Flexible circuit board with corrosion resistance

Abstract

The utility model discloses a kind of flexible circuit boards with anticorrosive performance, specifically related to circuit board technical field, flexible circuit board includes substrate layer, corrosion-resistant layer and waterproof layer, common constitute circuit board ontology, substrate layer adopts polyimide or polyester film, corrosion-resistant layer is composed of polytetrafluoroethylene, polyphenylene sulfide and epoxy resin, polytetrafluoroethylene is located substrate layer both sides, chemical stability is extremely excellent, can resist strong acid, strong base and strong oxidant etc. Corrosion, high temperature resistance and low temperature resistance are good, polyphenylene sulfide is high-performance thermoplastic resin, and resistance to acid, alkali, organic solvent is strong, epoxy resin has good adhesion, waterproof layer includes waterborne polyurethane, silicone resin and polyolefin, silicone resin is resistant to high temperature, and has high chemical stability, and is not easy to oxidize and decompose, and has good electrical insulation performance and self-cleaning property, polyolefin is adhered to silicone resin, and has good water and oxygen barrier performance, and the advantages of various materials are integrated in multilayer structure, forming a powerful anticorrosive waterproof system.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field, concretely is a kind of flexible circuit board with anticorrosive property. BACKGROUND

[0002] Flexible circuit board, also known as "FPC flexible board" or "soft board", is a kind of printed circuit with high reliability and excellent flexibility, which is made of flexible insulating substrate such as polyimide or polyester film.

[0003] The most commonly used substrate of flexible circuit board is polyimide or polyester film. These two materials are generally resistant to corrosion and high temperature, but in some environments with corrosive gases or liquids, such as industrial production sites and some chemical laboratories, polyimide or polyester film may gradually be corroded. This corrosion can cause the insulation performance of the substrate to decrease, causing short circuits between the wires in the circuit, which can affect the normal operation of the flexible circuit board and even completely damage the circuit, making the electronic product unable to operate normally. In some humid indoor environments or electronic products that are often exposed to water vapor, the flexible circuit board may have problems due to moisture. Therefore, we propose a flexible circuit board with anticorrosive property to solve the above problems. SUMMARY

[0004] The utility model aims at solving one of the technical problems existing in the prior art or related art.

[0005] To this end, the utility model employs the following technical scheme:

[0006] A flexible circuit board with anticorrosive property, comprising a substrate layer made of one of polyimide or polyester film, the substrate layer is provided with a corrosion-resistant layer on both sides to enhance its structural strength, the corrosion-resistant layers on both sides are symmetrically distributed along the axis of the substrate layer, the end faces of the corrosion-resistant layers on both sides away from each other are provided with a waterproof layer for improving the water resistance of the substrate layer, the waterproof layers on both sides are symmetrically distributed along the axis of the substrate layer, and the substrate layer, corrosion-resistant layer and waterproof layer together constitute a circuit board body.

[0007] Preferably, the corrosion-resistant layer comprises polytetrafluoroethylene, polyphenylene sulfide and epoxy resin.

[0008] Preferably, the polytetrafluoroethylene is arranged on both sides of the substrate layer, and the end faces of the polytetrafluoroethylene on both sides away from each other are compounded and adhered with polyphenylene sulfide.

[0009] Preferably, the epoxy resin is arranged on the side of the polyphenylene sulfide away from the polytetrafluoroethylene, and the polytetrafluoroethylene, the polyphenylene sulfide and the epoxy resin are arranged in sequence along the direction away from the substrate layer.

[0010] Preferably, the waterproof layer comprises water-based polyurethane, silicone resin and polyolefin.

[0011] Preferably, the water-based polyurethane is arranged on both sides of the substrate layer, and the water-based polyurethane on both sides is symmetrically arranged along the axis of the substrate layer.

[0012] Preferably, the water-based polyurethane on both sides is in contact with the epoxy resin on the side close to the substrate layer, and the water-based polyurethane is in contact with the silicone resin on the side away from the epoxy resin.

[0013] Preferably, the silicone resin on both sides is in contact with the polyolefin on the side away from the water-based polyurethane, and the water-based polyurethane, the silicone resin and the polyolefin are arranged in sequence along the direction away from the substrate layer of the corrosion-resistant layer.

