Solder strip fixing device and solar cell

By setting a concave structure with a low middle and high ends in the solder ribbon fixing device, the problem of poor contact between the solder ribbon and the cured printing medium was solved, thereby improving the stability and welding effect of the solder ribbon welding and enhancing the performance of the solar cell.

CN223613752UActive Publication Date: 2025-11-28TRINA SOLAR CO LTD
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Patent Information

Application Number
CN202422836086.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-20
Publication Date
2025-11-28
Estimated Expiration
2034-11-20

AI Technical Summary

Technical Problem

Positional misalignment can easily occur between the solder ribbon and the cured printing medium, leading to poor contact or soldering failure, which affects the reliability of solar cell modules.

Method used

A first curing zone and a second curing zone are set in the welding strip fixing device to form a concave structure that is low in the middle and high at both ends. By printing different numbers of printing working fluids in the first curing zone and the second curing zone, the welding strip can be stably contacted with the curing zone, thereby increasing the contact area.

Benefits of technology

The welding strips result in a stronger weld, improving the welding effect and performance of solar cells.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a solder strip fixing device and a solar cell, and the device comprises a curing area which comprises a cured printing working medium, and the curing area comprises a first curing area located in the middle of the curing area and second curing areas located at the two ends of the curing area; the thickness of the second curing area in the first direction perpendicular to the plane where the curing areas are located is larger than that of the first curing area in the first direction; and the welding strip is connected with the first curing area so as to be fixed with the battery piece through the welding strip fixing device. According to the solder strip fixing device and the solar cell, the solder strip can be welded more firmly, the welding effect of the solder strip is improved, and the performance of the solar cell is further improved.
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Description

TECHNICAL FIELD

[0001] The present application mainly relates to the technical field of battery, in particular to a solder strip fixing device and a solar cell. BACKGROUND

[0002] Among various new energies, photovoltaic is attracting more and more attention. Photovoltaic power generation is taken from solar energy, so it is inexhaustible, and its pollution-free characteristics make the photovoltaic industry develop rapidly in recent years. In order to ensure the tensile strength of the cell piece, a printed working medium is arranged on the solar cell, and the solder strip is placed above the printed working medium after the printed working medium is solidified.

[0003] After the printed working medium is completely solidified at a high temperature, it will gather into a hard spherical state with a certain height. Therefore, during the subsequent process of placing the solder strip on the solidified printed working medium, due to the spherical structure of the solidified printed working medium, the solder strip is prone to positional deviation between the solder strip and the solidified printed working medium, resulting in poor contact between the solder strip and the solidified printed working medium, and even complete failure of welding, which further leads to unqualified tensile test of the solder strip, seriously affecting the reliability of the module. CONTENT OF THE UTILITY MODEL

[0004] The technical problem to be solved by the present application is to provide a solder strip fixing device and a solar cell, which can make the solder strip welding more firm, improve the solder strip welding effect, and further improve the performance of the solar cell.

[0005] To solve the above technical problems, the present application provides a solder strip fixing device suitable for a solar cell, the solar cell comprising a cell piece and a solder strip, the solder strip fixing device comprising: a solidification area comprising a solidified printed working medium, wherein the solidification area comprises a first solidification area located in the middle of the solidification area and a second solidification area located at both ends of the solidification area; the thickness of the second solidification area along a first direction perpendicular to the plane of the solidification area is greater than the thickness of the first solidification area along the first direction; and the solder strip is connected to the first solidification area so as to be fixed between the solder strip fixing device and the cell piece through the solder strip.

[0006] Optionally, the solder strip fixing device further comprises a solder pad, and the solidification area is located on the solder pad.

[0007] Optionally, the material of the solder pad is silver paste.

[0008] Optionally, the printed working medium comprises tin paste.

[0009] Optionally, the solidification temperature range of the tin paste is 150℃-200℃.

[0010] Optionally, the thickness of the first solidified area along the first direction ranges from 60um to 90um, and the thickness of the second solidified area along the first direction ranges from 100um to 120um.

[0011] Optionally, the minimum width of the first solidified area along a second direction parallel to the plane where the solidified area is located is greater than the width of the solder strip along the second direction.

[0012] Optionally, the first solidified area comprises the printed working medium printed and solidified once, and the second solidified area comprises the printed working medium printed and solidified multiple times.

