Thick copper multilayer circuit board
By improving the fixing structure and heat dissipation system, the problem of inconvenient disassembly of thick copper multilayer circuit boards has been solved, realizing convenient disassembly and effective heat dissipation, thereby improving work efficiency and service life.
Patent Information
- Application Number
- CN202423144341.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-19
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-12-19
AI Technical Summary
The existing thick copper multilayer circuit boards are inconvenient to disassemble, requiring both hands to rotate the fixed parts simultaneously, and the disassembly process is complicated, affecting work efficiency.
A structure including a fixed frame, a rotating shaft, an eccentric wheel, a movable rod, a spring, and a support block is designed. By rotating the rotating shaft, the eccentric wheel rotates and presses against the force block. The movable rod moves by utilizing the reset action of the spring, simplifying the disassembly process of the circuit board. At the same time, a fan box, heat dissipation fins, heat-conducting plates, and a motor system are used for effective heat dissipation.
It enables convenient disassembly of the circuit board, improves disassembly efficiency, and extends the service life and adaptability of the circuit board through effective heat dissipation, making it suitable for different installation environments.
Smart Images

Figure CN223613608U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of circuit board, concretely to a thick copper multilayer circuit board. BACKGROUND
[0002] The multilayer board is multilayer wiring layer, and the medium layer is between every two layers, wherein the thick copper multilayer circuit board has at least three conductive layers, two layers are on the outer surface, and the remaining one layer is synthesized in the insulating plate, and the electrical connection between them is usually realized through the plated through hole on the cross section of the circuit board.
[0003] The prior art discloses a thick copper multilayer circuit board with the application number CN202222158103.3, the thick copper multilayer circuit board can protect the surface of the multilayer circuit board body through the protective layer, avoid the growth of mold directly or indirectly causing the failure of components on the multilayer circuit board body, and improve the service life of the multilayer circuit board body.
[0004] However, the device is not convenient to disassemble, and when disassembling, two hands are needed to rotate the two sets of fixing components synchronously, so that the fixing components do not limit the multilayer circuit board body, but after rotating the two sets of fixing components, the multilayer circuit board body is still embedded in the rectangular frame, and it is not convenient to take out the circuit board at this time, and the operation is not convenient. UTILITY MODEL CONTENTS
[0005] Therefore, the utility model aims at providing a thick copper multilayer circuit board to solve the technical problems in the background art.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a thick copper multilayer circuit board, including fixed frame and circuit board body, the inner wall of the fixed frame is equipped with the installation groove, and the inside of the installation groove is connected with the supporting block through the first spring, and the circuit board body is located in the inside of the installation groove, the inside of the fixed frame is equipped with the pivot, the both sides of the outer surface of the pivot are equipped with the eccentric wheel, the outer surface and the back of the fixed frame are installed with the movable rod through the fixed block, and the both ends of the movable rod are fixed with the stress block, and the side of the stress block is equipped with the second spring, one side of the movable rod is equipped with the fixed plate, one side of the fixed frame is equipped with the wind box, and one side of the wind box is equipped with the air pipe extending to the inside of the fixed frame, the other side of the wind box is equipped with the motor and the air inlet respectively, and the output end of the motor is connected with the fan blade, the inside of the wind box is equipped with the semiconductor refrigerating fin, the outer surface of the air pipe is equipped with the air nozzle, and the bottom of the circuit board body is equipped with the heat dissipation fin, and the both sides of the heat dissipation fin are equipped with the heat conduction sheet.
[0007] Further, the bottom of the fixed frame is connected with the telescopic plate through the connecting shaft, and one side of the telescopic plate is equipped with the mounting lug.
[0008] By adopting the technical scheme, the angle of the telescopic plate can be adjusted through the connecting shaft, the distance of the mounting lug can be adjusted through the telescopic plate, and then the mounting lug can correspond to different mounting holes, so that the application range is wider.
[0009] Further, the tuyere is provided with a plurality of groups, and the plurality of groups of tuyeres are equidistantly distributed.
[0010] By adopting the technical scheme, the tuyere can blow out cold air, and then the heat dissipation fins can be cooled.
[0011] Further, one end of the rotating shaft is fixed with a knob.
[0012] By adopting the technical scheme, the rotating shaft can be rotated more conveniently by the knob.
