Display card
By separating the graphics processor and power conversion components of the graphics card onto the main circuit board and the sub-circuit board, and connecting them using soldering or flexible circuit boards, the heat dissipation problem of the graphics card is solved, improving heat dissipation efficiency and operating performance.
Patent Information
- Application Number
- CN202422646598.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-10-31
AI Technical Summary
High-power, high-current graphics card designs result in excessively large circuit boards, hindering airflow and causing heat dissipation problems.
The graphics processor and power conversion components are placed on the main circuit board and the sub-circuit board respectively, and connected by soldering or flexible circuit boards. The main circuit board and the sub-circuit board are arranged vertically to form a heat dissipation space, and heat sinks and fans are used to improve heat dissipation efficiency.
It effectively solves the heat dissipation problem, ensures the operating performance of the graphics card, and reduces the overall size of the circuit board through a separate design.
Smart Images
Figure CN223613524U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of computer system especially relates to a display card. BACKGROUND
[0002] High-order display card due to high power consumption current is big, the power supply and main chip of display card usually designs on same circuit board to promote its operation efficiency. However, this design method will lead to circuit board size too big, hinders the airflow flow direction, and easily derives the heat dissipation problem. SUMMARY
[0003] The utility model discloses a display card to solve at least one of the above problems.
[0004] The utility model provides a display card. This display card contains a main circuit board, a graphics processor, a subcircuit board and a power conversion element. Wherein, the main circuit board has a first side and a second side, and the first side is provided with a display card connector. The graphics processor is arranged on the main circuit board. The subcircuit board is arranged on the second side and is electrically coupled to the main circuit board by welding. The power conversion element is arranged on the subcircuit board and is suitable for power supply to the graphics processor.
[0005] According to one of the embodiments of the utility model, the second side of the main circuit board is provided with a plurality of power input points, the subcircuit board has a power input connector and a plurality of power output points, the plurality of power input points are electrically connected to the plurality of power output points by welding, the power input connector is suitable for obtaining external power, the power conversion element is electrically connected to the power input connector and the plurality of power output points, and is suitable for converting the external power into display card power and providing the graphics processor through the plurality of power input points.
[0006] According to one of the embodiments of the utility model, the plurality of power output points are directly connected to the plurality of power input points by welding.
[0007] According to one of the embodiments of the utility model, the plurality of power output points are connected to the flexible circuit board by welding, and are electrically connected to the plurality of power input points through the flexible circuit board.
[0008] According to one of the embodiments of the utility model, the plurality of power output points are connected to a plurality of copper columns by welding respectively, and are electrically connected to the plurality of power input points through the plurality of copper columns respectively.
[0009] According to one of the embodiments of the utility model, the first side is parallel to the second side.
[0010] According to one of the embodiments of the utility model, the main circuit board still contains audio -video connector, audio -video connector is located third side of main circuit board, third side is perpendicular to first side.
[0011] According to one of the embodiments of the utility model, the second side defines a length direction, and the main circuit board has a first length along the length direction.
[0012] According to one of the embodiments of the utility model, the secondary circuit board has a second length along the length direction, and the first length is less than the second length.
[0013] According to one of the embodiments of the utility model, still contain the heat dissipation fin of display card, set up in the front of main circuit board, the heat dissipation fin of display card has third length along the length direction, and the third length is greater than the first length.
[0014] According to one of the embodiments of the utility model, still contain multiple heat dissipation fans, set up in the side of the heat dissipation fin of display card back to main circuit board.
[0015] According to one of the embodiments of the utility model, the multiple power output contacts and the power input connector are located on the same side of the secondary circuit board.
[0016] According to one of the embodiments of the utility model, the secondary circuit board further includes a plurality of communication contacts adapted to be electrically connected to the main circuit board for communication, and the plurality of power output contacts and the plurality of communication contacts are located on the same side of the secondary circuit board.
[0017] The utility model provides a display card, which separates the graphic processor and the power conversion element on the main circuit board and the secondary circuit board. Thus, the heat dissipation problem caused by the traditional display card that designs the power supply and the main chip on the same circuit board can be improved. Meanwhile, the main circuit board and the secondary circuit board are electrically connected by welding, which can effectively ensure the operation efficiency of the display card. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 It is the schematic diagram of the display card provided according to the first embodiment of the utility model;
[0019] Figure 2 It is the schematic diagram of the display card provided according to the second embodiment of the utility model;
[0020] Figure 3 It is the schematic diagram of the display card provided according to the third embodiment of the utility model; and
[0021] Figure 4is a schematic diagram of a display card according to the fourth embodiment of the present application. DETAILED DESCRIPTION
[0022] The specific embodiments of the present application will be described in more detail with reference to the accompanying drawings. The advantages and features of the present application will be more clearly understood from the following description taken in conjunction with the accompanying drawings, in which like reference numerals refer to like elements throughout. It should be noted that the drawings are in extremely simplified form and are not drawn to precise scale; only the purposes of convenient and clear illustration are served thereby and only the purposes of the embodiments of the present application are assisted thereby.
