the longitudinal direction perpendicular to the transverse direction, so as to complete the splitting operation of the wafer 14 in the transverse and longitudinal directions, avoid the phenomenon of not splitting, improve the defects of edge collapse and metal layer fracture, improve the yield of products, and the device is simple and suitable.

[0055] The above-described embodiments are only preferred embodiments for fully illustrating the present application, and the protection scope of the present application is not limited thereto. Any equivalent substitutions or transformations made by those skilled in the art based on the present application are within the protection scope of the present application. The protection scope of the present application is subject to the claims.

Claims

1. A sheet unscrambling apparatus characterized by comprising: include: The wafer dicing mechanism includes a transverse dicing assembly and a longitudinal dicing assembly, which are arranged opposite to each other. The transverse dicing assembly and the longitudinal dicing assembly are used to perform wafer dicing operations in the transverse and longitudinal directions, respectively. A protective mechanism is provided opposite to the dicing mechanism. The protective mechanism includes two feeding assemblies, which are respectively provided opposite to the transverse dicing assembly and the longitudinal dicing assembly. The feeding assemblies are used to feed the protective film on the wafer at the transverse dicing assembly and the longitudinal dicing assembly and cover the dicing surface of the wafer. A pressing mechanism is provided on the transverse dicing assembly and the longitudinal dicing assembly. The pressing mechanism is used to press the protective film on the unloading assembly onto the dicing surface of the wafer. A separation mechanism is provided on the transverse dicing assembly and the longitudinal dicing assembly. The separation mechanism is used to lift and separate the wafer after the wafer dicing operation has been completed from the protective film on it.

2. The apparatus of claim 1, wherein The separation mechanism includes two lifting cylinders, which are respectively located on both sides of the wafer dicing position. The lifting cylinders are driven and connected to the lifting plate. After the transverse dicing assembly or the longitudinal dicing assembly completes the wafer dicing, the two lifting cylinders drive the lifting plate to lift the protective film on both sides of the wafer, so that the protective film is separated from the wafer.

3. The apparatus of claim 1, wherein The feeding assembly includes a feeding component, a feeding rack, and a receiving rack. The feeding rack and receiving rack are respectively disposed on both sides of the transverse dicing assembly or the longitudinal dicing assembly. Protective film rolls are disposed on the feeding rack and the receiving rack. Guide rollers are disposed between the feeding rack and the wafer, and between the receiving rack and the wafer. The feeding component is disposed between the guide rollers at the receiving rack and the wafer. The feeding rack is used to feed the protective film onto the wafer for auxiliary wafer dicing, and the receiving rack collects the waste protective film.

4. The apparatus of claim 3, wherein The feeding component includes a fixed frame, a sliding frame slidably mounted on the fixed frame, a transmission roller mounted on the sliding frame, and a counterweight mounted on the sliding frame.

5. The apparatus of claim 1 wherein, The transverse dicing assembly and the longitudinal dicing assembly have the same structure. The transverse dicing assembly includes a movable frame that slides on the frame and is driven by a transverse linear module on the frame. A lifting drive module is provided on the movable frame and is driven by a lifting frame. A wafer-breaking roller assembly is provided on the lifting frame, and a pressing mechanism is provided on the wafer-breaking roller assembly. The lifting drive module drives the wafer-breaking roller assembly to press against the wafer under the action of the transverse linear module, so that the wafer-breaking roller assembly performs transverse rolling and wafer-breaking on the wafer.

6. The apparatus of claim 5, wherein the means for separating comprises a means for separating the first and second substrates by applying a force to the first and second substrates. The unsplitting roller assembly includes a fixed plate and unsplitting rollers. Both ends of the unsplitting rollers are connected to bearing seats on the fixed plate. A guide rod is provided on the fixed plate. The guide rod passes through the guide sleeve of the lifting frame. A fixing block is provided at the free end of the guide rod so that the guide rod cannot be detached from the guide sleeve. A limit block is provided on the fixed plate, and the limit block is arranged opposite to the lifting frame.

7. The apparatus of claim 5, wherein the means for separating comprises a means for separating the first and second substrates by applying a force to the first and second substrates. The lifting frame is equipped with a guide rod, which passes through a guide sleeve on the movable frame. A pressure sensor is installed on the lifting frame, and the lifting drive module is driven and connected to the pressure sensor.

8. The apparatus of claim 6, wherein the means for separating comprises a means for separating the first and second substrates by applying a force to the first and second substrates. The pressing mechanism comprises two pressing plates, which are respectively arranged on the two sides of the separating roller, and the pressing plates are provided with avoiding grooves matched with the separating roller, and the pressing plates are provided with pressing surfaces, and the pressing plates are floatingly connected with the fixed plate.

9. The apparatus of claim 8, wherein the means for separating comprises a means for separating the first and second substrates by applying a force to the first and second substrates. The pressing plate is provided with a sliding shaft, the sliding shaft is slidably arranged on the sliding sleeve of the fixed plate, the free end of the sliding shaft is provided with a limiting block, so that the sliding shaft cannot be separated from the sliding sleeve, and the fixed plate and the pressing plate are provided with floating springs.

10. The apparatus of claim 1, wherein The device further comprises a conveying track, the conveying track comprises a track frame, the track frame is provided with a belt conveying line, the separating mechanism is arranged on the track frame, and the belt conveying line is used for transferring the wafer between the transverse separating assembly and the longitudinal separating assembly.

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