Control device and drive device

Abstract

The utility model provides a control device and a driving device. A driving device according to one embodiment is a control device which is positioned on the upper side of a motor and controls the motor, and comprises: a power module; a first electronic component having any function of voltage regulation, current distribution, or capacitor; and a housing that houses the power module and the first electronic component. The housing includes: a housing portion having an opening portion opened at an upper side; and a cover part which covers the opening part. The housing part is provided with a flow path. The flow path has a cooling flow path portion that overlaps at least one of the power module and the first electronic component in the vertical direction.

Description

TECHNICAL FIELD

[0001] The utility model relates to control device and drive device. BACKGROUND

[0002] A plurality of electronic components are provided as heat generating elements in a control device that controls a motor. A flow path for cooling the electronic components is provided in the control device (for example, Patent Document 1).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2013-031330

[0004] The amount of heat generated by each of the plurality of electronic components is different. Therefore, in the control device, if the electronic components are simply arranged along the flow path, not only does the control device become large, but also the cooling efficiency for each electronic component cannot be sufficiently improved. SUMMARY

[0005] The utility model discloses one of the purposes in view of the above situation is to provide the control device and drive device that can cool electronic component while inhibiting the large -scale of high efficiency.

[0006] The first mode of the utility model is a kind of control device, it is in the upper side of motor, control the motor, it is characterized in that, the control device has: power module;First electronic component, it has arbitrary function in voltage adjustment, current distribution or condenser;And shell, it houses the power module and the first electronic component, the shell has: shell portion, it has the opening portion that opens in upper side;And cover portion, it covers the opening portion, flow path is provided in the shell portion, the flow path has the cooling flow path portion that at least one of the power module or the first electronic component is overlapped in up-down direction.

[0007] The control device of the second mode of the utility model is characterized in that, in the control device of first mode, the cooling flow path portion is in the lower side of at least one of the power module or the first electronic component.

[0008] The control device of the third mode of the utility model is characterized in that, in the control device of first mode, with the direction perpendicular to up-down direction is set as first direction, the power module and the first electronic component are arranged and are configured in the first direction.

[0009] The control device of the fourth mode of the utility model is characterized in that, in the control device of first mode, the power module and the first electronic component are arranged and are configured in up-down direction.

[0010] The control device of the fifth mode of the utility model is characterized in that, in the control device of fourth mode, the power module is configured in lower side relative to the first electronic component.

[0011] The control device of the sixth aspect of the present application is characterized in that, in the control device of the first aspect, a direction perpendicular to the up-down direction is set as a first direction, and the cooling flow path portion overlaps at least one of the power module or the first electronic component in the first direction.

[0012] The control device of the seventh aspect of the present application is characterized in that, in the control device of the first aspect, the control device has a second electronic component housed in the housing, the second electronic component has any function of voltage adjustment, current distribution, or a capacitor, a direction perpendicular to the up-down direction is set as a first direction, and the second electronic component overlaps the cooling flow path portion in the up-down direction or the first direction.

[0013] The control device of the eighth aspect of the present application is characterized in that, in the control device of the first aspect, the control device has a second electronic component housed in the housing, the second electronic component has any function of voltage adjustment, current distribution, or a capacitor, a direction perpendicular to the up-down direction is set as a first direction, and the second electronic component overlaps at least one of the power module or the first electronic component in the up-down direction or the first direction.

[0014] The control device of the ninth aspect of the present application is characterized in that, in the control device of the seventh aspect or the eighth aspect, the control device has a plurality of the second electronic components.

[0015] The control device of the tenth aspect of the present application is characterized in that, in the control device of the ninth aspect, the plurality of the second electronic components overlap each other in the up-down direction or the first direction.

[0016] The control device of the eleventh aspect of the present application is characterized in that, in the control device of the first aspect, the housing portion has a bottom portion positioned on a lower side of the opening portion, and a wall portion fixed to the bottom portion and positioned on an upper side of the bottom portion, and at least one of the power module and the first electronic component and the cooling flow path portion are provided in the wall portion.

[0017] The control device of the twelfth aspect of the present application is characterized in that, in the control device of the eleventh aspect, at least one of the power module or the first electronic component is arranged between the bottom portion and the wall portion in the up-down direction.

[0018] The control device of the thirteenth aspect of the present application is characterized in that, in the control device of the twelfth aspect, at least one of the power module and the first electronic component and the cooling flow path portion are provided in the bottom portion.

[0019] The control device of the fourteenth aspect of the present application is characterized in that, in the control device of the first aspect, the power module is fixed to the housing portion, and the first electronic component is fixed to the cover portion.

[0020] The control device of the fifteenth aspect of the present application is characterized in that, in the control device of the first aspect, the power module is fixed to the cover portion, and the first electronic component is fixed to the housing portion.

[0021] The control device of the sixteenth aspect of the present application is characterized in that, in the control device of the first aspect, the power module and the first electronic component are fixed to the housing portion.

[0022] The control device of the seventeenth aspect of the present application is characterized in that, in the control device of the first aspect, the control device has a heating device, the heating device has a heater portion and a control portion that controls the heater portion, and the control portion is housed in the housing.

[0023] The eighteenth aspect of the present application is a drive device, characterized in that the drive device has: the control device of any one of the first aspect to the seventeenth aspect; the motor; and a motor housing that houses the motor, the housing and the motor housing being joined to each other.

[0024] The nineteenth aspect of the present application is a drive device, characterized in that, in the drive device of the eighteenth aspect, the motor and the control device overlap in the vertical direction, and the cooling flow path portion is located between the motor and the power module or the first electronic component in the vertical direction.

[0025] The twentieth aspect of the present application is a drive device, characterized in that, in the drive device of the eighteenth aspect, the flow path has a third flow path portion provided to the motor housing, the third flow path portion cooling the motor, and the third flow path portion overlaps the portion of the flow path provided to the housing portion in the vertical direction.

[0026] The twenty-first aspect of the present application is a drive device, characterized in that, in the drive device of the twentieth aspect, the third flow path portion is connected to the portion of the flow path provided to the housing portion.

[0027] According to the present application, one of the objects is to provide a control device and a drive device that can efficiently cool electronic components while suppressing a large size. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 is a perspective view of a drive device of an embodiment.

[0029] Figure 2is a cross-sectional view of a drive device of an embodiment.

[0030] Figure 3 is a cross-sectional view of a drive device of Modification 1.

[0031] Figure 4 is a cross-sectional view of a drive device of Modification 2.

[0032] Figure 5 is a cross-sectional view of a drive device of Modification 3.

[0033] Figure 6 is a cross-sectional view of a drive device of Modification 4.

[0034] Figure 7 is a cross-sectional view of a drive device of Modification 5.

[0035] Figure 8 is a cross-sectional view of a drive device of Modification 6.

[0036] Figure 9 is a cross-sectional view of a drive device of Modification 7.

[0037] Figure 10 is a cross-sectional view of a drive device of Modification 8.

[0038] Figure 11 is a cross-sectional view of a drive device of Modification 9.

[0039] Explanation of Reference Signs

[0040] 1, 101, 201, 301, 401, 501, 601, 701, 801, 901: drive device; 2: motor; 6A: motor housing; 6C, 206C, 706C, 906C: electronic component housing (housing); 7, 107, 207, 307, 407, 507, 607, 707, 807, 907: control device; 11: power module; 12: power integrated system (first electronic component); 13: current distribution unit (second electronic component); 14: capacitor (second electronic component); 15, 115: heating device; 15a, 115a: heater unit; 15b, 115b: heater control unit (control unit); 61b, 761b: first bottom wall unit (bottom); 61A, 261A, 761A, 961A: housing unit; 64: third cover unit (cover unit); 65, 265, 965: flow path unit (wall unit); 90, 190, 290, 490, 590, 690, 790, 990: flow path; 90A, 90B, 190A, 190B, 290A, 490A, 490B, 590A, 590B, 690A, 690B, 790A, 790B, 990A, 990B: cooling flow path unit; 94: third flow path unit; D1: first direction; Z: up-down direction. DETAILED DESCRIPTION

[0041] Hereinafter, the drive device of the embodiment will be described with reference to the drawings. In the following description, the gravitational direction is defined in accordance with the positional relationship in the case where the drive device is mounted on a vehicle located on a horizontal road surface. In addition, XYZ coordinates are appropriately shown in each drawing. The Z axis is the vertical direction, the +Z side is the upper side, and the -Z side is the lower side. The Y axis is the left-right direction of the vehicle on which the drive device is mounted. The X axis is the front-rear direction of the vehicle on which the drive device is mounted.

[0042] In the following description, the direction parallel to the first axis J1 of the motor 2 (Y axis direction) will be simply referred to as "axial direction Y", the radial direction centered on the first axis J1 will be simply referred to as "radial direction", and the circumferential direction centered on the first axis J1, i.e., the direction around the first axis J1 will be simply referred to as "circumferential direction". Also, in the following description, the direction parallel to the Z axis will be referred to as the up-down direction Z.

[0043] In addition, in the following description, the direction parallel to the Z axis will be referred to as the "up-down direction Z", and one direction perpendicular to the up-down direction Z will be referred to as the first direction D1. In this specification, the first direction D1 is not only perpendicular to the up-down direction Z, but also perpendicular to the axial direction Y, and is a direction parallel to the X axis direction. However, the first direction D1 can also be a direction intersecting the X axis direction, and can also be a direction parallel to the axial direction Y.

