Camera module and electronic equipment

Abstract

The utility model relates to a camera module and electronic equipment. The camera module comprises a lens assembly; the circuit substrate comprises a first substrate provided with the lens assembly and a second substrate connected with the first substrate; the second substrate comprises a signal layer and a grid ground layer which are arranged in a stacked mode. The signal line is located on the surface, facing the grid ground layer, of the signal layer and electrically connected with the lens assembly; the first grounding wire is located on the surface, facing the signal layer, of the grid ground layer in the second substrate; wherein the projection of the signal line to the grid stratum at least partially covers the first grounding line. According to the embodiment of the invention, the shielding effect of the second substrate for the radio frequency antenna can be enhanced, and the user experience is improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electronic devices, and in particular, to a camera module and an electronic device. BACKGROUND

[0002] With the rapid development of communication technology, electronic devices such as mobile phones have increasingly rich functions to meet the urgent needs of users for high-performance electronic products. However, the richness of product functions relies on the dense configuration of internal devices of electronic devices, which brings increasingly serious electromagnetic interference (EMI) problems.

[0003] Among the series of difficult problems of electronic devices for electromagnetic compatibility (EMC), camera anti-interference has become a research and development pain point at the present stage due to its serious burstiness, hysteresis and complexity. Camera anti-interference refers to the ability of a camera module to effectively resist electromagnetic interference in a complete machine environment. When an electronic device communicates using a radio frequency antenna, the energy radiated by the radio frequency antenna will usually interfere with the Mobile Industry Processor Interface (MIPI) signal of the camera module, and then the camera will appear to be stuck, which affects the user experience. Therefore, the electromagnetic interference problem between the camera module and the radio frequency antenna in the electronic device needs to be solved urgently. UTILITY MODEL CONTENT

[0004] To overcome the problems in the related art, the present disclosure provides a camera module and an electronic device. The camera module provided by the present disclosure can enhance the shielding effect of the second substrate on the radio frequency antenna and improve the user experience.

[0005] In a first aspect of the embodiments of the present disclosure, a camera module is provided, which at least includes:

[0006] a lens assembly;

[0007] a circuit substrate including a first substrate on which the lens assembly is mounted and a second substrate connected to the first substrate; wherein the second substrate includes a signal layer and a mesh ground layer arranged in a stack;

[0008] a signal line located on a surface of the signal layer facing the mesh ground layer and electrically connected to the lens assembly;

[0009] a first ground line located on a surface of the mesh ground layer in the second substrate facing the signal layer; wherein a projection of the signal line to the mesh ground layer at least partially covers the first ground line.

[0010] In some embodiments, a projection of the signal line to the mesh ground layer coincides with the first ground line.

[0011] In some embodiments, the first substrate comprises: a first ground layer, the signal layer, the mesh ground layer and a second ground layer which are sequentially stacked; and the camera module further comprises:

[0012] A second ground line is located on a surface of the mesh ground layer in the first substrate facing the signal layer and connects one end of the first ground line facing the lens assembly; wherein a projection of the signal line to the mesh ground layer at least partially covers the second ground line.

[0013] In some embodiments, the circuit substrate further comprises a third substrate connected to the second substrate, the third substrate comprising: the first ground layer, the signal layer, the mesh ground layer and the second ground layer which are sequentially stacked; and the camera module further comprises:

[0014] A third ground line is located on a surface of the mesh ground layer in the third substrate facing the signal layer and connects one end of the first ground line away from the lens assembly; wherein a projection of the signal line to the mesh ground layer at least partially covers the third ground line.

[0015] In some embodiments, the second ground line, the first ground line and the third ground line are integrally formed.

[0016] In some embodiments, the camera module further comprises:

[0017] A connector is located on a surface of the third substrate away from the lens assembly and is electrically connected to the lens assembly through the signal line.

[0018] In some embodiments, the connector comprises a board-to-board connector.

[0019] In some embodiments, the signal line comprises a mobile industry processor interface signal line, and the second substrate comprises a flexible substrate.

[0020] A second aspect of the embodiments of the present disclosure provides an electronic device, comprising at least:

[0021] A middle frame;

[0022] A radio frequency antenna is arranged on a side of the middle frame;

[0023] The camera module as described in the first aspect, a circuit substrate of the camera module is fixed on the middle frame, and a lens assembly of the camera module is close to the radio frequency antenna.

[0024] In some embodiments, the electronic device further comprises:

[0025] A circuit board is fixed to the middle frame and is arranged apart from the radio frequency antenna.

[0026] The lens assembly is electrically connected to the circuit board through the circuit substrate and the connector of the camera module.

[0027] The technical solution provided by the embodiments of the present disclosure can include the following beneficial effects:

[0028] The camera module provided by the embodiments of the present disclosure includes: a lens assembly; a circuit substrate including a first substrate on which the lens assembly is mounted and a second substrate connected to the first substrate; wherein the second substrate includes a signal layer and a mesh ground layer arranged in layers; a signal line located on a surface of the signal layer facing the mesh ground layer and electrically connected to the lens assembly; a first ground line located on a surface of the mesh ground layer of the second substrate facing the signal layer; wherein a projection of the signal line to the mesh ground layer at least partially covers the first ground line.

