Power conversion circuit

Abstract

The utility model relates to a power conversion circuit, and relates to the technical field of power conversion. The power conversion circuit comprises a power supply which comprises an output end; the boosting module comprises a first end and a second end, the first end is electrically connected with the output end, the second end is electrically connected with an NFC module, and the second end is further electrically connected with at least one load module; the controller comprises a first interface, a second interface and a control end; the first interface is electrically connected with the output end; the second interface is electrically connected with the NFC module; the control end is electrically coupled with the boosting module so as to issue a control signal to the boosting module; the control signal is used for controlling the output voltage of the boost module. According to the invention, the controller is electrically connected with the power supply, the NFC module and the boost module, and the control signal capable of controlling the output voltage of the boost module is generated and issued to the boost module based on the feedback of the power supply and the NFC module. The output of different voltage levels of the power conversion circuit is realized, so that the power supply requirements of different voltage levels are met.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of power conversion, and in particular to a power conversion circuit. BACKGROUND

[0002] With the development of mobile devices, in order to ensure that the mobile device can work in various modes, the mobile device needs to supply power of different voltage levels to different load modules contained therein. Therefore, the power supply unit in the mobile device needs to supply power of different voltage levels.

[0003] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present disclosure, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. SUMMARY

[0004] The present disclosure provides a power conversion circuit.

[0005] According to a first aspect of an embodiment of the present disclosure, a power conversion circuit is provided, comprising:

[0006] a power supply comprising an output end;

[0007] a boost module comprising a first end and a second end, the first end being electrically connected to the output end, the second end being electrically connected to a near field communication (NFC) module, and the second end being further electrically connected to at least one load module;

[0008] a controller comprising a first interface, a second interface and a control end, the first interface being electrically connected to the output end, the second interface being electrically connected to the NFC module, and the control end being electrically coupled to the boost module and sending a control signal to the boost module;

[0009] The control signal is used to control the output voltage of the boost module.

[0010] In some embodiments of the present disclosure, the boost module comprises:

[0011] a boost bypass chip comprising a feedback pin and a switch pin;

[0012] a first impedance comprising a first end and a second end, the first end of the first impedance being electrically connected to the feedback pin, and the second end of the first impedance being electrically connected to the switch pin;

[0013] a second impedance comprising a first end and a second end, the first end of the second impedance being electrically connected to the feedback pin;

[0014] a third impedance comprising a first end and a second end, the first end of the third impedance being electrically connected to the second end of the second impedance, and the second end of the third impedance being grounded;

[0015] a switch tube comprising a first end, a second end and a third end, the first end of the switch tube being electrically connected to the second end of the second impedance, the second end of the switch tube being grounded, and the third end of the switch tube being electrically connected to the control end.

[0016] In some embodiments of the present disclosure, the control end comprises a first control sub-port;

[0017] The control signal comprises a first control signal.

[0018] The third end of the switch tube is electrically connected to the first control sub-port to receive the first control signal.

[0019] The first control signal is used to control the conduction or turn-off of the switch tube.

[0020] In some embodiments of the present disclosure, the control end comprises a second control sub-port;

[0021] The control signal comprises a second control signal.

[0022] The boost bypass chip comprises a bypass control pin.

[0023] The bypass control pin is electrically connected to the second control sub-port to receive the second control signal.

[0024] The second control signal is used to control the working mode of the boost bypass chip to be a bypass mode.

[0025] In some embodiments of the present disclosure, the connection point of the switch pin and the first impedance is the second end of the boost module.

[0026] In some embodiments of the present disclosure, the boost bypass chip comprises an input voltage pin.

[0027] The input voltage pin is electrically connected to the output end.

[0028] In some embodiments of the present disclosure, the input end of the input voltage pin is the first end of the boost module.

[0029] In some embodiments of the present disclosure, the first interface is configured to receive the output voltage of the power supply.

[0030] The second interface is configured to receive the working state signal of the NFC module.

[0031] The working state signal is used to represent whether the NFC module is in a working state.