[0044] In the following description, one side of the first direction D1 refers to a direction toward which an arrow of the first direction D1 in the drawing points (+D1), and the other side of the first direction D1 refers to a direction opposite to the direction toward which the arrow of the first direction D1 in the drawing points (-D1).

[0045] <Drive device>

[0046] Figure 1 is a perspective view of the drive device 1 of the present embodiment. The drive device 1 of the present embodiment is mounted on a vehicle, such as a hybrid electric vehicle (HEV), a plug-in hybrid electric vehicle (PHV), an electric vehicle (EV), or the like, which uses a motor 2 as a power source, and is used as a power source thereof.

[0047] The drive device 1 has the motor 2, a transmission mechanism 3, and a control device 7. In addition, as will be described later, the motor 2 has a motor housing 6A, the transmission mechanism 3 has a gear housing 6B, and the control device 7 has an electronic component housing (housing) 6C. The motor housing 6A, the gear housing 6B, and the electronic component housing 6C are joined to each other to constitute a housing joint body 6. That is, the housing joint body 6 houses the motor 2, the transmission mechanism 3, and the control device 7.

[0048] The housing joint body 6 is constituted by combining a plurality of members. The housing joint body 6 has a housing main body 61, a first cover member 63, a second cover member 62, and a third cover member (cover portion) 64. A portion of the housing main body 61 and the first cover member 63 constitute the motor housing 6A. A portion of the housing main body 61 and the second cover member 62 constitute the gear housing 6B. A portion of the housing main body 61 and the third cover member 64 constitute the electronic component housing 6C.

[0049] <Motor>

[0050] Figure 2 is a cross-sectional view of the drive device 1 of the present embodiment.

[0051] The motor 2 of the present embodiment is, for example, a three-phase alternating-current motor of an inner rotor type. The motor 2 has both a function of outputting power as a motor and a function of generating power as a generator. The motor 2 can also be used as either one of an engine or a generator. In addition, the structure of the motor 2 is not limited to the present embodiment, and can be, for example, an alternating-current motor of four phases or more.

[0052] The motor 2 has a rotor 20, a stator 25, and the motor housing 6A. The rotor 20 is rotatable about a first axis J1. The rotor 20 is rotatably supported to the motor housing 6A via a bearing, which is not shown. The stator 25 is located radially outward of the rotor 20 and surrounds the rotor 20 from the radially outward side. The stator 25 is fixed to an inner side surface of the motor housing 6A.

[0053] The motor housing 6A houses the rotor 20 and the stator 25. The motor housing 6A has: a cylindrical portion 6d, which is cylindrical about a first axis J1; and a first cover member 63, which covers an opening on the other side (-Y) of the axial direction of the cylindrical portion 6d. The cylindrical portion 6d surrounds the stator 25 radially outward. The cylindrical portion 6d is part of the housing body 61. Figure 1 The first cover component 63 shown is fastened to the cylindrical portion 6d.

[0054] <Transmission Mechanism>

[0055] like Figure 1 As shown, the transmission mechanism 3 is located on one side (+Y) of the axial direction of the motor 2. The transmission mechanism 3 is connected to the rotor 20. The transmission mechanism 3 has multiple gears (not shown) that transmit power to the rotor 20, multiple shafts and a differential device, a gear housing 6B that houses them, and an output shaft 55 that outputs power to the rotor 20. When the vehicle turns, the differential device absorbs the speed difference between the left and right wheels while transmitting the same torque to a pair of output shafts 55. The output shafts 55 are rotatable about a second axis J3 that is parallel to the first axis J1. Wheels (not shown) are respectively provided on the pair of output shafts 55. In this embodiment, the output shafts 55 are located on the other side (-D1) of the first direction relative to the first axis J1.

[0056] <Control Device>

[0057] Control device 7 controls motor 2. Control device 7 has at least the function of an inverter. That is, control device 7 is connected to the battery and converts the direct current supplied by the battery into alternating current. In addition, control device 7 is connected to stator 25 and supplies alternating current to stator 25. Control device 7 is located above motor 2 and is positioned on the opposite side (-Y) axially relative to transmission mechanism 3.

[0058] like Figure 2 As shown, the control device 7 of this embodiment includes a power module 11, a power integration system (first electronic component) 12, a current distribution unit (second electronic component) 13, a capacitor (second electronic component) 14, a heating device 15, and an electronic component housing 6C. However, the electronic components provided in the control device 7 are not limited to those described above. Furthermore, the control device 7 may also include electronic components other than those described above.

[0059] The power module 11 has, for example, a switching element and a circuit board on which the switching element is mounted. The switching element is, for example, an insulated gate bipolar transistor (IGBT). In addition, the switching element can also be a field effect transistor such as a metal-oxide-semiconductor field-effect transistor (MOSFET).

[0060] The power integration system 12 has a function of voltage adjustment. The power integration system 12 of the present embodiment has, for example, an on-board charger (OBC) 12a and a DC / DC converter 12b. The on-board charger 12a is a system for converting an alternating voltage supplied via a plug into a direct voltage and charging a battery. The DC / DC converter 12b is a portion that converts a voltage supplied from a battery and charges other batteries at a low voltage. In addition, the power integration system 12 can have at least one of the DC / DC converter 12b or the on-board charger 12a. In addition, the DC / DC converter 12b can step up a voltage supplied from a battery and supply it to other electronic components and the like.

[0061] The current distribution portion 13 is a power distribution unit (PDU) having a function of current distribution. The current distribution portion 13 is a portion that distributes a current supplied from a battery to various electrical fixtures in a vehicle including the power module 11.

[0062] The capacitor 14 is, for example, a film capacitor. The capacitor 14 is connected between a battery (omitted from the drawing) and the power module 11. The capacitor 14 is provided to smooth a direct current supplied to the power module 11.

[0063] The heating device 15 has a heater portion 15a and a heater control portion (control portion) 15b. The pipe P is connected to the heater portion 15a. The pipe P is a circulation path for circulating a fluid such as water, a refrigerant, or air. An external device that is a heating target of the heater portion 15a is connected in the path of the pipe P. The external device that is a heating target of the heating device 15 is, for example, a battery. The heating device 15 heats a fluid in the pipe P in the heater portion 15a, and heats the battery via the fluid. The heater control portion 15b is connected to a temperature sensor (omitted from the drawing) that measures a temperature of the battery. The heater control portion 15b controls the heater portion 15a in accordance with the temperature of the battery detected by the temperature sensor. In addition, the heating device 15 can also be used as a heater in a heating device.

[0064] The electronic component housing 6C houses the power module 11, the power integrated system 12, the current distribution portion 13, the capacitor 14, and the heater control portion 15b. The electronic component housing 6C has a housing portion 61A and a third cover member 64.

[0065] The housing portion 61A has a first opening portion 61h that is open on the upper side (+Z). The housing portion 61A has a housing portion main body 66 and a flow path member (wall portion) 65. The housing portion main body 66 is a portion of the housing main body 61. The housing portion main body 66 and the cylindrical portion 6d are portions of one member. In addition, the housing portion main body 66 is located on the upper side of the cylindrical portion 6d and is continuous with the cylindrical portion 6d. That is, the housing portion 61A is connected to the motor housing 6A.

[0066] The housing portion main body 66 has a first bottom wall portion (bottom portion) 61b, a first side wall portion 61c, a first flange portion 61f, and a plurality of support column portions 61u. That is, the housing portion 61A has the first bottom wall portion 61b, the first side wall portion 61c, the first flange portion 61f, and the plurality of support column portions 61u. The first bottom wall portion 61b extends along a plane that is perpendicular to the up-down direction Z. The first bottom wall portion 61b is located on the lower side (-Z) of the first opening portion 61h. The first bottom wall portion 61b is integrally continuous with the cylindrical portion 6d. The first bottom wall portion 61b has a common wall portion 61n that functions as a portion of the cylindrical portion 6d. In the present embodiment, the common wall portion 61n is curved in a substantially circular arc shape about the first axis J1. The first bottom wall portion 61b has a first inner side surface 61k that faces the upper side (+Z). The first side wall portion 61c extends from the outer edge of the first bottom wall portion 61b toward the upper side (+Z). The first flange portion 61f is provided at the upper end portion of the first side wall portion 61c. The first flange portion 61f surrounds the first opening portion 61h in a frame shape. The first flange portion 61f protrudes in a direction away from the first opening portion 61h along a plane that is perpendicular to the up-down direction Z. The support column portions 61u extend from the first inner side surface 61k of the first bottom wall portion 61b toward the upper side (+Z). The flow path member 65 is installed at the upper end portion of the support column portions 61u. That is, the flow path member 65 is fixed to the first bottom wall portion 61b.

[0067] The flow path member 65 is in a plate shape that extends along a plane that is perpendicular to the up-down direction Z. The flow path member 65 is a so-called water jacket. The flow path member 65 is located between the first bottom wall portion 61b and the second bottom wall portion 64b in the up-down direction Z. That is, the flow path member 65 is located on the upper side of the first bottom wall portion 61b. The flow path member 65 opposes the first inner side surface 61k in the up-down direction Z with a gap therebetween. In addition, the flow path member 65 opposes the second inner side surface 64k in the up-down direction Z with a gap therebetween. The flow path member 65 is located on the lower side of the third cover member 64 and on the upper side of the housing portion main body 66.