[0013] Further, the heat dissipation fins are made of copper material, and the heat conduction sheets are made of copper material.
[0014] By adopting the technical scheme, the heat conduction sheets can conduct the heat of the circuit board body out, and the heat dissipation fins can dissipate the heat.
[0015] Further, the force receiving block is in contact with the eccentric wheel, and one side of the force receiving block is inclined.
[0016] By adopting the technical scheme, the eccentric wheel can extrude the force receiving block, the inclined arrangement plays a guiding role, and then the eccentric wheel extrudes the force receiving block more conveniently.
[0017] Further, the movable rod is provided with two groups, and the two groups of movable rods are in sliding cooperation with the fixed block.
[0018] By adopting the technical scheme, under the limiting action of the fixed block, the movable rod moves more stably.
[0019] Further, the supporting block is provided with a plurality of groups, and the top of the plurality of groups of supporting blocks is provided with a silica gel pad.
[0020] By adopting the technical scheme, under the action of the supporting block, the force on the bottom of the circuit board body is more uniform, and the silica gel pad can protect the bottom of the circuit board body.
[0021] Further, the second spring and the first spring are each provided with a plurality of groups, and the plurality of groups of second springs and first springs are each made of manganese steel material.
[0022] By adopting the technical scheme, the manganese steel material makes the service life of the spring longer and the elasticity better.
[0023] In summary, the utility model mainly has the following beneficial effects:
[0024] 1. The utility model discloses a movable rod, fixed plate, eccentric wheel, stress block, second spring, first spring, the block and the pivot are in need to take out the circuit board main part and maintain, the staff rotates the pivot, and the pivot rotation makes the eccentric wheel rotate, and the eccentric wheel rotation can extrude the stress block, and in this way makes the second spring extrusion, and two groups of movable rods move to both sides, and the fixed plate no longer contacts the top of circuit board main part, at this time under the reset of first spring and the block, and the circuit board main part is then bounced out of the fixed frame, and further makes the circuit board main part dismount more convenient, simple operation, and the dismounting time is short, and the work efficiency is improved;
[0025] 2. The utility model discloses a wind box, heat dissipation fin, heat conduction sheet, semiconductor refrigeration piece, motor, fan blade, air pipe and air nozzle are under the action of heat dissipation fin and heat conduction sheet, can export the heat on the circuit board main part, and the motor rotation makes the fan blade rotate, and further produces the wind, and the semiconductor refrigeration piece carries out refrigeration to the wind and forms the cold gas, and the cold gas enters the air pipe after from the air nozzle and sprays, and the cold gas blows to heat dissipation fin and heat conduction sheet, and further can carry out the cooling treatment to it, thereby improve the use effect and the service life of circuit board main part;
[0026] 3. The utility model discloses a connecting shaft, telescopic plate and mounting lug are equipped with in need to install thick copper multilayer circuit board, and the staff can rotate telescopic plate using connecting shaft, and further can change the angle of mounting lug, and the distance of mounting lug can be adjusted using telescopic plate, and further can make thick copper multilayer circuit board installation range wider, and can adapt to different installation environment. ACCURACY OF DRAWINGS
[0027] Figure 1 It is the structure schematic drawing of the utility model;
[0028] Figure 2 It is the circuit board main part structure schematic drawing of the utility model;
[0029] Figure 3 It is the circuit board main part structure schematic drawing of the utility model;
[0030] Figure 4 It is the heat dissipation fin structure schematic drawing of the utility model;
[0031] Figure 5 It is the fixed frame structure schematic drawing of the utility model;
[0032] Figure 6 It is the movable rod structure schematic drawing of the utility model;
[0033] Figure 7 It is the wind box structure schematic drawing of the utility model;
[0034] Figure 8 It is the telescopic plate structure schematic drawing of the utility model.
[0035] In the diagram: 1. Fixed frame; 2. Circuit board body; 3. Fixed block; 4. Movable rod; 5. Heat dissipation fins; 6. Rotating shaft; 7. Eccentric wheel; 8. Mounting slot; 9. First spring; 10. Support block; 11. Fixed plate; 12. Air box; 13. Telescopic plate; 14. Heat-conducting plate; 15. Force-bearing block; 16. Second spring; 17. Connecting shaft; 18. Mounting ear; 19. Knob; 20. Air duct; 21. Air nozzle; 22. Semiconductor cooling chip; 23. Motor; 24. Fan blade; 25. Air inlet. Detailed Implementation
[0036] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.
