Control device and drive device

Abstract

The utility model provides a control device and a driving device. A driving device according to one embodiment is a control device which is positioned on the upper side of a motor and controls the motor, and comprises: a power module; a first electronic component having any function of voltage regulation, current distribution, or capacitor; and a housing that houses the power module and the first electronic component. The housing includes: a housing portion having an opening portion opened at an upper side; and a cover part which covers the opening part. The cover portion is provided with a flow path. The flow path has a cooling flow path portion that overlaps at least one of the power module and the first electronic component in the vertical direction.

Description

TECHNICAL FIELD

[0001] The utility model relates to control device and drive device. BACKGROUND

[0002] A plurality of electronic components are provided as heat generating elements in a control device that controls a motor. A flow path for cooling the electronic components is provided in the control device (for example, Patent Document 1).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2013-031330

[0004] The amount of heat generated by each of the plurality of electronic components is different. Therefore, in the control device, if the electronic components are simply arranged along the flow path, not only does the control device become large, but also the cooling efficiency for each electronic component cannot be sufficiently improved. SUMMARY

[0005] The utility model discloses in view of above -mentioned situation, one of its purposes is in the control device and drive device that can cool electronic component while inhibiting the large -scale of high efficiency.

[0006] The first mode of the utility model is a control device, which is located on the upper side of a motor and controls the motor, characterized in that the control device has: a power module; a first electronic component having any function of voltage adjustment, current distribution or capacitor; and a housing accommodating the power module and the first electronic component, the housing having: a housing portion having an opening portion open on the upper side; and a cover portion covering the opening portion, a flow path being provided in the cover portion, the flow path having a cooling flow path portion overlapping at least one of the power module or the first electronic component in the vertical direction.

[0007] The control device of the second mode of the utility model is characterized in that, in the control device of the first mode, the cooling flow path portion is located on the upper side of at least one of the power module or the first electronic component.

[0008] The control device of the third mode of the utility model is characterized in that, in the control device of the first mode, the power module and the first electronic component are fixed to the cover portion, and the cooling flow path portion includes: a first flow path portion provided in the cover portion to cool the power module; and a second flow path portion provided in the cover portion to cool the first electronic component.

[0009] The control device of the fourth mode of the utility model is characterized in that, in the control device of the third mode, a direction perpendicular to the vertical direction is set as a first direction, and the first flow path portion and the second flow path portion are arranged in the vertical direction or the first direction.

[0010] The control device of the fifth mode of the utility model is characterized in that, in the control device of the third mode, the first flow path part and the second flow path part are connected to each other.

[0011] The control device of the sixth mode of the utility model is characterized in that, in the control device of the first mode, a direction perpendicular to the up-down direction is set as a first direction, and the power module and the first electronic component are arranged in the first direction.

[0012] The control device of the seventh mode of the utility model is characterized in that, in the control device of the first mode, the power module and the first electronic component are arranged in the up-down direction.

[0013] The control device of the eighth mode of the utility model is characterized in that, in the control device of the sixth mode or the seventh mode, the power module is arranged on the lower side relative to the first electronic component.

[0014] The control device of the ninth mode of the utility model is characterized in that, in the control device of the first mode, the cooling flow path part is located on the lower side of at least one of the power module or the first electronic component.

[0015] The control device of the tenth mode of the utility model is characterized in that, in the control device of the first mode, a direction perpendicular to the up-down direction is set as a first direction, and the cooling flow path part and at least one of the power module or the first electronic component overlap in the first direction.

[0016] The control device of the eleventh mode of the utility model is characterized in that, in the control device of the first mode, the cover part has a cover main body located on the upper side of the opening part, and a wall part fixed to the cover main body and located on the lower side of the cover main body, the power module or the first electronic component is arranged between the cover main body and the wall part in the up-down direction, and the cooling flow path part is arranged on the wall part.

[0017] The control device of the twelfth mode of the utility model is characterized in that, in the control device of the first mode, the control device has a second electronic component accommodated in the shell, the second electronic component has any function of voltage adjustment, current distribution, or capacitor, a direction perpendicular to the up-down direction is set as a first direction, and the second electronic component overlaps the cooling flow path part in the up-down direction or the first direction.

[0018] The control device of the thirteenth aspect of the present application is characterized in that, in the control device of the first aspect, the control device has a second electronic component housed in the housing, the second electronic component has any function of voltage adjustment, current distribution, or a capacitor, a direction perpendicular to the up-down direction is set as a first direction, and the second electronic component overlaps the power module or the first electronic component in the up-down direction or the first direction.

[0019] The control device of the fourteenth aspect of the present application is characterized in that, in the control device of the twelfth aspect or the thirteenth aspect, the control device has a plurality of the second electronic components.

[0020] The control device of the fifteenth aspect of the present application is characterized in that, in the control device of the fourteenth aspect, the plurality of the second electronic components overlap each other in the up-down direction or the first direction.

[0021] The control device of the sixteenth aspect of the present application is characterized in that, in the control device of the first aspect, the power module is fixed to the housing portion, and the first electronic component is fixed to the cover portion.

[0022] The control device of the seventeenth aspect of the present application is characterized in that, in the control device of the first aspect, the power module is fixed to the cover portion, and the first electronic component is fixed to the housing portion.

[0023] The control device of the eighteenth aspect of the present application is characterized in that, in the control device of the first aspect, the power module and the first electronic component are fixed to the cover portion.

[0024] The control device of the nineteenth aspect of the present application is characterized in that, in the control device of the first aspect, the control device has a heating device, the heating device has a heater portion and a control portion that controls the heater portion, and the control portion is housed in the housing.

[0025] The twentieth aspect of the present application is a drive device, characterized in that the drive device has: the control device of any one of the first aspect to the nineteenth aspect; the motor; and a motor housing that houses the motor, the housing and the motor housing being connected to each other.

[0026] The twenty-first aspect of the present application is a drive device, characterized in that, in the drive device of the twentieth aspect, the flow path has a third flow path portion provided to the motor housing, the third flow path portion cools the motor, and the third flow path portion is connected to a portion of the flow path provided to the cover portion.

[0027] According to the utility model, one of the purposes is to provide a control device and a driving device which can efficiently cool electronic components while suppressing the size. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 is a perspective view of the driving device of the embodiment.

[0029] Figure 2 is a cross-sectional view of the driving device of the embodiment.

[0030] Figure 3 is a cross-sectional view of the driving device of the modification example 1.

[0031] Figure 4 is a cross-sectional view of the driving device of the modification example 2.

[0032] Figure 5 is a cross-sectional view of the driving device of the modification example 3.

[0033] Figure 6 is a cross-sectional view of the driving device of the modification example 4.

[0034] Figure 7 is a cross-sectional view of the driving device of the modification example 5.

[0035] Figure 8 is a cross-sectional view of the driving device of the modification example 6.

[0036] Figure 9 is a cross-sectional view of the driving device of the modification example 7.

[0037] Figure 10 is a cross-sectional view of the driving device of the modification example 8.

[0038] Figure 11 is a cross-sectional view of the driving device of the modification example 9.

[0039] Figure 12 is a cross-sectional view of the driving device of the modification example 10.

[0040] Figure 13 is a cross-sectional view of the driving device of the modification example 11.

[0041] REFERENCE NUMERALS

[0042] 1, 101, 201, 301, 401, 501, 601, 701, 801, 901, 1001, 1101: drive device; 2: motor; 6A: motor housing; 6C, 106C, 206C, 306C, 406C, 506C, 706C, 806C, 906C, 1006C, 1106C: electronic component housing (housing); 7, 107, 207, 307, 407, 507, 607, 707, 807, 907, 1007, 1107: control device; 11: power module; 12: power integration system (first electronic component); 13: current distribution portion (second electronic component); 14: capacitor (second electronic component); 15, 115: heating device; 15a, 115a: heater portion; 15b: heater control portion (control portion); 61A: housing portion; 64, 1064: third cover member (cover portion); 90, 190, 390, 490, 590, 690, 790, 890, 990, 1090, 1190: flow path; 90A, 90B, 190A, 190B, 390A, 490A, 490B, 490C, 590A, 690A, 790A, 790B, 890A, 990A, 1090A, 1190A: cooling flow path portion; 91, 191, 391, 1091, 1191: first flow path portion; 91a, 391a: opening portion; 94: third flow path portion; 192, 1092, 1192: second flow path portion; 464A, 564A, 664A, 764A, 864A: cover main body; 465: flow path member (wall portion); 491: internal flow path portion (first flow path portion); D1: first direction. DETAILED DESCRIPTION

[0043] Hereinafter, the drive device of the embodiment will be described with reference to the drawings. In the following description, the gravitational direction is defined in accordance with the positional relationship in the case where the drive device is mounted on a vehicle located on a horizontal road surface. In addition, XYZ coordinates are appropriately shown in each drawing. The Z axis is the vertical direction, the +Z side is the upper side, and the -Z side is the lower side. The Y axis is the left-right direction of the vehicle on which the drive device is mounted. The X axis is the front-rear direction of the vehicle on which the drive device is mounted.

[0044] In the following description, unless otherwise specified, the direction parallel to the first axis J1 of the motor 2 (Y axis direction) will be simply referred to as "axial direction Y", the radial direction centered on the first axis J1 will be simply referred to as "radial direction", and the circumferential direction centered on the first axis J1, i.e., the direction around the first axis J1 will be simply referred to as "circumferential direction". Also, in the following description, the direction parallel to the Z axis will be referred to as the up-down direction Z.

[0045] In addition, in the following description, the direction parallel to the Z-axis is referred to as the "up-down direction Z", and one direction orthogonal to the up-down direction Z is set as the first direction Dl. In the present specification, the first direction Dl is orthogonal not only to the up-down direction Z but also to the axial direction Y, and is a direction parallel to the X-axis direction. However, the first direction Dl can also be a direction intersecting the X-axis direction, and can also be a direction parallel to the axial direction Y.

[0046] In the following description, one side of the first direction Dl refers to the direction in which the arrow of the first direction Dl in the drawing is directed (+Dl), and the other side of the first direction Dl refers to the direction opposite to the direction in which the arrow of the first direction Dl in the drawing is directed (-Dl).

[0047] <DRIVE DEVICE>

[0048] Figure 1 is a perspective view of the drive device 1 of the present embodiment. The drive device 1 of the present embodiment is mounted on a vehicle, such as a hybrid electric vehicle (HEV), a plug-in hybrid electric vehicle (PHV), an electric vehicle (EV), or the like, which uses a motor 2 as a power source, and is used as the power source thereof.

[0049] The drive device 1 has the motor 2, a transmission mechanism 3, and a control device 7. In addition, as will be described later, the motor 2 has a motor housing 6A, the transmission mechanism 3 has a gear housing 6B, and the control device 7 has an electronic component housing (housing) 6C. The motor housing 6A, the gear housing 6B, and the electronic component housing 6C are joined to each other to constitute a housing joint body 6. That is, the housing joint body 6 houses the motor 2, the transmission mechanism 3, and the control device 7.