[0029] In this way, the first ground line of the signal line mirror image can be added on the surface of the mesh ground layer of the second substrate facing the signal layer, and when the radio frequency antenna transmits wireless signals near the camera module, the first ground line in the second substrate can ground the signal line in the second substrate to shield the electromagnetic interference of the radio frequency antenna on the signal line in the second substrate, thereby enhancing the shielding effect of the second substrate on the radio frequency antenna and improving the user experience; and the embodiments of the present disclosure do not need to additionally increase shielding or grounding devices in the camera module, thereby reducing the development cost of the camera module and reducing the occupied space of the camera module in the electronic device.

[0030] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0031] The accompanying drawings, which are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present disclosure and, together with the specification, serve to explain the principles of the present disclosure.

[0032] Figure 1 is a structural schematic diagram of a camera module provided according to an exemplary embodiment Figure 1 .

[0033] Figures 2a-2d is a structural schematic diagram of a conventional camera module according to an exemplary embodiment.

[0034] Figure 3 is a structural schematic diagram of a camera module according to an exemplary embodiment.

[0035] Figure 4is a schematic diagram of a strip line layout and a microstrip line layout in a camera module according to an exemplary embodiment.

[0036] Figure 5 is a schematic diagram of different layouts of ground lines in a camera module according to an exemplary embodiment.

[0037] Figure 6 is a schematic diagram of isolation curves of a camera module under different layouts of ground lines according to an exemplary embodiment.

[0038] Figure 7 is a structural schematic diagram of an electronic device according to an exemplary embodiment.

[0039] Figure 8 is a structural block diagram of an electronic device according to an exemplary embodiment.

[0040] Figures 1 to 7 Reference numerals of the drawings:

[0041] 10 - camera module, 11 - lens assembly, 12 - circuit substrate, 121 - first substrate, 122 - second substrate, 123 - third substrate, 124 - signal layer, 125 - mesh ground layer, 13 - signal line, 14 - first ground line, 126 - first ground layer, 127 - second ground layer, 15 - second ground line, 16 - third ground line, 1 - electronic device, 100 - middle frame, 101 - radio frequency antenna, 102 - circuit board, L1 - ground spring, L2 - shielding film, 21 - traditional lens, 22 - first hard substrate, 23 - second hard substrate, 24 - soft substrate, 25 - conductive cloth, 26 - grounding point, 27 - EMI film. DETAILED DESCRIPTION

[0042] The exemplary embodiments will be described in detail herein with reference to the attached drawings. The following description is made with reference to the accompanying drawings in which like reference numerals refer to like elements, unless the context of use indicates otherwise. The following description of exemplary embodiments is not representative of all embodiments consistent with the present disclosure. Rather, it is merely an example of structures consistent with some aspects of the present disclosure as detailed in the appended claims.

[0043] In the description of the present disclosure, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0044] In the description of the present disclosure, it needs to be understood that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances.

[0045] The technical solutions provided by various embodiments of the present disclosure will be described in detail below in combination with the drawings.

[0046] At present, when the electronic device communicates by using the radio frequency antenna, the energy radiated by the radio frequency antenna usually causes electromagnetic interference to the MIPI signal of the camera module, and then the camera freezes and other phenomena affecting the user experience occur.

[0047] Based on this, the present embodiment provides a camera module. Figure 1 The structure of the camera module provided according to an exemplary embodiment is shown in Figure 1 As shown in Figure 1 The camera module 10 can include:

[0048] A lens assembly 11;

[0049] A circuit substrate 12 including a first substrate 121 on which the lens assembly 11 is mounted and a second substrate 122 connected to the first substrate 121; wherein the second substrate 122 includes a signal layer 124 and a mesh ground layer 125 arranged in layers;

[0050] A signal line 13 located on the surface of the signal layer 124 facing the mesh ground layer 125 and electrically connected to the lens assembly 11;

[0051] A first ground line 14 located on the surface of the mesh ground layer 125 of the second substrate 122 facing the signal layer 124; wherein the projection of the signal line 13 to the mesh ground layer 125 at least partially covers the first ground line 14.

[0052] In the embodiments of the present disclosure, the electronic device can be any device with a camera module. Here, the electronic device can include a terminal device, for example, a mobile terminal or a fixed terminal. The mobile terminal can include a mobile phone, a tablet computer, a notebook computer, a wearable electronic device, and the like; the fixed terminal can include a desktop computer, a smart television, a vehicle-mounted device, and the like, which are not limited in the embodiments of the present disclosure.

[0053] It should be noted that the lens assembly can be a front camera assembly, a rear camera assembly, or a long-focus lens assembly in the electronic device, which is not limited in the embodiments of the present disclosure.

