Multi-layer hardware structure of embedded server application software

Abstract

The utility model relates to the technical field of servers, in particular to a multilayer hardware structure of embedded server application software. The server comprises a server body, inserting rods are fixedly arranged on the periphery of the top face of the server body, and butt joint sleeves are fixedly arranged on the periphery of the bottom face of the server body; heat dissipation fins are fixedly arranged on the top surface and the bottom surface of the server main body, and a heat dissipation mechanism is fixedly mounted in the middle of the top surface of each heat dissipation fin; positioning mechanisms are symmetrically arranged on the two sides of the outer surface of the server body, a threaded hole is formed in the bottom of the surface of the butt joint sleeve, and a fixing stud penetrates through the interior of the threaded hole in a threaded mode. According to the multi-layer hardware structure of the embedded server application software, through the arrangement of the butt joint sleeve and the insertion rod, when the multi-layer server main body is installed in a butt joint mode, the butt joint sleeve is arranged on the surface of the insertion rod in a sleeving mode, fixing studs are screwed for fixing, and the effect of facilitating butt joint installation of the multi-layer server main body hardware is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to server technical field, more specifically, relate to a kind of multi-layer hardware structure of embedded server application software. BACKGROUND

[0002] Server refers to in network environment for client to provide various services, special-purpose computer. In network, server assumes the key task such as the storage, retransmission, release of data, is indispensable important component in various client / server (C / S) mode or B / S mode network. In some large-scale application software, multiple servers need to be configured.

[0003] However, the multiple servers of traditional installation, generally is stacked, it is inconvenient to install the docking between each other, the space between servers is reduced after stacking, the heat dissipation efficiency of server is weakened, affect the operation of server.

[0004] Therefore, a kind of multi-layer hardware structure of embedded server application software is proposed. UTILITY MODEL CONTENT

[0005] The utility model aims at providing a kind of multi-layer hardware structure of embedded server application software, to solve the problem of inconvenient docking between each other, the space between servers is reduced after stacking, the heat dissipation efficiency of server is weakened.

[0006] To achieve the above-mentioned purpose, a kind of multi-layer hardware structure of embedded server application software is provided, including server main body, the top surface of the server main body is uniformly fixed with plug-in rod, the bottom surface of the server main body is uniformly fixed with docking sleeve;The top surface and bottom surface of the server main body are fixed with heat dissipation fin, the middle part of the top surface of the heat dissipation fin is fixed with heat dissipation mechanism;The both sides of the outer surface of the server main body are symmetrically provided with positioning mechanism.

[0007] As a further improvement of the technical solution, the bottom of the surface of the docking sleeve is provided with a threaded hole, the internal thread of the threaded hole is penetrated by a fixing stud, and a plurality of limiting holes adapted to the fixing stud are equidistantly provided on the surface of the plug-in rod along the axial direction, and the limiting holes are used to connect the fixing stud.

[0008] As a further improvement of the technical solution, the number of plug-in rods and docking sleeves is four groups and is distributed in a rectangular array, the plug-in rods and docking sleeves are adapted to each other, and the plug-in rods and docking sleeves are convenient for connecting multiple server main bodies.

[0009] As a further improvement of the technical solution, the heat dissipation mechanism comprises a semiconductor refrigerating sheet and a heat dissipation fan, the semiconductor refrigerating sheet is fixedly installed at the middle of the top surface of the heat dissipation fin, and the heat dissipation fan is fixedly installed on the top surface of the semiconductor refrigerating sheet.

[0010] As a further improvement of the technical solution, the temperature controller is fixedly installed at the edge of the top surface of the server body, the temperature controller is electrically connected with the semiconductor refrigerating sheet, and the temperature controller is used for controlling the temperature of the semiconductor refrigerating sheet.

[0011] As a further improvement of the technical solution, the positioning mechanism comprises two groups of electric push rods which are symmetrically arranged on the two sides of the outer surface of the server body and a positioning disc which is fixedly connected with the output end of the electric push rod on one side, and the electric push rod is used for pushing the positioning disc.

[0012] Compared with the prior art, the utility model has the advantages of:

[0013] 1、The multi-layer hardware structure of the embedded server application software, through the setting of the adapter sleeve and the plug-in rod, when the multi-layer server body is docked and installed, the adapter sleeve is sleeved on the surface of the plug-in rod, and the fixed stud is twisted to be fixed, so that the multi-layer server body hardware docking installation is facilitated.