[0050] The housing joint body 6 is constituted by combining a plurality of members. The housing joint body 6 has a housing main body 61, a first cover member 63, a second cover member 62, and a third cover member (cover portion) 64. A portion of the housing main body 61 and the first cover member 63 constitute the motor housing 6A. A portion of the housing main body 61 and the second cover member 62 constitute the gear housing 6B. A portion of the housing main body 61 and the third cover member 64 constitute the electronic component housing 6C.

[0051] <DRIVE DEVICE>

[0052] Figure 2 is a cross-sectional view of the drive device 1 of the present embodiment.

[0053] The motor 2 of the present embodiment is, for example, a three-phase alternating-current motor of an inner rotor type. The motor 2 has both a function of outputting power as a motor and a function of generating power as a generator. The motor 2 can also be used as either one of an engine or a generator. In addition, the structure of the motor 2 is not limited to the present embodiment, and can be, for example, an alternating-current motor of four phases or more.

[0054] The motor 2 has a rotor 20, a stator 25, and a motor housing 6A. The rotor 20 is rotatable about a first axis J1. The rotor 20 is rotatably supported to the motor housing 6A via an omitted bearing. The stator 25 is located radially outward of the rotor 20, and surrounds the rotor 20 from the radially outward side. The stator 25 is fixed to an inner side of the motor housing 6A.

[0055] The motor housing 6A houses the rotor 20 and the stator 25. The motor housing 6A has a cylindrical portion 6d that is a circular cylinder about the first axis J1, and a first cover member 63 that covers an opening of the other side (-Y) in the axial direction of the cylindrical portion 6d. The cylindrical portion 6d surrounds the stator 25 from the radially outward side. The cylindrical portion 6d is a part of the housing main body 61. Figure 1 The illustrated first cover member 63 is fastened to the cylindrical portion 6d.

[0056] <Transmission mechanism>

[0057] As Figure 1 illustrated, the transmission mechanism 3 is located on one side (+Y) in the axial direction of the motor 2. The transmission mechanism 3 is connected to the rotor 20. The transmission mechanism 3 has a plurality of gears, a plurality of shafts, and a differential device that transmit the power of the rotor 20, an omitted gear housing 6B that houses them, and an output shaft 55 that outputs the power of the rotor 20. The differential device transmits the same torque to a pair of output shafts 55 while absorbing the speed difference between the left and right wheels when the vehicle turns. The output shaft 55 is rotatable about a second axis J3 that is parallel to the first axis J1. An omitted wheel is provided to each of the pair of output shafts 55. In the present embodiment, the output shaft 55 is located on the other side (-D1) in the first direction with respect to the first axis J1.

[0058] <Control device>

[0059] The control device 7 controls the motor 2. The control device 7 has at least the function of an inverter. That is, the control device 7 is connected to a battery, and converts the direct current supplied from the battery into alternating current. In addition, the control device 7 is connected to the stator 25, and supplies the stator 25 with the alternating current. The control device 7 is located on the upper side of the motor 2 and on the other side (-Y) in the axial direction from the transmission mechanism 3.

[0060] As Figure 2 illustrated, the control device 7 of the present embodiment has a power module 11, a power integrated system (first electronic component) 12, a current distribution portion (second electronic component) 13, a capacitor (second electronic component) 14, a heating device 15, and an electronic component housing 6C. In addition, the electronic components provided to the control device 7 are not limited to the above. In addition, the control device 7 can also have electronic components other than the above electronic components.

[0061] The power module 11 has, for example, a switching element, a circuit board on which the switching element is mounted, and a heat sink that contacts the switching element. The switching element is, for example, an insulated gate bipolar transistor (IGBT). In addition, the switching element can also be a field effect transistor such as a metal-oxide-semiconductor field-effect transistor (MOSFET).

[0062] The power integration system 12 has a function of voltage adjustment. The power integration system 12 of the present embodiment has, for example, an on-board charger (OBC) 12a and a DC / DC converter 12b. The on-board charger 12a is a system for converting an alternating voltage supplied via a plug into a direct voltage and charging a battery. The DC / DC converter 12b is a portion that converts a voltage supplied from a battery and charges other batteries at a low voltage. In addition, the power integration system 12 can have at least one of the DC / DC converter 12b or the on-board charger 12a. In addition, the DC / DC converter 12b can step up a voltage supplied from a battery and supply it to other electronic components and the like.

[0063] The current distribution portion 13 is a power distribution unit (PDU) that has a function of current distribution. The current distribution portion 13 is a portion that distributes a current supplied from a battery to various electrical fixtures in a vehicle including the power module 11.

[0064] The capacitor 14 is, for example, a film capacitor. The capacitor 14 is connected between a battery (omitted from the drawing) and the power module 11. The capacitor 14 is provided to smooth a direct current supplied to the power module 11.

[0065] The heating device 15 has a heater portion 15a and a heater control portion (control portion) 15b. The pipe P is connected to the heater portion 15a. The pipe P is a circulation path through which a fluid such as water, a refrigerant, or air circulates. An external device that is a heating target of the heater portion 15a is connected in the path of the pipe P. The external device that is a heating target of the heating device 15 is, for example, a battery. The heating device 15 heats the fluid in the pipe P in the heater portion 15a, and heats the battery via the fluid. The heater control portion 15b is connected to a temperature sensor (omitted from the drawing) that measures a temperature of the battery. The heater control portion 15b controls the heater portion 15a in accordance with the temperature of the battery detected by the temperature sensor. In addition, the heating device 15 can also be used as a heater in a heating device.

[0066] The electronic component housing 6C houses the power module 11, the power integrated system 12, the current distribution portion 13, the capacitor 14, and the heater control portion 15b. The electronic component housing 6C has a housing portion 61A and a third cover member 64.

[0067] The housing portion 61A of the present embodiment is a portion of the housing main body 61. The housing portion 61A and the cylindrical portion 6d are portions of one member. In addition, the housing portion 61A is located on the upper side of the cylindrical portion 6d and is continuous with the cylindrical portion 6d. That is, the housing portion 61A is connected to the motor housing 6A. The housing portion 61A has a first opening portion 61h that is open on the upper side (+Z).

[0068] The housing portion 61A has a first bottom wall portion 61b, a first side wall portion 61c, and a first flange portion 61f. The first bottom wall portion 61b extends along a plane that is perpendicular to the vertical direction Z. The first bottom wall portion 61b is integrally continuous with the cylindrical portion 6d. The first bottom wall portion 61b has a common wall portion 61n that functions as a portion of the cylindrical portion 6d. In the present embodiment, the common wall portion 61n is curved in a substantially circular arc shape about the center axis J. The first bottom wall portion 61b has an outer side surface 61g that faces the lower side (-Z) and a first inner side surface 61k that faces the upper side (+Z). The first side wall portion 61c extends upward (+Z) from the outer edge of the first bottom wall portion 61b. The first flange portion 61f is provided at the upper end portion of the first side wall portion 61c. The first flange portion 61f surrounds the first opening portion 61h in a frame shape. The first flange portion 61f protrudes in a direction away from the first opening portion 61h along a plane that is perpendicular to the vertical direction Z.

[0069] The third cover member 64 is located on the upper side of the housing portion 61A. The third cover member 64 is continuous with the upper side (+Z) of the housing portion 61A. The third cover member 64 has a second opening portion 64h that is open on the lower side (-Z). The third cover member 64 has a second bottom wall portion 64b, a second side wall portion 64c, and a second flange portion 64f. The second bottom wall portion 64b extends along a plane that is perpendicular to the vertical direction Z. The second bottom wall portion 64b has a second inner side surface 64k that faces the lower side (-Z). The second side wall portion 64c extends downward (-Z) from the outer edge of the second bottom wall portion 64b. The second flange portion 64f is provided at the lower end portion of the second side wall portion 64c. The fourth flange portion 64f surrounds the second opening portion 64h in a frame shape. The second flange portion 64f protrudes in a direction away from the second opening portion 64h along a plane that is perpendicular to the vertical direction Z.

[0070] The first flange portion 61f and the second flange portion 64f are opposed to each other in the up-down direction Z. The first flange portion 61f and the second flange portion 64f are fastened to each other. Thereby, the housing portion 61A and the third cover member 64 are coupled to each other. In addition, the third cover member 64 covers the first opening portion 61h, and the housing portion 61A covers the second opening portion 64h. Thereby, the inside space of the housing portion 61A and the inside space of the third cover member 64 are connected, and the inside space Al of the electronic component housing 6C is configured. A sealing member can be interposed between the first flange portion 61f and the second flange portion 64f.

[0071] The inside space Al of the electronic component housing 6C is surrounded by the first bottom wall portion 61b, the second bottom wall portion 64b, the first side wall portion 61c, and the second side wall portion 64c. The first inner side surface 61k of the first bottom wall portion 61b and the second inner side surface 64k of the second bottom wall portion 64b are opposed to each other in the up-down direction Z. The power integration system 12, the current distribution portion 13, and the heater control portion 15b of the present embodiment are fixed to the first inner side surface 61k. In particular, in the present embodiment, the power integration system 12 is fixed to the common wall portion 61n. Thus, the power integration system 12 is fixed to the cylindrical portion 6d. In addition, the power module 11 and the capacitor 14 of the present embodiment are fixed to the second inner side surface 64k. Also, in the present embodiment, the heater portion 15a is fixed to the outer side surface 61g of the housing portion 61A.

[0072] In addition, in the present embodiment, a plurality of support portions 61u that protrude upward (+Z) are provided on the first inner side surface 61k. The plurality of support portions 61u respectively support the power integration system 12, the current distribution portion 13, and the heater control portion 15b. The first inner side surface 61k contacts the power integration system 12, the current distribution portion 13, and the heater control portion 15b at the upper end surfaces of the plurality of support portions 61u. In addition, it is also possible that the support portions 61u are not provided on the first inner side surface 61k. In this case, the first inner side surface 61k directly contacts the power integration system 12, the current distribution portion 13, and the heater control portion 15b.

[0073] The housing coupling body 6 is provided with a flow path 90. The flow path 90 is a path through which a fluid flows. A part of the flow path 90 is configured by a hole portion provided in the housing coupling body 6. In addition, another part of the flow path 90 is configured by an inner side surface of a recess portion provided in the housing coupling body 6 and a member that covers the recess portion. In the present specification, the flow path 90 does not necessarily mean a single circulation path, and can include a plurality of circulation paths. In the case where the flow path 90 has a plurality of circulation paths, the fluids that flow in the respective circulation paths can be the same kind of fluid, or can be different kinds of fluid. The fluid that flows in the flow path 90 is, for example, water, oil, or an aqueous ethylene glycol solution, or the like.

[0074] The flow path 90 of the present embodiment has a first flow path portion 91, a connection flow path portion 95, and a third flow path portion 94. The first flow path portion 91 and the connection flow path portion 95 are provided to the electronic component housing 6C. The third flow path portion 94 is provided to the motor housing 6A.