[0054] In the embodiments of the present disclosure, the circuit substrate can be used to carry electronic devices such as the lens assembly in the camera module, and realize electrical connection between the electronic devices such as the lens assembly. For example, the circuit substrate can realize electrical connection between the lens assembly and a circuit board in the electronic device.

[0055] Here, the circuit substrate can include a first substrate and a second substrate connected together. The first substrate can include a hard substrate, for example, a printed circuit board (PCB); the second substrate can include a flexible substrate, for example, a flexible printed circuit (FPC).

[0056] It can be understood that the FPC generally includes two layers of boards, that is, the second substrate can include a signal layer and a mesh ground layer arranged in layers. The PCB generally includes four layers of boards, that is, the first substrate can include a first ground layer, a signal layer, a mesh ground layer, and a second ground layer on which the lens assembly is mounted, arranged in layers.

[0057] The signal layer can be a dielectric layer with non-conductive properties and used to arrange signal lines. The mesh ground layer can be a ground layer with a grid-shaped conductive ground part, that is, the mesh ground layer can include a dielectric substrate with non-conductive properties and a grid-shaped conductive ground part arranged on the dielectric substrate; for example, the mesh ground layer presents a grid-shaped copper foil pattern in the first substrate or the second substrate, which has a grounding effect and the ability to suppress high-frequency interference.

[0058] The first ground layer and the second ground layer can both be a conductive area with an integral area. Since the first ground layer is arranged adjacent to the signal layer, that is, the signal lines can be seen as covering the first ground layer, the first ground layer can be regarded as a complete ground layer; since the second ground layer is arranged spaced apart from the signal layer by the mesh ground layer, that is, the signal lines can be seen as not covering the second ground layer, the second ground layer can be regarded as an incomplete ground layer.

[0059] Here, the signal line can be a transmission line in the camera module used to transmit signals between the lens assembly and the circuit board in the electronic device; one end of the signal line can be connected to the lens assembly, and the other end of the signal line can be connected to the circuit board in the electronic device.

[0060] It should be noted that the specific type of signal cable can be set according to the actual application scenario, and this disclosure does not impose any limitations. For example, the signal cable may include, but is not limited to: MIPI signal cable, Low-Voltage Differential Signaling (LVDS) signal cable, or High Definition Multimedia Interface (HDMI) signal cable, etc.

[0061] In this embodiment of the disclosure, the first grounding wire may be a grounding wire obtained by applying a conductive material such as copper to the projection area of ​​the signal line onto the grid ground layer on the second substrate.

[0062] It is understandable that when the radio frequency antenna on the electronic device is located near the camera module or close to the lens assembly, the first grounding wire in the projection area of ​​the signal line in the second substrate onto the grid ground layer can shield the electromagnetic interference of the radio frequency antenna to the signal line in the second substrate by grounding the signal line in the second substrate, thereby enhancing the shielding effect of the second substrate against the radio frequency antenna.

[0063] Here, the projection of the signal line onto the grid ground layer can partially cover the first ground line or completely cover the first ground line; when the first ground line is disposed on the surface of the grid ground layer facing the signal layer in the second substrate along the extension direction of the signal line, the first ground line can coincide with the signal line in the second substrate.

[0064] In some embodiments, such as Figure 1 As shown, the projection of signal line 13 onto the grid ground layer 125 coincides with the first ground line 14. Thus, the signal line can coincide with the first ground line between the signal layer and the grid ground layer, thereby achieving better effective grounding of the signal line and further enhancing the shielding effect of the second substrate for the RF antenna.

[0065] It should be noted that the specific material of the first grounding wire can be set according to the actual application scenario, as long as it is a material with conductive properties, and this embodiment does not impose any restrictions. For example, the material of the first grounding wire can be metal, graphite, conductive plastic, or conductive rubber, etc.

[0066] In the related art, as mentioned above, the camera anti-interference problem is currently usually suppressed by grounding or shielding measures from cutting off the propagation path and improving the anti-interference ability of the electronic device, such as adding grounding tabs or conductive foam at the key path, using EMI film in the soft plate area of the camera module, and using self-shielding in the BTB connector area of the camera module.

[0067] As shown in L1, a grounding tab is added in the front camera module of the mobile phone, that is, a copper sheet is attached to the head of the front camera module of the mobile phone, and the copper sheet is pulled to the ground at the BTB area of the front camera module. As shown in L2, a shielding film, such as an EMI film, is added in the soft plate area of the front camera module of the mobile phone. Figure 2a Figure 2c As shown in L1, a grounding tab is added in the front camera module of the mobile phone, that is, a copper sheet is attached to the head of the front camera module of the mobile phone, and the copper sheet is pulled to the ground at the BTB area of the front camera module. As shown in L2, a shielding film, such as an EMI film, is added in the soft plate area of the front camera module of the mobile phone.