[0068] The third cover member 64 is positioned on the upper side of the housing portion 61A. The third cover member 64 is connected to the upper side (+Z) of the housing portion 61A. The third cover member 64 has a second opening portion 64h which is open on the lower side (-Z). The third cover member 64 has a second bottom wall portion 64b, a second side wall portion 64c, and a second flange portion 64f. The second bottom wall portion 64b extends along a plane perpendicular to the vertical direction Z. The second bottom wall portion 64b has a second inner side surface 64k facing the lower side (-Z) and an outer side surface 64g facing the upper side (+Z). The second side wall portion 64c extends from the outer edge of the second bottom wall portion 64b toward the lower side (-Z). The second flange portion 64f is provided to the lower end portion of the second side wall portion 64c. The second flange portion 64f surrounds the second opening portion 64h in a frame shape. The second flange portion 64f protrudes in a direction away from the second opening portion 64h along a plane perpendicular to the vertical direction Z.

[0069] The first flange portion 61f and the second flange portion 64f are opposed to each other in the vertical direction Z. The first flange portion 61f and the second flange portion 64f are fastened to each other. Thus, the housing portion 61A and the third cover member 64 are joined to each other. In addition, the third cover member 64 covers the first opening portion 61h, and the housing portion 61A covers the second opening portion 64h. Thus, the internal space of the housing portion 61A and the internal space of the third cover member 64 are connected to each other, and the internal space A of the electronic component housing 6C is configured. A sealing member can be interposed between the first flange portion 61f and the second flange portion 64f.

[0070] The internal space A of the electronic component housing 6C is surrounded by the first bottom wall portion 61b, the second bottom wall portion 64b, the first side wall portion 61c, and the second side wall portion 64c. The first inner side surface 61k of the first bottom wall portion 61b and the second inner side surface 64k of the second bottom wall portion 64b are opposed to each other in the vertical direction Z. The power integration system 12, the current distribution portion 13, and the heater control portion 15b of the present embodiment are fixed to the second inner side surface 64k. In addition, the power module 11 and the capacitor 14 of the present embodiment are fixed to the upper surface 65a of the flow path member 65.

[0071] The flow path 90 is provided to the housing joint body 6. The flow path 90 is a path through which a fluid flows. A part of the flow path 90 is configured by a hole portion provided to the housing joint body 6. In addition, another part of the flow path 90 is configured by an inner side surface of a recess portion provided to the housing joint body 6 and a member which covers the recess portion. In the present specification, the flow path 90 does not necessarily indicate a single circulation path, and can include a plurality of circulation paths. In the case where the flow path 90 has a plurality of circulation paths, the fluids which flow in the respective circulation paths can be the same kind of fluid, or can be different kinds of fluid. The fluid which flows in the flow path 90 is, for example, water, oil, or an aqueous ethylene glycol solution, or the like.

[0072] The flow path 90 of the present embodiment has the first flow path portion 91 and the third flow path portion 94. The first flow path portion 91 is provided to the electronic component housing 6C. The third flow path portion 94 is provided to the motor housing 6A. In the present embodiment, the first flow path portion 91 and the third flow path portion 94 constitute one circulation path. Therefore, the same fluid flows in the first flow path portion 91 and the third flow path portion 94 of the present embodiment. In the present embodiment, the fluid flows in the respective portions of the flow path 90 in the order of the first flow path portion 91, the third flow path portion 94. In addition, the end portion of the downstream side of the third flow path portion 94 and the end portion of the upstream side of the first flow path portion 91 are connected to each other via a flow path portion, which is not illustrated. A pump that pressurizes the fluid and a radiator that cools the fluid, or the like are provided to the flow path portion.

[0073] The first flow path portion 91 extends in a meandering manner inside the flow path member 65. That is, the first flow path portion 91 is provided to the housing portion 61A. The power integration system 12 and the capacitor 14 are in contact with the upper surface 65a of the flow path member 65. The first flow path portion 91 cools the power integration system 12 and the capacitor 14. According to the present embodiment, it is possible to efficiently cool the power integration system 12 and the capacitor 14 using the plate-shaped flow path member 65.

[0074] In the present embodiment, the first flow path portion 91 provided to the housing portion 61A has a cooling flow path portion 90A. The cooling flow path portion 90A is a region of the first flow path portion 91 that overlaps at least one of the power module 11 or the power integration system 12 in the up-down direction Z. According to the present embodiment, the cooling flow path portion 90A overlaps the power module 11 or the power integration system 12 in the up-down direction Z, and thus it is possible to cool the power module 11 or the power integration system 12. In the present embodiment, the cooling flow path portion 90A overlaps both the power module 11 and the power integration system 12. The cooling flow path portion 90A of the present embodiment is provided to the flow path member 65 to which the power module 11 is fixed. Therefore, the cooling flow path portion 90A can efficiently cool the power module 11. The cooling flow path portion 90A of the present embodiment does not directly cool the power integration system 12. However, the cooling flow path portion 90A overlaps the power integration system 12 in the up-down direction Z, and thus it is possible to cool the power integration system 12 by adopting a configuration that easily transfers heat between the second bottom wall portion 64b and the power integration system 12. That is, the cooling flow path portion 90A overlaps the power integration system 12 in the up-down direction Z, and thus it is easy to cool the power integration system 12. As the configuration that easily transfers heat, for example, a heat transfer material or the like can be arranged in the gap between the second bottom wall portion 64b and the power integration system 12 in the up-down direction Z.

[0075] The cooling flow path portion 90A is preferably located on the lower side of at least one of the power module 11 or the power integration system 12. The cooling flow path portion 90A of the present embodiment is located on the lower side of both the power module 11 and the power integration system 12. As described above, the cooling flow path portion 90A is provided to the housing portion 61A that covers the inside space A of the electronic component housing 6C from the lower side. Therefore, by disposing the cooling flow path portion 90A on the lower side of the power module 11 and the power integration system 12, it is possible to simplify the configuration of the cooling flow path portion 90A.

[0076] The third flow path portion 94 is provided to the cylindrical portion 6d. That is, the third flow path portion 94 is provided to the motor housing 6A. The third flow path portion 94 of the present embodiment extends in a spiral shape along the axial direction Y with the first axis line J1 as the center. The fluid flowing in the third flow path portion 94 is transferred heat from the motor 2. That is, the third flow path portion 94 cools the motor 2.

[0077] The third flow path portion 94 is not limited to the present embodiment as long as it cools the motor 2. The motor 2 can also extend in the axial direction or the circumferential direction meandering inside the wall of the cylindrical portion 6d. In addition, the third flow path portion 94 can also cool the motor 2 by directly applying the fluid to the motor 2. In this case, the third flow path portion 94 can also be a configuration in which a spouting hole that spouts the fluid toward the motor 2 is provided to the inner wall of the motor housing 6A, a tube that is disposed to the inside space of the motor housing 6A and has a spouting hole that spouts the fluid toward the motor 2, a groove-shaped member, or the like.

[0078] The third flow path portion 94 of the present embodiment overlaps with the portion of the flow path 90 provided to the housing portion 61A (the first flow path portion 91 in the present embodiment) in the up-down direction Z. According to the present embodiment, by providing the first flow path portion 91 directly above the third flow path portion 94, it is possible to dispose the first flow path portion 91 and the third flow path portion 94 close to each other. By this, by partially intensively disposing the flow path 90, it is possible to suppress the transfer of heat from the components other than the cooling target to the fluid in the flow path 90. In addition, by partially intensively disposing the flow path 90, it is possible to make the heat respectively generated between the power module 11 and the motor as the cooling targets less likely to be transferred to each other. Furthermore, by the first flow path portion 91 and the third flow path portion 94 overlapping in the up-down direction Z, in the case where the first flow path portion 91 and the third flow path portion 94 are connected, it is possible to shorten the length of the entire flow path 90.

[0079] The cylindrical portion 6d of the present embodiment has a common wall portion 61n that also functions as a portion of the first bottom wall portion 61b. The third flow path portion 94 passes through the common wall portion 61n. Therefore, a portion of the third flow path portion 94 is provided to the first bottom wall portion 61b. By this, the third flow path portion 94 cools the inside space of the housing portion 61A.

[0080] According to the present embodiment, the power module 11 and the power integration system 12 are arranged in the up-down direction Z. Therefore, compared to a case where the power module 11 and the power integration system 12 are arranged in a direction perpendicular to the up-down direction Z, it is possible to downsize the control device 7 in a direction perpendicular to the up-down direction.

[0081] In the present embodiment, the power module 11 and the power integration system 12 are arranged on the upper side (+Z) with respect to the motor 2. In addition, the power module 11 is arranged on the lower side (-Z) with respect to the power integration system 12. The power module 11 is connected to the motor 2 and supplies electric power to the motor 2. Therefore, if the distance between the power module 11 and the motor 2 becomes large, the resistance of the connection path (for example, bus bar) connecting the power module 11 and the motor 2 becomes large, and the loss when the drive device 1 is driven can become large. According to the present embodiment, it is possible to arrange the power module 11 closer to the motor 2 than the power integration system 12, and therefore it is possible to reduce the resistance of the connection path between the power module 11 and the motor 2, and to reduce the loss generated in the drive device 1.

[0082] According to the present embodiment, the power module 11 is fixed to the housing portion 61A, and the power integration system 12 is fixed to the third cover member 64. That is, it is possible to bring the power module 11 and the power integration system 12 into contact with different portions (the housing portion 61A and the third cover member 64) of the electronic component housing 6C, respectively. Thereby, it is possible to transfer the heat of the power module 11 and the power integration system 12 to different portions, respectively, and dissipate the heat, and to efficiently cool the power module 11 and the power integration system 12. In addition, it is possible to suppress the transfer of heat from either one of the power module 11 and the power integration system 12 to the other.