[0037] The embodiments of this utility model will be described below based on its overall structure.
[0038] Example 1: A thick copper multilayer circuit board, such as Figures 1-7 As shown, the circuit board includes a fixed frame 1 and a circuit board body 2. The inner wall of the fixed frame 1 is provided with a mounting groove 8, and a support block 10 is connected to the inside of the mounting groove 8 through a first spring 9. The circuit board body 2 is located inside the mounting groove 8. The fixed frame 1 is provided with a rotating shaft 6. Eccentric wheels 7 are provided on both sides of the outer surface of the rotating shaft 6. A knob 19 is fixed to one end of the rotating shaft 6, which allows the operator to rotate the rotating shaft 6 more conveniently. A movable rod 4 is installed on the outer surface and back of the fixed frame 1 through a fixed block 3. Force blocks 15 are fixed to both ends of the movable rod 4. A second spring 16 is provided on one side of the force block 15. Multiple sets of the second spring (16) and the first spring (9) are provided, and multiple sets of the second spring 16 and the first spring 9 are made of manganese steel. Made of manganese steel, the spring has a longer service life and better elasticity. The movable rod 4 has a fixed plate 11 on one side, and the fixed frame 1 has a bellows 12 on one side. The bellows 12 has a duct 20 extending into the fixed frame 1 on one side. The bellows 12 has a motor 23 and an air inlet 25 on the other side. The output end of the motor 23 is connected to a fan blade 24. The bellows 12 has a semiconductor cooling chip 22 inside. The outer surface of the duct 20 has a nozzle 21. There are several sets of nozzles 21, which are equidistantly distributed. The nozzles 21 can blow out cold air, thereby cooling the heat dissipation fins 5. The bottom of the circuit board body 2 has heat dissipation fins 5, and heat-conducting plates 14 are provided on both sides of the heat dissipation fins 5.
[0039] See Figure 2 and Figure 4In the above embodiment, the heat dissipation fins 5 are made of copper material, and the heat conduction plates 14 are made of material capable of conducting heat out of the circuit board body 2.
[0040] Referring to Figure 1 , Figure 2 , Figure 3 , Figure 5 and Figure 6 In the above embodiment, the force receiving block 15 is in contact with the eccentric wheel 7, and one side of the force receiving block 15 is inclined, and the rotation of the eccentric wheel 7 can press the force receiving block 15, and the inclined arrangement plays a guiding role, thereby making it more convenient for the eccentric wheel 7 to press the force receiving block 15.
[0041] Referring to Figure 1 , Figure 2 , Figure 3 , Figure 5 and Figure 6 In the above embodiment, the movable rod 4 is provided with two groups, and the two groups of movable rods 4 are in sliding fit with the fixed block 3, and under the limiting action of the fixed block 3, the movable rod 4 moves more stably.
[0042] Referring to Figure 2 , Figure 3 and Figure 5 In the above embodiment, the supporting block 10 is provided with a plurality of groups, and the top of the plurality of groups of supporting blocks 10 is provided with a silica gel pad, and under the action of the supporting block 10, the bottom of the circuit board body 2 can be stressed more evenly, and the silica gel pad can protect the bottom of the circuit board body 2.
[0043] Embodiment two: in order to improve the installation range of the circuit board, adapt to different installation environments, referring to Figure 1 , Figure 2 , Figure 3 , Figure 5 and Figure 8 The bottom corners of the fixed frame 1 are connected with the expansion plates 13 through the connecting shafts 17, and one side of the expansion plates 13 is provided with the mounting ears 18, the angle of the expansion plates 13 can be adjusted through the connecting shafts 17, the distance of the mounting ears 18 can be adjusted through the expansion plates 13, thereby the mounting ears 18 can correspond to different mounting holes, and the application range is wider.
