High-temperature-resistant multilayer composite circuit board
By employing a metal core layer and connection mechanism in a multilayer composite circuit board, combined with thermally conductive materials, the problem of complex and costly heat dissipation in existing technologies is solved, achieving efficient heat dissipation and a compact heat dissipation effect.
Patent Information
- Application Number
- CN202520295119.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-24
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2035-02-24
AI Technical Summary
Existing heat dissipation methods for multilayer composite circuit boards are complex and costly, making it difficult to effectively handle high-temperature heat.
It adopts a metal core layer and connection mechanism, combined with the design of power layer, ground layer, signal layer and high thermal conductivity layer. The longitudinal heat dissipation channel is formed by threaded connection and thermally conductive adhesive, and stable heat conduction is provided by thermally conductive copper block and thermally conductive silver paste.
It achieves efficient heat dissipation, improves heat dissipation capacity, and maintains the compactness of the device structure.
Smart Images
Figure CN223613537U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to composite circuit board technical field especially relates to a multilayer composite circuit board of high temperature resistance. BACKGROUND
[0002] Composite circuit board refers to two or more different properties of circuit board materials (such as rigid circuit board, flexible circuit board, etc.) are laminated together through a specific process, forming a circuit board with multiple functions. According to the structure and application, composite circuit board can be divided into soft and hard composite circuit board, multilayer composite circuit board, etc.
[0003] Multilayer circuit board is usually used in high-density, high-performance electronic equipment, such as servers, communication equipment or high-end consumer electronics, multilayer composite circuit board carries larger current, so the heat in the process of use is larger, the existing heat dissipation mode is to make micro channel in the PCB, and the liquid cooling is passed through, but such structure may be too complex, especially for multilayer composite circuit board, the processing difficulty is big and the cost is high, there is certain deficiency, therefore we propose a multilayer composite circuit board of high temperature resistance. UTILITY MODEL CONTENT
[0004] The utility model aims at solving the shortcomings in the prior art and provides a multilayer composite circuit board of high temperature resistance.
[0005] In order to realize the above-mentioned purpose, the utility model adopts the following technical scheme:
[0006] A multilayer composite circuit board of high temperature resistance, comprising a metal core layer, a connecting mechanism is installed on the metal core layer, the number of the connecting mechanism is four groups, the connecting mechanism penetrates the metal core layer, a power supply layer, a first ground layer and a first signal layer are sleeved on one end of the connecting mechanism, a high-thermal-conductivity layer, a second ground layer and a second signal layer are sleeved on the other end of the connecting mechanism.
[0007] Preferably, the connecting mechanism comprises a fixed sleeve penetrating the metal core layer, and the fixed sleeve is connected with a first connecting sleeve and a second connecting sleeve through threads at both ends.
[0008] Preferably, the power supply layer, the first ground layer and the first signal layer are sleeved between the first connecting sleeve and the metal core layer, and the high-thermal-conductivity layer, the second ground layer and the second signal layer are sleeved between the second connecting sleeve and the metal core layer.
[0009] Preferably, the metal core layer is an aluminum substrate, the top and bottom of the metal core layer are laminated with the upper and lower layers through a thermal conductive adhesive, and the metal core layer forms a longitudinal heat dissipation channel.
[0010] Preferably, the first ground layer and the second ground layer are made of mesh copper, the first ground layer and the second ground layer are used for balancing electromagnetic compatibility and heat dissipation, the power layer is thick copper, and the power layer improves the current carrying capacity and transverse heat conduction of the device.
[0011] Preferably, the high-thermal-conductivity layer comprises a substrate, the substrate is provided with a mounting hole, the substrate is sleeved on the connecting mechanism through the mounting hole, a thermal-conductivity copper block is embedded in the substrate, the thermal-conductivity copper block is provided with a through hole, and the through hole is filled with thermal-conductivity silver paste.
[0012] Compared with the prior art, the utility model has the beneficial effects that:
[0013] The utility model discloses a connecting mechanism, installs power layer, first ground layer, first signal layer, high-thermal-conductivity layer, second ground layer and second signal layer on the metal core layer, and the heat generated by the first signal layer and the second signal layer is transferred to the metal core layer and the power layer in actual use, so that the heat in the device can be quickly conducted out, and the compactness of the device structure is considered while improving the heat dissipation capacity. BRIEF DESCRIPTION OF DRAWINGS
[0014] Figure 1 A structure diagram of a high-temperature-resistant multilayer composite circuit board is provided in the utility model.
[0015] Figure 2 A Figure 1 The installation schematic diagram of the connecting mechanism is shown in Fig.
[0016] Figure 3 A Figure 2 The installation schematic diagram of the high-thermal-conductivity layer is shown in Fig.
[0017] In the figure: 1 metal core layer, 2 connecting mechanism, 21 fixed sleeve, 22 first connecting sleeve, 23 second connecting sleeve, 3 power layer, 4 first ground layer, 5 first signal layer, 6 high-thermal-conductivity layer, 61 substrate, 62 mounting hole, 63 thermal-conductivity copper block, 64 thermal-conductivity silver paste, 7 second ground layer, 8 second signal layer. DETAILED DESCRIPTION
[0018] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments.