[0013] To solve the above technical problems, the application provides a solar cell, which comprises a cell piece and a solder strip fixing device as described above, the solder strip fixing device comprising a solidified area comprising a solidified printed working medium, wherein the solidified area comprises a first solidified area located in the middle of the solidified area and a second solidified area located at both ends of the solidified area; the thickness of the second solidified area along a first direction perpendicular to the plane where the solidified area is located is greater than the thickness of the first solidified area along the first direction; and a solder strip connecting the first solidified area so as to be fixed between the solder strip fixing device and the cell piece.

[0014] Optionally, the solder strip is laid flat on the first solidified area and is welded to the first solidified area.

[0015] Optionally, the solder strip is located at the central axis of the first solidified area.

[0016] Compared with the prior art, the application sets the first solidified area and the second solidified area on the solidified area, prints the printed working medium in the first solidified area and the second solidified area for different times, forms a concave structure with low middle and high ends in the solidified area, so that the solder strip can stably contact the first solidified area and cannot deviate, the soldering of the solder strip is more firm, and the soldering effect of the solder strip is improved. Further, by laying the solder strip flat in the first solidified area, the contact area of the solder strip and the solidified area can be increased, the tensile force of the soldering of the solder strip is ensured, the soldering effect is ensured, and the performance of the solar cell is further improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] The accompanying drawings are included to provide a further understanding of the application, and they are collected and constitute a part of the application, which show the embodiments of the application, and together with the description, serve to explain the principles of the application. In the drawings:

[0018] Figure 1 is a structural schematic view of a solder strip fixing device in an embodiment of the application in a state;

[0019] Figure 2is a structural schematic diagram of a welding strip fixing device in another state in an example of the present application;

[0020] Figure 3 is a partial structural schematic diagram of a solar cell in an example of the present application. DETAILED DESCRIPTION

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments description. Obviously, the drawings in the following description are only some examples or embodiments of the present application, and for those skilled in the art, the present application can also be applied to other similar scenarios without creative labor on the basis of these drawings. Unless it is clear from the language context or otherwise indicated, the same reference numbers in the drawings represent the same structure or operation.

[0022] As shown in the present application and claims, unless the context clearly indicates otherwise, the words "one", "an", "a", and / or "the" do not specify a singular form, but also include a plural form. Generally speaking, the terms "comprise" and "include" only indicate the inclusion of the steps and elements explicitly identified, and these steps and elements do not constitute an exclusive list, and the method or device can also include other steps or elements.

[0023] Unless otherwise specifically indicated, the relative arrangement of the components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that for the purpose of description, the size of each part shown in the drawings is not drawn according to the actual proportional relationship. The technology, method and device known to those skilled in the relevant art can not be discussed in detail, but in appropriate cases, the technology, method and device should be considered as part of the authorized specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, and not as a limitation. Therefore, other examples of exemplary embodiments can have different values. It should be noted that similar reference numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0024] In the description of the present application, it needs to be understood that the orientation words such as "front, back, up, down, left, right", "transverse, vertical, perpendicular, horizontal" and "top, bottom" and the like indicated orientation or position relationship is generally based on the orientation or position relationship shown in the drawings, only for the convenience of describing the present application and simplifying the description, without making the opposite statement, these orientation words do not indicate and imply that the device or element indicated must have a particular orientation or be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the scope of protection of the present application; the orientation words "inner, outer" refer to the inner and outer of the contour of each component itself.

[0025] For the convenience of description, spatial relative terms such as "over", "above", "upper surface", "upper" and the like can be used herein to describe the spatial position relationship of one device or feature with other devices or features as shown in the drawings. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation of the device described in the drawings. For example, if the device in the drawing is inverted, the device described as "above" or "over" other devices or structures will be positioned "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below" orientations. The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein are interpreted accordingly.

[0026] In addition, it should be noted that the use of the words "first", "second" and the like to define parts is only for the convenience of distinguishing the corresponding parts, and the above words have no special meaning unless otherwise stated, therefore it cannot be understood as a limitation on the scope of protection of the present application. In addition, although the terms used in the present application are selected from the commonly known and used terms, some terms mentioned in the specification of the present application may be selected by the applicant according to his or her judgment, and the detailed meaning of each term is described in the relevant part of the description. In addition, the present application is required to be understood not only by the actual terms used, but also by the meaning implied by each term.