[0068] As shown in L1, a grounding tab is added in the front camera module of the mobile phone, that is, a copper sheet is attached to the head of the front camera module of the mobile phone, and the copper sheet is pulled to the ground at the BTB area of the front camera module. As shown in L2, a shielding film, such as an EMI film, is added in the soft plate area of the front camera module of the mobile phone. Figure 2b Figure 2d As shown in L1, a grounding tab is added in the front camera module of the mobile phone, that is, a copper sheet is attached to the head of the front camera module of the mobile phone, and the copper sheet is pulled to the ground at the BTB area of the front camera module. As shown in L2, a shielding film, such as an EMI film, is added in the soft plate area of the front camera module of the mobile phone.

[0069] ​​However, the EMI film, shielding cover, grounding spring or conductive foam adopted in the related art increases the research and development cost of electronic devices such as mobile phones; for example, the unit price of the shielding cover is 0.88 yuan, and assuming that the shipment of the mobile phone reaches 50 million, the cost increases by 44 million yuan for each additional shielding cover; for another example, improper grounding of the EMI film can cause the resonance of the camera module and the radio frequency antenna in a certain frequency band to be enhanced, and the isolation degree deteriorates sharply, and the grounding of the EMI film is less, which reduces the shielding effect of the EMI film, and also increases unnecessary research and development costs. In addition, poor contact of the grounding spring or conductive foam can also induce the phenomenon of radiated spurious emission (RSE) harmonic exceeding, increasing the complexity of the whole machine EMC problem.

[0070] Based on this, the camera module provided by the embodiment of the present disclosure includes: a lens assembly; a circuit substrate including a first substrate on which the lens assembly is mounted and a second substrate connected to the first substrate; wherein the second substrate includes a signal layer and a mesh ground layer arranged in layers; a signal line located on the surface of the signal layer facing the mesh ground layer and electrically connected to the lens assembly; a first ground line located on the surface of the mesh ground layer of the second substrate facing the signal layer; wherein the projection of the signal line to the mesh ground layer at least partially covers the first ground line.

[0071] In this way, the first ground line of the signal line mirror image can be added on the surface of the mesh ground layer of the second substrate facing the signal layer, and when the radio frequency antenna near the camera module transmits wireless signals, the first ground line in the second substrate can ground the signal line in the second substrate to shield the electromagnetic interference of the radio frequency antenna on the signal line in the second substrate, thereby enhancing the shielding effect of the second substrate on the radio frequency antenna and improving the user experience; and the camera module does not need to additionally increase shielding or grounding devices in the camera module, thereby reducing the research and development cost of the camera module and reducing the occupied space of the camera module in the electronic device.

[0072] Figure 3 is a structural schematic diagram of a camera module according to an exemplary embodiment, as Figure 3 shown, the camera module provided by the embodiment of the present disclosure adds other components such as a second ground line and a third ground line on the basis of the camera module shown in Figure 1

[0073] As Figure 3 shown, the first substrate 121 includes: a first ground layer 126, a signal layer 124, a mesh ground layer 125 and a second ground layer 127 arranged in layers; the above-mentioned camera module 10 further includes:

[0074] ​The second ground wire 15 is located on the surface of the grid ground layer 125 in the first substrate 121 facing the signal layer 124, and is connected to one end of the first ground wire 14 facing the lens assembly 11; wherein the projection of the signal line 13 onto the grid ground layer 125 at least partially covers the second ground wire 15.

[0075] In this embodiment of the disclosure, the second grounding wire may be a grounding wire obtained by applying a conductive material such as copper to the projection area of ​​the signal line onto the grid ground layer on the first substrate.

[0076] It should be noted that the first substrate may be a circuit board on which a lens assembly is mounted; the lens assembly may be mounted on the surface of the first ground layer of the first substrate away from the signal layer, or it may be mounted on the surface of the second ground layer of the first substrate away from the signal layer, etc., and the embodiments disclosed herein are not limited thereto.

[0077] Here, the projection of the signal line onto the grid ground layer can partially cover the second ground line or completely cover the second ground line; when the second ground line is disposed on the surface of the grid ground layer facing the signal layer in the first substrate along the extension direction of the signal line, the second ground line can coincide with the signal line in the first substrate.

[0078] It is understandable that when the radio frequency antenna on the electronic device is located near the camera module or close to the lens assembly, the first ground layer, the signal line and the second ground line in the first substrate can form a stripline layout, that is, the signal line is located between the two ground layers; at this time, the energy radiated by the high-frequency signal line will be confined in the circuit board to shield the electromagnetic interference of the radio frequency antenna to the signal line in the first substrate.

[0079] For example, such as Figure 4 As shown, 41 indicates a stripline layout, and 42 indicates a microstrip layout. Before the second ground wire is added to the first substrate, the signal line and the first ground layer in the first substrate constitute the microstrip layout 42, that is, one side of the signal line is exposed and not grounded, while the other side is attached to the signal layer supported by the first ground layer. Due to the lack of a ground layer for current return path and shielding, the microstrip line is more susceptible to external interference than the stripline, so the anti-interference capability of the microstrip line is weak. After the second ground wire is added to the first substrate, the first ground layer, the signal line and the second ground wire in the first substrate constitute the stripline layout 41, that is, the signal line is located between the first ground layer and the second ground wire. At this time, the energy radiated by the high-frequency signal line will be confined in the circuit board to reduce the electromagnetic interference of the radio frequency antenna to the signal line in the first substrate.