[0019] Reference Figures 1-3The utility model relates to a kind of high-temperature-resistant multilayer composite circuit board, including metal core layer 1, metal core layer 1 is aluminum substrate, the top and bottom of metal core layer 1 are laminated with upper and lower layer through heat-conducting adhesive, metal core layer 1 forms longitudinal heat dissipation channel, metal core layer 1 is installed with connecting mechanism 2, the number of connecting mechanism 2 is four groups, connecting mechanism 2 penetrates metal core layer 1, one end of connecting mechanism 2 is sleeved with power supply layer 3, first ground layer 4 and first signal layer 5, the other end of connecting mechanism 2 is sleeved with high thermal conductivity layer 6, second ground layer 7 and second signal layer 8, connecting mechanism 2 includes fixed sleeve 21 on the penetration of metal core layer 1, the both ends of fixed sleeve 21 are all connected with first connecting sleeve 22 and second connecting sleeve 23 by screw thread, power supply layer 3, first ground layer 4 and first signal layer 5 are sleeved between first connecting sleeve 22 and metal core layer 1, high thermal conductivity layer 6, second ground layer 7 and second signal layer 8 are sleeved between second connecting sleeve 23 and metal core layer 1, first ground layer 4 and second ground layer 7 are grid copper and are used for balancing electromagnetic compatibility and heat dissipation, power supply layer 3 is thick copper, and power supply layer 3 improves current-carrying capacity and transverse heat conduction, high thermal conductivity layer 6 includes substrate 61, mounting hole 62 is set up on substrate 61, substrate 61 is sleeved on connecting mechanism 2 by mounting hole 62, heat-conducting copper block 63 is embedded on substrate 61, through hole is set up on heat-conducting copper block 63, the inside of through hole is filled with heat-conducting silver paste 64, by being provided connecting mechanism, power supply layer, first ground layer, first signal layer, high thermal conductivity layer, second ground layer and second signal layer are installed on metal core layer, in actual use process, the heat generated by first signal layer and second signal layer is transferred to metal core layer and power supply layer, can quickly lead out the heat in device, while improving its heat dissipation capacity, compact structure of device is considered.
[0020] When using, power supply layer 3, first ground layer 4 and first signal layer 5 are installed on one side of metal core layer 1 through fixed sleeve 21 and first connecting sleeve 22, high thermal conductivity layer 6, second ground layer 7 and second signal layer 8 are installed on the other side of metal core layer 1 through fixed sleeve 21 and second connecting sleeve 23, metal core layer 1 is aluminum substrate, and its top and bottom are laminated with upper and lower layer through heat-conducting adhesive, longitudinal heat dissipation channel is formed by using metal core layer 1, first ground layer 4 and second ground layer 7 are grid copper and are used for balancing electromagnetic compatibility and heat dissipation, power supply layer 3 is thick copper, and improves current-carrying capacity and transverse heat conduction of device, high thermal conductivity layer 6 provides stable heat conduction channel by using heat-conducting copper block 63 and heat-conducting silver paste 64 in it, the heat generated by electric element on first signal layer 5 and second signal layer 8 is conducted to metal core layer 1, while improving stable heat dissipation performance, compact structure of device is considered.
[0021] Compared with the prior art, the utility model discloses a connecting mechanism is set, and power supply layer, first ground layer, first signal layer, high heat conduction layer, second ground layer and second signal layer are installed on the metal core layer, in actual use process, the heat generated by first signal layer and second signal layer is transferred to the metal core layer and power supply layer, can export the heat in the device quickly, and the compactness of device structure is considered, and its heat dissipation capacity is improved.
[0022] The above is only the preferred specific embodiment of the utility model, but the protection scope of the utility model is not limited to this, any skilled person in the art in the technical range disclosed by the utility model, according to the technical scheme and the utility model concept of the utility model, equivalent replacement or change are covered in the protection scope of the utility model.
Claims
1. A high-temperature-resistant multilayer composite circuit board comprising a metal core layer (1), characterized in that, The metal core layer (1) is provided with connecting mechanisms (2), the number of the connecting mechanisms (2) is four groups, the connecting mechanisms (2) penetrate the metal core layer (1), one end of the connecting mechanisms (2) is sleeved with a power supply layer (3), a first ground layer (4) and a first signal layer (5), the other end of the connecting mechanisms (2) is sleeved with a high-thermal-conductivity layer (6), a second ground layer (7) and a second signal layer (8).
2. The high temperature resistant multilayer composite circuit board of claim 1, wherein, The connecting mechanisms (2) comprise fixing sleeves (21) penetrating the metal core layer (1), both ends of the fixing sleeves (21) are threadedly connected with first connecting sleeves (22) and second connecting sleeves (23).
3. The high temperature resistant multilayer composite circuit board of claim 2, wherein, The power supply layer (3), the first ground layer (4) and the first signal layer (5) are sleeved between the first connecting sleeves (22) and the metal core layer (1), the high-thermal-conductivity layer (6), the second ground layer (7) and the second signal layer (8) are sleeved between the second connecting sleeves (23) and the metal core layer (1).
4. The high temperature resistant multilayer composite circuit board of claim 1, wherein, The metal core layer (1) is an aluminum substrate, the top and bottom of the metal core layer (1) are laminated with the upper and lower layers through the heat-conducting glue, and the metal core layer (1) forms a longitudinal heat dissipation channel.
5. The high temperature resistant multilayer composite circuit board of claim 1, wherein, The first ground layer (4) and the second ground layer (7) are made of grid copper, the first ground layer (4) and the second ground layer (7) are used for balancing electromagnetic compatibility and heat dissipation, the power supply layer (3) is thick copper, and the power supply layer (3) improves the current-carrying capacity and transverse heat conduction of the device.
6. The high temperature resistant multilayer composite circuit board of claim 1, wherein, The high-thermal-conductivity layer (6) comprises a substrate (61), the substrate (61) is provided with mounting holes (62), the substrate (61) is sleeved on the connecting mechanisms (2) through the mounting holes (62), the substrate (61) is embedded with heat-conducting copper blocks (63), the heat-conducting copper blocks (63) are provided with through holes, and the through holes are filled with heat-conducting silver paste (64).