[0014] By adopting the above technical scheme, the utility model has the beneficial effects of:

[0015] The flexible circuit board comprises a substrate layer, a corrosion-resistant layer and a waterproof layer, which jointly form a circuit board body. The substrate layer is made of polyimide or polyester film. The polyimide is flexible and has good mechanical properties, can withstand bending and folding, has high insulation and thermal stability, and is resistant to corrosion. The corrosion-resistant layer is composed of polytetrafluoroethylene, polyphenylene sulfide and epoxy resin. The polytetrafluoroethylene is located on both sides of the substrate layer, has excellent chemical stability, can resist strong acid, strong alkali and strong oxidizing agent corrosion, has low friction coefficient, smooth surface and is not easy to contaminate, and has good high-temperature resistance and low-temperature resistance. The polyphenylene sulfide is a high-performance thermoplastic resin, has strong resistance to acid, alkali and organic solvents, has good thermal stability and dimensional stability, is easy to process and shape, but has slightly poor toughness. The epoxy resin has good adhesion, can ensure the integrity of the corrosion-resistant layer, has certain resistance to various chemicals, has stable size after curing, and can closely adhere to other materials.

[0016] The waterproof layer comprises water-based polyurethane, silicone resin and polyolefin. The water-based polyurethane is in adhesion with the epoxy resin, uses water as a dispersion medium, has good flexibility, can bend without breaking, has good waterproofness, wear resistance, chemical corrosion resistance and aging resistance. The silicone resin has high temperature resistance, high chemical stability, is not easy to oxidize and decompose, has good electrical insulation performance and self-cleaning performance, but has a high price and is incompatible with some organic solvents. The polyolefin is in adhesion with the silicone resin, has good water and oxygen barrier properties, has low cost, light weight and various processing methods.

[0017] The multi-layer structure integrates the advantages of each material, forms a strong corrosion and waterproof system, improves the reliability, stability and service life of the circuit board while maintaining flexibility, and is suitable for various electronic devices and harsh environments with high requirements for corrosion and waterproof. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a schematic diagram of the circuit board body structure of the utility model.

[0019] Figure 2 It is the utility model Figure 2 It is a schematic diagram of the enlarged structure at A.

[0020] Figure 3 It is a schematic diagram of the internal structure of the circuit board body of the utility model.

[0021] Figure 4 It is a schematic diagram of the corrosion-resistant layer structure of the utility model.

[0022] Figure 5 It is a schematic diagram of the waterproof layer structure of the utility model.

[0023] In the figure: 1, base material layer; 2, corrosion-resistant layer; 201, polytetrafluoroethylene; 202, polyphenylene sulfide; 203, epoxy resin; 3, waterproof layer; 301, water-based polyurethane; 302, silicone resin; 303, polyolefin; 4, circuit board body. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0025] Embodiment: as Figures 1-5The utility model provides a kind of flexible circuit board with anticorrosion performance, including substrate layer 1, substrate layer 1 material is one of polyimide or polyester film, substrate layer 1 both sides are provided with the corrosion-resistant layer 2 of enhancing own structural strength, both sides corrosion-resistant layer 2 is distributed along substrate layer 1 axis symmetry, both sides corrosion-resistant layer 2 mutually far end surface is provided with waterproof layer 3 for promoting substrate layer 1 own water resistance, both sides waterproof layer 3 is distributed along substrate layer 1 axis symmetry, substrate layer 1, corrosion-resistant layer 2 and waterproof layer 3 jointly constitute circuit board body 4, polyimide has good flexibility and mechanical properties, can withstand certain degree of bending and folding without breaking. While having higher insulation performance and thermal stability, can maintain the normal operation of circuit within a certain temperature range. But its corrosion resistance and waterproof performance are relatively weak, polyester film flexibility is better, relatively low in price, easy to process. But high-temperature resistance and limited chemical corrosion resistance, performance is prone to decline in some harsh environments.