[0032] In some embodiments of the present disclosure, the controller is configured to generate the control signal according to the output voltage and the working state signal.

[0033] According to a second aspect of the embodiments of the present disclosure, a power supply module is provided, which includes the power conversion circuit according to the first aspect, and the power supply module supplies power for a mobile device.

[0034] The technical solutions provided by the embodiments of the present disclosure can have the following beneficial effects:

[0035] The present disclosure sets the first end of the boost module to be electrically connected with the output end of the power supply, and sets the second end of the boost module to be electrically connected with an NFC module and at least one load module, so as to supply the NFC module and the at least one load module with the power supply after the power supply is boosted by the boost module; the controller is electrically connected with the power supply, the NFC module and the boost module, and based on the feedback of the power supply and the NFC module, the controller generates a control signal capable of controlling the output voltage of the boost module and sends the control signal to the boost module. The power conversion circuit can output different voltage levels, thereby meeting the power supply requirements of different voltage levels.

[0036] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0037] The accompanying drawings, which are incorporated into and form part of the specification, illustrate embodiments consistent with the present disclosure and, together with the specification, serve to explain the principles of the present disclosure. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor based on these drawings.

[0038] Figure 1 is a power conversion circuit structure schematic diagram according to some embodiments of the present disclosure.

[0039] Figure 2 is a power conversion circuit structure schematic diagram according to some exemplary embodiments of the present disclosure.

[0040] Figure 3 is a power conversion circuit structure schematic diagram according to some exemplary embodiments of the present disclosure. Figure 2 is an equivalent circuit schematic diagram of the power conversion circuit shown Figure 1 .

[0041] Figure 4 is a power conversion circuit structure schematic diagram according to some exemplary embodiments of the present disclosure. Figure 2An equivalent circuit schematic of the power conversion circuit shown Figure 2 .

[0042] Figure 5 is shown according to some exemplary embodiments of the present disclosure Figure 2 An equivalent circuit schematic of the power conversion circuit shown Figure 3 .

[0043] Figure 6 is shown according to some exemplary embodiments of the present disclosure DETAILED DESCRIPTION

[0044] Some embodiments of the present disclosure will be described in detail herein with reference to the drawings, in which the same reference characters refer to elements with the same or similar functions. Various changes, modifications, and equivalents thereof will become apparent to those skilled in the art after an understanding of the present disclosure. For instance, the order of the operations described herein can be altered in some embodiments, and the alterations will become apparent to those skilled in the art after an understanding of the present disclosure. Additionally, for the sake of brevity and clarity, some features of the description can be omitted or simplified.

[0045] The implementations described below with respect to some embodiments of the present disclosure are not meant to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0046] The specific implementations of the embodiments of the present disclosure will be described below in detail with reference to the accompanying drawings.

[0047] To cope with the situation of extremely low temperature, the lithium battery may be affected because the performance of the lithium ion battery will decrease at low temperature, which can cause the device to automatically shut down. In the related art, a working mode of extremely cold mode is developed to enable the phone to operate normally in this case.

[0048] When the phone is working normally, the power output voltage is generally maintained at 3.4V or above. If it is lower than 3.4V, the output level is insufficient to power the load module in the phone, and the phone may shut down. In a cold environment, the voltage of the lithium battery changes very seriously, causing the output voltage of the battery to be lower than 3.4V, or even less than 3.2V. In order to ensure that the phone can work without being forced to shut down, the power supply module in the phone needs to output an output voltage higher than 3.4V.

[0049] And the mobile phone generally has a NFC chip built-in to realize the NFC function, since the NFC chip needs to use an antenna to identify the card, so the required power is relatively large, that is, the voltage required by the NFC module is high, generally 5V, but the output voltage of the power supply is generally less than 5V, generally around 4.5V, which cannot directly meet the power supply requirements of the NFC module.

[0050] It can be seen that the power supply requirements inside the mobile phone are various, and different voltage levels need to be met.

[0051] In view of the above different requirements, the power conversion circuit and the power supply module comprising the same are provided.