[0080] In the embodiments of the present disclosure, the second ground line mirroring the signal line can be added on the surface of the grid ground layer in the first substrate facing the signal layer. When the radio frequency antenna on the electronic device transmits and receives wireless signals, the first ground layer, the signal line and the second ground line in the first substrate can form a strip line layout to shield the electromagnetic interference of the radio frequency antenna on the signal line in the first substrate, thereby effectively enhancing the shielding effect of the first substrate on the radio frequency antenna and improving the user experience. Moreover, the embodiments of the present disclosure do not need to additionally increase shielding or grounding devices in the camera module, so as to reduce the development cost of the camera module and reduce the occupied space of the camera module in the electronic device.

[0081] In some embodiments, as shown in FIG. 1, the circuit substrate 12 further includes a third substrate 123 connected to the second substrate 122, and the third substrate 123 includes a first ground layer 126, a signal layer 124, a grid ground layer 125 and a second ground layer 127 which are sequentially stacked. Figure 3

[0082] A third ground line 16 is located on the surface of the grid ground layer 125 in the third substrate 123 facing the signal layer 124 and connected to one end of the first ground line 14 away from the lens assembly. The projection of the signal line 13 to the grid ground layer 125 at least partially covers the third ground line 16.

[0083] In the embodiments of the present disclosure, the third substrate can be the same as the first substrate, i.e., the third substrate can include a hard substrate, for example, a PCB. The third ground line can be a ground line obtained by applying a conductive material such as copper on the third substrate at the projection area of the signal line to the grid ground layer.

[0084] It should be noted that one end of the signal line can pass through the first ground layer of the first substrate and be electrically connected to the lens assembly, and the other end of the signal line can pass through the grid ground layer and the second ground layer of the third substrate and be electrically connected to the circuit board in the electronic device. Alternatively, one end of the signal line can pass through the grid ground layer and the second ground layer of the first substrate and be electrically connected to the lens assembly, and the other end of the signal line can pass through the first ground layer of the third substrate and be electrically connected to the circuit board in the electronic device, and the like, which are not limited in the embodiments of the present disclosure.

[0085] It can be understood that when the radio frequency antenna near the camera module or close to the lens assembly on the electronic device transmits and receives wireless signals, the first ground layer, the signal line and the third ground line in the third substrate can form a strip line layout, i.e., the signal line is located between the two ground layers. At this time, the energy radiated by the high-frequency signal line is bound in the circuit substrate, and the electromagnetic interference of the radio frequency antenna on the signal line in the third substrate is reduced.

[0086] ​Here, the projection of the signal line onto the grid ground layer can partially cover the third ground line or completely cover the third ground line; when the third ground line is disposed on the surface of the grid ground layer facing the signal layer in the third substrate along the extension direction of the signal line, the third ground line can coincide with the signal line in the third substrate.

[0087] In some embodiments, the second ground wire, the first ground wire, and the third ground wire are all integrally formed. This allows for a better implementation of the stripline layout between the first ground layer, the signal line, and the second ground wire, as well as between the first ground layer, the signal line, and the third ground wire, thereby further enhancing the shielding effect of the circuit board for the RF antenna.

[0088] It should be noted that when the second grounding wire, the first grounding wire, and the third grounding wire are a straight line after being integrally formed, the straight line can coincide with the signal line between the signal layer and the grid ground layer; when the second grounding wire, the first grounding wire, and the third grounding wire are a curve after being integrally formed, the curve can also coincide with the signal line between the signal layer and the grid ground layer. This disclosure does not impose any limitations on the embodiments.

[0089] For example, such as Figure 5 As shown, 51 indicates a pure microstrip layout, 52 indicates a strip-microstrip-strip layout, and 53 indicates a pure stripline layout; as... Figure 6 As shown, 61 indicates the isolation curve corresponding to the pure microstrip layout, 62 indicates the isolation curve corresponding to the strip-microstrip-strip layout, 63 indicates the isolation curve corresponding to the pure stripline layout, and 64 and 65 indicate the isolation curves corresponding to the two verification scenarios. Before the first ground line, second ground line, and third ground line are added to the circuit board, the signal line and the first ground layer in the circuit board constitute a pure microstrip layout 51, at which time the corresponding isolation can be 33dB; after the first ground line, second ground line, and third ground line are added to the circuit board, the first ground layer, signal line, and the integrally formed second ground line, first ground line, and third ground line in the circuit board constitute a strip-microstrip-strip layout 52, at which time the corresponding isolation can be 36dB; it can be seen that the anti-interference benefit of adding the second ground line, first ground line, and third ground line mirrored by the signal line on the surface of the grid ground layer facing the signal layer of the camera module can be improved by 3dB. In addition, the isolation corresponding to the pure stripline layout 53 can be 45dB, but this requires adding complete ground lines on both sides of the signal line, which will not only affect the transmission impedance of the signal line, but also increase the rigidity of the second substrate, which is not in line with the actual application. The isolation corresponding to the other two verification scenarios 64 and 65 can verify that the embodiments of this disclosure can effectively enhance the shielding effect of the circuit board for the radio frequency antenna and reduce the R&D cost of the camera module.