[0044] The utility model discloses an implementation principle is: when needing to install thick copper multilayer circuit board, the staff can utilize connecting shaft 17 rotation telescopic plate 13, and then can change the angle of mounting lug 18, utilize telescopic plate 13 to be able to adjust the distance of mounting lug 18, and then can make mounting lug 18 install in the equipment, under the action of radiating fin 5 and heat conduction piece 14, can export the heat on circuit board main part 2, and the rotation of motor 23 makes that fan blade 24 rotates, and then produces wind, semiconductor refrigeration piece 22 carries out refrigeration to the wind and forms cold air, and cold air is sprayed from air nozzle 21 after entering into air pipe 20, and cold air blows to radiating fin 5 and heat conduction piece 14, and then can carry out cooling treatment to it, when needing to take out circuit board main part 2 and maintain, the staff rotates pivot 6, and pivot 6 rotates makes eccentric wheel 7 rotate, and eccentric wheel 7 rotation can extrude stressed block 15, to this makes second spring 16 extrusion, two groups of movable rod 4 move to both sides, and fixed plate 11 no longer contacts the top of circuit board main part 2, at this time under the reset action of first spring 9 and toper 10, and circuit board main part 2 is then bounced out fixed frame 1, and then can maintain circuit board main part 2.
[0045] Although the embodiments of the utility model have been shown and described, the specific embodiments are only the explanation of the utility model, and it is not the limitation of the utility model, and the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in the suitable way, and the person skilled in the art can make the modification, replacement and variation without creative contribution after reading the specification, but as long as in the patent right claim range of the utility model, it is protected by the patent law.
Claims
1. A thick copper multilayer wiring board comprising a fixing frame (1) and a wiring board main body (2), characterized in that: The inner wall of the fixed frame (1) is provided with a mounting groove (8), and the inside of the mounting groove (8) is connected with a supporting block (10) through a first spring (9), and the circuit board body (2) is located in the inside of the mounting groove (8), the inside of the fixed frame (1) is provided with a rotating shaft (6), the outer surface of the rotating shaft (6) is provided with an eccentric wheel (7) on both sides, the outer surface and the back of the fixed frame (1) are provided with a movable rod (4) through a fixed block (3), and the both ends of the movable rod (4) are fixedly provided with a stress block (15), one side of the stress block (15) is provided with a second spring (16), one side of the movable rod (4) is provided with a fixed plate (11), one side of the fixed frame (1) is provided with a wind box (12), one side of the wind box (12) is provided with a wind pipe (20) extending into the inside of the fixed frame (1), the other side of the wind box (12) is respectively provided with a motor (23) and an air inlet (25), and the output end of the motor (23) is connected with a fan blade (24), the inside of the wind box (12) is provided with a semiconductor refrigerating fin (22), the outer surface of the wind pipe (20) is provided with a tuyere (21), the bottom of the circuit board body (2) is provided with a heat dissipation fin (5), and the both sides of the heat dissipation fin (5) are provided with a heat conduction sheet (14).
2. The thick copper multilayer circuit board of claim 1, wherein: The bottom of the fixed frame (1) is connected with a telescopic plate (13) through a connecting shaft (17), and one side of the telescopic plate (13) is provided with a mounting lug (18).
3. The thick copper multilayer circuit board of claim 1, wherein: The tuyere (21) is provided with a plurality of groups, and the plurality of groups of tuyeres (21) are equidistantly distributed.
4. The thick copper multilayer circuit board of claim 1, wherein: One end of the rotating shaft (6) is fixedly provided with a rotary knob (19).
5. The thick copper multilayer circuit board of claim 1, wherein: The heat dissipation fin (5) is made of copper material, and the heat conduction sheet (14) is made of copper material.
6. The thick copper multilayer circuit board of claim 1, wherein: The stress block (15) is in contact with the eccentric wheel (7), and one side of the stress block (15) is inclined.
7. The thick copper multilayer circuit board of claim 1, wherein: The movable rod (4) is provided with two groups, and the two groups of movable rods (4) are in sliding fit with the fixed block (3).
8. The thick copper multilayer circuit board of claim 1, wherein: The supporting block (10) is provided with a plurality of groups, and the top of the plurality of groups of supporting blocks (10) is provided with a silica gel pad.
9. The thick copper multilayer circuit board of claim 1, wherein: The second spring (16) and the first spring (9) are provided with a plurality of groups, and the plurality of groups of the second spring (16) and the first spring (9) are made of manganese steel material.
Citation Information
Patent Citations
Thick copper multilayer circuit board
CN218482999U