[0075] In the present embodiment, the first flow path portion 91, the connection flow path portion 95, and the third flow path portion 94 constitute one circulation path. Therefore, the same fluid flows in the first flow path portion 91, the connection flow path portion 95, and the third flow path portion 94 of the present embodiment. In the present embodiment, the fluid flows in each portion of the flow path 90 in the order of the first flow path portion 91, the connection flow path portion 95, and the third flow path portion 94. In addition, the end portion of the downstream side of the third flow path portion 94 and the end portion of the upstream side of the first flow path portion 91 are connected to each other via a flow path portion, which is not illustrated. In addition, a pump that pressurizes the fluid and a radiator that cools the fluid, or the like can be provided to the flow path portion.

[0076] The first flow path portion 91 is provided to the second bottom wall portion 64b. That is, the first flow path portion 91 is provided to the third cover member 64. The first flow path portion 91 of the present embodiment extends along the axial direction Y. However, the first flow path portion 91 can extend in any direction as long as it extends along a plane that is perpendicular to the vertical direction Z. One end portion of the first flow path portion 91 is open at the lower surface of the second flange portion 64f. The first flow path portion 91 is connected to the connection flow path portion 95 at the one end portion that is open at the lower surface of the second flange portion 64f.

[0077] The first flow path portion 91 has an opening portion 91a that is open at the second inner side surface 64k of the second bottom wall portion 64b. The opening portion 91a is open at the lower side (-Z). The power module 11 has a radiator that covers the opening portion 91a. The radiator is in contact with the fluid that flows in the first flow path portion 91. The radiator preferably has a plurality of fins or pins that are arranged inside the first flow path portion 91. The fluid that flows in the first flow path portion 91 cools the power module 11 by being in contact with the radiator. That is, the first flow path portion 91 cools the power module 11. In addition, the configuration for cooling the power module 11 with the fluid that flows in the first flow path portion 91 is not limited to the present embodiment.

[0078] In the present embodiment, the first flow path portion 91 provided to the third cover member 64 has a cooling flow path portion 90A. The cooling flow path portion 90A is a region of the first flow path portion 91 that overlaps at least one of the power module 11 or the power integration system 12 in the up-down direction Z. According to the present embodiment, the cooling flow path portion 90A overlaps the power module 11 or the power integration system 12 in the up-down direction Z, and thus the power module 11 or the power integration system 12 can be cooled. In the present embodiment, the cooling flow path portion 90A overlaps both the power module 11 and the power integration system 12. The cooling flow path portion 90A of the present embodiment is provided to the second bottom wall portion 64b in which the power module 11 is fixed. Thus, the cooling flow path portion 90A can efficiently cool the power module 11. The cooling flow path portion 90A of the present embodiment does not directly transfer heat from the power integration system 12. However, the cooling flow path portion 90A overlaps the power integration system 12 in the up-down direction Z, and thus the power integration system 12 can be cooled, for example, by employing a configuration in which heat is easily transferred between the second bottom wall portion 64b and the power integration system 12. That is, the cooling flow path portion 90A overlaps the power integration system 12 in the up-down direction Z, and thus heat is easily transferred from the power integration system 12. As a configuration in which heat is easily transferred, a configuration in which a heat transfer material or the like is arranged in a gap in the up-down direction Z between the second bottom wall portion 64b and the power integration system 12 can be employed.

[0079] The cooling flow path portion 90A is preferably positioned on the upper side of at least one of the power module 11 or the power integration system 12. The cooling flow path portion 90A of the present embodiment is positioned on the upper side of both the power module 11 and the power integration system 12. As described above, the cooling flow path portion 90A is provided to the third cover member 64 that covers the internal space Al of the electronic component housing 6C from the upper side. Thus, by arranging the cooling flow path portion 90A in the internal space Al of the electronic component housing 6C and on the upper side of the power module 11 and the power integration system 12 that overlap the cooling flow path portion 90A in the up-down direction Z, the configuration of the cooling flow path portion 90A can be simplified.

[0080] The connection flow path portion 95 is provided to the first side wall portion 61c. That is, the connection flow path portion 95 is provided to the housing portion 61A. The connection flow path portion 95 is constituted by a hole portion provided to the inside of the wall of the first side wall portion 61c. The connection flow path portion 95 extends in the up-down direction Z. An end portion of the connection flow path portion 95 on the upper side (+Z) is open to a surface of the first flange portion 61f that faces the upper side (+Z). The connection flow path portion 95 is connected to the first flow path portion 91 by fastening the first flange portion 61f and the second flange portion 64f to each other. That is, one end portion of the connection flow path portion 95 is connected to the first flow path portion 91. In addition, the other end portion of the connection flow path portion 95 on the lower side (-Z) is connected to the third flow path portion 94.

[0081] The third flow path portion 94 is provided to the cylindrical portion 6d. That is, the third flow path portion 94 is provided to the motor housing 6A. The third flow path portion 94 of the present embodiment extends in a spiral shape along the axial direction Y with the first axis line J1 as the center. The fluid flowing in the third flow path portion 94 transfers heat from the motor 2. That is, the third flow path portion 94 cools the motor 2.

[0082] The third flow path portion 94 is not limited to the present embodiment as long as it cools the motor 2. The motor 2 can also extend in the axial direction or the circumferential direction in a meandering manner inside the wall of the cylindrical portion 6d. In addition, the third flow path portion 94 can also cool the motor 2 by directly applying the fluid to the motor 2. In this case, the third flow path portion 94 can also be a configuration in which an ejection hole that ejects the fluid toward the motor 2 is provided to the inner wall of the motor housing 6A, a tube that is arranged in the inner space of the motor housing 6A and has an ejection hole that ejects the fluid toward the motor 2, a member in a groove shape, or the like.

[0083] The cylindrical portion 6d of the present embodiment has a common wall portion 61n that also functions as a part of the first bottom wall portion 61b. The third flow path portion 94 passes through the inside of the common wall portion 61n. Therefore, a part of the third flow path portion 94 is provided to the first bottom wall portion 61b. Thus, the third flow path portion 94 cools the inner space of the housing portion 61A. In addition, the power integration system 12 is fixed to the common wall portion 61n. According to the present embodiment, the third flow path portion 94 can cool the power integration system 12.

[0084] In the present embodiment, the third flow path portion 94 is connected to the first flow path portion 91 via the connection flow path portion 95. Therefore, the third flow path portion 94 of the present embodiment constitutes the same circulation path as the first flow path portion 91. According to the present embodiment, compared to a case in which the third flow path portion 94 constitutes a different circulation path from the first flow path portion 91, it is possible to simplify the flow path 90 and make the drive device 1 as a whole smaller.

[0085] According to the present embodiment, the power module 11 and the power integration system 12 are arranged in the up-down direction Z. Therefore, compared to a case in which the power module 11 and the power integration system 12 are arranged in a direction perpendicular to the up-down direction Z, it is possible to make the control device 7 smaller in the first direction D1.

[0086] In the present embodiment, the power module 11 and the power integration system 12 are located on the upper side (+Z) with respect to the motor 2. In addition, the power integration system 12 is located on the lower side (-Z) with respect to the power module 11. According to the present embodiment, it is possible to arrange the power module 11 at a position farther from the motor 2 than the power integration system 12, and thus it is possible to suppress the heat of the motor 2 from affecting the operation of the power module 11. Conversely, it is also possible to suppress the heat of the power module 11 from affecting the operation of the motor 2.

[0087] According to the present embodiment, the power module 11 is fixed to the third cover member 64, and the power integration system 12 is fixed to the housing portion 61A. That is, it is possible to bring the power module 11 and the power integration system 12 into contact with different members (the third cover member 64 and the housing portion 61A) of the electronic component housing 6C, respectively. Thereby, it is possible to transfer the heat of the power module 11 and the power integration system 12 to different members, respectively, to dissipate the heat, and it is possible to efficiently cool the power module 11 and the power integration system 12. In addition, it is possible to suppress the transfer of heat from either one of the power module 11 and the power integration system 12 to the other.

[0088] According to the present embodiment, the heater control portion 15b, which is a part of the heating device 15, is housed in the electronic component housing 6C. Thereby, it is possible to protect the heater control portion 15b by the electronic component housing 6C. Also, by disposing the heater control portion 15b inside the electronic component housing 6C, it is easy to cool the heater control portion 15b by the flow path 90, and it is possible to improve the reliability of the heating device 15. In the present embodiment, the case where only the heater control portion 15b is housed in the electronic component housing 6C is described. However, even if both the heater portion 15a and the heater control portion 15b are housed in the electronic component housing 6C, the same effects can be obtained.

[0089] In the present embodiment, the heater portion 15a of the heating device 15 is fixed to the outer side of the electronic component housing 6C, and is not disposed inside the electronic component housing 6C. According to the present embodiment, it is possible to suppress the influence of the heat of the heater portion 15a on the electronic components disposed inside the electronic component housing 6C. In addition, the heater portion 15a of the heating device 15 can be disposed not only on the outer side of the electronic component housing 6C, but also on the outer side of the motor housing 6A or the gear housing 6B.

[0090] In the present embodiment, a case where the cooling flow path portion 90A overlaps both the power module 11 and the power integrated system 12 in the up-down direction Z to be able to cool them is described. However, the cooling flow path portion 90A can also be able to cool other electronic components instead of the power integrated system 12. Here, the electronic component other than the power module 11 to be cooled by the cooling flow path portion 90A is referred to as a first electronic component 12. The first electronic component 12 of the present embodiment is the power integrated system 12, but can also be the current distribution portion 13 or the capacitor 14. That is, the first electronic component 12 only needs to have any function of voltage adjustment, current distribution, or capacitor. In addition, the cooling flow path portion 90A is provided to the third cover member 64, and only needs to be a portion of the flow path 90 overlapping any one of the power integrated system 12, the current distribution portion 13, the capacitor 14, or the power module 11 in the up-down direction Z. In addition, in the present embodiment, the capacitor 14 can be replaced with the first electronic component, and a portion of the first flow path portion 91 overlapping the capacitor 14 can be replaced with the cooling flow path portion 90B. The cooling flow path portion 90B in this case cools the capacitor 14. Also, the current distribution portion 13 can be replaced with the first electronic component, and a portion of the first flow path portion 91 overlapping the current distribution portion 13 can be replaced with the cooling flow path portion 90B.

[0091] In the present embodiment, the capacitor 14 overlaps the power module 11 in the first direction D1. In addition, the current distribution portion 13 overlaps the first electronic component 12 in the first direction D1. Here, the electronic component having any function of voltage adjustment, current distribution, or capacitor other than the power module 11 and the first electronic component 12 is referred to as a second electronic component 13, 14. The second electronic component 13, 14 only needs to have any function of voltage adjustment, current distribution, or capacitor. That is, the second electronic component 13, 14 only needs to be any one of the power integrated system 12, the current distribution portion 13, and the capacitor 14. According to the present embodiment, the second electronic component 13, 14 overlaps at least one of the power module 11 or the first electronic component 12 in the first direction D1. According to the present embodiment, the second electronic component 13, 14 is arranged along the first direction D1 with the power module 11 or the first electronic component 12, whereby the control device 7 can be suppressed from being large in the up-down direction Z.