[0090] In the embodiment of the present disclosure, the third ground line mirroring the signal line can be added on the surface of the grid ground layer in the third substrate facing the signal layer. When the radio frequency antenna transmits and receives wireless signals on the electronic device, the first ground layer, the signal line and the third ground line in the third substrate can form a strip line layout to shield the electromagnetic interference of the radio frequency antenna on the signal line in the third substrate, thereby effectively enhancing the shielding effect of the third substrate on the radio frequency antenna and improving the user experience. Moreover, the present embodiment does not need to additionally increase shielding or grounding devices in the camera module, so as to reduce the development cost of the camera module and reduce the occupied space of the camera module in the electronic device.

[0091] In some embodiments, the camera module further includes:

[0092] The connector is located on the surface of the third substrate away from the lens assembly and is electrically connected to the lens assembly through the signal line.

[0093] In this way, the connector can be arranged on the surface of the third substrate away from the lens assembly, and the connector is electrically connected to the lens assembly through the signal line and can be electrically connected to the circuit board in the electronic device, thereby better realizing the connection between the camera module and the circuit board in the electronic device.

[0094] In the embodiment of the present disclosure, the connector can include a board-to-board connector. The BTB connector can realize data transmission and power connection between the lens assembly and the circuit board in the electronic device, and is used in pairs through male and female connectors to improve the stability of the connection.

[0095] Here, when the lens assembly is installed on the surface of the first ground layer in the first substrate away from the signal layer, the connector can be arranged on the surface of the second ground layer in the third substrate away from the signal layer; when the lens assembly is installed on the surface of the second ground layer in the first substrate away from the signal layer, the connector can be arranged on the surface of the first ground layer in the third substrate away from the signal layer.

[0096] It should be noted that when the connector is arranged on the surface of the second ground layer in the third substrate away from the signal layer, the signal line can pass through the grid ground layer and the second ground layer of the third substrate to be electrically connected to the circuit board in the electronic device; when the connector is arranged on the surface of the first ground layer in the third substrate away from the signal layer, the signal line can pass through the first ground layer of the third substrate to be electrically connected to the circuit board in the electronic device, which is not limited in the embodiment of the present disclosure.

[0097] Figure 7 is a structural schematic diagram of an electronic device according to an exemplary embodiment, as Figure 7 As shown in the figure, the electronic device 1 provided by the embodiment of the present disclosure can at least include:

[0098] a middle frame 100;

[0099] a radio frequency antenna 101 disposed on a side of the middle frame 100;

[0100] The camera module 10 of the first aspect, the circuit substrate 12 of the camera module 10 is fixed on the middle frame 100, and the lens assembly 11 of the camera module 10 is close to the radio frequency antenna 101.

[0101] In the embodiments of the present disclosure, the middle frame can be a frame body supporting internal devices in an electronic device. When the middle frame includes a conductive side, the conductive side of the middle frame can be reused as a radio frequency antenna; when the middle frame includes an insulating side, the radio frequency antenna can be disposed on the insulating side by LDS technology.

[0102] It should be noted that the radio frequency antenna can be a Laser-Direct-structuring (LDS) antenna or an FPC antenna, and the embodiments of the present disclosure are not limited thereto.

[0103] Here, a support medium can be disposed between the circuit substrate and the middle frame, for example, a fixed support or a medium substrate made of a non-conductive material is disposed, or an insulating medium is filled, so as to fix the circuit substrate on the middle frame through the support medium.

[0104] It should be noted that when the lens assembly is a front camera in an electronic device, the radio frequency antenna can be located at the top of the electronic device, i.e., close to the front camera; when the lens assembly is a rear camera or a long-focus lens assembly in an electronic device, the radio frequency antenna can be located on the side of the electronic device close to the rear camera or the long-focus lens assembly, and the embodiments of the present disclosure are not limited thereto.

[0105] In some embodiments, the above-mentioned electronic device 1 further includes:

[0106] a circuit board 102 fixed on the middle frame 100 and disposed in a spaced manner with the radio frequency antenna 101;

[0107] The lens assembly 11 is electrically connected to the circuit board 102 through the circuit substrate 12 and the connector of the camera module 10.

[0108] In this way, the lens assembly can be electrically connected to the circuit board in the electronic device through the signal line in the circuit substrate and the connector of the camera module, so as to better realize the function of the camera module while improving the anti-interference capability of the camera module.