[0083] According to the present embodiment, the power module 11 and the cooling flow path portion 90A are provided in the flow path member 65, and therefore it is possible to efficiently cool the power module 11. In addition, it is also possible to provide the power integration system 12 in the flow path member 65. That is, it is sufficient to provide at least one of the power module 11 and the power integration system 12 and the cooling flow path portion 90A in the flow path member 65. In addition, here, with respect to the electronic components such as the power module 11 and the power integration system 12, "provided in the flow path member 65" means that these electronic components are mounted in the flow path member 65.

[0084] In the present embodiment, the motor 2 and the control device 7 overlap in the up-down direction. In addition, the flow path member 65 is located between the motor 2 and the power module 11 and the power integration system 12 in the up-down direction Z. Therefore, the cooling flow path portion 90A of the present embodiment is located between the motor 2 and the power module 11 and the power integration system 12 in the up-down direction Z. According to the present embodiment, the cooling flow path portion 90A divides the internal space A of the electronic component housing 6C into an upper region and a lower region of the cooling flow path portion 90A. In addition, the cooling flow path portion 90A blocks the transfer of heat between these upper and lower regions. Thereby, the transfer of heat from the motor 2 to the power module 11 and the power integration system 12 can be suppressed. Likewise, the transfer of heat from the power module 11 and the power integration system 12 to the motor 2 can be suppressed. In the present embodiment, a case where both the power module 11 and the power integration system 12 are located on the upper side of the cooling flow path portion 90A is described. However, as long as at least one of the power module 11 and the power integration system 12 is located on the upper side of the cooling flow path portion 90A, the transfer of heat between the one located on the upper side than the cooling flow path portion 90A and the motor 2 can be suppressed. That is, as long as the cooling flow path portion 90A is located between the motor 2 and the power module 11 or the power integration system 12 in the up-down direction Z, at least a part of the above-described effects can be obtained.

[0085] According to the present embodiment, the heater control portion 15b as a part of the heating device 15 is housed in the electronic component housing 6C. Thereby, the heater control portion 15b can be protected by the electronic component housing 6C. Also, by arranging the heater control portion 15b inside the electronic component housing 6C, the heater control portion 15b can be easily cooled by the flow path 90, and the reliability of the heating device 15 can be improved. In the present embodiment, a case where only the heater control portion 15b is housed in the electronic component housing 6C is described. However, even if both the heater portion 15a and the heater control portion 15b are housed in the electronic component housing 6C, the same effects can be obtained.

[0086] In the present embodiment, the heater portion 15a of the heating device 15 is fixed to the outer side surface 64g of the electronic component housing 6C, and is not arranged inside the electronic component housing 6C. According to the present embodiment, the heat of the heater portion 15a can be suppressed from affecting the electronic components arranged inside the electronic component housing 6C. In addition, the heater portion 15a of the heating device 15 can be arranged not only to the outer side surface of the electronic component housing 6C, but also to the outer side surface of the motor housing 6A or the gear housing 6B.

[0087] In the present embodiment, a case where the cooling flow path portion 90A overlaps both the power module 11 and the power integrated system 12 in the up-down direction Z to be able to cool them is described. However, the cooling flow path portion 90A can also be able to cool other electronic components instead of the power integrated system 12. Here, the electronic components other than the power module 11 to be cooled by the cooling flow path portion 90A are referred to as first electronic components 12. The first electronic components 12 of the present embodiment are the power integrated system 12, but can also be the current distribution portion 13 or the capacitor 14. That is, the first electronic components 12 only need to have any of the functions of voltage adjustment, current distribution, or a capacitor. In addition, the cooling flow path portion 90A is provided to the housing portion 61A, and only needs to be a portion of the flow path 90 that overlaps any of the power integrated system 12, the current distribution portion 13, the capacitor 14, or the power module 11 in the up-down direction Z. In addition, in the present embodiment, the capacitor 14 can be replaced with the first electronic component, and the portion of the first flow path portion 91 that overlaps the capacitor 14 can be replaced with the cooling flow path portion 90B. The cooling flow path portion 90B in this case cools the capacitor 14. Also, the current distribution portion 13 can be replaced with the first electronic component, and the portion of the first flow path portion 91 that overlaps the current distribution portion 13 can be replaced with the cooling flow path portion 90B.

[0088] In the present embodiment, the capacitor 14 overlaps the power module 11 in the first direction D1. In addition, the current distribution portion 13 overlaps the first electronic component 12 in the first direction D1. Here, the electronic components other than the power module 11 and the first electronic component 12 that have any of the functions of voltage adjustment, current distribution, or a capacitor are referred to as second electronic components 13, 14. The second electronic components 13, 14 only need to have any of the functions of voltage adjustment, current distribution, or a capacitor. That is, the second electronic components 13, 14 can be any of the power integrated system 12, the current distribution portion 13, and the capacitor 14. According to the present embodiment, the second electronic components 13, 14 overlap at least one of the power module 11 or the first electronic component 12 in the first direction D1. According to the present embodiment, the second electronic components 13, 14 are arranged in the first direction D1 along with the power module 11 or the first electronic component 12, whereby the control device 7 can be suppressed from being large in the up-down direction Z.

[0089] In the present embodiment, the control device 7 has a plurality of second electronic components 13, 14 (the current distribution portion 13 and the capacitor 14). The plurality of second electronic components 13, 14 overlap each other in the up-down direction Z. According to the present embodiment, the plurality of second electronic components 13, 14 are arranged in the up-down direction Z, whereby the control device 7 can be suppressed from being large in a direction perpendicular to the up-down direction Z.

[0090] In the present embodiment, the power module 11 and the power integrated system 12 are preferably arranged in a manner extending along a plane perpendicular to the up-down direction Z with the up-down direction Z as a thickness direction. Also, the cooling flow path portion 90A preferably extends along a plane perpendicular to the up-down direction Z. According to the present embodiment, the power module 11 and the power integrated system 12 can be arranged in overlap with the cooling flow path portion 90A in the up-down direction Z in a wider range, and the cooling efficiency of the power module 11 and the power integrated system 12 can be improved. Also, for the same reason, as for the current distribution portion 13 and the capacitor 14, it is also preferable to arrange in a manner extending along a plane perpendicular to the up-down direction Z with the up-down direction Z as a thickness direction.

[0091]

[0092] Hereinafter, modifications of the drive device will be described. In the description of each modification described below, the same reference numerals are assigned to the same constituent elements as those of the already described embodiments or modifications, and the description thereof will be omitted.

[0093] Also, in the following modifications, as with the above-described embodiments, the case where the power integrated system 12 is the first electronic component 12, and the current distribution portion 13 and the capacitor 14 are the second electronic components 13 and 14 is described. However, the first electronic component only needs to have any of the functions of voltage adjustment, current distribution, or capacitor, and only needs to be any one of the power integrated system 12, the current distribution portion 13, or the capacitor 14. Also, the second electronic component only needs to be a component having any of the functions of voltage adjustment, current distribution, or capacitor among the electronic components other than the first electronic component, and only needs to be any one of the power integrated system 12, the current distribution portion 13, or the capacitor 14.

[0094] (Modification 1)

[0095] Figure 3 is a cross-sectional view of the drive device 101 of Modification 1. As with the above-described embodiments, the drive device 101 of the present modification has the motor 2, the transmission mechanism 3 (see Figure 1 ), and the control device 107. Also, the drive device 101 has the housing link body 6. The housing link body 6 has the motor housing 6A, the gear housing 6B (see Figure 1 ), and the electronic component housing 6C. The electronic component housing 6C has the casing portion 61A having the casing portion main body 66 and the flow path member 65, and the third cover member 64. Also, the flow path 190 is provided in the housing link body 6.

[0096] ​The electronic component housing 6C of the present modification example houses the power module 11, the power integration system 12, the current distribution portion 13, the capacitor 14, and the heating device 115. The power module 11 and the power integration system 12 are fixed to the upper surface 65a of the flow path member 65. The current distribution portion 13, the capacitor 14, and the heating device 115 are fixed to the second inner side surface 64k of the second bottom wall portion 64b.

[0097] As with the above embodiment, the flow path 190 has the first flow path portion 91 provided to the flow path member 65 and the third flow path portion 94 provided to the motor housing 6A. According to the present modification example, by bringing the power module 11 and the power integration system 12 into contact with the upper surface 65a of the flow path member 65 on which the first flow path portion 91 is provided, the power module 11 and the power integration system 12 can be efficiently cooled.

[0098] The first flow path portion 91 of the present modification example has a cooling flow path portion 190A overlapping the power module 11 in the up-down direction Z and a cooling flow path portion 190B overlapping the power integration system 12 in the up-down direction Z. The cooling flow path portions 190A, 190B of the present modification example overlap the power module 11 or the power integration system 12 in the up-down direction Z, whereby the power module 11 or the power integration system 12 can be easily cooled.

[0099] In the present modification example, the current distribution portion 13 overlaps the cooling flow path portion 190A in the up-down direction Z, and the capacitor 14 overlaps the cooling flow path portion 190B in the up-down direction Z. According to the present modification example, the control device 107 can be suppressed from being large in a direction perpendicular to the up-down direction Z.

[0100] In the present modification example, the power module 11 and the power integration system 12 are arranged in the first direction D1. According to the present modification example, the power module 11 and the power integration system 12 overlap in the first direction D1. The power module 11 and the power integration system 12 are relatively large components among the electronic components of the control device 107, and thus by arranging the power module 11 and the power integration system 12 in the first direction D1, the control device 107 can be suppressed from being large in the up-down direction Z.