[0092] In the present embodiment, the control device 7 has a plurality of second electronic components 13, 14. The plurality of second electronic components 13, 14 overlap each other in the up-down direction Z. According to the present embodiment, the plurality of second electronic components 13, 14 are arranged along the up-down direction Z, whereby the control device 7 can be suppressed from being large in a direction perpendicular to the up-down direction Z.

[0093] In the present embodiment, the power module 11 and the power integrated system 12 are preferably arranged in a manner extending along a plane perpendicular to the up-down direction Z with the up-down direction Z as a thickness direction. Also, the cooling flow path portion 90A preferably extends along a plane perpendicular to the up-down direction Z. According to the present embodiment, the power module 11 and the power integrated system 12 can be arranged to overlap the cooling flow path portion 90A in the up-down direction Z in a wide range, and the cooling efficiency of the power module 11 and the power integrated system 12 can be improved. Also, for the same reason, as for the current distribution portion 13 and the capacitor 14, it is also preferable to arrange in a manner extending along a plane perpendicular to the up-down direction Z with the up-down direction Z as a thickness direction.

[0094] <MODIFIED EXAMPLE>

[0095] Hereinafter, modified examples of the drive device will be described. In the description of each of the modified examples described below, the same reference numerals are assigned to the same constituent elements as those of the already described embodiments or modified examples, and the description thereof will be omitted.

[0096] Also, in the modified examples below, as with the above-described embodiments, the case where the power integrated system 12 is the first electronic component 12, and the current distribution portion 13 and the capacitor 14 are the second electronic components 13, 14 will be described. However, the first electronic component only needs to have any of the functions of voltage adjustment, current distribution, or capacitor, and only needs to be any one of the power integrated system 12, the current distribution portion 13, or the capacitor 14. Also, the second electronic component only needs to be a component having any of the functions of voltage adjustment, current distribution, or capacitor among the electronic components other than the first electronic component, and only needs to be any one of the power integrated system 12, the current distribution portion 13, or the capacitor 14.

[0097] (Modified Example 1)

[0098] Figure 3 is a cross-sectional view of the drive device 101 of Modified Example 1. As with the above-described embodiments, the drive device 101 of the present modified example has the motor 2, the transmission mechanism 3 (see Figure 1 ), and the control device 107. Also, the drive device 101 has the housing link body 106. The housing link body 106 has the motor housing 6A, the gear housing 6B (see Figure 1 ), and the electronic component housing 106C (housing). The flow path 190 is provided in the housing link body 106.

[0099] The electronic component housing 106C of the present modification houses the power module 11, the power integration system 12, the current distribution portion 13, the capacitor 14, and the heating device 115. The power module 11 and the power integration system 12 are fixed to the second inner side surface 64k of the second bottom wall portion 64b. On the other hand, the current distribution portion 13, the capacitor 14, and the heating device 115 are fixed to the first inner side surface 61k of the first bottom wall portion 61b.

[0100] The flow path 190 has the first flow path portion 191 and the second flow path portion 192 provided in the electronic component housing 106C, the connection flow path portion 95, and the third flow path portion 94 provided in the motor housing 6A. The first flow path portion 191 and the second flow path portion 192 are provided in the second bottom wall portion 64b. In the present modification, the first flow path portion 191 and the second flow path portion 192 are connected to each other to constitute the same circulation path. However, the first flow path portion 191 and the second flow path portion 192 can constitute different circulation paths from each other.

[0101] The first flow path portion 191 of the present modification has a cooling flow path portion 190A overlapping the power module 11 in the up-down direction Z. In addition, the second flow path portion 192 of the present modification has a cooling flow path portion 190B overlapping the power integration system 12 in the up-down direction Z. The first flow path portion 191 is capable of cooling the power module 11, and the second flow path portion 192 is capable of cooling the power integration system 12.

[0102] The first flow path portion 191 has a first opening portion 191a opening at the second inner side surface 64k of the second bottom wall portion 64b, similarly to the above-described embodiment. The first opening portion 191a is covered by the power module 11. The fluid flowing in the first flow path portion 191 contacts the power module 11 at the first opening portion 191a to cool the power module 11.

[0103] The second flow path portion 192 has a second opening portion 192a opening at the second inner side surface 64k of the second bottom wall portion 64b. The second opening portion 192a is covered by the power integration system 12. The fluid flowing in the second flow path portion 192 contacts the power integration system 12 at the second opening portion 192a to cool the power integration system 12. In addition, the power integration system 12 has a heat generating element and a housing portion housing the heat generating element. The fluid flowing in the second flow path portion 192 contacts the housing portion of the power integration system 12 to cool the heat generating element via the housing portion.

[0104] In the present modification, the first flow path portion 191 and the second flow path portion 192 are arranged in the first direction D1. According to the present modification, the second bottom wall portion 64b can be made thinner, and the control device 107 can be made smaller in the up-down direction Z, as compared with the case where the first flow path portion 191 and the second flow path portion 192 are arranged overlapping each other in the up-down direction Z.

[0105] In the present modification, the power module 11 and the power integrated system 12 are arranged in the first direction Dl. According to the present modification, the power module 11 and the power integrated system 12 are arranged in the first direction Dl. In the present modification, the power module 11 and the power integrated system 12 are comparatively large-sized components among the electronic components of the control device 107, and thus by arranging the power module 11 and the power integrated system 12 in the first direction Dl, the control device 107 can be prevented from being large-sized in the vertical direction Z.

[0106] In the present modification, the power module 11 and the power integrated system 12 are both fixed to the third cover member 64. In the present modification, the power module 11 and the power integrated system 12 have comparatively large heat generation amounts among the electronic components of the control device 107. According to the present modification, by the flow paths (the first flow path portion 191 and the second flow path portion 192) provided to the third cover member 64, the power module 11 and the power integrated system 12 having large heat generation amounts can be cooled.

[0107] In the present modification, the capacitor 14 is fixed to the common wall portion 61n. A part of the third flow path portion 94 is provided to the common wall portion 61n. Thus, the third flow path portion 94 can cool the capacitor 14. In addition, the current distribution portion 13 can be fixed to the common wall portion 61n. In this case, the third flow path portion 94 can cool the current distribution portion 13.

[0108] In the present modification, the heater portion 115a and the heater control portion 115b of the heating device 115 are housed in the housing portion 61A of the electronic component housing 106C. That is, according to the present modification, the entire heating device 115 is arranged in the internal space of the electronic component housing 106C. If a part of the heating device 115 is fixed to the outer side surface of the housing connecting body 106, the drive device can be large-sized because of the protrusion from the outer shape of the drive device. According to the present modification, by arranging the entire heating device 115 (i.e., the heater portion 115a and the heater control portion 115b) in the internal space of the electronic component housing 106C, the drive device 101 can be miniaturized.

[0109] (Modification 2)

[0110] Figure 4 is a cross-sectional view of the drive device 201 of Modification 2. Like the above-described embodiment, the drive device 201 of the present modification has the motor 2, the transmission mechanism 3 (see Figure 1 ), and the control device 207. In addition, the drive device 201 has a housing connecting body 206. The housing connecting body 206 has a motor housing 6A, a gear housing 6B (see Figure 1) and an electronic component housing 206C (a housing). The housing link body 206 is provided with a flow path 190.

[0111] The electronic component housing 206C of the present modification houses the power module 11, the power integration system 12, the current distribution portion 13, and the capacitor 14. The power module 11 and the power integration system 12 are fixed to the second inner side surface 64k of the second bottom wall portion 64b. The current distribution portion 13 is fixed to the lower surface of the power module 11. The capacitor 14 is fixed to the lower surface of the power module 11. In the present modification, the arrangement of the power module 11 and the power integration system 12 can be interchanged. In the present modification, the arrangement of the current distribution portion 13 and the capacitor 14 can be interchanged.

[0112] The flow path 190 has a first flow path portion 191 provided to the electronic component housing 206C, a second flow path portion 192 and a connection flow path portion 95, and a third flow path portion 94 provided to the motor housing 6A. The first flow path portion 191 has a cooling flow path portion 190A that overlaps the power module 11 in the up-down direction Z. In addition, the second flow path portion 192 of the present modification has a cooling flow path portion 190B that overlaps the power integration system 12 in the up-down direction Z.

[0113] The power module 11 of the present modification is cooled by the first flow path portion 191. In addition, the current distribution portion 13 of the present modification is mounted to the power module 11. According to the present modification, by bringing the current distribution portion 13 into contact with the heat sink of the power module 11, the current distribution portion 13 can be cooled by the first flow path portion 191 via the heat sink of the power module 11. Also, the capacitor 14 of the present modification is mounted to the current distribution portion 13. According to the present modification, the capacitor 14 can be cooled by the first flow path portion 191 via the current distribution portion 13 and the power module 11.

[0114] In the present modification, the second electronic components 13, 14 (the current distribution portion 13 and the capacitor 14) overlap the cooling flow path portion 190A in the up-down direction Z. According to the present modification, the second electronic components 13, 14 can be brought close to the cooling flow path portion 190A, and the second electronic components 13, 14 can be easily cooled by the cooling flow path portion 190A.

[0115] In the present modification, the second electronic components 13, 14 overlap the power module 11 in the up-down direction Z. According to the present modification, the control device 207 can be downsized in a direction perpendicular to the up-down direction Z. In the present modification, a plurality of second electronic components 13, 14 overlap each other in the up-down direction Z, and thus the control device 207 can be downsized in a direction perpendicular to the up-down direction Z.

[0116] According to the present modification example, all of the electronic components (the power module 11, the power integration system 12, the current distribution portion 13, and the capacitor 14) of the control device 207 are fixed to the third cover member 64. Therefore, the connection process of the electronic components to each other can be completed before the third cover member 64 is assembled to the housing main body 61, and the assembly process can be simplified.

[0117] (Modification Example 3)

[0118] Figure 5 is a cross-sectional view of the drive device 301 of Modification Example 3. Like the above-described embodiment, the drive device 301 of the present modification example has the motor 2, the transmission mechanism 3 (see Figure 1 ), and the control device 307. In addition, the drive device 301 has a housing link body 306. The housing link body 306 has the motor housing 6A, the gear housing 6B (see Figure 1 ), and an electronic component housing 306C (housing). The flow path 390 is provided in the housing link body 306.

[0119] The power module 11, the power integration system 12, the current distribution portion 13, and the capacitor 14 are housed in the electronic component housing 306C of the present modification example. The power integration system 12 and the current distribution portion 13 are fixed to the second inner side surface 64k of the second bottom wall portion 64b. The power module 11 is fixed to the lower surface of the power integration system 12. That is, the power module 11 is disposed on the lower side of the power integration system 12. The capacitor 14 is fixed to the lower surface of the current distribution portion 13. In the present modification example, the arrangement of the power module 11 and the power integration system 12 can be exchanged with each other. In the present modification example, the arrangement of the current distribution portion 13 and the capacitor 14 can be exchanged with each other.

[0120] The flow path 390 has the first flow path portion 391 provided in the electronic component housing 306C and the connection flow path portion 95, and the third flow path portion 94 provided in the motor housing 6A. In the present modification example, the first flow path portion 391 has a cooling flow path portion 390A that overlaps the power module 11 and the power integration system 12 in the vertical direction Z.