[0052] Figure 1 is a structural schematic diagram of a power conversion circuit according to some embodiments of the present disclosure, as Figure 1 shown, the power conversion circuit comprises:

[0053] A power supply 110 comprising an output end.

[0054] It should be noted that the power supply 110 is used to provide electric energy, which can be a lithium ion battery or a lithium polymer battery, and has a high energy density and a long service life.

[0055] A boost module 120 comprising a first end and a second end, the first end being electrically connected to the output end, and the second end being electrically connected to a near field communication NFC module, and further being electrically connected to at least one load module.

[0056] It should be noted that since the voltage output capability of the power supply 110 is limited, the boost module 120 is used to boost the output voltage of the power supply 110 to meet the voltage requirements of the NFC module and / or the load module.

[0057] In some exemplary embodiments of the present disclosure, the NFC module is configured to use a radio frequency RF frequency to perform wireless communication through magnetic field induction to realize functions such as data exchange, mobile payment, card simulation, connection device or electronic tag information reading. The load module is some functional modules in the mobile device for supporting the work of the mobile device, which can be CPU, GPU, image acquisition module, audio codec or wireless communication module, etc.

[0058] A controller 130 comprising a first interface 131, a second interface 132 and a control end 133; the first interface 131 is electrically connected to the output end; the second interface 132 is electrically connected to the NFC module; the control end 133 is electrically coupled to the boost module 120, and the following control signal is sent to the boost module 120.

[0059] It should be noted that the control signal is used to control the output voltage of the boost module 120.

[0060] The power supply 110 is electrically connected to the first end of the voltage boosting module 120, and the second end of the voltage boosting module 120 is electrically connected to the NFC module and the at least one load module, so that the voltage boosting module 120 boosts the output voltage of the power supply 110 and supplies the boosted voltage to the NFC module and the at least one load module. The controller 130 is electrically connected to the power supply 110, the NFC module, and the voltage boosting module 120, and generates a control signal for controlling the output voltage of the voltage boosting module 120 based on the feedback of the power supply 110 and the NFC module. The power conversion circuit can output different voltage levels, thereby meeting the power supply requirements of different voltage levels.

[0061] In some example embodiments of the present disclosure, the first interface 131 is configured to receive the output voltage of the power supply 110, and the second interface 132 is configured to receive a working state signal of the NFC module, the working state signal being used to represent whether the NFC module is in a working state. The controller 130 is configured to generate the control signal according to the output voltage and the working state signal.

[0062] It can be understood that the NFC module does not work all the time, and thus does not need to be powered all the time. Therefore, the working state signal of the NFC module can be received, and the controller 130 can determine whether the NFC module is in a working state through the working state signal, so as to determine whether the voltage boosting module 120 needs to output the voltage level required by the NFC module. In addition, the voltage boosting gain of the voltage boosting module 120 is different with different output voltages of the battery, and thus the controller 130 can determine the working mode of the voltage boosting module 120 through the output voltage of the power supply 110 and the working state signal of the NFC module.

[0063] In some example embodiments of the present disclosure, the working mode of the voltage boosting module 120 can include a first working mode, a second working mode, and a third working mode. In the first working mode, the voltage boosting module 120 outputs a first working voltage, and the first working voltage corresponds to the working voltage required by the NFC module. In the second working mode, the voltage boosting module 120 receives an input voltage in a first voltage range and outputs a second working voltage. The input voltage in the first voltage range corresponds to the output voltage of the power supply 110 in a non-extreme cold mode, i.e., the output voltage of the power supply 110 in a normal state. The second working voltage corresponds to the working voltage required by the at least one load module. In the third working mode, the voltage boosting module 120 receives an input voltage in a second voltage range and outputs the second working voltage. The input voltage in the second voltage range corresponds to the output voltage of the power supply 110 in an extreme cold mode, i.e., the low output voltage of the power supply 110 in an extreme case. It can be understood that the second voltage range is lower than the first voltage range, and the second working voltage is lower than the first working voltage.