[0109] It can be understood that the circuit board can be a mainboard in the electronic device, that is, a PCB board, used to carry electronic components in the electronic device. The circuit board can be provided with a central processing unit (CPU), which can send a control signal to the lens assembly through the circuit board, the connector and the signal line to control the camera module to work.

[0110] The electronic device provided by the embodiments of the present disclosure can add the second ground wire, the first ground wire and the third ground wire of the signal line mirror on the surface of the grid layer of the circuit substrate of the camera module, which can shield the electromagnetic interference of the radio frequency antenna on the signal line in the circuit substrate when the radio frequency antenna transmits and receives wireless signals, thereby enhancing the shielding effect of the circuit substrate on the radio frequency antenna and improving the user experience; and the embodiments of the present disclosure do not need to additionally increase shielding or grounding devices in the camera module, so as to reduce the development cost of the camera module and reduce the occupied space of the camera module in the electronic device.

[0111] Figure 8 is a structural block diagram of an electronic device according to an exemplary embodiment. For example, the electronic device can be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0112] Referring to Figure 8 , the electronic device can include one or more of the following components: a processing component 802, a memory 804, a power supply component 806, a multimedia component 808, an audio component 810, an input / output (I / O) interface 812, a sensor component 814, and a communication component 816.

[0113] The processing component 802 generally controls the overall operation of the electronic device, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing component 802 can include one or more processors 820 to execute instructions to complete all or part of the steps of the methods described above. In addition, the processing component 802 can include one or more modules to facilitate interaction between the processing component 802 and other components. For example, the processing component 802 can include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.

[0114] The memory 804 is configured to store various types of data to support operations of the electronic device. Examples of such data include at least one of instructions for any application or method operating on the electronic device, contact data, phonebook data, messages, pictures, and videos. The memory 804 can be implemented by any type of volatile or nonvolatile memory, or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read only memory (EEPROM), erasable programmable read only memory (EPROM), programmable read only memory (PROM), read only memory (ROM), magnetic memory, flash memory, a magnetic disc or a compact disc.

[0115] The power component 806 supplies power to various components of the electronic device. The power component 806 can include at least one of a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for the electronic device.

[0116] The multimedia component 808 includes a screen providing an output interface between the electronic device and a user. In some embodiments, the screen can include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes the touch panel, the screen can be implemented as a touch screen to receive an input signal from a user. The touch panel includes one or more touch sensors to sense a touch, a slide, and a gesture on the touch panel. The touch sensor can not only sense a boundary of a touching or a sliding action, but also detect duration and pressure related to the touching or sliding action. In some embodiments, the multimedia component 808 includes a front camera and / or a back camera. When the electronic device is in an operation mode, such as a photographing mode or a video mode, the front camera and / or the back camera can receive external multimedia data. Each of the front camera and the back camera can be a fixed optical lens system or have a focal length and optical zoom capability.

[0117] The audio component 810 is configured to output and / or input audio signals. For example, the audio component 810 includes a microphone (MIC) that is configured to receive an external audio signal when the electronic device is in an operation mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signal can be further stored in the memory 804 or transmitted via the communication component 816. In some embodiments, the audio component 810 also includes a speaker for outputting audio signals.

[0118] The I / O interface 812 provides an interface between the processing component 802 and peripheral interface modules, which can be a keyboard, a click wheel, and buttons, etc. The buttons can include, but are not limited to, a home button, a volume button, a start button, and a lock button.

[0119] The sensor component 814 includes one or more sensors for providing various state assessments for the electronic device. For example, the sensor component 814 can detect an open / closed state of the electronic device, relative positioning of components, such as a display and a keypad of the electronic device, a change in position of the electronic device or a component of the electronic device, presence or absence of user contact with the electronic device, the electronic device orientation or acceleration / deceleration, and a temperature change of the electronic device. The sensor component 814 can include a proximity sensor configured to detect presence of a nearby object without any physical touch. The sensor component 814 can further include a light sensor, such as a complementary metal oxide semiconductor (CMOS) or charge coupled device (CCD) image sensor, for use in an imaging application. In some embodiments, the sensor component 814 can further include at least one of the following: an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, and a temperature sensor.

[0120] The communication component 816 is configured to facilitate wired or wireless communication between the electronic device and other devices. The electronic device can access a wireless network based on a communication standard, such as Wi-Fi, 4G, 5G, or a combination thereof. In an example embodiment, the communication component 816 receives a broadcast signal or broadcast related information from an external broadcast management system via a broadcast channel. In an example embodiment, the communication component 816 also includes a Near Field Communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on Radio Frequency Identification (RFID) technology, Infrared Data Association (IrDA) technology, Ultra Wide Band (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0121] In example embodiments, the electronic device can be implemented with one or more Application Specific Integrated Circuits (ASICs), Digital Signal Processors (DSPs), Digital Signal Processing Devices (DSPDs), Programmable Logic Devices (PLDs), Field Programmable Gate Arrays (FPGAs), controllers, microcontrollers, or other electronic elements.