[0121] The first flow path portion 391 of the present modification example has an opening portion 391a that is opened at the second inner side surface 64k, like the above-described embodiment. The opening portion 391a is covered by the power integration system 12. Thereby, the power integration system 12 is cooled by the first flow path portion 391. In addition, the power module 11 is mounted to the power integration system 12. According to the present modification example, the power module 11 can be cooled by the first flow path portion 391 via the housing portion of the power integration system 12.

[0122] In the present modification example, a portion of the first flow path portion 391 overlaps the current distribution portion 13 in the up-down direction Z. The current distribution portion 13 is cooled by the first flow path portion 391. In addition, the capacitor 14 mounted to the current distribution portion 13 is cooled by the first flow path portion 391 via the current distribution portion 13.

[0123] In the present modification example, the current distribution portion 13 of the plurality of second electronic components 13, 14 (the current distribution portion 13 and the capacitor 14) overlaps the power integration system 12 in the first direction D1. In addition, the capacitor 14 of the plurality of second electronic components 13, 14 overlaps the power module 11 in the first direction D1. Therefore, according to the present modification example, the control device 307 can be downsized in the up-down direction Z. In the present modification example, the plurality of second electronic components 13, 14 overlap each other in the up-down direction Z, and thus the control device 307 can be downsized in a direction perpendicular to the up-down direction Z.

[0124] In the present embodiment, the power module 11 and the power integration system 12 are disposed on the upper side (+Z) with respect to the motor 2. In addition, the power module 11 is disposed on the lower side (-Z) with respect to the power integration system 12. The power module 11 is connected to the motor 2 and supplies electric power to the motor 2. Therefore, if the distance between the power module 11 and the motor 2 becomes large, the resistance of a connection path (for example, a bus bar) connecting the power module 11 and the motor 2 becomes large, and the loss when the drive device 1 is driven can become large. According to the present embodiment, the power module 11 can be disposed closer to the motor 2 than the power integration system 12, and thus the resistance of the connection path between the power module 11 and the motor 2 can be reduced, and the loss generated in the drive device 1 can be reduced.

[0125] (Modification Example 4)

[0126] Figure 6 is a cross-sectional view of a drive device 401 of Modification Example 4. Like the above-described embodiment, the drive device 401 of the present modification example has a motor 2, a transmission mechanism 3 (refer to Figure 1 ), and a control device 407. In addition, the drive device 401 has a housing connection body 406. The housing connection body 406 has a motor housing 6A, a gear housing 6B (refer to Figure 1 ), and an electronic component housing 406C (housing). A flow path 490 is provided in the housing connection body 406.

[0127] The electronic component housing 406C of this modification example has the housing portion 61A and a third cover member 464. In addition, the third cover member 464 has a cover main body 464A and a flow path member (wall portion) 465. The cover main body 464A is positioned on the upper side of the first opening portion 61h of the housing portion 61A and is fixed to the housing portion 61A. The cover main body 464A has a plurality of support column portions 464d in addition to the second bottom wall portion 64b, the second side wall portion 64c, and the second flange portion 64f, which are the same as those of the above-described embodiment. The support column portions 464d extend downward (-Z) from the second inner side surface 64k of the second bottom wall portion 64b. The flow path member 465 is attached to the lower end portions of the support column portions 464d. That is, the flow path member 465 is fixed to the cover main body 464A.

[0128] The flow path member 465 is in the shape of a plate extending along a plane perpendicular to the up-down direction Z. The flow path member 465 is a so-called water jacket. The flow path member 465 is positioned between the first bottom wall portion 61b and the second bottom wall portion 64b in the up-down direction Z. The flow path member 465 opposes the first inner side surface 61k via a gap in the up-down direction Z. In addition, the flow path member 465 opposes the second inner side surface 64k via a gap in the up-down direction Z. The flow path member 465 is positioned on the lower side of the cover main body 464A and on the upper side of the housing portion 61A.

[0129] The power module 11, the power integration system 12, the current distribution portion 13, and the capacitor 14 are housed in the electronic component housing 406C of this modification example. The power module 11 is fixed to the second inner side surface 64k of the second bottom wall portion 64b. The power integration system 12 is fixed to the upper surface of the flow path member 465. The capacitor 14 is fixed to the upper surface of the power integration system 12. The current distribution portion 13 is fixed to the upper surface of the capacitor 14. Also, the upper surface of the current distribution portion 13 is in contact with the second bottom wall portion 64b. The current distribution portion 13 and the second bottom wall portion 64b can also be in contact via a heat transfer material such as a heat transfer sheet. In this modification example, the arrangement of the current distribution portion 13 and the capacitor 14 can also be interchanged.

[0130] The flow path 490 of this modification example has an internal flow path portion (first flow path portion) 491 in addition to the first flow path portion 391, the connection flow path portion 95, and the third flow path portion 94, which are the same as those of the above-described embodiment or modification example. The first flow path portion 391, the connection flow path portion 95, and the internal flow path portion 491 are provided to the electronic component housing 406C. The third flow path portion 94 is provided to the motor housing 6A.

[0131] In this modification example, the first flow path portion 391 has a cooling flow path portion 490A that overlaps the power module 11 in the up-down direction Z and a cooling flow path portion 490C that overlaps the power integration system 12 in the up-down direction Z. The cooling flow path portion 490A has an opening portion 391a that is covered by the power module 11.

[0132] The internal flow path portion 491 extends meanderingly inside the flow path member 465. That is, the internal flow path portion 491 is provided to the third lid member 464. Fluid cooled by a radiator (omitted from the drawing) flows in the internal flow path portion 491. The internal flow path portion 491 has a cooling flow path portion 490B that overlaps the power integrated system 12 in the up-down direction Z. The power integrated system 12 is in contact with the upper surface of the flow path member 465. The internal flow path portion 491 cools the power integrated system 12. According to the present modification, the power integrated system 12 can be efficiently cooled using the plate-shaped flow path member 465.

[0133] In the present modification, the current distribution portion 13 is in contact with the second bottom wall portion 64b, and is thus cooled by the first flow path portion 391 inside the second bottom wall portion 64b. In addition, the capacitor 14 is in contact with the current distribution portion 13 on the upper surface and with the power module 11 on the lower surface. Thus, the capacitor 14 is cooled by the first flow path portion 391 via the current distribution portion 13 and by the internal flow path portion 491 via the power module 11.

[0134] In the present modification, the power integrated system 12, the current distribution portion 13, and the capacitor 14 are arranged between the lid main body 464A and the flow path member 465 in the up-down direction Z. In addition, the cooling flow path portion 490B is provided to the flow path member 465. That is, the cooling flow path portion 490B is positioned on the lower side of the power integrated system 12. According to the present modification, heat of the electronic components (the power integrated system 12, the current distribution portion 13, and the capacitor 14) arranged between the lid main body 464A and the flow path member 465 can be transferred to the lid main body 464A and the flow path member 465, and the temperature of these electronic components can be suppressed from becoming excessively high. In the present modification, the power module 11 is not arranged between the lid main body 464A and the flow path member 465, but the power module 11 can be arranged between the lid main body 464A and the flow path member 465. That is, the power module 11 or the first electronic component 12 (the power integrated system 12) is arranged between the lid main body 464A and the flow path member 465 in the up-down direction Z, and if the cooling flow path portion 490B is provided to the flow path member 465, the power module 11 or the first electronic component 12 can be cooled.

[0135] In particular, in the present modification example, the power integration system 12, the current distribution portion 13, and the capacitor 14 are arranged in the first flow path portion 391 between the cooling flow path portion 490C of the internal flow path portion 491 and the cooling flow path portion 490B in the vertical direction Z. Therefore, the flow path 490 can cool the power integration system 12, the current distribution portion 13, and the capacitor 14 from the vertical direction Z. In the present modification example, the power module 11 is not arranged between the first flow path portion 391 and the internal flow path portion 491, but the power module 11 can be arranged between the first flow path portion 391 and the internal flow path portion 491. That is, as long as the power module 11 or the first electronic component 12 (the power integration system 12) is arranged between the first flow path portion 391 and the internal flow path portion 491 in the vertical direction Z.

[0136] In the present modification example, the cooling flow path portion 490B overlaps the power module 11 in the first direction D1. Therefore, it is possible to suppress the control device 407 from being large in the vertical direction Z. In the present modification example, the cooling flow path portion 490B of the flow path member 465 overlaps the power integration system 12 in the vertical direction Z and overlaps the power module 11 in the first direction D1. However, the cooling flow path portion 490B can overlap the power module 11 in the vertical direction Z and overlap the power integration system 12 in the first direction D1. If the cooling flow path portion 490B overlaps at least one of the power module 11 or the first electronic component 12 (the power integration system 12) in the first direction D1, it is possible to achieve the vertical direction Z of the control device 407 to be small.

[0137] In the present modification example, the plurality of second electronic components 13, 14 (the current distribution portion 13 and the capacitor 14) overlap the power integration system 12 in the vertical direction Z. According to the present modification example, it is possible to make the control device 407 small in a direction perpendicular to the vertical direction Z. In the present modification example, the plurality of second electronic components 13, 14 overlap the power module 11 in the first direction D1. According to the present modification example, it is possible to make the control device 407 small in the vertical direction Z. In the present modification example, the plurality of second electronic components 13, 14 overlap each other in the vertical direction Z. According to the present modification example, it is possible to make the control device 407 small in a direction perpendicular to the vertical direction Z.

[0138] (Modification Example 5)

[0139] Figure 7 is a cross-sectional view of the drive device 501 of Modification Example 5. Like the above-described embodiment, the drive device 501 of the present modification example has the motor 2, the transmission mechanism 3 (see Figure 1 ), and the control device 507. In addition, the drive device 501 has a housing link body 506. The housing link body 506 has the motor housing 6A, the gear housing 6B (see Figure 1) and an electronic component housing 506C (a housing). The housing link body 506 is provided with a flow path 590.

[0140] The electronic component housing 506C of the present modification has a housing portion 61A and a third cover member 564. In addition, the third cover member 564 has a cover main body 564A and a flow path member 465. The cover main body 564A has a plurality of support column portions 564d in addition to the second bottom wall portion 64b, the second side wall portion 64c, and the second flange portion 64f which are the same as those of the above-described embodiment. The support column portions 564d extend downward (-Z) from the second inner side surface 64k of the second bottom wall portion 64b. The flow path member 465 is attached to lower end portions of the support column portions 564d. The flow path member 465 is positioned between the first bottom wall portion 61b and the second bottom wall portion 64b in the up-down direction Z. The flow path member 465 opposes the first inner side surface 61k with a gap in the up-down direction Z. In addition, the flow path member 465 opposes the second inner side surface 64k with a gap in the up-down direction Z.