[0101] In the present modification example, the current distribution portion 13 overlaps the power module 11 in the up-down direction Z. Also, the capacitor 14 overlaps the power integration system 12 in the up-down direction Z. That is, according to the present modification example, the second electronic components 13, 14 (the current distribution portion 13 and the capacitor 14) overlap at least one of the power module 11 or the first electronic component 12 in the up-down direction Z, and thus the control device 107 can be suppressed from being large in a direction perpendicular to the up-down direction Z. Also, in the present modification example, the plurality of second electronic components 13, 14 overlap each other in the first direction D1, and thus the control device 107 can be suppressed from being large in the up-down direction Z.

[0102] In the present modification example, the power module 11 and the power integrated system 12 are both fixed to the flow path member 65. That is, according to the present modification example, the power module 11 and the power integrated system 12 are fixed to the housing portion 61A. The power module 11 and the power integrated system 12 have a relatively large amount of heat generation among the electronic components of the control device 107. According to the present modification example, the power module 11 and the first electronic component 12, which have a large amount of heat generation, can be cooled by the first flow path portion 91 provided to the housing portion 61A.

[0103] In the present modification example, the electronic component housing 6C accommodates the heater portion 115a and the heater control portion 115b of the heating device 115. That is, according to the present modification example, the entire heating device 115 is disposed inside the internal space of the electronic component housing 6C. If a portion of the heating device 115 is fixed to the outer side surface of the housing link body 6, the driving device can be likely to be upsized from the outer shape of the driving device. According to the present modification example, by disposing the entire heating device 115 (i.e., the heater portion 115a and the heater control portion 115b) inside the electronic component housing 6C, the downsizing of the driving device 101 can be achieved.

[0104] (Modification Example 2)

[0105] Figure 4 is a cross-sectional view of the driving device 201 of Modification Example 2. Like the above-described embodiment, the driving device 201 of the present modification example has a motor 2, a transmission mechanism 3 (refer to Figure 1 ), and a control device 207. In addition, the driving device 201 has a housing link body 206. The housing link body 206 has a motor housing 6A, a gear housing 6B (refer to Figure 1 ), and an electronic component housing (housing) 206C. The electronic component housing 206C has a housing portion 261A having a housing portion main body 266 and a flow path member (wall portion) 265, and a third cover member 64. The flow path 290 is provided to the housing link body 206.

[0106] The housing portion main body 266 has a first bottom wall portion 61b, a first side wall portion 61c, a first flange portion 61f, and a plurality of support column portions 261u, like the above-described embodiment. The support column portions 261u extend upward (+Z) from the first inner side surface 61k of the first bottom wall portion 61b. The flow path member 265 is attached to the upper end portions of the support column portions 261u. Compared with the above-described embodiment, the support column portions 261u of the present modification example are disposed to be biased to one side (+D1) in the first direction. In addition, the flow path member 265 of the present modification example has a smaller dimension in the first direction D1 compared with the above-described embodiment.

[0107] The electronic component housing 206C of the present modification houses the power module 11, the power integration system 12, the current distribution portion 13, and the capacitor 14. The power integration system 12 is fixed to the upper surface 265a of the flow path member 265. The power module 11 is disposed on the other side (-D1) of the first direction of the flow path member 265, and is fixed to the first inner side surface 61k of the first bottom wall portion 61b. The current distribution portion 13 and the capacitor 14 are fixed to the second inner side surface 64k of the second bottom wall portion 64b.

[0108] As with the above embodiment, the flow path 290 has the first flow path portion 291 provided to the flow path member 265 and the third flow path portion 94 provided to the motor housing 6A. According to the present modification, the power integration system 12 can be efficiently cooled by being in contact with the upper surface 265a of the flow path member 265 on which the first flow path portion 291 is provided.

[0109] The first flow path portion 291 of the present modification has the cooling flow path portion 290A that overlaps the power integration system 12 in the up-down direction Z. The cooling flow path portion 290A of the present modification overlaps the power integration system 12 in the up-down direction Z, and thus the power integration system 12 can be easily cooled.

[0110] The cooling flow path portion 290A of the present modification overlaps the power module 11 in the first direction D1. That is, the cooling flow path portion 290A of the present modification overlaps one of the power module 11 and the power integration system 12 that does not overlap the cooling flow path portion 290A in the up-down direction Z in the first direction D1. According to the present modification, the control device 207 can be suppressed from being large in the up-down direction Z. This effect can be obtained as long as the cooling flow path portion 290A overlaps at least one of the power module 11 or the power integration system 12 in the first direction.

[0111] In the present modification example, the power module 11 and the power integration system 12 are arranged in the first direction D1, and thus the control device 207 can be suppressed from being large in the up-down direction Z. In the present modification example, the current distribution portion 13 overlaps the power integration system 12 in the up-down direction Z, and the capacitor 14 overlaps the power module 11 in the up-down direction Z. That is, according to the modification example, the second electronic components 13, 14 (the current distribution portion 13 and the capacitor 14) overlap at least one of the power module 11 and the first electronic component 12 in the up-down direction Z, and thus the control device 207 can be suppressed from being large in a direction perpendicular to the up-down direction Z. In the present modification example, the current distribution portion 13 overlaps the cooling flow path portion 290A in the up-down direction Z, and thus the control device 207 can be suppressed from being large in a direction perpendicular to the up-down direction Z. In the present modification example, the plurality of second electronic components 13, 14 overlap each other in the first direction D1, and thus the control device 207 can be suppressed from being large in a direction perpendicular to the up-down direction Z.

[0112] (Modification Example 3)

[0113] Figure 5 is a cross-sectional view of the drive device 301 of Modification Example 3. Like the above-described embodiment, the drive device 301 of the present modification example has the motor 2, the transmission mechanism 3 (see Figure 1 ), and the control device 307. In addition, the drive device 301 has the housing link body 206. The housing link body 206 has the motor housing 6A, the gear housing 6B (see Figure 1 ), and the electronic component housing 206C. The electronic component housing 206C has the casing portion 261A having the casing portion main body 266 and the flow path member 265, and the third cover member 64. The flow path 290 is provided in the housing link body 206.

[0114] The control device 307 of the present modification example differs from the above-described Modification Example 2 (see Figure 4 ) in that the power module 11 and the power integration system 12 are arranged to be interchanged. In the present modification example, the power module 11 is fixed to the upper surface 265a of the flow path member 265. In the present modification example, the power integration system 12 is arranged on the other side (-D1) of the first direction of the flow path member 265, and is fixed to the first inner side surface 61k of the first bottom wall portion 61b.

[0115] According to the present modification example, the power module 11 can be efficiently cooled by being brought into contact with the upper surface 265a of the flow path member 265 provided with the first flow path portion 291. The first flow path portion 291 of the present modification example has the cooling flow path portion 290A overlapping the power module 11 in the vertical direction Z. The cooling flow path portion 290A of the present modification example overlaps the power module 11 in the vertical direction Z, and thus the power module 11 can be easily cooled.

[0116] The cooling flow path portion 290A of the present modification example overlaps the power integrated system 12 in the first direction D1. According to the present modification example, the control device 307 can be suppressed from being upsized in the vertical direction Z. In the present modification example, the power integrated system 12 and the power module 11 are arranged in the first direction D1, and thus the control device 307 can be suppressed from being upsized in the vertical direction Z. In the present modification example, the current distribution portion 13 overlaps the power module 11 in the vertical direction Z, and the capacitor 14 overlaps the power integrated system 12 in the vertical direction Z. That is, according to the present modification example, the second electronic components 13, 14 (the current distribution portion 13 and the capacitor 14) overlap at least one of the power integrated system 12 or the first electronic component 12 in the vertical direction Z, and thus the control device 307 can be suppressed from being upsized in a direction perpendicular to the vertical direction Z. In the present modification example, the current distribution portion 13 overlaps the cooling flow path portion 290A in the vertical direction Z, and thus the control device 307 can be suppressed from being upsized in a direction perpendicular to the vertical direction Z. In the present modification example, the plurality of second electronic components 13, 14 overlap each other in the first direction D1, and thus the control device 307 can be suppressed from being upsized in the vertical direction Z.

[0117] (Modification Example 4)

[0118] Figure 6 is a cross-sectional view schematically showing the drive device 401 of Modification Example 4. Like the above-described embodiment, the drive device 401 of the present modification example has the motor 2, the transmission mechanism 3 (see Figure 1 ), and the control device 407. In addition, the drive device 401 has the housing link body 206. The housing link body 206 has the motor housing 6A, the gear housing 6B (see Figure 1 ), and the electronic component housing 206C. The electronic component housing 206C has a housing portion 261A having a housing portion main body 266 and a flow path member 265, and a third cover member 64. The flow path 490 is provided in the housing link body 206.

[0119] The control device 407 of the present modification example is the same as that of Modification Example 2 (see Figure 4In contrast, the power module 11, the power integration system 12, the current distribution portion 13, and the capacitor 14 inside the electronic component housing 206C are arranged differently. In the present modification, the power module 11 and the power integration system 12 are fixed to the upper surface 265a of the flow path member 265. In addition, in the present modification, the current distribution portion 13 and the capacitor 14 are arranged on the other side (-D1) of the first direction of the flow path member 265, and are fixed to the first inner side surface 61k of the first bottom wall portion 61b.

[0120] According to the present modification, by bringing the power module 11 and the power integration system 12 into contact with the upper surface 265a of the flow path member 265 in which the first flow path portion 291 is provided, the power module 11 and the power integration system 12 can be efficiently cooled. The first flow path portion 291 of the present modification has a cooling flow path portion 490A that overlaps the power module 11 in the up-down direction Z and a cooling flow path portion 490B that overlaps the power integration system 12 in the up-down direction Z. The cooling flow path portions 490A, 490B of the present modification overlap the power module 11 or the power integration system 12 in the up-down direction Z, and thus the power module 11 or the power integration system 12 can be easily cooled.