[0023] Figure 1 is a schematic diagram of a display card 100 according to the first embodiment of the present application.
[0024] As shown in the figure, the display card 100 includes a main circuit board 120, a graphic processor 140, a sub-circuit board 160, and a power conversion element 180.
[0025] The main circuit board 120 has a first side 120a opposite to a second side 120b, and the first side 120a is provided with a display card connector 122. The graphic processor 140 is disposed on the main circuit board 120. The sub-circuit board 160 is disposed on the second side 120b and is electrically coupled to the main circuit board 120 by welding. The power conversion element 180 is disposed on the sub-circuit board 160 and is adapted to supply power to the graphic processor 140.
[0026] In this embodiment, the main circuit board 120 is parallel to the XY plane as shown in the figure, and the sub-circuit board 160 is parallel to the XZ plane as shown in the figure, and the main circuit board 120 and the sub-circuit board 160 are perpendicular to each other. The first side 120a of the main circuit board 120 is parallel to the second side 120b, and both of them are parallel to the X direction in the figure.
[0027] The aforementioned main circuit board 120 and sub-circuit board 160 define a space S1 on the front surface of the main circuit board 120 to accommodate a display card heat sink 190. The display card heat sink 190 can be mainly used for heat dissipation of electronic elements on the main circuit board 120.
[0028] The connection mode of the main circuit board 120 and the sub-circuit board 160 is described as follows.
[0029] As shown in the figure, the second side 120b of the main circuit board 120 is provided with a plurality of power input contacts 124. The sub-circuit board 160 has a power input connector 162 and a plurality of power output contacts 164, the power input connector 162 is adapted to obtain an external power, and the plurality of power input contacts 124 are electrically connected to the plurality of power output contacts 164 by welding. In an embodiment, the plurality of power output contacts 164 and the power input connector 162 are located on the same side of the sub-circuit board 160, but the present application is not limited thereto.
[0030] Secondly, in an embodiment, the sub-circuit board 160 further comprises a plurality of communication contacts 166 adapted to be electrically connected to the main circuit board 120 for communication. The plurality of power output contacts 164 and the plurality of communication contacts 166 can be located at the same side of the sub-circuit board 160. However, the utility model is not limited thereto.
[0031] In an embodiment, as shown in the figure, the plurality of power output contacts 164 are respectively connected to a plurality of copper columns 170 by soldering, and are respectively electrically connected to the plurality of power input contacts 124 through the plurality of copper columns 170. In addition, in a preferred embodiment, the copper columns 170 can have an L-shaped appearance to facilitate the connection of the power input contacts 124 on the main circuit board 120 and the power output contacts 164 on the sub-circuit board 160. However, the utility model is not limited thereto, and in other embodiments, the plurality of power output contacts 164 can also be directly connected to the plurality of power input contacts 124 by soldering. For example, the power output contacts 164 can be located at the edge of the sub-circuit board 160 and are directly connected to the power input contacts 124 on the front side of the main circuit board 120 by soldering.
[0032] The power conversion element 180 is electrically connected to the power input connector 162 and the plurality of power output contacts 164, and is adapted to convert external power into graphics card power and provide the graphics card power to the graphics processor 140 through the plurality of power input contacts 124.
[0033] In an embodiment, as shown in the figure, the main circuit board 120 further comprises at least one audio connector 126 (four audio connectors are shown in the figure, only one of which is marked). The audio connector 126 is located at a third side edge 120c of the main circuit board 120. The third side edge 120c is parallel to the Y direction in the figure and perpendicular to the first side edge 120a.
[0034] In addition, in an embodiment, as shown in the figure, the second side edge 120b defines a length direction (i.e. the X direction in the figure), and the main circuit board 120 has a first length L1 along the length direction. The sub-circuit board 160 has a second length L2 along the length direction. The area of the main circuit board 120 in this embodiment is greater than the area of the sub-circuit board 160, but the first length L1 corresponding to the main circuit board 120 is less than the second length L2 corresponding to the sub-circuit board 160. Compared with the main circuit board 120 and the sub-circuit board 160, the graphics card heat sink 190 has a third length L3 along the length direction, which is greater than the first length L1 and also greater than the second length L2.
[0035] Figure 2 is a schematic view of a graphics card 200 according to a second embodiment of the utility model.
[0036] Compared with the embodiment of Figure 1 In this embodiment, a plurality of cooling fans 290 (represented by circular patterns in dotted lines in the figure) are arranged in the space S1 defined by the main circuit board 120 and the auxiliary circuit board 160. The cooling fans 290 are arranged on the side of the graphics card heat sink 190 opposite to the main circuit board 120, so as to improve the overall heat dissipation efficiency of the graphics card 200.
[0037] In one embodiment, as shown in the figure, the graphics card 200 has three cooling fans 290 evenly distributed on the graphics card heat sink 190 to provide cooling air flow. However, the present application is not limited thereto. In other embodiments, two or four cooling fans 290 can be arranged for heat dissipation according to the size of the graphics card heat sink 190.
[0038] Figure 3 is a schematic view of a graphics card 300 according to a third embodiment of the present application.