[0141] The power module 11, the power integration system 12, the current distribution portion 13, and the capacitor 14 are housed in the electronic component housing 506C of the present modification. The power integration system 12 is fixed to the second inner side surface 64k of the second bottom wall portion 64b. The power module 11 is fixed to an upper surface of the flow path member 465. The capacitor 14 is fixed to an upper surface of the power module 11. The current distribution portion 13 is fixed to an upper surface of the capacitor 14. In addition, the upper surface of the current distribution portion 13 is in contact with the second bottom wall portion 64b. The current distribution portion 13 and the second bottom wall portion 64b can also be in contact via a heat transfer material such as a heat transfer sheet. According to the present modification, heat of the current distribution portion 13 can be moved to the third cover member 564 to be radiated. In the present modification, the arrangement of the power module 11 and the power integration system 12 can be exchanged with each other. In the present modification, the arrangement of the current distribution portion 13 and the capacitor 14 can be exchanged with each other.

[0142] The flow path 590 of the present modification has an internal flow path portion 491 provided in the electronic component housing 506C and a third flow path portion 94 provided in the motor housing 6A. The internal flow path portion 491 extends in a meandering manner inside the flow path member 465. The internal flow path portion 491 is provided in the third cover member 564. The internal flow path portion 491 has a cooling flow path portion 590A which overlaps the power module 11 in the up-down direction Z. The power module 11 is in contact with the upper surface of the flow path member 465. The cooling flow path portion 590A is positioned on the lower side of the power module 11. The internal flow path portion 491 cools the power module 11. According to the present modification, the power module 11 can be efficiently cooled using the plate-shaped flow path member 465. In addition, the capacitor 14 is in contact with the power module 11 on the lower surface, and thus is cooled by the internal flow path portion 491 via the power module 11.

[0143] In the present modification example, the power module 11, the current distribution portion 13, and the capacitor 14 are arranged between the lid main body 564A and the flow path member 465 in the up-down direction Z. Also, the cooling flow path 590A is provided in the flow path member 465. According to the present modification example, heat of the electronic components (the power module 11, the current distribution portion 13, and the capacitor 14) arranged between the lid main body 564A and the flow path member 465 can be transferred to the lid main body 564A and the flow path member 465, and it is possible to suppress the temperature of these electronic components from becoming excessively high.

[0144] In the present modification example, the plurality of second electronic components 13, 14 (the current distribution portion 13 and the capacitor 14) overlap the power module 11 in the up-down direction Z. According to the present modification example, it is possible to downsize the control device 507 in a direction perpendicular to the up-down direction Z. In the present modification example, the plurality of second electronic components 13, 14 overlap each other in the up-down direction Z. According to the present modification example, it is possible to downsize the control device 507 in a direction perpendicular to the up-down direction Z.

[0145] (Modification Example 6)

[0146] Figure 8 is a cross-sectional view of the drive device 601 of Modification Example 6. Like the above-described embodiment, the drive device 601 of the present modification example has the motor 2, the transmission mechanism 3 (see Figure 1 ), and the control device 607. In addition, the drive device 601 has a housing link body 606. The housing link body 606 has the motor housing 6A, the gear housing 6B (see Figure 1 ), and an electronic component housing 606C (housing). The flow path 690 is provided in the housing link body 606.

[0147] The electronic component housing 606C of the present modification example has the housing portion 61A and a third lid member 664. In addition, the third lid member 664 has a lid main body 664A and the flow path member 465. The lid main body 664A has a plurality of support column portions 664d in addition to the second bottom wall portion 64b, the second side wall portion 64c, and the second flange portion 64f which are the same as those of the above-described embodiment. The support column portion 664d extends downward (-Z) from the second inner side surface 64k of the second bottom wall portion 64b. The flow path member 465 is attached to a lower end portion of the support column portion 664d. The flow path member 465 is positioned between the first bottom wall portion 61b and the second bottom wall portion 64b in the up-down direction Z. The flow path member 465 opposes the first inner side surface 61k with a gap in the up-down direction Z. In addition, the flow path member 465 opposes the second inner side surface 64k with a gap in the up-down direction Z.

[0148] The power module 11, the power integration system 12, the current distribution portion 13, and the capacitor 14 are housed in the electronic component housing 606C. The power integration system 12 and the current distribution portion 13 are fixed to the second inner side surface 64k of the second bottom wall portion 64b. The power integration system 12 and the current distribution portion 13 are arranged in the first direction D1. In addition, the current distribution portion 13 is positioned on the upper side of the flow path member 465. The current distribution portion 13 and the flow path member 465 can be in contact with each other directly or via a heat transfer material. The power module 11 is fixed to the lower surface of the flow path member 465. The capacitor 14 is fixed to the lower surface of the power module 11. In the present modification, the arrangement of the power module 11 and the power integration system 12 can be exchanged with each other. In the present modification, the arrangement of the current distribution portion 13 and the capacitor 14 can be exchanged with each other.

[0149] The flow path 690 of the present modification has the internal flow path portion 491 provided inside the electronic component housing 606C and the third flow path portion 94 provided in the motor housing 6A. The internal flow path portion 491 extends in a meandering manner inside the flow path member 465. The internal flow path portion 491 is provided in the third cover member 664. The internal flow path portion 491 has a cooling flow path portion 690A that overlaps the power module 11 in the vertical direction Z. The power module 11 is in contact with the lower surface of the flow path member 465. The cooling flow path portion 690A is positioned on the upper side of the power module 11. The internal flow path portion 491 cools the power module 11. According to the present modification, the power module 11 can be efficiently cooled using the plate-shaped flow path member 465. In addition, the capacitor 14 is in contact with the power module 11 on the lower surface, and thus is cooled by the internal flow path portion 491 via the power module 11.

[0150] In the present modification, the current distribution portion 13 is arranged between the cover main body 664A and the flow path member 465 in the vertical direction Z. In addition, the cooling flow path portion 690A is provided in the flow path member 465. According to the present modification, heat of the current distribution portion 13 arranged between the cover main body 664A and the flow path member 465 can be transferred to the cover main body 664A and the flow path member 465, and thus the temperature of the current distribution portion 13 can be prevented from becoming excessively high.

[0151] In the present modification example, the plurality of second electronic components 13, 14 (the current distribution portion 13 and the capacitor 14) overlap the power module 11 in the up-down direction Z. According to the present modification example, it is possible to downsize the control device 607 in a direction perpendicular to the up-down direction Z. In the present modification example, the current distribution portion 13 of the plurality of second electronic components 13, 14 overlaps the power integrated system 12 in the first direction D1. According to the present modification example, it is possible to downsize the control device 607 in the up-down direction Z. In the present modification example, the plurality of second electronic components 13, 14 overlap each other in the up-down direction Z. According to the present modification example, it is possible to downsize the control device 607 in a direction perpendicular to the up-down direction Z.

[0152] (Modification Example 7)

[0153] Figure 9 is a cross-sectional view of the drive device 701 of Modification Example 7. Like the above-described embodiment, the drive device 701 of the present modification example has the motor 2, the transmission mechanism 3 (refer to Figure 1 ), and the control device 707. In addition, the drive device 701 has a housing link body 706. The housing link body 706 has the motor housing 6A, the gear housing 6B (refer to Figure 1 ), and an electronic component housing 706C (housing). The flow path 790 is provided in the housing link body 706.

[0154] The electronic component housing 706C of the present modification example has the housing portion 61A and a third cover member 764. In addition, the third cover member 764 has the cover main body 764A and the flow path member 465. The cover main body 764A has a second bottom wall portion 764b, a second side wall portion 64c, a second flange portion 64f, and a plurality of support column portions 764d.

[0155] The second bottom wall portion 764b of the present modification example has a first bottom plate portion 764g, a second bottom plate portion 764n, and a first step portion 764m. The first bottom plate portion 764g and the second bottom plate portion 764n are in a plate shape extending along a plane perpendicular to the up-down direction Z. The first flow path portion 91 is provided in the first bottom plate portion 764g. The second bottom plate portion 764n is located on the lower side (-Z) and the other side (-D1) of the first direction with respect to the first bottom plate portion 764g. The first step portion 764m connects the first bottom plate portion 764g and the second bottom plate portion 764n.

[0156] The support column portion 764d extends from the first bottom plate portion 764g toward the lower side (-Z). The flow path member 465 is attached to the lower end portion of the support column portion 764d.

[0157] The electronic component housing 706C of the present modification houses the power module 11, the power integration system 12, the current distribution portion 13, and the capacitor 14. In the present modification, the power module 11 is fixed to the lower surface of the first bottom portion 764g. In addition, the power module 11 is in contact with the upper surface of the flow path member 465 directly or via a heat transfer material. The power integration system 12 is fixed to the lower surface of the flow path member 465. The current distribution portion 13 and the capacitor 14 are fixed to the lower surface of the second bottom portion 764n. The current distribution portion 13 and the capacitor 14 are arranged in the first direction D1. In the present modification, the arrangement of the power module 11 and the power integration system 12 can be exchanged with each other. In the present modification, the arrangement of the current distribution portion 13 and the capacitor 14 can be exchanged with each other.

[0158] The flow path 790 has the first flow path portion 91 provided to the electronic component housing 706C, the connection flow path portion 95 and the internal flow path portion 491, and the third flow path portion 94 provided to the motor housing 6A. The first flow path portion 91 has a cooling flow path portion 790A that overlaps the power module 11 and the power integration system 12 in the vertical direction Z. The cooling flow path portion 790A cools the power module 11 that is in contact with the second bottom wall portion 764b.

[0159] The internal flow path portion 491 extends meanderingly inside the flow path member 465. The internal flow path portion 491 has a cooling flow path portion 790B that overlaps the power module 11 and the power integration system 12 in the vertical direction Z. The cooling flow path portion 790B cools the power module 11 and the power integration system 12 that are in contact with the flow path member 465.

[0160] In the present modification, the power module 11 is arranged between the cover body 764A and the flow path member 465 in the vertical direction Z. In addition, the cooling flow path portion 790B is provided to the flow path member 465. According to the present modification, heat of the power module 11 arranged between the cover body 764A and the flow path member 465 can be transferred to the cover body 764A and the flow path member 465, and the temperature of the power module 11 can be suppressed from becoming excessively high. In particular, in the present modification, the power module 11 is arranged between the two cooling flow path portions 790A, 790B in the vertical direction Z. Thus, the power module 11 is effectively cooled from both sides in the vertical direction Z by the two cooling flow path portions 790A, 790B.

[0161] In the present modification example, the plurality of second electronic components 13, 14 overlap the cooling flow path portion 790B in the first direction D1. According to the present modification example, it is possible to downsize the control device 707 in the up-down direction Z. In the present modification example, the plurality of second electronic components 13, 14 overlap the power module 11 in the first direction D1. According to the present modification example, it is possible to downsize the control device 707 in the up-down direction Z. In the present modification example, the plurality of second electronic components 13, 14 overlap each other in the first direction D1. According to the present modification example, it is possible to downsize the control device 707 in the up-down direction Z.

[0162] (Modification Example 8)

[0163] Figure 10 is a cross-sectional view of the drive device 801 of Modification Example 8. Like the above-described embodiment, the drive device 801 of the present modification example has the motor 2, the transmission mechanism 3 (refer to Figure 1 ), and the control device 807. In addition, the drive device 801 has a housing link body 806. The housing link body 806 has the motor housing 6A, the gear housing 6B (refer to Figure 1 ), and an electronic component housing 806C (housing). The flow path 890 is provided in the housing link body 806.