[0026] Wherein corrosion-resistant layer 2 includes polytetrafluoroethylene 201, polyphenylene sulfide 202 and epoxy resin 203, polytetrafluoroethylene 201 is arranged on both sides of substrate layer 1, both sides polytetrafluoroethylene 201 mutually far end surface is compounded with polyphenylene sulfide 202 adhesion, epoxy resin 203 is arranged on the side of polyphenylene sulfide 202 far from polytetrafluoroethylene 201, polytetrafluoroethylene 201, polyphenylene sulfide 202 and epoxy resin 203 are sequentially arranged and distributed along the direction away from substrate layer 1, polytetrafluoroethylene 201 has extremely excellent chemical stability, can resist the corrosion of almost all strong acids, strong bases, strong oxidizing agents and other chemical substances. Its friction coefficient is extremely low, surface is very smooth, not easy to stain dust and impurities. At the same time, polytetrafluoroethylene 201 also has good high-temperature resistance and low-temperature resistance, can work normally within a wide temperature range, polyphenylene sulfide 202 is a high-performance thermoplastic resin, has excellent resistance to acid, alkali, organic solvents and other chemicals, good chemical stability. It can maintain good performance in high temperature environment, good thermal stability, good dimensional stability, low molding shrinkage, easy to process, can be well attached to the surface of other materials. But its toughness is slightly poor, relatively brittle, epoxy resin 203 has good adhesion, can firmly bond different materials together, ensure the integrity of corrosion-resistant layer 2. It also has certain resistance to a variety of chemicals, and can adjust performance by adding fillers and other ways. Low curing shrinkage, the size is stable after curing, can be closely attached to substrate and other corrosion-resistant materials.

[0027] The waterproof layer 3 is composed of water-based polyurethane 301, silicone resin 302 and polyolefin 303. The water-based polyurethane 301 is arranged on both sides of the substrate layer 1, and the water-based polyurethane 301 on both sides is distributed symmetrically along the axis of the substrate layer 1. The side of the water-based polyurethane 301 close to the substrate layer 1 is in contact with the epoxy resin 203 and adheres to it. The side of the water-based polyurethane 301 away from the epoxy resin 203 is in contact with the silicone resin 302. The side of the silicone resin 302 away from the water-based polyurethane 301 is in contact with the polyolefin 303 and adheres to it. The water-based polyurethane 301, silicone resin 302 and polyolefin 303 are arranged in sequence in the direction away from the substrate layer 1 of the corrosion-resistant layer 2. The water-based polyurethane 301 has good flexibility and can not be broken when the circuit board is bent and folded, ensuring the integrity of the waterproof layer 3. It has good waterproof performance and can form a dense waterproof film on the surface of the circuit board to prevent water from penetrating. It also has wear resistance, chemical corrosion resistance and aging resistance, and can adapt to various complex environments. The silicone resin 302 has excellent high-temperature resistance and can maintain good waterproof effect at high temperature. It has high chemical stability and is not easy to be oxidized and decomposed, with long service life. It has good electrical insulation performance, ensuring the normal operation of the circuit board. Its surface energy is low, and it has self-cleaning property and is not easy to adsorb dust and dirt. However, the price is relatively high, and it may not be compatible with some organic solvents. The polyolefin 303 has good barrier properties to water and oxygen, which can effectively prevent water from entering the circuit board. It has low cost and light weight, and various processing methods such as extrusion and coating, which is easy to form a waterproof layer 3 on the surface of the circuit board.

[0028] The corrosion-resistant layer 2 is composed of polytetrafluoroethylene 201, polyphenylene sulfide 202 and epoxy resin 203. From close to the substrate layer 1, the polytetrafluoroethylene 201 plays its super strong corrosion resistance, resisting the erosion of most chemicals to the substrate. The polyphenylene sulfide 202 further enhances the defense capability to chemicals, and its good thermal stability and dimensional stability help to maintain the structural integrity of the corrosion-resistant layer 2 in different environments. The epoxy resin 203 plays the role of bonding and supplementing corrosion resistance, tightly combining the entire corrosion-resistant layer 2, ensuring that there is no gap for corrosive substances to enter, providing a strong anti-corrosion barrier from the inside to the outside for the flexible circuit board.