[0039] Compared with the embodiment of Figure 1 In the embodiment, the plurality of power output contacts 164 on the auxiliary circuit board 160 are connected to the plurality of copper columns 170 by soldering, and are electrically connected to the plurality of power input contacts 124 on the main circuit board 120 through the plurality of copper columns 170. In this embodiment, the plurality of power output contacts 164 are connected to a flexible circuit board 370 by soldering, and are electrically connected to the plurality of power input contacts 124 through the flexible circuit board 370.
[0040] Compared with the connection method using copper columns 170, the use of a flexible circuit board 370 makes the arrangement of the power output contacts 164 and the power input contacts 124 more flexible. In addition, power conversion related elements can also be arranged on the flexible circuit board 370, which helps to reduce the size of the auxiliary circuit board 160. In addition, the flexible circuit board 370 can also serve as a communication path between the main circuit board 120 and the auxiliary circuit board 160.
[0041] Figure 4 is a schematic view of a graphics card 400 according to a fourth embodiment of the present application.
[0042] Compared with the embodiment of Figure 1In the embodiment, the graphics card 400 further comprises a power conversion heat sink 490 disposed on the sub-circuit board 160. Specifically, the power conversion heat sink 490 can be disposed on the side of the sub-circuit board 160 opposite to the graphics card heat sink 190, so as to avoid affecting the arrangement of the graphics card heat sink 190. However, the present application is not limited thereto. In other embodiments, the power conversion heat sink 490 can also be disposed in the space S1 defined by the main circuit board 120 and the sub-circuit board 160, and the heat dissipation airflow generated by the heat dissipation fan 290 can flow to the graphics card heat sink 190 and the power conversion heat sink 490 for heat dissipation.
[0043] The graphics card 100, 200, 300, 400 provided by the present application divides the graphic processor 140 and the power conversion element 180 on the main circuit board 120 and the sub-circuit board 160, so that the heat dissipation problem caused by the traditional graphics card which arranges the power supply and the main chip on the same circuit board can be improved. Meanwhile, the main circuit board 120 and the sub-circuit board 160 are electrically connected by welding, so that the operation efficiency of the graphics card 100, 200, 300, 400 can be effectively ensured.
[0044] Although the present application has been disclosed with embodiments as above, it is not intended to limit the present application, and those skilled in the art can make some changes and modifications without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application shall be subject to the definition of the claims.
Claims
1. A graphics card, The features include: a main circuit board having opposite first and second sides, the first side being provided with a graphics card connector; a graphics processor disposed on the main circuit board; a sub-circuit board disposed on the second side and electrically coupled to the main circuit board by soldering; and a power conversion element disposed on the sub-circuit board and adapted to supply power to the graphics processor.
2. The graphics card of claim 1, wherein, The second side of the main circuit board is provided with a plurality of power input contacts, the sub-circuit board has a power input connector and a plurality of power output contacts, the plurality of power input contacts are electrically connected to the plurality of power output contacts by soldering, the power input connector is adapted to obtain external power, and the power conversion element is electrically connected to the power input connector and the plurality of power output contacts, adapted to convert the external power into graphics card power and provide it to the graphics processor through the plurality of power input contacts.
3. The graphics card of claim 2, wherein, Among them, The plurality of power output contacts are directly connected to the plurality of power input contacts by soldering.
4. The graphics card of claim 2, wherein, The plurality of power output contacts are connected to a flexible circuit board by soldering, and are electrically connected to the plurality of power input contacts through the flexible circuit board.
5. The graphics card of claim 2, wherein, The plurality of power output contacts are respectively connected to a plurality of copper columns by soldering, and are respectively electrically connected to the plurality of power input contacts through the plurality of copper columns.
6. The graphics card of claim 1, wherein, Among them, The first side is parallel to the second side.
7. The graphics card of claim 1, wherein, The main circuit board further includes an audio-video connector disposed on a third side of the main circuit board, the third side being perpendicular to the first side.
8. The graphics card of claim 1, wherein, The second side defines a length direction, and the main circuit board has a first length along the length direction.
9. The graphics card of claim 8, wherein, Among them, The sub-circuit board has a second length along the length direction, and the first length is less than the second length.
10. The graphics card of claim 8, wherein, Further comprising a graphics card heat sink disposed on the front side of the main circuit board, the graphics card heat sink having a third length along the length direction, the third length being greater than the first length.
11. The graphics card of claim 10, wherein, Further comprising a plurality of cooling fans disposed on the side of the graphics card heat sink opposite to the main circuit board.
12. The graphics card of claim 1, wherein, Among them, The sub-circuit board has a power input connector and a plurality of power output contacts, the plurality of power output contacts and the power input connector are located on the same side of the sub-circuit board.
13. The graphics card of claim 1, wherein, Among them, The sub-circuit board has a power input connector and a plurality of power output contacts, and further comprises a plurality of communication contacts adapted to be electrically connected to the main circuit board for communication, the plurality of power output contacts and the plurality of communication contacts are located on the same side of the sub-circuit board.