[0164] The electronic component housing 806C of the present modification example has the housing portion 61A and a third cover member 864. In addition, the third cover member 864 has a cover main body 864A and the flow path member 465. The cover main body 864A has a plurality of support column portions 864d in addition to the second side wall portion 64c and the second flange portion 64f. The support column portions 864d extend downward (-Z) from the second bottom wall portion 64b. The flow path member 465 is attached to the lower end portions of the support column portions 864d.

[0165] In the electronic component housing 806C of the present modification example, the power module 11, the power integrated system 12, the current distribution portion 13, and the capacitor 14 are housed. In the present modification example, the current distribution portion 13 is fixed to the lower surface of the second bottom wall portion 64b. The power integrated system 12 is fixed to the upper surface of the flow path member 465. The power module 11 is fixed to the lower surface of the flow path member 465. The capacitor 14 is fixed to the upper surface of the first bottom wall portion 61b. In the present modification example, the current distribution portion 13, the power integrated system 12, the power module 11, and the capacitor 14 are arranged in the up-down direction Z. In the present modification example, the arrangement of the power module 11 and the power integrated system 12 can be exchanged with each other. In the present modification example, the arrangement of the current distribution portion 13 and the capacitor 14 can be exchanged with each other.

[0166] The flow path 890 has an inner flow path portion 491 and a third flow path portion 94. The inner flow path portion 491 extends meanderingly inside the flow path member 465. The inner flow path portion 491 has a cooling flow path portion 890A that overlaps the power module 11 and the power integration system 12 in the up-down direction Z. The cooling flow path portion 890A cools the power module 11 and the power integration system 12 that are in contact with the flow path member 465.

[0167] In the present modification example, the power integration system 12 is disposed between the lid main body 864A and the flow path member 465 in the up-down direction Z. According to the present modification example, heat transfer from the power integration system 12 disposed between the lid main body 864A and the flow path member 465 to the lid main body 864A and the flow path member 465 is facilitated, and it is possible to suppress the temperature of the power integration system 12 from becoming excessively high.

[0168] In the present modification example, the plurality of second electronic components 13, 14 overlap the cooling flow path portion 890A in the up-down direction Z. According to the present modification example, it is possible to downsize the control device 807 in a direction perpendicular to the up-down direction Z. In the present modification example, the plurality of second electronic components 13, 14 overlap the power module 11 and the power integration system 12 in the up-down direction Z. According to the present modification example, it is possible to downsize the control device 807 in a direction perpendicular to the up-down direction Z. In the present modification example, the plurality of second electronic components 13, 14 overlap each other in the up-down direction Z. According to the present modification example, it is possible to downsize the control device 807 in a direction perpendicular to the up-down direction Z.

[0169] The capacitor 14 of the present modification example is fixed to the common wall portion 61n. A portion of the third flow path portion 94 is provided to the common wall portion 61n. Therefore, the third flow path portion 94 is able to cool the capacitor 14.

[0170] (Modification Example 9)

[0171] Figure 11 is a cross-sectional view of a drive device 901 of Modification Example 9. Like the above-described embodiment, the drive device 901 of the present modification example has a motor 2, a transmission mechanism 3 (refer to Figure 1 ), and a control device 907. In addition, the drive device 901 has a housing link body 906. The housing link body 906 has a motor housing 6A, a gear housing 6B (refer to Figure 1 ), and an electronic component housing 906C (housing). The flow path 990 is provided to the housing link body 906.

[0172] The electronic component housing 906C of the present modification example houses the power module 11, the power integration system 12, the current distribution portion 13, the capacitor 14, and the heating device 115. The power integration system 12 and the capacitor 14 are fixed to the second inner side surface 64k of the second bottom wall portion 64b. On the other hand, the power module 11, the current distribution portion 13, and the heating device 115 are fixed to the first inner side surface 61k of the first bottom wall portion 61b.

[0173] The flow path 990 has the first flow path portion 91, the connection flow path portion 95, and the third flow path portion 94. The first flow path portion 91 is provided to the second bottom wall portion 64b. The first flow path portion 91 has a cooling flow path portion 990A that overlaps the power module 11 and the power integration system 12 in the up-down direction Z. Thus, the first flow path portion 91 cools the power integration system 12. In addition, the first flow path portion 91 can cool the power module 11.

[0174] In the present modification example, the power module 11 and the power integration system 12 overlap in the up-down direction Z. According to the present modification example, the power module 11 and the power integration system 12 are arranged in the first direction D1, whereby the control device 907 can be suppressed from being large in a direction perpendicular to the up-down direction Z.

[0175] According to the present modification example, the power module 11 is fixed to the housing portion 61A, and the power integration system 12 is fixed to the third cover member 64. According to the present modification example, heat of the power module 11 can be dissipated via the housing portion 61A, and heat of the power integration system 12 can be dissipated via the third cover member 64.

[0176] The power module 11 of the present modification example is fixed to the common wall portion 61n. A part of the third flow path portion 94 is provided to the common wall portion 61n. Thus, the third flow path portion 94 can cool the power module 11.

[0177] (Modification Example 10)

[0178] Figure 12 is a cross-sectional view schematically showing the drive device 1001 of Modification Example 10. Like the above-described embodiment, the drive device 1001 of the present modification example has the motor 2, the transmission mechanism 3 (see Figure 1 ), and the control device 1007. In addition, the drive device 1001 has a housing connecting body 1006. The housing connecting body 1006 has the motor housing 6A, the gear housing 6B (see Figure 1 ), and an electronic component housing 1006C (housing). The flow path 1090 is provided to the housing connecting body 1006.

[0179] The electronic component housing 1006C of this modification example has the housing portion 61A, a third cover member (cover portion) 1064, and a fourth cover member 1065. The third cover member 1064 is positioned on the upper side of the housing portion 61A and covers the first opening portion 61h. The third cover member 1064 has a second opening portion 1064h that is open on the upper side (+Z).

[0180] The third cover member 1064 has a second bottom wall portion 1064b, a second side wall portion 1064c, a second flange portion 1064d, and a third flange portion 1064f. The second bottom wall portion 1064b extends along a plane perpendicular to the up-down direction Z. The second bottom wall portion 1064b covers the first opening portion 61h of the housing portion 61A. The second bottom wall portion 1064b divides the internal space of the housing portion 61A and the internal space of the third cover member 1064. The second bottom wall portion 1064b has a second inner side surface 1064k facing the lower side (-Z) and a third inner side surface 1064s facing the upper side (+Z). The second side wall portion 1064c extends from the outer edge of the second bottom wall portion 1064b toward the upper side (+Z).

[0181] The second flange portion 1064d is arranged on the same plane as the second bottom wall portion 1064b. The second flange portion 1064d is provided at the lower end portion of the second side wall portion 1064c. The second flange portion 1064d opposes the first flange portion 61f in the up-down direction Z. The second flange portion 1064d is fastened to the first flange portion 61f. A sealing member can be interposed between the first flange portion 61f and the second flange portion 1064d.

[0182] The third flange portion 1064f is provided at the upper end portion of the second side wall portion 1064c. The third flange portion 1064f surrounds the second opening portion 1064h in a frame shape. The third flange portion 1064f projects in a direction away from the second opening portion 1064h along a plane perpendicular to the up-down direction Z. The fourth cover member 1065 is fastened to the third flange portion 1064f.

[0183] The fourth cover member 1065 is in a plate shape extending along a plane perpendicular to the first direction D1. The fourth cover member 1065 is fastened to the third flange portion 1064f. Thus, the fourth cover member 1065 covers the second opening portion 1064h. A sealing member can be interposed between the third flange portion 1064f and the fourth cover member 1065.

[0184] The electronic component housing 1006C houses the power module 11, the power integration system 12, the current distribution portion 13, the capacitor 14, and the heating device 115. The internal space of the electronic component housing 1006C has a first housing space B1 and a second housing space B2. The first housing space B1 is surrounded by the housing portion 61A and the third cover member 1064. The power module 11, the capacitor 14, and the heating device 115 are disposed in the first housing space B1. The power module 11, the capacitor 14, and the heating device 115 are fixed to the second inner side surface 1064k. The second housing space B2 is surrounded by the third cover member 1064 and the fourth cover member 1065. The power integration system 12 and the current distribution portion 13 are disposed in the second housing space B2. The power integration system 12 and the current distribution portion 13 are fixed to the third inner side surface 1064s. That is, all of the electronic components (the power module 11, the capacitor 14, the heating device 115, the power integration system 12, and the current distribution portion 13) of the control device 1007 are fixed to the second bottom wall portion 1064b.

[0185] The flow path 1090 of the present modification has the cooling flow path portion 1090A, the connection flow path portion 95, and the third flow path portion 94. In addition, the cooling flow path portion 1090A has the first flow path portion 1091 and the second flow path portion 1092. The cooling flow path portion 1090A overlaps the power module 11 and the power integration system 12 in the up-down direction Z. In addition, the cooling flow path portion 1090A is disposed between the power module 11 and the power integration system 12. The cooling flow path portion 1090A can cool the power module 11 and the power integration system 12 at the same time. In particular, the cooling flow path portion 1090A of the present modification is provided to the second bottom wall portion 1064b in which the power module 11 and the power integration system 12 are fixed. Therefore, the cooling flow path portion 1090A can directly cool the power module 11 and the power integration system 12. In addition, other electronic components (the current distribution portion 13, the capacitor 14, and the heating device 115) are fixed to the second bottom wall portion 1064b. The fluid flowing in the cooling flow path portion 1090A cools the second bottom wall portion 1064b, and thus can indirectly cool the other electronic components (the current distribution portion 13, the capacitor 14, and the heating device 115).

[0186] The first flow path portion 1091 and the second flow path portion 1092 of the present modification are arranged in the up-down direction Z. The first flow path portion 1091 is located on the lower side (-Z) with respect to the second flow path portion 1092. The first flow path portion 1091 cools the power module 11. The second flow path portion 1092 cools the power integration system 12.

[0187] The first flow path portion 1091 and the second flow path portion 1092 are connected to each other. Thus, the first flow path portion 1091 and the second flow path portion 1092 constitute one circulation flow path in which the same fluid flows. Thus, it is possible to simplify the configuration of the flow path 1090 including the first flow path portion 1091 and the second flow path portion 1092. In addition, the first flow path portion 1091 and the second flow path portion 1092 can also be parts of separate circulation flow paths, in which case, different fluids can also flow in the first flow path portion 1091 and the second flow path portion 1092, respectively.

[0188] In the present modification example, the power module 11, the first flow path portion 1091, the second flow path portion 1092, and the power integration system 12 are arranged in the up-down direction Z. Thus, it is possible to suppress the control device 1007 from being large in a direction perpendicular to the up-down direction Z.