[0029] The waterproof layer 3 is composed of water-based polyurethane 301, silicone resin 302 and polyolefin 303. The water-based polyurethane 301 is first connected closely with the corrosion-resistant layer 2 to form the first layer of waterproof, and its good flexibility ensures that it can also prevent water when the circuit board is deformed. The silicone resin 302 is in the middle position, and its high-temperature resistance and chemical stability can maintain waterproof performance in high-temperature or complex chemical environment. The polyolefin 303 is in the outermost layer, which further prevents the entry of water by its good barrier property to water and oxygen, forming a multi-layer waterproof structure to effectively protect the circuit board from water damage.

[0030] In the whole structure, whether the flexibility of the substrate layer 1 itself, or the polytetrafluoroethylene 201, the polyphenylene sulfide 202 in the corrosion-resistant layer 2, although slightly brittle, the overall does not affect the flexibility and the epoxy resin 203, and the water-based polyurethane 301 and the silicone resin 302 in the waterproof layer 3, while ensuring waterproof, have flexibility, make the flexible circuit board still be able to maintain good flexibility while enhancing the corrosion and waterproof performance, can adapt to various shapes of installation space and use scene, such as the application of folding mobile phones, wearable devices and other electronic products, this multi-layer structure combines the advantages of different materials, the basic mechanical and insulating properties of polyimide or polyester film, the chemical protection ability of the corrosion-resistant layer 2 and the waterproof barrier ability of the waterproof layer 3, while making up for the shortcomings of single material, improving the overall reliability, stability and service life of the flexible circuit board, so that it can be used in harsh industrial environments, high humidity environments or electronic equipment with high requirements for waterproof and corrosion resistance.

[0031] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application also intends to include these modifications and variations.

Claims

1. A flexible circuit board having corrosion resistance, characterized by, The application relates to a circuit board, which comprises a substrate layer (1) made of polyimide or polyester film, corrosion-resistant layers (2) arranged on both sides of the substrate layer (1) to enhance the structural strength of the substrate layer (1), waterproof layers (3) arranged on the end faces of the corrosion-resistant layers (2) away from each other to improve the water resistance of the substrate layer (1), and a circuit board body (4) composed of the substrate layer (1), the corrosion-resistant layers (2) and the waterproof layers (3).

2. The flexible circuit board with corrosion resistance according to claim 1, wherein, The corrosion-resistant layer (2) comprises polytetrafluoroethylene (201), polyphenylene sulfide (202) and epoxy resin (203).

3. The flexible circuit board with corrosion resistance according to claim 2, wherein, The polytetrafluoroethylene (201) is arranged on both sides of the substrate layer (1), and the end faces of the polytetrafluoroethylene (201) on both sides are adhesively connected with the polyphenylene sulfide (202).

4. The flexible circuit board with corrosion resistance according to claim 3, wherein, The epoxy resin (203) is arranged on the side of the polyphenylene sulfide (202) away from the polytetrafluoroethylene (201), and the polytetrafluoroethylene (201), the polyphenylene sulfide (202) and the epoxy resin (203) are sequentially arranged in the direction away from the substrate layer (1).

5. The flexible circuit board with corrosion resistance according to claim 1, wherein The waterproof layer (3) comprises water-based polyurethane (301), organic silicon resin (302) and polyolefin (303).

6. The flexible circuit board with corrosion resistance according to claim 5, wherein, The water-based polyurethane (301) is arranged on both sides of the substrate layer (1), and the water-based polyurethane (301) on both sides is symmetrically distributed along the axis of the substrate layer (1).

7. The flexible circuit board with corrosion resistance according to claim 6, wherein The side of the water-based polyurethane (301) on both sides close to the substrate layer (1) is adhesively connected with the epoxy resin (203), and the side of the water-based polyurethane (301) away from the epoxy resin (203) is in contact with the organic silicon resin (302).

8. The flexible circuit board with corrosion resistance according to claim 7, wherein, The side of the organic silicon resin (302) on both sides away from the water-based polyurethane (301) is adhesively connected with the polyolefin (303), and the water-based polyurethane (301), the organic silicon resin (302) and the polyolefin (303) are sequentially arranged in the direction of the corrosion-resistant layer (2) away from the substrate layer (1).

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