[0027] The present application refers to Figures 1-2 A structural schematic diagram of a welding strip fixing device 10 (hereinafter referred to as "fixing device 10") is shown, wherein, Figure 1 A structural schematic diagram of the fixing device 10 when the curing area region has not been cured is shown, Figure 2 A structural schematic diagram of the fixing device 10 when the curing area region has been cured is shown. Specifically, the fixing device 10 is suitable for Figure 3The solar cell 100 shown, on the basis of the fixing device 10, further comprises a cell piece (not shown in the figure) and a solder strip 11.

[0028] With reference to Figure 1 and Figure 2 , the fixing device 10 comprises a solidification area 101, which comprises a solidified printing working medium, and more specifically with reference to Figure 2 , the solidification area 101 comprises a first solidification area 1011 located in the middle of the solidification area and a second solidification area 1012 located at both ends of the solidification area. Further, the fixing device 10 further comprises a solder pad 102, and the solidification area 101 is located on the solder pad. Exemplarily, the material of the solder pad 102 can be silver paste. The solidification area 101 is printed on the solder pad 102 as a whole, and in the preferred embodiment, the area of the solder pad 102 is larger than the area of the solidification area 101, so that the entire area of the solidification area 101 can be located on the solder pad 102, achieving better welding effect.

[0029] Exemplarily, the printing working medium comprises tin paste, which can be printed in the solidification area 101 according to the square shape as shown in Figure 1 , and since the tin paste will form a spherical structure after high-temperature solidification, the fixing device 10 after solidification is as shown in Figure 2 , at this time the solidification area 101 after solidification comprises the first solidification area 1011 and the second solidification area 1012. Exemplarily, the high-temperature solidification temperature range of the tin paste is 150℃-200℃.

[0030] More specifically, with reference to Figure 1 , when printing the solidification area 101, the printing working medium is first printed as a whole in a single printing in the area S1, and before the printing working medium printed for the first time is solidified, the printing working medium is printed multiple times in the area S2, and then the printing working medium is further solidified to form the solidification area 101 as shown in Figure 2 , at this time the printing working medium in the area S1 and the area S2 forms a hard spherical shape, wherein Figure 2 the first solidification area 1011 comprises the printing working medium after single printing and solidification, and the second solidification area 1012 comprises the printing working medium after multiple printing and solidification.

[0031] Further, the thickness of the second solidification area 1012 along the first direction perpendicular to the plane S where the solidification area is located is greater than the thickness of the first solidification area 1011 along the first direction, wherein the thickness of the first solidification area 1011 along the first direction ranges from 60um to 90um, and the thickness of the second solidification area 1012 along the first direction ranges from 100um to 120um. Therefore, in the fixing device 10, the thickness of the second solidification area 1012 located at both ends of the solidification area 101 region is greater than the thickness of the first solidification area 1011 located in the middle of the solidification area 101 region. Thus, a concave region with high ends and low middle is formed in the solidification area 101 region of the fixing device 10.

[0032] In the present embodiment, reference is made to Figure 3 , Figure 3 A partial structure schematic diagram of the solar cell 100 is shown, as Figure 3 shown, the solar cell 100 includes a cell sheet (not shown in the figure), a solder strip fixing device according to any embodiment of the present application, for example, the solder strip fixing device 10 and the solder strip 11 described above. Further, the solder strip 11 in the solar cell 100 is connected to the first solidification area 1011 and is fixed between the fixing device 10 and the cell sheet. The solder strip 11 in the solar cell 100 is located in the concave region, and due to the blocking effect of the second solidification area 1012 at both ends of the solidification area 101 region, the solder strip 11 is limited in the first solidification area 1011, so that the solder strip 11 is not easy to deviate when in contact with the solidification area 101, so that the solder strip 11 can be more firmly welded with the solidification area 101, further ensuring the welding effect of the solder strip 11.

[0033] In the present embodiment, preferably, the minimum width w1 of the first solidification area 1011 of the solidification area 101 along the second direction y parallel to the plane where the solidification area 101 is located is greater than the width w2 of the solder strip 11 along the second direction y, so that the solder strip 11 can be laid flat on the first solidification area 1011 of the solidification area 101 and welded and connected with the first solidification area 1011 of the solidification area 101. Through the flat welding mode of the solder strip 11 and the first solidification area 1011 of the solidification area 101, the contact area of the solder strip 11 and the first solidification area 1011 of the solidification area 101 can be further increased, so that the solder strip 11 and the first solidification area 1011 of the solidification area 101 can be better welded, further ensuring the welding tensile effect of the solder strip 11 in the subsequent manufacturing process of the solar cell 100. Exemplarily, the solder strip 11 can be arranged at the central axis position of the first solidification area 1011.