[0121] In the present modification, the power module 11 and the power integration system 12 are arranged in the first direction D1, and thus the control device 407 can be suppressed from being large in the up-down direction Z. In addition, in the present modification, the second electronic components 13, 14 (the current distribution portion 13 and the capacitor 14) overlap the power module 11 and the power integration system 12 in the first direction D1, and thus the control device 407 can be suppressed from being large in the up-down direction Z. Furthermore, in the present modification, the second electronic components 13, 14 overlap the cooling flow path portions 490A, 490B in the first direction D1, and thus the control device 407 can be suppressed from being large in the up-down direction Z. In addition, in the present modification, the plurality of second electronic components 13, 14 overlap each other in the first direction D1, and thus the control device 407 can be suppressed from being large in the up-down direction Z.

[0122] (Modification 5)

[0123] Figure 7 is a cross-sectional view of the drive device 501 of Modification 5. Like the above-described embodiment, the drive device 501 of the present modification has the motor 2, the transmission mechanism 3 (see Figure 1 ), and the control device 507. In addition, the drive device 501 has the housing link body 6. The housing link body 6 has the motor housing 6A, the gear housing 6B (see Figure 1 ), and the electronic component housing 6C. The electronic component housing 6C has the housing portion 61A having the housing portion main body 66 and the flow path member 65, and the third cover member 64. The flow path 590 is provided in the housing link body 6.

[0124] The control device 507 of the present modification differs from the above-described embodiment (refer to Figure 2 ) and the first modification (refer to Figure 3 ) in the arrangement of the power module 11, the power integration system 12, the current distribution portion 13, and the capacitor 14 inside the electronic component housing 6C. In the present modification, the power module 11 and the power integration system 12 are fixed to the upper surface 65a of the flow path member 65. In addition, the current distribution portion 13 is fixed to the second inner side surface 64k of the second bottom wall portion 64b. Further, the capacitor 14 is fixed to the first inner side surface 61k of the first bottom wall portion 61b.

[0125] According to the present modification, by bringing the power module 11 and the power integration system 12 into contact with the upper surface 65a of the flow path member 65 provided with the first flow path portion 91, the power module 11 and the power integration system 12 can be efficiently cooled. The first flow path portion 91 of the present modification has a cooling flow path portion 590A overlapping the power module 11 in the up-down direction Z and a cooling flow path portion 590B overlapping the power integration system 12 in the up-down direction Z. The cooling flow path portions 590A, 590B of the present modification overlap the power module 11 or the power integration system 12 in the up-down direction Z, whereby the power module 11 or the power integration system 12 is easily cooled.

[0126] In the present modification, the flow path member 65 is fixed to the front end of the support column portion 61u protruding upward from the first bottom wall portion 61b. Therefore, a gap is provided between the first bottom wall portion 61b and the flow path member 65. In the present modification, the capacitor 14 is positioned on the lower side of the flow path member 65. Therefore, the capacitor 14 is provided between the first bottom wall portion 61b and the flow path member 65 in the up-down direction Z. According to the present modification, the space between the first bottom wall portion 61b and the flow path member 65 can be effectively used as the accommodation space of the capacitor 14. In addition, according to the present modification, heat of the capacitor 14 can be transferred from the lower surface of the capacitor 14 to the housing portion main body 66 and from the upper surface of the capacitor 14 to the flow path member 65. That is, according to the present modification, the capacitor 14 can be cooled from above and below, and the temperature of the capacitor 14 can be suppressed from becoming excessively high. In addition, in the present modification, a gap is provided between the capacitor 14 and the flow path member 65. However, the capacitor 14 and the flow path member 65 can be brought into contact, directly or via a heat transfer material. In addition, in the present modification, the arrangement of the current distribution portion 13 and the capacitor 14 can be exchanged with each other. That is, as long as at least one of the current distribution portion 13 and the capacitor 14 (the second electronic component) is provided between the first bottom wall portion 61b and the flow path member 65 in the up-down direction Z. Figure 7

[0127] ​In the present modification example, the power module 11 and the power integration system 12 are arranged in the first direction D1, and thus the control device 507 can be prevented from being upsized in the vertical direction Z. In the present modification example, the second electronic components 13, 14 (the current distribution portion 13 and the capacitor 14) overlap the power module 11 and the power integration system 12 in the vertical direction Z, and thus the control device 507 can be prevented from being upsized in a direction perpendicular to the vertical direction Z. In the present modification example, the second electronic components 13, 14 overlap the cooling flow path portion 590A in the vertical direction Z, and thus the control device 507 can be prevented from being upsized in a direction perpendicular to the vertical direction Z. In the present modification example, the plurality of second electronic components 13, 14 overlap each other in the vertical direction Z, and thus the control device 507 can be prevented from being upsized in a direction perpendicular to the vertical direction Z.

[0128] (Modification Example 6)

[0129] Figure 8 is a cross-sectional view of the drive device 601 of Modification Example 6. Like the above-described embodiment, the drive device 601 of the present modification example has the motor 2, the transmission mechanism 3 (see Figure 1 ), and the control device 607. In addition, the drive device 601 has the housing link body 6. The housing link body 6 has the motor housing 6A, the gear housing 6B (see Figure 1 ), and the electronic component housing 6C. The electronic component housing 6C has the casing portion 61A having the casing portion main body 66 and the flow path member 65, and the third cover member 64. The flow path 690 is provided in the housing link body 6.

[0130] The control device 607 of the present modification example is different from Modification Example 5 (see Figure 7 ) described above in the arrangement of the power module 11 and the power integration system 12. The power module 11 and the power integration system 12 of the present modification example are fixed to the lower surface 65b of the flow path member 65.

[0131] According to the present modification example, the power module 11 and the power integration system 12 can be efficiently cooled by being brought into contact with the lower surface 65b of the flow path member 65 in which the first flow path portion 91 is provided. The first flow path portion 91 of the present modification example has the cooling flow path portion 690A overlapping the power module 11 in the vertical direction Z and the cooling flow path portion 690B overlapping the power integration system 12 in the vertical direction Z. The cooling flow path portions 690A, 690B of the present modification example overlap the power module 11 or the power integration system 12 in the vertical direction Z, and thus the power module 11 or the power integration system 12 can be easily cooled.

[0132] In the present modification example, the power module 11 and the power integration system 12 are located on the lower side of the flow path member 65. Therefore, the power module 11 and the power integration system 12 are disposed between the first bottom wall portion 61b and the flow path member 65 in the up-down direction Z. According to the present modification example, the space between the first bottom wall portion 61b and the flow path member 65 can be effectively used as the accommodation space of the power module 11 and the power integration system 12.

[0133] In the present modification example, the lower surfaces of the power module 11 and the power integration system 12 face the first inner side surface 61k of the first bottom wall portion 61b with a gap therebetween. The lower surfaces of the power module 11 and the power integration system 12 can also be in contact with the first inner side surface 61k directly or via the heat transfer material 667. In this case, it is possible to cool the power module 11 and the power integration system 12 from the up-down direction while transferring the heat generated from the power module 11 and the power integration system 12 to the first bottom wall portion 61b by the flow path member 65. In addition, as long as at least one of the power module 11 or the power integration system 12 is disposed between the first bottom wall portion 61b and the flow path member 65 in the up-down direction Z, it is also possible to cool the power module 11 and the power integration system 12 from the up-down direction.

[0134] In the present modification example, the power module 11 and the power integration system 12 are arranged in the first direction D1, and therefore it is possible to suppress the control device 607 from being large in the up-down direction Z. In addition, in the present modification example, the second electronic components 13, 14 (the current distribution portion 13 and the capacitor 14) overlap the power module 11 and the power integration system 12 in the up-down direction Z, and therefore it is possible to suppress the control device 607 from being large in the direction perpendicular to the up-down direction Z. Furthermore, in the present modification example, the second electronic components 13, 14 overlap the cooling flow path portion 690A in the up-down direction Z, and therefore it is possible to suppress the control device 607 from being large in the direction perpendicular to the up-down direction Z. In addition, in the present modification example, the plurality of second electronic components 13, 14 overlap each other in the up-down direction Z, and therefore it is possible to suppress the control device 607 from being large in the direction perpendicular to the up-down direction Z.

[0135] (Modification Example 7)

[0136] Figure 9 is a cross-sectional view of the drive device 701 of Modification Example 7. Like the above-described embodiments, the drive device 701 of the present modification example has the motor 2, the transmission mechanism 3 (see Figure 1 ), and the control device 707. In addition, the drive device 701 has a housing link body 706. The housing link body 706 has the motor housing 6A, the gear housing 6B (see Figure 1 ), and an electronic component housing (housing) 706C.

[0137] In the present modification example, the electronic component housing 706C has a housing portion 761A having a housing portion main body 766 and a flow path member 265, and a third cover member 64. The housing portion main body 766 has a first bottom wall portion (bottom portion) 761b, a first side wall portion 61c, a first flange portion 61f, and a plurality of support column portions 261u. The flow path member 265 is fixed to the upper end portions of the plurality of support column portions 261u.