[0064] In some example embodiments of the present disclosure, as shown in Figure 2 The boost module 120 includes:

[0065] The boost-bypass chip 210 includes a feedback pin FB and a switch pin SW.

[0066] It should be noted that the boost-bypass chip can work in a boost mode for boosting the input voltage of the boost-bypass chip and outputting the boosted voltage, and the boost-bypass chip can also work in a bypass mode for directly outputting the input voltage of the boost-bypass chip without boosting, so that the input voltage can be directly transmitted to the load when the boost conversion is not needed, thereby avoiding the efficiency loss caused by the boost conversion.

[0067] In some embodiments of the present disclosure, the boost-bypass chip 210 includes an input voltage pin VIN electrically connected to the output end of the power supply 110 to receive the power output by the power supply 110. Correspondingly, the input end of the input voltage pin VIN is the first end of the boost module 120.

[0068] The first impedance 220 includes a first end and a second end, and the first end of the first impedance 220 is electrically connected to the feedback pin FB, and the second end of the first impedance 220 is electrically connected to the switch pin SW. Correspondingly, the connection point of the switch pin SW and the first impedance 220 is the second end of the boost module 120.

[0069] The second impedance 230 includes a first end and a second end, and the first end of the second impedance 230 is electrically connected to the feedback pin FB;

[0070] The third impedance 240 includes a first end and a second end, and the first end of the third impedance 240 is electrically connected to the second end of the second impedance 230, and the second end of the third impedance 240 is grounded.

[0071] The switch tube 250 includes a first end, a second end and a third end, the first end of the switch tube 250 is electrically connected to the second end of the second impedance 230, the second end of the switch tube 250 is grounded, and the third end of the switch tube 250 is electrically connected to the control end 133.

[0072] In some example embodiments of the present disclosure, as shown in Figure 2 The control end 133 includes a first control subport 1331, and correspondingly, the control signal includes a first control signal. The third end of the switch tube 250 is electrically connected to the first control subport 1331 to receive the first control signal, and the first control signal is used to control the conduction or turn-off of the switch tube 250. That is, the controller 130 controls the switch tube 250 to be in a conduction state or a turn-off state by issuing the first control signal.

[0073] In some example embodiments of the present disclosure, as shown in Figure 2 The control end 133 includes a second control sub-port 1332, and the control signal includes a second control signal. The boost-bypass chip 210 includes a bypass control pin BypassControl (indicated as pin CON in the figure), which is electrically connected to the second control sub-port 1332 to receive the second control signal. The second control signal is used to control the working mode of the boost-bypass chip 210 to be the bypass mode. That is, the controller 130 controls the working mode of the boost-bypass chip 210 to be the bypass mode by issuing the second control signal.

[0074] Corresponding to Figure 2 The working principle of the power conversion circuit shown in

[0075] The first interface 131 of the controller 130 receives the output voltage of the power supply 110 to determine whether the voltage range corresponding to the output voltage of the power supply 110 is the first voltage range or the second voltage range. For example, when the output voltage is the first voltage range, the power supply 110 feeds back a high level to the first interface 131, which can be represented by 1. When the output voltage is the second voltage range, the power supply 110 feeds back a low level to the first interface 131, which can be represented by 0.

[0076] The second interface 132 of the controller 130 receives the working state signal of the NFC module to obtain whether the NFC module is in the working state. For example, when the NFC module is in the working state, the working state signal of the NFC module is a high level, which can be represented by 1. When the NFC module is in the non-working state, the NFC module does not trigger the working state signal to the controller 130, and at this time, the second interface 132 has no signal input, which can be regarded as a low level, and the input signal value can be represented by 0.

[0077] The controller 130 performs logical operation based on the signal values input by the first interface 131 and the second interface 132 to determine the working mode of the boost module 120 to be the first working mode, the second working mode or the third working mode.