[0034] The application sets the first solidification area and the second solidification area on the solidification area, prints the printing working medium for different times in the first solidification area and the second solidification area, forms the concave structure of middle low and two ends high in the solidification area, so that the solder strip can be in stable contact with the first solidification area and cannot be offset, the solder strip is welded more firmly, and the solder strip welding effect is improved. Further, the solder strip is laid flat in the first solidification area, the contact area of the solder strip and the solidification area is increased, the tensile force of the solder strip in the solar cell is ensured, the welding effect is ensured, and the performance of the solar cell is further improved.

[0035] The above has described the basic concept, and it is obvious that the above application disclosure is only as an example for the person skilled in the art, and does not constitute a limitation on the application. Although it is not explicitly stated here, the person skilled in the art can make various modifications, improvements and corrections to the application. Such modifications, improvements and corrections are suggested in the application, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of the application.

[0036] At the same time, specific words are used in the application to describe the embodiments of the application. As "one embodiment", "an embodiment", and / or "some embodiments" means a certain feature, structure or characteristic related to at least one embodiment of the application. Therefore, it should be emphasized and noted that the "an embodiment" or "one embodiment" or "an alternative embodiment" mentioned in different places in the specification twice or more does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the application can be properly combined.

[0037] Similarly, it should be noted that, in order to simplify the description of the disclosure and to help understand one or more embodiments of the application, sometimes multiple features are combined into one embodiment, figure or description thereof in the foregoing description of the embodiments of the application. However, this disclosure method does not mean that the features required by the application are more than the features mentioned in the claims. In fact, the features of the embodiment are less than all the features of the disclosed single embodiment.

[0038] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of scope in some embodiments of this application are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0039] Although this application has been described with reference to specific embodiments, those skilled in the art should recognize that the above embodiments are only used to illustrate this application, and various equivalent changes or substitutions can be made without departing from the spirit of this application. Therefore, any changes or modifications to the above embodiments within the essential spirit of this application will fall within the scope of the claims of this application.

Claims

1. A ribbon fixing device, suitable for solar cells, said solar cells comprising solar cells and ribbons, characterized in that, The welding strip fixing device includes: The curing zone includes the cured printing medium, in which... The curing zone includes a first curing zone located in the middle of the curing zone and second curing zones located at both ends of the curing zone; The thickness of the second cured region along a first direction perpendicular to the plane containing the cured region is greater than the thickness of the first cured region along the first direction; and The welding ribbon connects to the first curing area, thereby fixing it to the battery cell via the welding ribbon fixing device.

2. The welding strip fixing device as described in claim 1, characterized in that, It also includes pads, and the curing area is located on the pads.

3. The welding strip fixing device as described in claim 2, characterized in that, The pads are made of silver paste.

4. The welding strip fixing device as described in claim 1, characterized in that, The printing medium includes solder paste.

5. The welding strip fixing device as described in claim 1, characterized in that, The thickness of the first cured region along the first direction ranges from 60um to 90um, and the thickness of the second cured region along the first direction ranges from 100um to 120um.

6. The welding strip fixing device as described in claim 1, characterized in that, The minimum width of the first cured zone along a second direction parallel to the plane where the cured zone is located is greater than the width of the solder strip along the second direction.

7. The welding strip fixing device as described in claim 1, characterized in that, The first curing zone includes the printing medium that has been printed and cured in a single step, and the second curing zone includes the printing medium that has been printed and cured multiple times.

8. A solar cell, characterized in that, include Battery cells; The ribbon fixing device according to any one of claims 1 to 7, the ribbon fixing device comprising: a curing zone, including a cured printing medium, wherein the curing zone includes a first curing zone located in the middle of the curing zone and a second curing zone located at both ends of the curing zone; the thickness of the second curing zone along a first direction perpendicular to the plane of the curing zone is greater than the thickness of the first curing zone along the first direction. A welding ribbon is connected to the first curing area and thus fixed to the battery cell by the welding ribbon fixing device.

9. The solar cell as claimed in claim 8, characterized in that, The welding strip is laid flat on the first curing area and welded to the first curing area.

10. The solar cell as claimed in claim 8, characterized in that, The welding strip is located on the central axis of the first curing zone.