[0014] 2、The multi-layer hardware structure of the embedded server application software, through the setting of the heat dissipation mechanism, the heat dissipation fin absorbs the heat generated by the server body, the semiconductor refrigerating sheet is cooled after being electrified, and the heat dissipation fan accelerates the heat dissipation of the semiconductor refrigerating sheet, so that the heat dissipation function of each layer of the server body can be guaranteed after the multi-layer server body is docked and installed.

[0015] 3、The multi-layer hardware structure of the embedded server application software, through the setting of the positioning mechanism, after the embedded server body is installed, the electric push rod is turned on, the positioning disc is driven to abut against the inner walls of the embedded groove, and the server body is fixed, so that the multi-layer server body is facilitated to be installed and disassembled. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a whole structure schematic view of the utility model;

[0017] Figure 2 It is a structure schematic view of the positioning mechanism of the utility model;

[0018] Figure 3 It is a structure schematic view of the heat dissipation mechanism of the utility model;

[0019] Figure 4 It is a structure schematic view of the adapter sleeve of the utility model.

[0020] The meanings of the various reference numerals in the Figures are as follows:

[0021] 1, server body; 2, plug-in rod; 3, butt joint sleeve; 4, heat dissipation fin; 5, heat dissipation mechanism; 501, semiconductor refrigeration piece; 502, heat dissipation fan; 6, positioning mechanism; 601, electric push rod; 602, positioning disc; 7, fixing stud; 8, temperature controller. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0023] In the description of the present application, it should be understood that the orientations or positional relationships indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0024] Please refer to Figures 1-4 The present embodiment aims to provide a multi-layer hardware structure of an embedded server application software, which comprises a server body 1, plug-in rods 2 are fixedly arranged around the top surface of the server body 1, and butt joint sleeves 3 are fixedly arranged around the bottom surface of the server body 1. When the multi-layer server body 1 is butt jointed and installed, the butt joint sleeves 3 are sleeved on the surfaces of the plug-in rods 2, and the fixing studs 7 are screwed to be fixed, so that the multi-layer server body 1 is conveniently butt jointed and installed.

[0025] Heat dissipation fins 4 are fixedly arranged on the top surface and the bottom surface of the server body 1, and a heat dissipation mechanism 5 is fixedly installed on the middle part of the top surface of the heat dissipation fins 4. The heat dissipation fins 4 absorb the heat generated by the server body 1, the semiconductor refrigeration piece 501 cools the heat dissipation fins 4 after being powered on, and the heat dissipation fan 502 accelerates the heat dissipation of the semiconductor refrigeration piece 501, so that the heat dissipation function of each layer of the server body 1 can be guaranteed after the multi-layer server body 1 is butt jointed and installed.

[0026] The positioning mechanism 6 is symmetrically arranged on both sides of the outer surface of the server body 1, and after the server body 1 is embedded, the electric push rod 601 is opened to drive the positioning disc 602 to abut against the inner walls of the embedded groove, so that the server body 1 is fixed, and the effect of facilitating the installation and disassembly of the multi-layer server body 1 is achieved.

[0027] Please refer to Figure 2 The bottom surface of the docking sleeve 3 is provided with a threaded hole, and the threaded hole is internally threaded with a fixing stud 7. The surface of the insertion rod 2 is axially provided with a plurality of limiting holes matched with the fixing stud 7.

[0028] Through the arrangement of the fixing stud 7, the position of the docking sleeve 3 is adjusted, so that it is lifted on the surface of the insertion rod 2. After the height is appropriate, the fixing stud 7 is screwed to fix the server body 1.

[0029] Please refer to Figure 4 The number of the insertion rod 2 and the docking sleeve 3 is four groups and is arranged in a rectangular array, and the insertion rod 2 and the docking sleeve 3 are matched.

[0030] Through the arrangement of the docking sleeve 3 and the insertion rod 2, when the multi-layer server body 1 is docked and installed, the docking sleeve 3 is sleeved on the surface of the insertion rod 2, and the fixing stud 7 is screwed to fix the effect of facilitating the hardware docking installation of the multi-layer server body 1.

[0031] Please refer to Figure 3 The heat dissipation mechanism 5 includes a semiconductor refrigerating sheet 501 and a heat dissipation fan 502. The semiconductor refrigerating sheet 501 is fixedly installed on the middle part of the top surface of the heat dissipation fin 4, and the heat dissipation fan 502 is fixedly installed on the top surface of the semiconductor refrigerating sheet 501.

[0032] Through the arrangement of the heat dissipation mechanism 5, the heat dissipation fin 4 absorbs the heat generated by the server body 1. After the semiconductor refrigerating sheet 501 is powered on, the heat dissipation fin 4 is cooled, and the heat dissipation fan 502 accelerates the heat dissipation of the semiconductor refrigerating sheet 501. After the multi-layer server body 1 is docked and installed, the heat dissipation function of each layer of the server body 1 can also be guaranteed.