[0078] For example, when the input signal value of the second interface 132 is 1, it is determined that the working mode of the boost module 120 is the first working mode, and the first control signal is issued to the switch tube 250 through the first control sub-port 1331 to make the switch tube 250 conductive, and the second control signal is not issued. At this time, the Boost-bypass chip works in the boost mode, as shown in Figure 3 The equivalent circuit diagram under this working mode, the internal voltage V FBOne way through the second impedance 230 (impedance value Z2) to ground, one way through the first impedance 220 (impedance value Z1) to the switch pin SW, that is, the output voltage of the boost module 120 at this time is: V out1 = V FB × (1+Z1 / Z2).

[0079] When the input signal value of the second interface 132 is 0 and the input signal value of the first interface 131 is 0, it is determined that the working mode of the boost module 120 is the third working mode. The first control sub-port 1331 no longer issues the first control signal to the switch tube 250 to make the switch tube 250 closed, and the second control signal is not issued. At this time, the Boost-bypass chip works in the boost mode, as shown in Figure 4 , which is the equivalent circuit diagram under this working mode. The internal voltage V FB of the feedback pin FB is one way through the second impedance 230 and the third impedance 240 (impedance value Z3) to ground, and one way through the first impedance 220 to the switch pin SW. That is, the output voltage of the boost module 120 at this time is: V out3 = V FB × (1+Z1 / (Z2+Z3).

[0080] When the input signal value of the second interface 132 is 0 and the input signal value of the first interface 131 is 1, it is determined that the working mode of the boost module 120 is the second working mode. The bypass control pin Bypass Control of the Boost-bypass chip is issued with the second control signal, that is, a high level is given to the Bypass Control, so that the Boost-bypass chip works in the bypass mode. At this time, the Boost-bypass chip works in the bypass mode, and the rest of the pins are invalid, as shown in Figure 5 , which is the equivalent circuit diagram under this working mode. The boost function of the Boost-bypass chip is not available, and the voltage output by the boost module 120 is roughly the same as the voltage V IN input to the boost module 120. That is, the output voltage of the boost module 120 at this time is: V out2 = V IN .

[0081] Therefore, the controller 130 determines the working mode of the boost module 120 by receiving the signal fed back by the NFC module and the power supply 110, and issues different control signals based on different working modes to control the working mode of the switch tube 250 or the Boost-bypass chip, so that the boost module 120 outputs an output voltage corresponding to the different working modes to meet the power supply requirements of the load module and the NFC module. And because the output voltage is adjusted based on the power supply requirement, unnecessary power consumption can be reduced. By setting the boost module 120, different boost requirements can be achieved with only one Boost-bypass chip, without the need for multiple boost chips, reducing the cost of the device and the footprint and area of the power conversion circuit, and improving the power density.

[0082] Based on the same inventive concept, the disclosure embodiments also provide a power supply module, as described in the following embodiments. Since the problem-solving principle of the power supply module embodiments is similar to that of the above-mentioned power conversion circuit embodiments, the implementation of the above-mentioned power conversion circuit embodiments can be referred to, and the repeated parts will not be described again.

[0083] In some embodiments of the disclosure, the power supply module includes any one of the power conversion circuits provided in the above-mentioned embodiments, and the power supply module supplies power to a mobile device. It should be noted that the mobile device is an electronic device that is convenient to carry and can be used at different locations, for example, it can be a smartphone, a tablet computer, a wearable device, a notebook computer, a portable media player, a portable game device, or a mobile hotspot device, etc.

[0084] In order to better illustrate how the power supply module provided by the embodiments of the disclosure supplies power, a smartphone is taken as an example, as shown in Figure 6 Fig. 3 shows a working logic diagram of the power supply module.

[0085] Specifically, the NFC module of the smartphone can work only when the supply voltage reaches 5V, and the NFC module does not start below 5V. Under normal circumstances, the output voltage range of the power supply 110 is 3.4V-4.5V, and the working voltage range of the plurality of load modules is also 3.4V-4.5V. Under extreme circumstances, the output voltage range of the power supply 110 is lower than 3.4V, and the minimum can be 3.0V.