[0122] In example embodiments, a non-transitory computer-readable storage medium including instructions, such as a memory including executable instructions or a computer program, which can be executed by a processor of an electronic device, is also provided. For example, the non-transitory computer-readable storage medium can be a ROM, a Random Access Memory (RAM), a Compact Disc Read-Only Memory (CD-ROM), a magnetic tape, a floppy disc, and an optical data storage device, or the like.

[0123] Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the features disclosed herein. It is intended that the specification and examples be considered as exemplary only, with the true scope and spirit of the disclosure being indicated by the following claims.

[0124] It should be understood that the present disclosure is not limited to the precise structures herein described and illustrated in the drawings, and that various modifications and changes can be made without departing from its scope. The scope of the present disclosure is limited only by the claims that follow.

Claims

1. A camera module, comprising: Comprise: A lens assembly; A circuit substrate comprising a first substrate on which the lens assembly is mounted and a second substrate connected to the first substrate; wherein the second substrate comprises a signal layer and a mesh ground layer which are arranged in layers; A signal line located on a surface of the signal layer facing the mesh ground layer and electrically connected to the lens assembly; A first ground line located on a surface of the mesh ground layer in the second substrate facing the signal layer; wherein a projection of the signal line onto the mesh ground layer at least partially covers the first ground line.

2. The camera module of claim 1, wherein, The projection of the signal line onto the mesh ground layer coincides with the first ground line.

3. The camera module according to claim 1 or 2, wherein The first substrate comprises a first ground layer, the signal layer, the mesh ground layer and a second ground layer which are arranged in layers in turn; the camera module further comprises: A second ground line located on a surface of the mesh ground layer in the first substrate facing the signal layer and connected to one end of the first ground line facing the lens assembly; wherein a projection of the signal line onto the mesh ground layer at least partially covers the second ground line.

4. The camera module of claim 3, wherein, The circuit substrate further comprises a third substrate connected to the second substrate, the third substrate comprising the first ground layer, the signal layer, the mesh ground layer and the second ground layer which are arranged in layers in turn; the camera module further comprises: A third ground line located on a surface of the mesh ground layer in the third substrate facing the signal layer and connected to one end of the first ground line away from the lens assembly; wherein a projection of the signal line onto the mesh ground layer at least partially covers the third ground line.

5. The camera module of claim 4, wherein, The second ground line, the first ground line and the third ground line are integrally formed.

6. The camera module of claim 4, wherein, The camera module further comprises: A connector located on a surface of the third substrate away from the lens assembly and electrically connected to the lens assembly through the signal line.

7. The camera module of claim 6, wherein, The connector comprises a board-to-board connector.

8. The camera module of claim 1 or 2, wherein, The signal line comprises a mobile industry processor interface signal line, and the second substrate comprises a flexible substrate.

9. An electronic device, comprising: Comprise: A middle frame; A radio frequency antenna arranged on a side of the middle frame; The camera module of any one of claims 1 to 8, a circuit substrate of the camera module is fixed on the middle frame, and a lens assembly of the camera module is close to the radio frequency antenna.

10. The electronic device of claim 9, wherein, The electronic device further comprises: A circuit board fixed on the middle frame and arranged in a spaced manner with the radio frequency antenna; The lens assembly is electrically connected to the circuit board through the circuit substrate and a connector of the camera module. The projection of the signal line onto the mesh ground layer coincides with the first ground line. The first substrate comprises a first ground layer, the signal layer, the mesh ground layer and a second ground layer which are arranged in layers in turn; the camera module further comprises: A second ground line located on a surface of the mesh ground layer in the first substrate facing the signal layer and connected to one end of the first ground line facing the lens assembly; wherein a projection of the signal line onto the mesh ground layer at least partially covers the second ground line. The circuit substrate further comprises a third substrate connected to the second substrate, the third substrate comprising the first ground layer, the signal layer, the mesh ground layer and the second ground layer which are arranged in layers in turn; the camera module further comprises: A third ground line located on a surface of the mesh ground layer in the third substrate facing the signal layer and connected to one end of the first ground line away from the lens assembly; wherein a projection of the signal line onto the mesh ground layer at least partially covers the third ground line. The second ground line, the first ground line and the third ground line are integrally formed. The camera module further comprises: A connector located on a surface of the third substrate away from the lens assembly and electrically connected to the lens assembly through the signal line. The connector comprises a board-to-board connector. The signal line comprises a mobile industry processor interface signal line, and the second substrate comprises a flexible substrate. Comprise: A middle frame; A radio frequency antenna arranged on a side of the middle frame; The camera module of any one of claims 1 to 8, a circuit substrate of the camera module is fixed on the middle frame, and a lens assembly of the camera module is close to the radio frequency antenna. The electronic device further comprises: A circuit board fixed on the middle frame and arranged in a spaced manner with the radio frequency antenna; The lens assembly is electrically connected to the circuit board through the circuit substrate and a connector of the camera module.

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