[0033] Please refer to Figure 2 The temperature controller 8 is fixedly installed on the edge of the top surface of the server body 1, and the temperature controller 8 is electrically connected with the semiconductor refrigerating sheet 501.

[0034] Through the arrangement of the temperature controller 8, the temperature of the semiconductor refrigerating sheet 501 is controlled.

[0035] Please refer to Figure 4The positioning mechanism 6 comprises electric push rods 601 and a positioning disc 602, the electric push rods 601 are symmetrically arranged on both sides of the outer surface of the server body 1, and one side of the positioning disc 602 is fixedly connected with the output ends of the electric push rods 601.

[0036] By arranging the positioning mechanism 6, after embedding the server body 1, the electric push rods 601 are opened to drive the positioning disc 602 to abut against the inner walls of the embedding groove, so that the server body 1 is fixed, and the effect of facilitating the installation and dismounting of the multi-layer server body 1 is achieved.

[0037] Working steps: when the multi-layer server body 1 is butt-jointed and installed, the butt-joint sleeve 3 is sleeved on the surface of the inserting rod 2, the position of the butt-joint sleeve 3 is adjusted, the butt-joint sleeve 3 is lifted on the surface of the inserting rod 2, after the height is appropriate, the fixed screw column 7 is screwed, and the server body 1 is fixed;

[0038] After embedding the server body 1, the electric push rods 601 are opened to drive the positioning disc 602 to abut against the inner walls of the embedding groove, so that the server body 1 is fixed, and the effect of facilitating the installation and dismounting of the multi-layer server body 1 is achieved.

[0039] The heat dissipation fins 4 absorb the heat generated by the server body 1, the semiconductor refrigeration piece 501 is electrified to cool the heat dissipation fins 4, the heat dissipation fan 502 accelerates the heat dissipation of the semiconductor refrigeration piece 501, and after the multi-layer server body 1 is butt-jointed and installed, the heat dissipation function of each layer of server body 1 can also be guaranteed.

[0040] The basic principle, main characteristics and advantages of the utility model are shown and described. It should be understood by the person skilled in the art that the utility model is not limited by the above-mentioned embodiments, the above-mentioned embodiments and the description in the specification are only preferred examples of the utility model, and are not used to limit the utility model, various changes and improvements of the utility model can be made without departing from the spirit and range of the utility model, and these changes and improvements all fall within the scope of the utility model claimed. The protection scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. A multi-tiered hardware structure for in-line server application software, characterized by: Including server body (1), the top surface of the server body (1) is fixedly provided with plug-in rod (2) around, the bottom surface of the server body (1) is fixedly provided with butt joint cover (3) around; The top surface and the bottom surface of the server body (1) are fixedly provided with heat dissipation fins (4), and the top surface of the heat dissipation fins (4) is fixedly installed with heat dissipation mechanism (5) in the middle part; The outer surface of the server body (1) is symmetrically provided with positioning mechanism (6) on both sides.

2. The multi-tiered hardware structure for in-line server application software of claim 1, wherein: The bottom surface of the butt joint cover (3) is provided with threaded hole, the inside threaded hole is penetrated with fixed stud (7), the surface of the plug-in rod (2) is axially provided with a plurality of limiting holes adapted to the fixed stud (7) at equal intervals.

3. The multi-tiered hardware structure for in-line server application software of claim 1, wherein: The number of the plug-in rod (2) and the butt joint cover (3) is four groups and is rectangular array distribution, and the plug-in rod (2) and the butt joint cover (3) are adapted.

4. The multi-tiered hardware structure for in-line server application software of claim 1, wherein: The heat dissipation mechanism (5) includes semiconductor refrigeration sheet (501) and heat dissipation fan (502), the semiconductor refrigeration sheet (501) is fixedly installed on the top surface of the heat dissipation fin (4) in the middle part, and the heat dissipation fan (502) is fixedly installed on the top surface of the semiconductor refrigeration sheet (501).

5. The multi-tiered hardware structure for in-line server application software of claim 4, wherein: The edge of the top surface of the server body (1) is fixedly installed with temperature controller (8), and the temperature controller (8) is electrically connected with the semiconductor refrigeration sheet (501).

6. The multi-tiered hardware structure for in-line server application software of claim 1, wherein: The positioning mechanism (6) includes electric push rod (601) and positioning disc (602), the number of the electric push rod (601) is two groups and is symmetrically arranged on the outer surface of the server body (1) on both sides, and one side of the positioning disc (602) is fixedly connected with the output end of the electric push rod (601).

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