[0138] The power module 11, the power integration system 12, the current distribution portion 13, and the capacitor 14 are housed in the electronic component housing 706C of the present modification example. The power integration system 12 is fixed to the upper surface 265a of the flow path member 265. The power module 11 is disposed on the other side (-D1) of the first direction of the flow path member 265, and is fixed to the first inner side surface 761k of the first bottom wall portion 761b. The current distribution portion 13 and the capacitor 14 are fixed to the second inner side surface 64k of the second bottom wall portion 64b.

[0139] The flow path 790 is provided in the housing connection body 706. The control device 707 of the present modification example differs from the above-described modification example 2 (refer to FIG. 2) mainly in the structure of the flow path 790. Figure 4 The flow path 790 of the present modification example has a first flow path portion 291, a second flow path portion 792, and a third flow path portion 94. The second flow path portion 792 of the present modification example is provided to the first bottom wall portion 761b. The second flow path portion 792 extends along the axial direction Y. However, the second flow path portion 792 can extend in any direction as long as it extends along a plane perpendicular to the up-down direction Z. The second flow path portion 792 is connected to the third flow path portion 94 at one end portion. This one end portion is located at the common wall portion 61n.

[0140] The third flow path portion 94 is provided to the motor housing 6A to cool the motor 2. The third flow path portion 94 of the present modification example overlaps, in the up-down direction, with the portion of the flow path 790 provided to the housing portion 761A (in the present modification example, the first flow path portion 291 and the second flow path portion 792). According to the present modification example, by providing the first flow path portion 291 and the second flow path portion 792 directly above the third flow path portion 94, it is possible to dispose the third flow path portion 94 close to the first flow path portion 291 and the second flow path portion 792. By this, the flow path 790 is locally densely disposed, and it is possible to suppress the heat of the fluid in the flow path 790 from being absorbed by the components other than the cooling target. In addition, by locally densely disposing the flow path 790, it is possible to make the heat respectively generated between the power module 11, which is the cooling target, and the motor, not easily transfer to each other. Furthermore, by the third flow path portion 94 overlapping the second flow path portion 792 in the up-down direction Z, it is possible to connect the third flow path portion 94 and the second flow path portion 792 with a shorter path, and it is possible to shorten the length of the entire flow path 790.

[0141] In the present modification, the third flow path portion 94 is connected to a portion of the flow path 790 provided to the housing portion 761A (the second flow path portion 792 in the present modification). According to the present modification, the second flow path portion 792 and the third flow path portion 94 can be portions of one circulation path, and thus the structure of the flow path 790 can be easily simplified.

[0142] According to the present modification, the power integration system 12 can be efficiently cooled by being in contact with the upper surface 265a of the flow path member 265 provided with the first flow path portion 291. The first flow path portion 291 of the present modification has a cooling flow path portion 790A that overlaps the power integration system 12 in the vertical direction Z. The cooling flow path portion 790A of the present modification easily cools the power integration system 12 by overlapping the power integration system 12 in the vertical direction Z.

[0143] The second flow path portion 792 has an opening portion 792a that is open at the first inner side surface 761k of the first bottom wall portion 761b. The opening portion 792a is open upward (+Z). In the present modification, the power module 11 covers the opening portion 792a. Fluid flowing in the second flow path portion 792 is in contact with the power module 11 and absorbs heat from the power module 11. That is, the second flow path portion 792 cools the power module 11. The second flow path portion 792 of the present modification has a cooling flow path portion 790B that overlaps the power module 11 in the vertical direction Z. The cooling flow path portion 790B of the present modification easily cools the power integration system 12 by overlapping the power module 11 in the vertical direction Z. In the present modification, the positions of the power module 11 and the power integration system 12 can also be interchanged. That is, as long as at least one of the power module 11 and the power integration system 12 and the cooling flow path portion 790B are provided to the first bottom wall portion 761b.

[0144] The first flow path portion 291 of the present modification is provided to the flow path member 265. The first flow path portion 291 has a cooling flow path portion 790A that overlaps the power integration system 12 in the vertical direction Z. According to the present modification, the power integration system 12 can be cooled in the cooling flow path portion 790A.

[0145] In the present modification example, the power module 11 and the power integration system 12 are arranged in the first direction D1, and thus the control device 707 can be prevented from being upsized in the up-down direction Z. In the present modification example, the current distribution section 13 overlaps the power integration system 12 in the up-down direction Z, and the capacitor 14 overlaps the power module 11 in the up-down direction Z. That is, according to the modification example, the second electronic components 13, 14 (the current distribution section 13 and the capacitor 14) overlap at least one of the power module 11 or the first electronic component 12 in the up-down direction Z, and thus the control device 707 can be prevented from being upsized in a direction perpendicular to the up-down direction Z. In the present modification example, the second electronic components 13, 14 respectively overlap the cooling flow path sections 790A, 790B in the up-down direction Z, and thus the control device 707 can be prevented from being upsized in a direction perpendicular to the up-down direction Z. In the present modification example, the plurality of second electronic components 13, 14 overlap each other in the first direction D1, and thus the control device 707 can be prevented from being upsized in the up-down direction Z.

[0146] (Modification Example 8)

[0147] Figure 10 is a cross-sectional view of the drive device 801 of Modification Example 8. Like the above-described embodiment, the drive device 801 of the present modification example has the motor 2, the transmission mechanism 3 (see Figure 1 ), and the control device 807. In addition, the drive device 801 has the housing link body 6. The housing link body 6 has the motor housing 6A, the gear housing 6B (see Figure 1 ), and the electronic component housing 6C. The electronic component housing 6C has the casing section 61A having the casing section main body 66 and the flow path member 65, and the third cover member 64. The flow path 90 is provided to the housing link body 6.

[0148] The control device 807 of the present modification example differs from the above-described embodiment (see Figure 2 ) in that the power module 11 and the power integration system 12 are arranged to be interchanged. In the present modification example, the power module 11 is fixed to the second inner side surface 64k of the second bottom wall section 64b, and the power integration system 12 is fixed to the upper surface 65a of the flow path member 65.

[0149] In the present modification example, the power module 11 is fixed to the third cover member 64, and the power integration system 12 is fixed to the housing portion 61A. That is, according to the present modification example, it is possible to bring the power module 11 and the power integration system 12 into contact with different portions (the housing portion 61A and the third cover member 64) of the electronic component housing 6C, respectively. Thereby, it is possible to dissipate the heat of the power module 11 and the power integration system 12 to different portions, respectively, and to efficiently cool the power module 11 and the power integration system 12. In addition, it is possible to suppress the transfer of heat from either one of the power module 11 and the power integration system 12 to the other.

[0150] In the present modification example, the power module 11 and the power integration system 12 are located on the upper side (+Z) with respect to the motor 2. In addition, the power integration system 12 is located on the lower side (-Z) with respect to the power module 11. The power module 11 among the electronic components included in the control device 807 has the largest heat generation amount, and the temperature easily becomes high. According to the present modification example, it is possible to arrange the power module 11 at a position farther from the motor 2 than the power integration system 12, and thus it is also possible to suppress the influence of the heat of the power module 11 on the operation of the motor 2. Conversely, it is possible to suppress the influence of the heat of the motor 2 on the operation of the power module 11.

[0151] (Modification Example 9)

[0152] Figure 11 is a cross-sectional view of the drive device 901 of Modification Example 9. Like the above-described embodiment, the drive device 901 of the present modification example has the motor 2, the transmission mechanism 3 (refer to Figure 1 ), and the control device 907. In addition, the drive device 901 has a housing link body 906. The housing link body 906 has the motor housing 6A, the gear housing 6B (refer to Figure 1 ), and an electronic component housing (housing) 906C.

[0153] In the present modification example, the electronic component housing 906C has a housing portion 961A having a housing portion main body 966, a first flow path member (wall portion) 265, and a second flow path member (wall portion) 965, and the third cover member 64. The housing portion main body 966 has the first bottom wall portion 61b, the first side wall portion 61c, the first flange portion 61f, a plurality of first support column portions 261u, and a plurality of second support column portions 961u. The first flow path member 265 is fixed to the upper end portions of the plurality of first support column portions 261u. The second flow path member 965 is fixed to the upper end portions of the plurality of second support column portions 961u. The first flow path member 265 and the second flow path member 965 are each a plate-shaped water jacket extending along a plane perpendicular to the vertical direction Z.

[0154] The electronic component housing 906C of the present modification example houses the power module 11, the power integration system 12, the current distribution portion 13, and the capacitor 14. The power module 11 is fixed to the upper surface 265a of the first flow path member 265. The power integration system 12 is fixed to the upper surface 965a of the second flow path member 965. The current distribution portion 13 and the capacitor 14 are fixed to the second inner side surface 64k of the second bottom wall portion 64b.

[0155] The flow path 990 is provided in the housing connecting body 906. The control device 907 of the present modification example differs from the above-described modification example 2 (refer to FIG. 9) mainly in the structure of the flow path 990. The flow path 990 of the present modification example has a first flow path portion 291, a second flow path portion 991, and a third flow path portion 94. The first flow path portion 291 extends in a meandering manner inside the first flow path member 265. Similarly, the second flow path portion 991 extends in a meandering manner inside the second flow path member 965. Figure 4

[0156] According to the present modification example, the power module 11 can be efficiently cooled by being in contact with the upper surface 265a of the first flow path member 265 provided with the first flow path portion 291. In addition, according to the present modification example, the power integration system 12 can be efficiently cooled by being in contact with the upper surface 965a of the second flow path member 965 provided with the second flow path portion 991. The first flow path portion 291 of the present modification example has a cooling flow path portion 990A that overlaps the power module 11 in the vertical direction Z. The second flow path portion 991 of the present modification example has a cooling flow path portion 990B that overlaps the power integration system 12 in the vertical direction Z. The cooling flow path portions 990A, 990B of the present modification example easily cool the power module 11 or the power integration system 12 by overlapping the power module 11 or the power integration system 12 in the vertical direction Z.