[0086] The specific working process includes the following steps:

[0087] S601, the power supply module determines whether the NFC module works by the working state signal fed back by the NFC module set in the mobile phone;

[0088] S602, if it is determined that the NFC module works, the power supply module adjusts the working mode of the boost module 120 to the first working mode and outputs 5V voltage;

[0089] S603, if it is determined that the NFC module is not working, determining whether the output voltage of the power supply 110 is 3.4V-4.5V;

[0090] S604, if it is determined that the output voltage of the power supply 110 is 3.4V-4.5V, the power supply module adjusts the working mode of the boost module 120 to the third working mode, and outputs a voltage of 3.4V-4.5V;

[0091] S605, if it is determined that the output voltage of the power supply 110 is not 3.4V-4.5V, determining whether the output voltage of the power supply 110 is 3.0V-3.4V;

[0092] S606, if it is determined that the output voltage of the power supply 110 is 3.0V-3.4V, the power supply module adjusts the working mode of the boost module 120 to the second working mode, and outputs a voltage of 3.4V-4.5V;

[0093] S607, if it is determined that the output voltage of the power supply 110 is lower than 3.0V, the mobile phone is powered off.

[0094] It can be seen that the mobile device applies the above power supply module, which can still maintain the device running in extreme cases, increase the endurance time of the device, and the power supply module can reduce unnecessary power consumption loss, which is also beneficial to increase the endurance time of the device. The elements of the power supply module are simple, and the structure is easy to implement, which is beneficial to realize the high integration of the device, and can improve the power density and ensure the realization of the miniaturization of the device.

[0095] It should be understood that the features of various embodiments of the present disclosure described herein can be combined with each other unless specifically indicated otherwise. As used herein, the term "and / or" includes any of the related listed terms and any combination of any two or more; similarly, "at least one of" includes any of the related listed terms and any combination of any two or more.

[0096] It should be understood that, unless otherwise specifically stated and limited, the terms "engagement", "attachment", "installation", "connection", "connection", "fixing" and the like used in the embodiments of the present disclosure should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection or communication with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in this paper can be understood according to the specific circumstances.

[0097] Further, the word "over" used in the context of a component, an element, or a material layer "over" another component, an element, or a material layer means that the component, element, or material layer is positioned, for example, placed, formed, deposited, etc. "indirectly" over the other component, element, or material layer such that one or more additional components, elements, or layers are arranged between the component, element, or material layer and the other component, element, or material layer. However, the word "over" used in the context of a component, an element, or a material layer "over" another component, an element, or a material layer also can optionally mean that the component, element, or material layer is positioned, for example, placed, formed, deposited, etc. "directly" over the other component, element, or material layer, for example, in direct contact with the other component, element, or material layer.

[0098] Although terms such as "first," "second," and "third" can be used herein to describe various elements, components, regions, layers or sections, these elements, components, regions, layers or sections should not be limited to the terms. Instead, these terms are used only to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, the first element, component, region, layer or section mentioned in the examples described herein can also be called the second element, component, region, layer or section without departing from the teachings of the examples. In addition, the terms "first," "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or an indicated number of the technical features. Thus, the features defined with "first," "second" can explicitly or implicitly include at least one of the features. In the description herein, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise explicitly specifically limited.

[0099] It will be understood that the spatially relative terms, such as "above," "upper," "below," and "lower," are intended to be interpreted as the relative positions of one element to another element as shown in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation, in addition to the orientations depicted in the figures. For example, if a device in the figures is turned over, elements described as above other element would then be oriented below the other element. Accordingly, the term "above" encompasses both an orientation of above and below. The device can be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative terms used herein interpreted accordingly.

[0100] Furthermore, the term “exemplary” is used herein to mean serving as an example, instance, or illustration. Any aspect or design described herein as “exemplary” is not necessarily to be construed as advantageous compared to other aspects or designs. Rather, the use of the term “exemplary” is intended to present the concept in a concrete manner. As used herein, the term “or” is intended to mean an inclusive “or” rather than an exclusive “or.” That is, unless otherwise specified or clear from the context, “X applies A or B” is intended to mean any of the natural inclusive arrangements. That is, “X applies A or B” satisfies any of the foregoing instances if X applies A; X applies B; or both X applies A and B. Additionally, unless otherwise specified or clear from the context to refer to the singular form, the articles “a” and “an” as used in this application and the appended claims are generally understood to mean “one or more.”