[0189] (Modification Example 11)

[0190] Figure 13 is a cross-sectional view of the drive device 1101 of Modification Example 11. Like the above-described embodiment, the drive device 1101 of the present modification example has the motor 2, the transmission mechanism 3 (see Figure 1 ), and the control device 1107. In addition, the drive device 1101 has a housing connection body 1106. The housing connection body 1106 has the motor housing 6A, the gear housing 6B (see Figure 1 ), and an electronic component housing 1106C (housing). The flow path 1190 is provided in the housing connection body 1106.

[0191] The electronic component housing 1106C houses the power module 11, the power integration system 12, the current distribution portion 13, the capacitor 14, and the heating device 115. The power module 11, the capacitor 14, and the heating device 115 are fixed to the second inner side surface 1064k. The power integration system 12 and the current distribution portion 13 are fixed to the third inner side surface 1064s. That is, all of the electronic components (the power module 11, the capacitor 14, the heating device 115, the power integration system 12, and the current distribution portion 13) of the control device 1107 are fixed to the second bottom wall portion 1064b.

[0192] The flow path 1190 of the present modification has a cooling flow path portion 1190A. In addition, the cooling flow path portion 1190A has a first flow path portion 1191 and a second flow path portion 1192. The cooling flow path portion 1190A overlaps the power module 11 and the power integration system 12 in the up-down direction Z. In addition, the cooling flow path portion 1190A is arranged between the power module 11 and the power integration system 12. The cooling flow path portion 1190A can cool the power module 11 and the power integration system 12 at the same time. In particular, the cooling flow path portion 1190A of the present modification is provided to the second bottom wall portion 1064b in which the power module 11 and the power integration system 12 are fixed. In addition, other electronic components (the current distribution portion 13, the capacitor 14, and the heating device 115) are fixed to the second bottom wall portion 1064b. The fluid flowing in the cooling flow path portion 1190A cools the second bottom wall portion 1064b, and thus can indirectly cool the other electronic components (the current distribution portion 13, the capacitor 14, and the heating device 115).

[0193] The first flow path portion 1191 and the second flow path portion 1192 of the present modification are arranged in the first direction D1. The first flow path portion 1191 cools the power module 11. The second flow path portion 1192 cools the power integration system 12.

[0194] The first flow path portion 1191 and the second flow path portion 1192 are connected to each other. Therefore, the first flow path portion 1191 and the second flow path portion 1192 constitute one circulation flow path in which the same fluid flows. Therefore, it is possible to simplify the configuration of the flow path 1190 including the first flow path portion 1191 and the second flow path portion 1192.

[0195] In the present modification, the first flow path portion 1191 and the second flow path portion 1192 are arranged in the first direction D1, and thus it is possible to thin the second bottom wall portion 1064b, and thus it is possible to downsize the control device 1107 in the up-down direction Z, as compared with the case where the first flow path portion 1191 and the second flow path portion 1192 are arranged so as to overlap each other in the up-down direction Z.

[0196] The above describes the embodiment of the present application, but the structures and combinations thereof in the embodiment are one example, and it is possible to add, omit, replace, and change other structures within the scope of the gist of the present application. In addition, the present application is not limited to the embodiment.

[0197] In particular, the structure of the control device shown in the above embodiment and the present modification is only one example. The control device can be a device having at least a power module, and can have other arbitrary electronic components.

[0198] In addition, the present technology can employ the following structure.

[0199] (1) A control device that is located on an upper side of a motor that controls the motor, characterized by having: a power module; a first electronic component that has any function of voltage adjustment, current distribution, or a capacitor; and a housing that houses the power module and the first electronic component, the housing having: a housing portion that has an opening portion that is open on an upper side; and a cover portion that covers the opening portion, a flow path being provided in the cover portion, the flow path having a cooling flow path portion that overlaps at least one of the power module or the first electronic component in a vertical direction.

[0200] (2) The control device according to (1), characterized in that the cooling flow path portion is located on an upper side of at least one of the power module or the first electronic component.

[0201] (3) The control device according to (1) or (2), characterized in that the power module and the first electronic component are fixed to the cover portion, the cooling flow path portion including: a first flow path portion that is provided in the cover portion and cools the power module; and a second flow path portion that is provided in the cover portion and cools the first electronic component.

[0202] (4) The control device according to (3), characterized in that a direction that is perpendicular to the vertical direction is set as a first direction, the first flow path portion and the second flow path portion being arranged in the vertical direction or the first direction.

[0203] (5) The control device according to (3) or (4), characterized in that the first flow path portion and the second flow path portion are connected to each other.

[0204] (6) The control device according to any one of (1) to (5), characterized in that a direction that is perpendicular to the vertical direction is set as a first direction, the power module and the first electronic component being arranged in the first direction.

[0205] (7) The control device according to any one of (1) to (5), characterized in that the power module and the first electronic component are arranged in the vertical direction.

[0206] (8) The control device according to (6) or (7), characterized in that the power module is arranged on a lower side with respect to the first electronic component.

[0207] (9) The control device according to (1), characterized in that the cooling flow path portion is located on a lower side of at least one of the power module or the first electronic component.

[0208] (10) The control device according to any one of (1) to (9), characterized in that a direction perpendicular to the up-down direction is set as a first direction, and the cooling flow path portion overlaps at least one of the power module or the first electronic component in the first direction.

[0209] (11) The control device according to any one of (1) to (10), characterized in that the cover portion has a cover main body positioned on an upper side of the opening portion, and a wall portion fixed to the cover main body and positioned on a lower side of the cover main body, the power module or the first electronic component being disposed between the cover main body and the wall portion in the up-down direction, the cooling flow path portion being provided to the wall portion.

[0210] (12) The control device according to any one of (1) to (11), characterized in that the control device has a second electronic component housed in the housing, the second electronic component having any function of voltage adjustment, current distribution, or a capacitor, and in that a direction perpendicular to the up-down direction is set as a first direction, the second electronic component overlapping the cooling flow path portion in the up-down direction or the first direction.

[0211] (13) The control device according to any one of (1) to (12), characterized in that the control device has a second electronic component housed in the housing, the second electronic component having any function of voltage adjustment, current distribution, or a capacitor, and in that a direction perpendicular to the up-down direction is set as a first direction, the second electronic component overlapping at least one of the power module or the first electronic component in the up-down direction or the first direction.

[0212] (14) The control device according to (12) or (13), characterized in that the control device has a plurality of the second electronic components.

[0213] (15) The control device according to (14), characterized in that the plurality of the second electronic components overlap each other in the up-down direction or the first direction.

[0214] (16) The control device according to any one of (1) to (15), characterized in that the power module is fixed to the housing portion, and the first electronic component is fixed to the cover portion.

[0215] (17) The control device according to any one of (1) to (15), characterized in that the power module is fixed to the cover portion, and the first electronic component is fixed to the housing portion.

[0216] (18) The control device according to any one of (1) to (15), characterized in that the power module and the first electronic component are fixed to the cover portion.

[0217] (19) The control device according to any one of (1) to (18), characterized in that the control device has a heating device having a heater portion and a control portion that controls the heater portion, the control portion being housed in the housing.

[0218] (20) A drive device characterized by the control device according to any one of (1) to (19), the motor, and a motor housing that houses the motor, the housing and the motor housing being joined to each other.

[0219] (21) The drive device according to (20), characterized in that the flow path has a third flow path portion provided to the motor housing, the third flow path portion cooling the motor, the third flow path portion being connected to a portion of the flow path provided to the cover portion.

Claims

1. A control device that is located on an upper side of a motor that controls the motor, characterized by comprising: a power module; a first electronic component that has any of a voltage adjustment, a current distribution, or a capacitor; and a housing that houses the power module and the first electronic component, the housing having: a housing portion that has an opening portion that is open on an upper side; and a cover portion that covers the opening portion, a flow path being provided in the cover portion, the flow path having a cooling flow path portion that overlaps at least one of the power module or the first electronic component in a vertical direction.

2. The control device according to claim 1, characterized in that the cooling flow path portion is located on an upper side of at least one of the power module or the first electronic component.

3. The control device according to claim 1, characterized in that the power module and the first electronic component are fixed to the cover portion, the cooling flow path portion including: a first flow path portion that is provided in the cover portion and cools the power module; and a second flow path portion that is provided in the cover portion and cools the first electronic component.

4. The control device according to claim 3, characterized in that a direction that is perpendicular to the vertical direction is set as a first direction, the first flow path portion and the second flow path portion being arranged in the vertical direction or the first direction.

5. The control device according to claim 3, characterized in that the first flow path portion and the second flow path portion are connected to each other.

6. The control device according to claim 1, characterized in that a direction that is perpendicular to the vertical direction is set as a first direction, the power module and the first electronic component being arranged in the first direction.

7. The control device according to claim 1, characterized in that the power module and the first electronic component are arranged in the vertical direction.

8. The control device according to claim 6 or 7, characterized in that the power module is arranged on a lower side with respect to the first electronic component.

9. The control device according to claim 1, characterized in that the cooling flow path portion is located on a lower side of at least one of the power module or the first electronic component.

10. The control device according to claim 1, characterized in that a direction that is perpendicular to the vertical direction is set as a first direction, the cooling flow path portion overlapping at least one of the power module or the first electronic component in the first direction.

11. The control device according to claim 1, characterized in that the cover portion has: a cover main body that is located on an upper side of the opening portion; and a wall portion that is fixed to the cover main body and is located on a lower side of the cover main body, the power module or the first electronic component being arranged between the cover main body and the wall portion in the vertical direction, the cooling flow path portion being provided in the wall portion.

12. The control device according to claim 1, characterized in that the control device has a second electronic component that is housed in the housing, the second electronic component having any of a voltage adjustment, a current distribution, or a capacitor, a direction that is perpendicular to the vertical direction being set as a first direction, ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ The second electronic component overlaps the cooling flow path portion in the up-and-down direction or the first direction.

13. The control device according to claim 1, wherein the control device has a second electronic component housed in the housing, the second electronic component has any function of voltage adjustment, current distribution, or a capacitor, a direction perpendicular to the up-and-down direction is set as a first direction, the second electronic component overlaps the power module or the first electronic component in the up-and-down direction or the first direction.

14. The control device according to claim 12 or 13, wherein the control device has a plurality of the second electronic components.

15. The control device according to claim 14, wherein the plurality of the second electronic components overlap each other in the up-and-down direction or the first direction.

16. The control device according to claim 1, wherein the power module is fixed to the housing portion, the first electronic component is fixed to the cover portion.

17. The control device according to claim 1, wherein the power module is fixed to the cover portion, the first electronic component is fixed to the housing portion.

18. The control device according to claim 1, wherein the power module and the first electronic component are fixed to the cover portion.

19. The control device according to claim 1, wherein the control device has a heating device having a heater portion and a control portion that controls the heater portion, the control portion is housed in the housing.

20. A drive device, comprising: a control device according to any one of claims 1 to 19; a motor; and a motor housing that houses the motor, the housing and the motor housing are joined to each other.

21. The drive device according to claim 20, wherein the flow path has a third flow path portion provided to the motor housing, the third flow path portion cooling the motor, the third flow path portion is connected to a portion of the flow path provided to the cover portion. ​

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