[0157] According to the present modification example, the housing portion 961A has a plurality of flow path members 265, 965, and the power module 11 and the power integration system 12 are respectively fixed to the upper surfaces 265a, 965a of the respective flow path members 265, 965. Therefore, the arrangement of the respective flow path members 265, 965 can be appropriately decided according to the size of the power module 11 and the power integration system 12 in the vertical direction Z, and the internal space A of the electronic component housing 906C can be efficiently utilized without gaps. According to the present modification example, the control device 907 can be miniaturized.

[0158] ​In the present modification example, the power module 11 and the power integration system 12 are arranged in the first direction D1, and thus the control device 907 can be prevented from being upsized in the vertical direction Z. In the present modification example, the current distribution section 13 overlaps the power module 11 in the vertical direction Z, and the capacitor 14 overlaps the power integration system 12 in the vertical direction Z. That is, according to the modification example, the second electronic components 13, 14 (the current distribution section 13 and the capacitor 14) overlap at least one of the power module 11 or the first electronic component 12 in the vertical direction Z, and thus the control device 907 can be prevented from being upsized in a direction perpendicular to the vertical direction Z. In the present modification example, the current distribution section 13 overlaps the cooling flow path sections 990A, 990B in the vertical direction Z, and thus the control device 907 can be prevented from being upsized in a direction perpendicular to the vertical direction Z.

[0159] The above describes the embodiment of the present application and the modification example thereof, but the structures and combinations thereof in the embodiment and the modification example are one example, and the addition, omission, replacement, and other changes of the structures can be made within the scope of the gist of the present application. The present application is not limited to the embodiment.

[0160] In particular, the structure of the control device shown in the above embodiment and the modification example thereof is one example. The control device can be a device having at least a power module, and can have other arbitrary electronic components.

[0161] In addition, the present technology can adopt the following structure.

[0162] (1) A control device that is located above a motor and controls the motor, characterized by comprising: a power module; a first electronic component that has any function of voltage adjustment, current distribution, or a capacitor; and a housing that houses the power module and the first electronic component, the housing having: a housing portion that has an opening portion that is open in an upper side; and a lid portion that covers the opening portion, a flow path being provided in the housing portion, the flow path having a cooling flow path section that overlaps at least one of the power module or the first electronic component in a vertical direction.

[0163] (2) The control device according to (1), characterized in that the cooling flow path section is located below at least one of the power module or the first electronic component.

[0164] (3) The control device according to (1) or (2), characterized in that a direction perpendicular to the vertical direction is set as a first direction, and the power module and the first electronic component are arranged in the first direction.

[0165] (4) The control device according to any one of (1) to (3), characterized in that the power module and the first electronic component are arranged in the up-down direction.

[0166] (5) The control device according to (4), characterized in that the power module is arranged on the lower side with respect to the first electronic component.

[0167] (6) The control device according to any one of (1) to (5), characterized in that a direction perpendicular to the up-down direction is set as a first direction, and the cooling flow path portion overlaps at least one of the power module or the first electronic component in the first direction.

[0168] (7) The control device according to any one of (1) to (6), characterized in that the control device has a second electronic component housed in the housing, the second electronic component has any function of voltage adjustment, current distribution, or a capacitor, and the second electronic component overlaps the cooling flow path portion in the up-down direction or the first direction.

[0169] (8) The control device according to any one of (1) to (7), characterized in that the control device has a second electronic component housed in the housing, the second electronic component has any function of voltage adjustment, current distribution, or a capacitor, and the second electronic component overlaps at least one of the power module or the first electronic component in the up-down direction or the first direction.

[0170] (9) The control device according to (7) or (8), characterized in that the control device has a plurality of the second electronic components.

[0171] (10) The control device according to (9), characterized in that the plurality of the second electronic components overlap each other in the up-down direction or the first direction.

[0172] (11) The control device according to any one of (1) to (10), characterized in that the housing portion has a bottom portion located on the lower side of the opening portion, and a wall portion fixed to the bottom portion and located on the upper side of the bottom portion, and at least one of the power module or the first electronic component and the cooling flow path portion are provided in the wall portion.

[0173] (12) The control device according to (11), characterized in that at least one of the power module or the first electronic component is arranged between the bottom portion and the wall portion in the up-down direction.

[0174] (13) The control device according to (12), characterized in that at least one of the power module and the first electronic component is provided at the bottom portion, and the cooling flow path portion is provided at the bottom portion.

[0175] (14) The control device according to any one of (1) to (13), characterized in that the power module is fixed to the housing portion, and the first electronic component is fixed to the cover portion.

[0176] (15) The control device according to any one of (1) to (13), characterized in that the power module is fixed to the cover portion, and the first electronic component is fixed to the housing portion.

[0177] (16) The control device according to any one of (1) to (13), characterized in that the power module and the first electronic component are fixed to the housing portion.

[0178] (17) The control device according to any one of (1) to (16), characterized by further comprising a heating device having a heater portion and a control portion that controls the heater portion, the control portion being housed in the housing.

[0179] (18) A drive device characterized by comprising: the control device according to (1); a motor; and a motor housing that houses the motor, the housing and the motor housing being joined to each other.

[0180] (19) The drive device according to (18), characterized in that the motor and the control device overlap in a vertical direction, and the cooling flow path portion is located between the motor and at least one of the power module and the first electronic component in the vertical direction.

[0181] (20) The drive device according to (18) or (19), characterized in that the flow path has a third flow path portion provided at the motor housing, the third flow path portion cooling the motor, the third flow path portion overlapping with a portion of the flow path provided at the housing portion in a vertical direction.

[0182] (21) The drive device according to (20), characterized in that the third flow path portion is connected to the portion of the flow path provided at the housing portion.

Claims

1. A control device that is located on an upper side of a motor that controls the motor, characterized by comprising: a power module; a first electronic component that has any of a voltage adjustment, a current distribution, or a capacitor; and a housing that houses the power module and the first electronic component, the housing having: a housing portion that has an opening portion that is open on an upper side; and a cover portion that covers the opening portion, a flow path being provided in the housing portion, the flow path having a cooling flow path portion that overlaps at least one of the power module or the first electronic component in a vertical direction.

2. The control device according to claim 1, characterized in that the cooling flow path portion is located on a lower side of at least one of the power module or the first electronic component.

3. The control device according to claim 1, characterized in that a direction that is perpendicular to the vertical direction is set as a first direction, the power module and the first electronic component being arranged in the first direction.

4. The control device according to claim 1, characterized in that the power module and the first electronic component are arranged in the vertical direction.

5. The control device according to claim 4, characterized in that the power module is arranged on a lower side with respect to the first electronic component.

6. The control device according to claim 1, characterized in that a direction that is perpendicular to the vertical direction is set as a first direction, the cooling flow path portion overlapping at least one of the power module or the first electronic component in the first direction.

7. The control device according to claim 1, characterized by further comprising a second electronic component that is housed in the housing, the second electronic component having any of a voltage adjustment, a current distribution, or a capacitor, a direction that is perpendicular to the vertical direction being set as a first direction, the second electronic component overlapping the cooling flow path portion in the vertical direction or the first direction.

8. The control device according to claim 1, characterized by further comprising a second electronic component that is housed in the housing, the second electronic component having any of a voltage adjustment, a current distribution, or a capacitor, a direction that is perpendicular to the vertical direction being set as a first direction, the second electronic component overlapping at least one of the power module or the first electronic component in the vertical direction or the first direction.

9. The control device according to claim 7 or 8, characterized in that the control device has a plurality of the second electronic components.

10. The control device according to claim 9, characterized in that the plurality of the second electronic components overlap each other in the vertical direction or the first direction.

11. The control device according to claim 1, characterized in that the housing portion has: a bottom portion that is located on a lower side of the opening portion; and a wall portion that is fixed to the bottom portion and is located on an upper side of the bottom portion, at least one of the power module or the first electronic component and the cooling flow path portion being provided in the wall portion.

12. The control device according to claim 11, characterized in that ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ At least one of the power module or the first electronic component is arranged between the bottom and the wall portion in the up-down direction.

13. The control device according to claim 12, wherein At least one of the power module and the first electronic component is provided at the bottom, and the cooling flow path portion is provided.

14. The control device according to claim 1, wherein The power module is fixed to the housing portion, The first electronic component is fixed to the cover portion.

15. The control device according to claim 1, wherein The power module is fixed to the cover portion, The first electronic component is fixed to the housing portion.

16. The control device according to claim 1, wherein The power module and the first electronic component are fixed to the housing portion.

17. The control device according to claim 1, wherein The control device has a heating device having a heater portion and a control portion that controls the heater portion, The control portion is housed in the case.

18. A drive device, comprising: the control device according to any one of claims 1 to 17; the motor; and a motor case that houses the motor, the case and the motor case are joined to each other.

19. The drive device according to claim 18, wherein The motor and the control device overlap in the up-down direction, The cooling flow path portion is located between the motor and at least one of the power module or the first electronic component in the up-down direction.

20. The drive device according to claim 18, wherein The flow path has a third flow path portion provided at the motor case, the third flow path portion cooling the motor, The third flow path portion overlaps with a portion of the flow path provided at the housing portion in the up-down direction.

21. The drive device according to claim 20, wherein The third flow path portion is connected to the portion of the flow path provided at the housing portion. ​

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