[0101] Similarly, although this disclosure has been shown and described with respect to one or more implementations, equivalent variations and modifications will occur to those skilled in the art upon reading and understanding the specification and drawings. This disclosure includes all such modifications and variations and is limited only by the scope of the claims. In particular, with respect to the various functions performed by the components described above (e.g., elements, resources, etc.), unless otherwise indicated, the terminology used to describe such components is intended to correspond to any component (functionally equivalent) that performs the specific function of the described component, even if structurally not equivalent to the disclosed structure. Furthermore, although specific features of this disclosure may have been disclosed with respect to only one of several implementations, such features may be combined with one or more other features of other implementations, as may be desired and advantageous to any given or particular application. Moreover, with regard to the terms “comprising,” “owning,” “having,” “having,” or variations thereof as used in the detailed description or claims, such terms are intended to be inclusive in a manner similar to the term “including.”

[0102] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0103] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A power conversion circuit, characterized by, The power supply comprises: a power supply comprising an output end; a voltage boosting module comprising a first end and a second end, the first end being electrically connected to the output end, the second end being electrically connected to a near field communication (NFC) module, and the second end being further electrically connected to at least one load module; a controller comprising a first interface, a second interface, and a control end, the first interface being electrically connected to the output end, the second interface being electrically connected to the NFC module, and the control end being electrically coupled to the voltage boosting module to send a control signal to the voltage boosting module; wherein the control signal is used to control the output voltage of the voltage boosting module.

2. The power conversion circuit of claim 1, wherein, The voltage boosting module comprises: a voltage boosting bypass chip comprising a feedback pin and a switch pin; a first impedance comprising a first end and a second end, the first end of the first impedance being electrically connected to the feedback pin, and the second end of the first impedance being electrically connected to the switch pin; a second impedance comprising a first end and a second end, the first end of the second impedance being electrically connected to the feedback pin; a third impedance comprising a first end and a second end, the first end of the third impedance being electrically connected to the second end of the second impedance, and the second end of the third impedance being grounded; a switch tube comprising a first end, a second end, and a third end, the first end of the switch tube being electrically connected to the second end of the second impedance, the second end of the switch tube being grounded, and the third end of the switch tube being electrically connected to the control end.

3. The power conversion circuit of claim 2, wherein, The control end comprises a first control sub-port; The control signal comprises a first control signal; The third end of the switch tube is electrically connected to the first control sub-port to receive the first control signal; wherein the first control signal is used to control the conduction or turn-off of the switch tube.

4. A power conversion circuit according to claim 2 or 3, characterised in that, The control end comprises a second control sub-port; The control signal comprises a second control signal; The voltage boosting bypass chip comprises a bypass control pin; The bypass control pin is electrically connected to the second control sub-port to receive the second control signal; wherein the second control signal is used to control the working mode of the voltage boosting bypass chip to be a bypass mode.

5. The power conversion circuit of claim 2, wherein, The connection point of the switch pin and the first impedance is the second end of the voltage boosting module.

6. The power conversion circuit of claim 2, wherein, The voltage boosting bypass chip comprises an input voltage pin; The input voltage pin is electrically connected to the output end.

7. The power conversion circuit of claim 6, wherein, The input end of the input voltage pin is the first end of the voltage boosting module.

8. The power conversion circuit of claim 1, wherein, The first interface is configured to receive the output voltage of the power supply; The second interface is configured to receive a working state signal of the NFC module; wherein the working state signal is used to represent whether the NFC module is in a working state.

9. The power conversion circuit of claim 8, wherein, The controller is configured to generate the control signal according to the output voltage and the working state signal.

10. A power supply module, characterized by The power supply module comprises the power conversion circuit according to any one of claims 1 to 9; The power supply module supplies power to a mobile device.

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